JP2006259682A - Composite photoelectric device, ic socket and optical waveguide used for the device, optical waveguide coupling chip and electronic appliance using the device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite photoelectric device capable of enhancing the relative positioning precision between an interposer and an optical waveguide with respect to an optical coupling method based on an IC socket. <P>SOLUTION: The interposers 106a and 106b, on the back surfaces of which optical elements (a light emitting element array 107 and a light receiving element array 108) are mounted, are fixed on protruded surfaces of the IC sockets 102a and 102b mounted on a substrate 101. The end parts of an optical waveguide array 103 are disposed on grooved recesses 102d of the IC sockets 102a, 102b so as to face the optical elements. The positioning of the interposers and the optical waveguide array is performed by inserting positioning pins 111 of the interposer into positioning holes 112 of the the optical waveguide array 103. The interposer and the optical waveguide array are directly connected by the positioning pins. Accordingly, the relative positioning precision between the interposer and the optical waveguide array can be enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a photoelectric composite device suitable for signal transmission between semiconductor chips such as an LSI (Large Scale Integrated circuit), an IC socket and an optical waveguide used therefor, and an electronic apparatus using the same.

  Specifically, the present invention relates to an interposer for positioning an interposer, in which an interposer on which an optical element is mounted on the back surface is fixed to an IC socket and an optical waveguide is disposed on the IC socket so as to face the optical element. The present invention relates to a photoelectric composite device or the like that increases the relative positioning accuracy between the interposer and the optical waveguide by adopting a configuration in which the pins are inserted into the positioning holes of the optical waveguide.

  Conventionally, signal transmission between semiconductor chips such as LSIs is performed by electrical signals via substrate wiring. However, with the recent increase in functionality of MPUs (Micro Processing Units), the amount of data exchanged between semiconductor chips has increased significantly, and as a result, various high frequency problems have emerged.

  Typical examples thereof include RC (Register and Capacitor) signal delay, impedance mismatching, EMC (ElectroMagnetic Compatibility) / EMI (ElectroMagnetic Interference), and crosstalk. Conventionally, in order to solve these problems, optimization of wiring positions, development of new materials, and the like have been performed.

  However, in recent years, the effects of the optimization of wiring positions and the development of new materials have been hampered by physical limitations. In order to realize higher system functionality in the future, it is assumed that simple semiconductor chips will be mounted. There is a need to review the board structure itself. For example, the following is a brief description of the fine wiring bonding by multi-chip module (MCM), two-dimensional sealing of wiring using polyimide resin of various semiconductor chips, electrical wiring bonding by integration, and substrate bonding Three-dimensional bonding of semiconductor chips by means of has been developed.

-Fine wiring coupling by MCM High-performance chip is mounted on a precision mounting board such as ceramic silicon, and fine wiring bonding that cannot be formed on a mother board (multilayer printed circuit board) is realized. As a result, the wiring pitch can be reduced, and the amount of data exchange increases dramatically by expanding the bus width.

-Sealing of various semiconductor chips and electric wiring coupling by integration Various semiconductor chips are two-dimensionally sealed using polyimide resin or the like, integrated, and fine wiring bonding is performed on the integrated substrate. As a result, the wiring pitch can be reduced, and the amount of data exchange increases dramatically by expanding the bus width.

-Three-dimensional bonding of semiconductor chips A through electrode is provided in various semiconductor chips, and each is bonded to form a laminated structure. As a result, the connection between the different types of semiconductor chips is physically short-circuited, and as a result, problems such as signal delay are avoided. However, problems such as an increase in the amount of heat generated by stacking and thermal stress between semiconductor chips occur.

  In addition, in order to realize high-speed signal transmission and large capacity, an optical transmission coupling technique using optical wiring has been developed (see, for example, Non-Patent Document 1 and Non-Patent Document 2). By performing signal transmission between the semiconductor chips using optical signals, there is no problem of RC delay as in electrical wiring, and the transmission speed can be greatly improved. Further, by performing signal transmission between semiconductor chips using optical signals, it is possible to design a relatively free wiring without requiring any countermeasures against electromagnetic waves.

  There are various methods for optical wiring technology corresponding to semiconductor chips. For example, there are an active interposer method, a free space transmission method, an optical connector connection method, an optical waveguide embedding method, and a surface mounting method, which will be briefly described below.

