JPH08151136A - Automatic separating method of resin plate - Google Patents

Automatic separating method of resin plate

Info

Publication number
JPH08151136A
JPH08151136A JP29417994A JP29417994A JPH08151136A JP H08151136 A JPH08151136 A JP H08151136A JP 29417994 A JP29417994 A JP 29417994A JP 29417994 A JP29417994 A JP 29417994A JP H08151136 A JPH08151136 A JP H08151136A
Authority
JP
Japan
Prior art keywords
plate
resin plate
molding
resin
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP29417994A
Other languages
Japanese (ja)
Inventor
Yasuhiro Sumikawa
泰弘 澄川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP29417994A priority Critical patent/JPH08151136A/en
Publication of JPH08151136A publication Critical patent/JPH08151136A/en
Withdrawn legal-status Critical Current

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Landscapes

  • Sheets, Magazines, And Separation Thereof (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: To provide automatic separating method for separating a resin plate contacted with a molding plate from the molding plate smoothly. CONSTITUTION: Method for separating a resin plate 1 from a molding plate 2 of a laminated matter 10 on which the resin plate 1 and the molding plate 2 are alternately laminated. Both ends of a top surface of the laminated matter 10 bringing up the resin plate 1 detects if they are the molding plate 2 or the resin plate 1 after rising suction pads 3 suctioned to a top face of both ends of the resin plate 1. As a result, when the both ends of the top surface of the laminated matter 10 are detected as the molding plate 2, the resin plate is taken out as it is. While, when the both ends are detected as the resin plate 1, the resin plate 1 is taken out after curving the attracted resin plate 1 and repeatedly twisting it to drop the molding plate 2 and the both ends of the top face of the laminated matter 10 is detected as the molding plate 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えばプリント配線
板、絶縁板、化粧板等の積層板を構成する樹脂の硬化物
からなる樹脂板の製造において、成形プレートとして用
いた、例えば鏡板と樹脂板を自動的に分離する方法に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a mirror plate and a resin used as a molding plate in the production of a resin plate made of a cured product of a resin which constitutes a laminated plate such as a printed wiring board, an insulating plate and a decorative plate. It relates to a method for automatically separating plates.

【0002】[0002]

【従来の技術】樹脂板に含まれる、例えばプリント配線
板用の積層板は、外層に金属箔を重ねたプリプレグ体を
成形プレートに交互に挟んだ被圧体を熱盤間に挟み、加
熱加圧する成形法が採用されてきた。この成形法による
と、樹脂板と成形プレートを分離し、樹脂板を取り出す
方法として、吸着パットで樹脂板の表面を吸着し、持ち
上げる方法が知られている。しかし、この吸着パッドで
分離する方法は、成形の圧力により樹脂板と成形プレー
トが強く密着しているため、樹脂板に付着して成形プレ
ートが持ち上がるため、樹脂板が円滑に成形プレートか
ら分離できない欠点がある。そのため、人手により付着
した樹脂板と成形プレートを分離する作業を必要として
いる。
2. Description of the Related Art A laminated board for a printed wiring board, which is included in a resin board, for example, a prepreg body in which a metal foil is laminated as an outer layer is alternately sandwiched between molding plates, and an object to be pressured is sandwiched between heating plates and heated. Pressing molding methods have been adopted. According to this molding method, as a method of separating the resin plate and the molding plate and taking out the resin plate, a method of adsorbing the surface of the resin plate with an adsorption pad and lifting it is known. However, in the method of separating with the suction pad, the resin plate and the molding plate are strongly adhered to each other due to the molding pressure, so that the resin plate cannot be smoothly separated from the molding plate because it adheres to the resin plate and lifts the molding plate. There are drawbacks. Therefore, it is necessary to manually separate the resin plate and the molding plate from each other.

【0003】[0003]

【発明が解決しようとする課題】しかし、人手により付
着した樹脂板と成形プレートを分離するのでは多大の困
難と煩雑な労力を要するため、自動的に樹脂板と成形プ
レートを円滑に分離する方法が求められている。
However, it is very difficult and labor-intensive to manually separate the resin plate and the molding plate from each other. Therefore, a method for automatically and smoothly separating the resin plate and the molding plate is required. Is required.

【0004】本発明は上述の事実に鑑みてなされたもの
で、その目的とするところは、成形プレートに密着した
樹脂板を、成形プレートから円滑に分離する自動分離方
法を提供することにある。
The present invention has been made in view of the above facts, and an object of the present invention is to provide an automatic separating method for smoothly separating a resin plate that is in close contact with a molding plate from the molding plate.

【0005】[0005]

【課題を解決するための手段】本発明の請求項1に係る
樹脂板の自動分離方法は、樹脂板と成形プレートが交互
に積み重ねられた積層体の成形プレートから樹脂板を自
動分離する方法であって、上記樹脂板の両端の上面に吸
着した吸着パッドを上昇させた後に、この樹脂板が上昇
した後の積層体の最上面の両端が、成形プレートか樹脂
板かを検知し、上記検知に基づいて、上記積層体の最上
面の両端が成形プレートであることを検知した際は、吸
着した樹脂板を取り出し、上記積層体の最上面の両端が
樹脂板であることを検知した際は、吸着した樹脂板を弓
形にそらせるひねりを繰り返し加えて、樹脂板に付着し
て上昇した成形プレートを落下させ、上記積層体の最上
面の両端が成形プレートになったことを検知した後に、
上記吸着した樹脂板を取り出すことを特徴とする。
A method for automatically separating a resin plate according to claim 1 of the present invention is a method for automatically separating a resin plate from a molding plate of a laminate in which a resin plate and a molding plate are alternately stacked. Therefore, after raising the suction pads adsorbed on the upper surfaces of both ends of the resin plate, it is detected whether the uppermost ends of the laminated body after the resin plate is raised are the molding plate or the resin plate, and the above detection is performed. On the basis of the above, when it is detected that both ends of the uppermost surface of the laminate are molded plates, the adsorbed resin plate is taken out, and when it is detected that both ends of the uppermost surface of the laminate are resin plates. , Repeatedly adding a twist to bend the adsorbed resin plate in an arc shape, dropping the rising molding plate adhering to the resin plate, and detecting that both ends of the uppermost surface of the laminate have become molding plates,
It is characterized in that the adsorbed resin plate is taken out.

【0006】[0006]

【作用】本発明の請求項1に係る樹脂板の自動分離方法
によると、樹脂板が上昇した後の積層体の最上面の両端
が、成形プレートか樹脂板かを検知し、積層体の最上面
の両端が樹脂板であることを検知した際は、上記吸着し
た樹脂板を弓形にそらせるひねりを繰り返し加えるの
で、樹脂板と成形プレートの端部より空気が入り、徐々
に端部より分離し、分離した成形プレートは積層体上に
落下するため、自動的に、且つ、確実に樹脂板が成形プ
レートから分離する。
According to the method for automatically separating a resin plate according to claim 1 of the present invention, it is detected whether both ends of the uppermost surface of the laminate after the resin plate is raised are the molding plate or the resin plate, and the uppermost portion of the laminate is detected. When it is detected that both ends of the upper surface are resin plates, twists that bend the adsorbed resin plate in an arc shape are repeatedly added, so air enters from the ends of the resin plate and the molding plate, and gradually separates from the ends. Since the separated molding plate falls on the laminated body, the resin plate is automatically and surely separated from the molding plate.

【0007】[0007]

【実施例】以下本発明の方法を一実施例に係る図面に基
づいて詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of the present invention will be described in detail below with reference to the drawings related to one embodiment.