Active interposer method (see p.125 of Non-Patent Document 1, FIG. 7)
In this case, an optical waveguide is mounted on a printed wiring board (board). The optical element is mounted on the back surface of the transceiver module and is precisely positioned with respect to the 45 ° total reflection mirror of the optical waveguide. As an advantage, it can be developed on a mounting structure of an existing printed wiring board. Moreover, as a matter of concern, the structure is large, so that the cost is high, it is difficult to align the optical axis, and it is difficult to shorten the electric transmission path, which is not suitable for high-frequency transmission.

-Free space transmission system (see Non-Patent Document 1, p. 123, Fig. 5)
In this method, an optical wiring board (quartz) is mounted on the back surface of the printed wiring board, and light is reflected in a zigzag manner in the transmission board to propagate signals. By optical element array + free space transmission, in principle, multi-channeling of several thousand levels is possible. Further, in order to facilitate optical axis alignment, a hybrid optical system in which several lenses are combined is configured. As an advantage, in principle, multiplex transmission of several thousand channels is possible, and since a hybrid optical system is configured, optical axis alignment is easy. Also, as a matter of concern, because of the high cost of optical wiring boards, signal propagation due to reflection, the waveform is likely to be disturbed, the propagation loss is large, and many newly developed technologies have been incorporated. There is almost no.

・ Optical connector connection method (p.122 of Non-Patent Document 1, see FIG. 4)
This is an optical transmission module system in which a small optical connector is arranged around an LSI chip and an optical path can be freely set after the LSI chip is mounted. The advantages are that the accuracy is guaranteed by the connector, the costly optical axis alignment process is unnecessary, and the use of optical fiber enables middle-distance transmission between printed circuit boards, as well as existing It can be developed on a printed wiring board mounting structure. In addition, there are limits to the miniaturization of the connector module, it is difficult to shorten the electrical wiring between the semiconductor chip and the connector, it is not suitable for high-frequency transmission, and an optical fiber is used as the transmission medium Therefore, there is a limit to the number of buses, and there are many components and it is difficult to reduce the cost per bus.

-Optical waveguide embedding method (see p.124 of Non-Patent Document 1, FIG. 6)
In this method, an optical waveguide is embedded in a printed wiring board, and an optical wiring is provided while maintaining the form of the existing printed wiring board mounting structure. A microlens is used for optical path coupling, and the allowable optical axis deviation is relaxed to the general mounting accuracy level. As an advantage, since the light emitting element is mounted directly on the back surface of the LSI chip, the electrical wiring path between the LSI chip and the light emitting element can be shortened to the limit, and collimated optical coupling enables optical axis alignment with general mounting accuracy. It is possible. Also, as a matter of concern, since the optical wiring is provided in the printed wiring board, it is difficult to manufacture and reduce the cost of the printed wiring board, the heat dissipation measures for the optical elements are unknown, and the printed wiring board is fragile. Therefore, there is a possibility that the optical coupling loss between the lens and the optical waveguide may fluctuate.

・ Surface mounting method (see Non-Patent Document 2)
In this method, an optical element is directly attached to the back surface of an LSI chip to function, and an optical waveguide is directly mounted on a printed wiring board. The structure of the existing printed wiring board can be maintained as it is, and an optical wiring can be provided. As an advantage, since the light emitting element is directly mounted on the back surface of the LSI chip, the electrical wiring path between the LSI chip and the light emitting element can be shortened to the limit, the structure is simple, and the cost can be reduced. It can be developed on a mounting structure of an existing printed wiring board. Also, as a matter of concern, since the optical element is directly attached to the LSI chip, it is necessary to develop a dedicated LSI chip, and because the optical element is directly attached to the high-temperature LSI chip, There is a concern about high temperature deterioration.

Nikkei Electronics, “Encounter with Optical Wiring”, pages 122-125, December 3, 2001, FIGS. 4-7 NTT R & D, vol.48, no.3, pp.271-280 (1999)

  Each method described above lacks decisive power at present for the following first to fifth reasons.