【0008】図1〜図3は本発明の方法を実施するのに
使用する分離装置の一例を示した正面図であり、図1は
樹脂板を成形プレートから分離している状態を示した図
であり、図2は分離前の状態を示し、図3は分離後の状
態を示した図である。
1 to 3 are front views showing an example of a separating apparatus used for carrying out the method of the present invention, and FIG. 1 is a view showing a state where a resin plate is separated from a molding plate. 2 is a diagram showing a state before separation, and FIG. 3 is a diagram showing a state after separation.

【0009】本発明の方法によって成形プレート2から
分離される対象は樹脂板1である。この樹脂板1の一例
を挙げると、基材に熱硬化性樹脂を含浸し半硬化したプ
リプレグを加熱加圧により基材中の樹脂を硬化させた積
層板が挙げられる。上記基材は、例えばガラス、アスベ
スト等の無機繊維、ポリエステル、ポリアミド、ポリビ
ニルアルコール、アクリル等の有機合成繊維、紙、木綿
等の天然繊維からなる織布、不織布、マット、及びこれ
らの組合せた基材が用いられる。上記基材に含浸する熱
硬化性樹脂はフェノール樹脂、エポキシ樹脂、不飽和ポ
リエステル樹脂、メラミン樹脂、ポリイミド、フッ素樹
脂等の単独、変成物、混合物等が用いられる。積層板に
含まれるプリント配線板の場合は、これらプリプレグに
銅、アルミニウム、鉄、ニッケル、亜鉛等の金属箔を重
ね合わせ、さらに金属箔を重ね、成形プレート2と交互
に挟む。上記成形プレート2はプリント配線板より剛性
が高い、厚さ1〜5mmのステンレス、鉄等の単独、合
金からなる、例えば鏡板が用いられる。加熱加圧の条件
は熱硬化性樹脂の種類、配合等により適宜決定される。
上記樹脂板1と成形プレート2が交互に積まれた積層体
10は、加圧により樹脂板1と成形プレート2が密着し
た状態となっている。この樹脂板1を成形プレート2か
ら分離する。
The object to be separated from the molding plate 2 by the method of the present invention is the resin plate 1. An example of the resin plate 1 is a laminated plate in which a base material is impregnated with a thermosetting resin and semi-cured, and a prepreg is heated and pressed to cure the resin in the base material. The above-mentioned substrate is, for example, inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol and acrylic, woven cloth, non-woven cloth and mat made of natural fibers such as paper and cotton, and a combination thereof. Wood is used. As the thermosetting resin with which the above-mentioned base material is impregnated, a phenol resin, an epoxy resin, an unsaturated polyester resin, a melamine resin, a polyimide, a fluororesin or the like alone, a modified product, a mixture or the like is used. In the case of a printed wiring board included in a laminated board, a metal foil of copper, aluminum, iron, nickel, zinc or the like is superposed on these prepregs, and further, a metal foil is superposed and sandwiched alternately with the molding plate 2. As the molding plate 2, for example, a mirror plate having a rigidity higher than that of the printed wiring board and having a thickness of 1 to 5 mm, which is made of an individual material such as stainless steel or iron, or an alloy, is used. The heating and pressurizing conditions are appropriately determined depending on the type and composition of the thermosetting resin.
The laminated body 10 in which the resin plates 1 and the molding plates 2 are alternately stacked is in a state in which the resin plates 1 and the molding plates 2 are in close contact with each other by applying pressure. The resin plate 1 is separated from the molding plate 2.