  First, it is not a structure in which the existing printed wiring board mounting structure can be used as it is. That is, the structure in which the optical path is directly laminated on the printed wiring board is not realistic because the printed wiring board itself serving as a base is fragile, causing problems such as optical axis misalignment. On the other hand, if a change is made to the structure of the printed wiring board that has been cultivated so far, enormous efforts are required for confirmation of performance, reliability, and high-frequency performance. Therefore, a system structure that cannot utilize an existing printed wiring board such as an embedded optical waveguide is not desirable.

  Secondly, it is not a structure that allows the existing mounting process to be used as it is. In general, optical modules such as optical waveguides are vulnerable to high temperature processes. In the method in which the printed wiring board and the optical wiring unit are integrated as described above, the optical module is exposed to a high-temperature process such as solder reflow and underfill resin sealing, which is actually difficult to implement. . In addition, materials and parts that take high temperature processes into account must be adopted, which is a major constraint.

  Third, it should not be a structure that excludes large-scale structures. That is, since the rigidity of the printed wiring board is low, the optical path structure with large parts is likely to cause an optical axis shift due to external stress. Therefore, the post structure by the active interposer system as described above should be avoided.

  Fourth, it is not an optical wiring structure capable of high density. In other words, when specializing in optical wiring between semiconductor chips on a printed wiring board, it is considered that an optical fiber that cannot be densified should not be adopted. An optical connector connection method using an optical fiber is limited as a system for inter-device communication.

  Fifth, it is not a structure that can shorten the wiring length between the LSI chip and the optical element. That is, in the structure in which the electrical wiring length between the LSI chip and the optical element cannot be short-circuited, the high-frequency signal deteriorates before reaching the optical element, and the effect of light conversion is lost. Therefore, it is necessary to construct a system structure that can shorten this distance.

  Therefore, the applicant previously fixed an interposer on which an optical element such as a light emitting element or a light receiving element is mounted on the back surface, and an optical waveguide is disposed on the IC socket so as to face the optical element. An optical coupling method based on IC socket was proposed.

  An object of the present invention is to increase the relative positioning accuracy between an interposer and an optical waveguide in an optical coupling method based on an IC socket.

  The photoelectric composite device according to the present invention includes an IC socket, an interposer in which an optical element is mounted on the back surface and fixed to the IC socket, and an optical waveguide installed in the IC socket so as to face the optical element. The interposer has a positioning pin on the back surface, the optical waveguide has a positioning hole for inserting the positioning pin, and the positioning pin of the interposer is inserted into the positioning hole of the optical waveguide. Is.

  In addition, the IC socket according to the present invention has a groove-shaped recess, and an optical waveguide is disposed in the recess, and an interposer having an optical element mounted on the back surface is fixed so that the optical element faces the optical waveguide. The IC socket is provided with a groove extending in the vertical direction for regulating the position of the optical waveguide or the interposer in the horizontal direction on the side surface of the groove-shaped recess.

  An optical waveguide according to the present invention comprises a waveguide body and a lens portion disposed at the longitudinal end of the waveguide body, and a positioning hole is formed in the lens portion. It is.

  Each of the optical waveguide coupling chips according to the present invention includes a waveguide body portion and a lens portion that is disposed at a longitudinal end portion of the waveguide body portion and has a positioning hole. An optical waveguide coupling chip for connecting the end portions of the first optical waveguide and the second optical waveguide, the first lens and the second optical waveguide corresponding to the lens of the lens portion of the first optical waveguide A lens forming portion having a second pin corresponding to the lens of the lens portion and having a connecting pin for insertion into a positioning hole formed in the lens portion of the first optical waveguide and the second optical waveguide And a waveguide portion that is fixed to the lens forming portion and optically connects between the first lens and the second lens.

  The electronic device according to the present invention is an electronic device comprising a plurality of electronic components, and a signal using an optical signal between the first electronic component and the second electronic component included in the plurality of electronic components. A photoelectric composite device for performing transmission is provided. The photoelectric composite device is installed in the IC socket so that the IC socket and the electronic component are mounted on the front surface, the optical element is mounted on the back surface, the interposer fixed to the IC socket, and the optical element. The interposer has positioning pins on the back surface, the optical waveguide has positioning holes for inserting the positioning pins, and the positioning pins of the interposer are positioned in the positioning holes of the optical waveguide. Is to be inserted.

  In the present invention, an interposer in which an electronic component such as a semiconductor chip is mounted and an optical element is mounted on the back surface is fixed to the IC socket. In addition, an optical waveguide is disposed in the IC socket so as to face the optical element. For example, the IC socket has a groove-shaped recess, and the optical waveguide is stably disposed in the groove-shaped recess. Here, the optical element is either or both of a light emitting element for emitting an optical signal incident on the optical waveguide and a light receiving element for receiving an optical signal emitted from the optical waveguide.

  In this case, positioning pins fixed to the back surface of the interposer are inserted into the positioning holes of the optical waveguide. Since the interposer and the optical waveguide are directly connected by the positioning pins as described above, the relative positioning accuracy between the interposer and the optical waveguide can be increased.

  Here, the positioning pins of the interposer are press-fitted into the positioning holes of the optical waveguide. For example, the diameter of the positioning hole of the optical waveguide is slightly smaller than the diameter of the positioning pin of the interposer, and when the positioning pin is inserted into the positioning hole, the positioning hole is expanded by resin deformation. . Thereby, the play after positioning of the optical waveguide with respect to an interposer can be suppressed.

  For example, the optical waveguide has at least three positioning holes at positions surrounding the optical element mounted on the back surface of the interposer. In this case, when the optical waveguide is composed of a waveguide main body and a lens unit disposed at the end of the waveguide main body, for example, at least three positioning members are provided so as to surround the lens in the lens unit. A hole is formed.

  Thereby, the expansion or contraction of the optical waveguide can be satisfactorily followed with respect to the two-dimensional expansion or contraction of the interposer due to the temperature change of the use environment. In this case, the deviation between the optical axis of the optical element and the optical axis of the lens of the lens portion due to temperature change is reduced, and the light amount loss due to the deviation of the optical axis can be reduced.

  When the optical waveguide is composed of a waveguide main body and a lens portion disposed at the end of the waveguide main body in the longitudinal direction, the both ends of the optical waveguide should have the necessary rigidity by the lens. The other parts can be made thin and flaky. Thereby, for example, the mounting position accuracy of the IC socket for installing the optical waveguide can be moderated, and the working efficiency can be increased. In addition, since the positioning hole is formed in the lens portion, the positioning hole can be accurately formed simultaneously with the lens, for example, by injection molding.

  For example, the optical waveguide has a protruding piece portion protruding on the side surface of the end portion in the longitudinal direction. On the other hand, the IC socket has a groove portion extending in the vertical direction for fitting the protruding piece portion to restrict the position of the optical waveguide in the horizontal direction on the side surface of the groove-like concave portion in which the optical waveguide is disposed. Thereby, for example, at the time of assembly, the horizontal position of the optical waveguide is restricted by simply fitting the protruding portion of the optical waveguide into the groove of the IC socket. It can be omitted. As described above, when the optical waveguide is composed of the waveguide main body portion and the lens portion disposed at the end portion in the longitudinal direction of the waveguide main body portion, for example, a protruding piece portion is formed on the side surface of the lens portion. Then, a positioning hole is formed in the projecting piece. In this case, the projecting piece portion can be accurately formed simultaneously with the lens by, for example, injection molding.

  For example, the positioning pin includes a flange portion fixed to the back surface of the interposer with a first diameter, and a pin portion having a second diameter smaller than the first diameter and connected to the flange portion. The pin portion of the positioning pin is inserted into the positioning hole. On the other hand, the IC socket has a groove extending in the vertical direction for fitting the flange portion of the positioning pin to the side surface of the groove-shaped recess in which the optical waveguide is arranged to restrict the horizontal position of the interposer with respect to the IC socket. To be. As a result, for example, during assembly, the position of the interposer in the horizontal direction is restricted by simply fitting the flange portion of the positioning pin into the groove portion of the IC socket, thereby saving the time required for the horizontal alignment of the interposer. it can.

  In addition, you may make it further provide the urging means which urges | biases the part of the positioning hole of an optical waveguide so that it may press on the positioning pin of an interposer. Thereby, even if the positioning pin of the interposer is not bonded to the positioning hole of the optical waveguide, it can be prevented from coming out of the positioning hole. Thus, when the positioning pins of the interposer are not bonded to the positioning holes of the optical waveguide, the interposer and the optical waveguide can be easily separated at the time of disassembly.