【0010】本発明の方法を実施するのに用いる分離装
置の一例について説明する。図2に示す如く、分離装置
は、上下に昇降する可動軸5を有し、この可動軸5の下
端に基盤7を有する。この基盤7には、上記可動軸5に
対して枢軸8を中心にして直角から鋭角に自在に変位す
るアーム4を枢着し、このアーム4の下面に吸着パッド
3が備えられている。上記アーム4が可動軸5に対して
枢軸8を中心にして鋭角に変位すると、上記吸着パッド
3に吸着した樹脂板1が下方に凸となる弓形にそる。上
記アーム4が、可動軸5に対して角度を自在に変位する
ことにより、上記吸着した樹脂板1の弓形のそりの程度
に強弱が付く。
An example of a separation device used to carry out the method of the present invention will be described. As shown in FIG. 2, the separating device has a movable shaft 5 that moves up and down, and a base 7 at the lower end of the movable shaft 5. An arm 4 which is freely displaced from a right angle to an acute angle about the pivot 8 with respect to the movable shaft 5 is pivotally attached to the base 7, and a suction pad 3 is provided on the lower surface of the arm 4. When the arm 4 is displaced at an acute angle with respect to the movable shaft 5 about the pivot axis 8, the resin plate 1 adsorbed on the adsorption pad 3 is curved in a downward convex shape. By freely displacing the arm 4 with respect to the movable shaft 5, the degree of the bowed warp of the adsorbed resin plate 1 is increased or decreased.

【0011】上記分離装置は、上記樹脂板1と成形プレ
ート2が交互に積まれた積層体10の両脇に、この積層
体10の最上面の両端が、成形プレート2か樹脂板1か
を検知するレーザー変位計6を備える。上記レーザー変
位計6は所定波長の光線を積層体10の上面に対し鋭角
で照射し、この光線が照射面に反射し、上記レーザー変
位計6の方向に戻る反射光線の割合により、照射面が何
であるかを検知するものである。成形プレート2に鏡板
が用いられた場合、鏡板の成形プレート2に対し鋭角で
照射した光線は、上記レーザー変位計6には極少量しか
戻らない。一方樹脂板1、及び、金属箔を重ねた樹脂板
1は乱反射をするので、鏡板の成形プレート2に比較
し、照射した光線が上記レーザー変位計6に多く戻る。
このレーザー変位計6の方へ反射する光線の割合によ
り、積層体10の最上部に積載されているものが、成形
プレート2か樹脂板1かを検知する。
In the separating device, the resin plate 1 and the molding plate 2 are alternately stacked on both sides of the laminated body 10 so that both ends of the uppermost surface of the laminated body 10 are the molding plate 2 or the resin plate 1. A laser displacement meter 6 for detecting is provided. The laser displacement meter 6 irradiates the upper surface of the laminate 10 with a light beam having a predetermined wavelength at an acute angle, the light beam is reflected on the irradiation surface, and the irradiation surface is determined by the ratio of the reflected light beam returning to the direction of the laser displacement meter 6. It detects what it is. When a mirror plate is used as the molding plate 2, only a very small amount of the light beam irradiated to the mirror-molding plate 2 at an acute angle returns to the laser displacement meter 6. On the other hand, since the resin plate 1 and the resin plate 1 on which the metal foils are overlapped diffusely reflect, compared with the molding plate 2 of the mirror plate, a large amount of the irradiated light returns to the laser displacement meter 6.
Based on the ratio of the light rays reflected toward the laser displacement meter 6, it is detected whether the uppermost one of the laminated body 10 is the molding plate 2 or the resin plate 1.

【0012】上記分離装置を用いた本発明の分離方法に
ついて説明する。図2に示す如く、加熱加圧成形された
樹脂板1と成形プレート2が交互に組み合わされてい
る。樹脂板1を分離する際、アーム4が直角の状態で可
動軸5が下降し、樹脂板1の上面を吸着パット3で吸着
した後に、上記アーム4が可動軸5に対し鋭角に変位
し、吸着パッド3を内側にひねり、樹脂板1を弓形にそ
らせながら、上昇する。なお、上記アーム4が可動軸5
に対し鋭角に変位せず、アーム4が直角の状態で上昇し
てもかまわないが、樹脂板1を弓形にそらせながら上昇
する方が、成形プレート2が樹脂板1に付着する割合が
少ないので好ましい。
The separating method of the present invention using the above separating apparatus will be described. As shown in FIG. 2, heat-press molded resin plates 1 and molded plates 2 are alternately combined. When the resin plate 1 is separated, the movable shaft 5 descends with the arm 4 at a right angle, the upper surface of the resin plate 1 is sucked by the suction pad 3, and then the arm 4 is displaced at an acute angle with respect to the movable shaft 5. The suction pad 3 is twisted inward, and the resin plate 1 is raised while being bent in an arc shape. It should be noted that the arm 4 has a movable shaft 5
On the other hand, it does not matter if the arm 4 is raised at a right angle without being displaced at an acute angle, but if the resin plate 1 is raised while being bent, the forming plate 2 will adhere to the resin plate 1 less frequently. preferable.

【0013】図1に示す如く、吸着パッド3が略200
mm程度上昇したところで、上記積層体10の最上面の
両端が、成形プレートか樹脂板かをレーザー変位計6で
検知する。
As shown in FIG. 1, the suction pad 3 has approximately 200
When it has risen by about mm, the laser displacement meter 6 detects whether the uppermost end of the laminate 10 is a molded plate or a resin plate.

【0014】上記検知の結果、上記積層体10の最上面
の両端が成形プレート2であると検知すれば、成形プレ
ート2は樹脂板1に付着することなく、積層体10に積
載されたと判断し、吸着した樹脂板1を取り出す。
As a result of the above detection, if it is detected that both ends of the uppermost surface of the laminated body 10 are the molding plates 2, it is judged that the molding plate 2 is loaded on the laminated body 10 without adhering to the resin plate 1. , The adsorbed resin plate 1 is taken out.

【0015】上記検知の結果、上記積層体10の最上面
の両端が樹脂板1であると検知すれば、樹脂板1に成形
プレート2が付着して上昇したと判定し、上記アーム4
が、可動軸5に対して角度を自在に変位する。上記アー
ム4が、可動軸5に対して角度を自在に変位することに
より、弓形にそった樹脂板1に、ひねりが繰り返し加わ
る。このひねりを繰り返すと、上記樹脂板1と成形プレ
ート2の端部より空気が入り、徐々に端部より分離し、
分離した成形プレート2は積層体10上に落下する。上
記動作は、積層体10の最上面の両端に成形プレート2
を検知するまで繰り返される。図3に示す如く、上記積
層体10の最上面の両端が成形プレート2になったこと
を検知した後に、上記吸着した樹脂板1を取り出す。
As a result of the detection, if it is detected that both ends of the uppermost surface of the laminated body 10 are the resin plates 1, it is determined that the molding plate 2 has adhered to the resin plate 1 and has risen, and the arm 4 is moved.
However, the angle is freely displaced with respect to the movable shaft 5. The arm 4 is freely displaced at an angle with respect to the movable shaft 5, so that the resin plate 1 having an arcuate shape is repeatedly twisted. When this twist is repeated, air enters from the ends of the resin plate 1 and the molding plate 2 and gradually separates from the ends,
The separated molding plate 2 falls on the laminated body 10. The above operation is performed by forming the molding plates 2 on both ends of the uppermost surface of the laminated body 10.
Is repeated until is detected. As shown in FIG. 3, after detecting that both ends of the uppermost surface of the laminate 10 have become the molding plates 2, the adsorbed resin plate 1 is taken out.

【0016】[0016]

【発明の効果】本発明の請求項1に係る樹脂板の自動分
離方法によって、成形プレートに密着した樹脂板を、成
形プレートから自動的に、且つ、円滑に分離することが
できる。
According to the method for automatically separating a resin plate according to the first aspect of the present invention, the resin plate that is in close contact with the molding plate can be automatically and smoothly separated from the molding plate.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の方法を実施するのに使用する分離装置
の一例を示した正面図である。
FIG. 1 is a front view showing an example of a separation device used for carrying out the method of the present invention.

【図2】本発明の方法を実施するのに使用する分離装置
の一例を示した正面図である。
FIG. 2 is a front view showing an example of a separation device used for carrying out the method of the present invention.