  For example, as the biasing means, a coil spring disposed between the IC socket and the optical waveguide can be used. In this case, by providing an insertion hole for inserting one end side of the coil spring in the IC socket, the arrangement position of the coil spring at the time of assembly can be easily known, and the coil spring after assembly can be stably held. Further, for example, as the urging means, an elastic piece formed integrally with the IC socket and disposed between the IC socket and the optical waveguide can be used. In this case, there is an advantage that the number of members can be reduced and the arrangement work like a coil spring is not required.

  In addition, O-rings, washers, urethane sheets, and the like are also conceivable as the biasing means. Further, as an urging means, not only an urging means disposed between the IC socket and the optical waveguide and pressing the optical waveguide toward the interposer side, but also disposed between the interposer and the optical waveguide to attract the optical waveguide toward the interposer side. It may be a thing.

  Further, as described above, when the optical waveguide is composed of the waveguide main body portion and the lens portion that is disposed at the longitudinal end portion of the waveguide main body portion and has a positioning hole, Using the coupling chip, the ends of the first and second optical waveguides can be connected to extend the optical waveguide. In this case, by inserting the connecting pin of the lens forming portion of the optical waveguide coupling chip into the positioning holes formed in the lens portions of the first and second optical waveguides, the first, The end of the second optical waveguide can be easily connected.

  According to the present invention, the interposer on which the optical element is mounted on the back surface is fixed to the IC socket, and the optical waveguide is disposed on the IC socket so as to face the optical element. Is inserted into the positioning hole of the optical waveguide, and the relative positioning accuracy between the interposer and the optical waveguide can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view illustrating a configuration of a photoelectric composite device 100 as an embodiment.

  The photoelectric composite device 100 includes IC sockets 102a and 102b mounted on a printed wiring board (motherboard) 101, and a lens-integrated optical waveguide array 103 installed in the IC sockets 102a and 102b. . Each of the IC sockets 102a and 102b has an uneven structure having a cross-shaped groove-like recess 102d. As is well known in the art, the IC sockets 102a and 102b are made of, for example, an insulating resin such as a glass-filled PES (polyethylene sulfide) resin, a glass-filled PET (polyethylene terephthalate) resin, or the like, and a mold having an uneven structure. It is formed.

  Each of the IC sockets 102a and 102b includes a groove 102f extending in the vertical direction on the side surface of the groove-shaped recess 102d. The groove portion 102f is for fitting a protruding piece portion (not shown in FIG. 1) formed on the lens portion 103b of the optical waveguide array 103, and regulates the horizontal position of the optical waveguide array 103. . Further, the groove portion 102f is fitted with a flange portion 111a of the positioning pin 111 fixed to the back surfaces of the interposers 106a and 106b, and regulates the horizontal position of the interposers 106a and 106b.

  Thus, by providing the IC socket 102a, 102b with the groove portion 102f that regulates the horizontal position of the optical waveguide array 103 and the interposers 106a, 106b, for example, the lens portion 103b of the optical waveguide array 103 is assembled during assembly. The horizontal position of the optical waveguide array 103 can be adjusted only by fitting the formed projecting piece portion into the groove portion 102f, and the flange portion 111a of the positioning pin 111 fixed to the back surface of the interposers 106a and 106b. It is possible to align the positions of the interposers 106a and 106b in the horizontal direction simply by fitting them into the grooves 102f, and to save the labor of alignment.

  The optical waveguide array 103 is bridged between the IC socket 102a and the IC socket 102b. Both ends in the longitudinal direction of the optical waveguide array 103 are respectively disposed in groove-like recesses 102d of the IC sockets 102a and 102b. The optical waveguide array 103 includes a waveguide main body portion 103a and a lens portion 103b disposed at an end portion in the longitudinal direction of the waveguide main body portion 103a.

  The waveguide main body 103a includes optical waveguides for a plurality of channels by imprinting a core layer on a low-rigidity resin sheet. The lens portion 103b is formed by injection molding using an optical resin, and includes lens arrays 104 and 105. The lens array 104 includes a plurality of lenses (condenser lenses) for inputting optical signals to the optical waveguide. The lens array 105 includes a plurality of lenses (collimator lenses) for outputting an optical signal from the optical waveguide.