【図3】本発明の方法を実施するのに使用する分離装置
の一例を示した正面図である。
FIG. 3 is a front view showing an example of a separation device used for carrying out the method of the present invention.

【符号の説明】[Explanation of symbols]

1 樹脂板 2 成形プレート 3 吸着パッド 4 アーム 5 可動軸 6 レーザー変位計 10 積層体 1 Resin Plate 2 Molding Plate 3 Adsorption Pad 4 Arm 5 Movable Axis 6 Laser Displacement Meter 10 Laminate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 樹脂板と成形プレートが交互に積み重ね
られた積層体の成形プレートから樹脂板を自動分離する
方法であって、 上記樹脂板の両端の上面に吸着した吸着パッドを上昇さ
せた後に、 この樹脂板が上昇した後の積層体の最上面の両端が、成
形プレートか樹脂板かを検知し、 上記検知に基づいて、上記積層体の最上面の両端が成形
プレートであることを検知した際は、吸着した樹脂板を
取り出し、 上記積層体の最上面の両端が樹脂板であることを検知し
た際は、吸着した樹脂板を弓形にそらせるひねりを繰り
返し加えて、樹脂板に付着して上昇した成形プレートを
落下させ、上記積層体の最上面の両端が成形プレートに
なったことを検知した後に、上記吸着した樹脂板を取り
出すことを特徴とする樹脂板の自動分離方法。
1. A method for automatically separating a resin plate from a molding plate of a laminated body in which a resin plate and a molding plate are alternately stacked, which is characterized in that after suction pads adsorbed on the upper surfaces of both ends of the resin plate are raised. , Both ends of the uppermost surface of the laminated body after the resin plate is raised are detected as a molding plate or a resin plate, and based on the above detection, it is detected that both ends of the uppermost surface of the laminated body are molding plates. In this case, the adsorbed resin plate was taken out, and when it was detected that both ends of the uppermost surface of the laminate were resin plates, the adsorbed resin plate was repeatedly twisted to bend it so that it adhered to the resin plate. The method for automatically separating resin plates is characterized in that the resin plate adsorbed is taken out after it is detected that both ends of the uppermost surface of the laminated body have become the molding plates by dropping the molding plate that has risen.
JP29417994A 1994-11-29 1994-11-29 Automatic separating method of resin plate Withdrawn JPH08151136A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29417994A JPH08151136A (en) 1994-11-29 1994-11-29 Automatic separating method of resin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29417994A JPH08151136A (en) 1994-11-29 1994-11-29 Automatic separating method of resin plate

Publications (1)

Publication Number Publication Date
JPH08151136A true JPH08151136A (en) 1996-06-11

Family

ID=17804340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29417994A Withdrawn JPH08151136A (en) 1994-11-29 1994-11-29 Automatic separating method of resin plate

Country Status (1)

Country Link
JP (1) JPH08151136A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008125711A (en) * 2006-11-20 2008-06-05 Newgin Corp Permission seal sticking device
JP2008127040A (en) * 2006-11-20 2008-06-05 Newgin Corp Permission seal sticking apparatus
JP2008125710A (en) * 2006-11-20 2008-06-05 Newgin Corp Permission seal sticking device
JP2010064814A (en) * 2008-09-09 2010-03-25 Nec Corp Method and device for acquiring flexible plate-like body by separation
JP2019140049A (en) * 2018-02-15 2019-08-22 トヨタ自動車株式会社 Separator adsorption device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008125711A (en) * 2006-11-20 2008-06-05 Newgin Corp Permission seal sticking device
JP2008127040A (en) * 2006-11-20 2008-06-05 Newgin Corp Permission seal sticking apparatus
JP2008125710A (en) * 2006-11-20 2008-06-05 Newgin Corp Permission seal sticking device
JP2010064814A (en) * 2008-09-09 2010-03-25 Nec Corp Method and device for acquiring flexible plate-like body by separation
JP2019140049A (en) * 2018-02-15 2019-08-22 トヨタ自動車株式会社 Separator adsorption device

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