  For example, the optical waveguide array 103 is manufactured by imprinting a core layer on a low-rigidity resin sheet to obtain a waveguide main body portion 103a, and then aligning and bonding the injection-molded lens portion 103b. Further, for example, the optical waveguide array 103 is obtained by bonding a low-rigidity resin sheet to an injection-molded lens portion 103b and then imprinting a core layer on the resin sheet to obtain a waveguide main body portion 103a. Manufactured.

  Since the optical waveguide array 103 is composed of the waveguide main body portion 103a and the lens portion 103b as described above, the lens portion 103b has necessary rigidity at both ends where the optical signal of the optical waveguide array 103 is input / output. Other parts can be made thin and flaky. Thereby, for example, the accuracy of the mounting position of the IC sockets 102a, 102b on which the optical waveguide array 103 is installed on the printed wiring board 101 can be moderated, and the working efficiency during assembly can be increased.

  In addition, the photoelectric composite device 100 includes ceramic interposers 106a and 106b fixed on the convex surfaces of the IC sockets 102a and 102b, respectively. A light emitting element array 107 and a light receiving element array 108 as optical elements are mounted on the back surface of the interposer 106a, and a semiconductor chip 109a, for example, a CPU is mounted on the front surface. The light emitting element array 107 and the light receiving element array 108 are electrically connected to the semiconductor chip 109a through the inside of the interposer 106a. An aluminum fin 110 as a heat sink is provided on the upper surface of the semiconductor chip 109a.

  Similarly, a light emitting element array 107 and a light receiving element array 108 as optical elements are mounted on the back surface of the interposer 106b, and a semiconductor chip 109b is mounted on the front surface. The light emitting element array 107 and the light receiving element array 108 are electrically connected to the semiconductor chip 109b through the inside of the interposer 106b.

  The light emitting element array 107 has a configuration in which a plurality of light emitting elements, for example, surface emitting lasers (VCSELs) are arranged. The light receiving element array 108 has a structure in which a plurality of light receiving elements, for example, photodiodes are arranged. The optical waveguide array 103 described above is installed so that the optical waveguides of the respective channels face the light emitting elements of the light emitting element array 107 and the light receiving elements of the light receiving element array 108, respectively. Here, the light emitting element emits an optical signal incident on the optical waveguide. The light receiving element receives an optical signal emitted from the optical waveguide.

  Next, the positioning mechanism of the interposers 106a and 106b and the optical waveguide array 103 in the above-described photoelectric composite device 100 will be described.

  The interposers 106a and 106b have positioning pins 111 planted downward on the back surfaces thereof. The positioning pins 111 are attached with high accuracy to metal pads (not shown in FIG. 1) provided on the back surfaces of the interposers 106a and 106b by, for example, a self-alignment mounting method. The positioning pin 111 includes a flange portion 111a having a first diameter fixed to the interposers 106a and 106b, and a pin portion 111b having a second diameter smaller than the first diameter and connected to the flange portion 111a. ing.

  The optical waveguide array 103 has positioning holes 112 for inserting the pin portions 111b of the positioning pins 111 of the interposers 106a and 106b described above at both ends. Here, the positioning hole 112 is formed in the lens portion 103b. Since the positioning hole 112 is formed in the lens portion 103b as described above, the positioning hole 112 can be formed with high accuracy by, for example, injection molding simultaneously with the lens (lens arrays 104 and 105).

  The diameter of the positioning hole 112 is slightly smaller than the diameter of the pin portion 111 b of the positioning pin 111. For example, when the diameter of the pin portion 111b of the positioning pin 111 is 2.1 mm (φ = 2.1 mm), the diameter of the positioning hole 112 is 2.0 mm (φ = 2.0 mm). Thereby, when the pin portion 111b of the positioning pin 111 is inserted into the positioning hole 112, the resin is deformed in the positioning hole 112 to be in a press-fitted state, and play after positioning is suppressed.

  The positioning of the interposers 106a and 106b and the optical waveguide array 103 is performed by inserting the pin portions 111b of the positioning pins 111 included in the above-described interposers 106a and 106b into the positioning holes 112 of the optical waveguide array 103.

  Further, the IC sockets 102a and 102b have insertion holes 102g at positions facing the positioning pins 111 of the above-described interposers 106a and 106b, respectively. One end side of the coil spring 113 is inserted into the insertion hole 102g. That is, the coil spring 113 is disposed between the IC sockets 102 a and 102 b and the optical waveguide array 103, and the other end is in contact with the lens portion 103 b of the optical waveguide array 103.

  The coil spring 113 constitutes an urging means for urging the portion of the positioning hole 112 formed in the lens portion 103b to be pressed against the positioning pins 111 of the interposers 106a and 106b. The biasing action of the coil spring 113 allows the positioning pin 111 to come out of the positioning hole 112 even if the positioning pin 111 of the interposers 106a and 106b is not bonded to the positioning hole 112 of the lens portion 103b. Since the positioning pins 111 do not have to be bonded to the positioning holes 112, the interposers 106a and 106b and the optical waveguide array 103 can be easily separated at the time of disassembly.

  Also, the IC sockets 102a and 102b are provided with an insertion hole 102g, and one end of the coil spring 113 is inserted into the insertion hole 102g, and the arrangement position of the coil spring 113 can be easily known during assembly. The subsequent coil spring 113 can be stably held.

  Although not described in detail, each of the interposers 106a and 106b is provided with a biasing force applied to the IC sockets 102a and 102b, for example, at its four corners and pressed against the IC sockets 102a and 102b. It is fixed on 102a, 102b.

  FIG. 2 is a schematic perspective view of the photoelectric composite device 100 described above. In FIG. 2, the printed wiring board 101 and the aluminum fins 109 are not shown.

  Next, each member constituting the above-described photoelectric composite device 100 will be described in more detail. 3A and 3B show the configuration of the IC socket 102 (corresponding to each of the IC sockets 102a and 102b). 3A is a schematic perspective view of the IC socket 102 viewed from the front surface side, and FIG. 3B is a schematic perspective view of the IC socket 102 viewed from the back surface side.

  As shown in FIG. 3A, the surface side of the IC socket 102 has a concave-convex structure having a cross-shaped groove-shaped concave portion 102d. The depth of the recess 102d is made larger than the thickness of the optical waveguide array 103, and a space is formed between the optical waveguide array 103, the light emitting element array 107, and the light receiving element array 108 at the time of mounting.

  On the convex surface of the IC socket 102, a rod shape, a leaf spring shape, and the like for taking electrical contact with the electrode pad 151 provided on the back surface of the interposers 106a and 106b (see FIG. 1) fixed on the convex surface. A plurality of spiral electrode pins 121 are provided. In FIG. 3A, a rod-shaped electrode pin 121 is shown.

  Further, as shown in FIG. 3B, a plurality of electrode contacts 122 such as solder bumps are provided on the back surface of the IC socket 102 for electrical connection with electrodes on the printed wiring board 101 (see FIG. 1). One is provided. The electrode contact 122 is electrically connected within the IC socket 102 to the electrode pin 121 provided on the convex surface.

  Further, a groove 102f having a semicircular cross section extending in the vertical direction is provided on the side surface of the recess 102d of the IC socket 102. Further, as shown in FIGS. 3A and 3B, an insertion hole (through hole) 102 g for inserting one end of the coil spring 113 is provided on the bottom surface of the recess 102 d of the IC socket 102. As will be described later, since twelve positioning pins 111 are provided on the back surfaces of the interposers 106a and 106b, twelve insertion holes 102g are also provided.

  In this IC socket 102, four optical waveguide arrays 103 (see FIG. 1) can be installed from a maximum of four directions using a cross-shaped groove-shaped recess 102d. Therefore, of the 12 insertion holes 102g described above, three insertion holes 102g corresponding to the respective directions are coil springs that urge the optical waveguide array 103 installed from the respective directions toward the interposers 106a and 106b. Used to insert 113. Of the three insertion holes 102g corresponding to the respective directions, two insertion holes 102g are formed continuously with the groove 102f.

  4A and 4B show the configuration of the interposer 106 (corresponding to each of the interposers 106a and 106b). 4A is a schematic perspective view of the interposer 106 viewed from the front surface side, and FIG. 4B is a schematic perspective view of the interposer 106 viewed from the back surface side.

  A semiconductor chip 109 (corresponding to the semiconductor chips 109a and 109b) is mounted on the surface of the interposer 106, as shown in FIG. 4A. Although FIG. 4A shows a case where one semiconductor chip 109 is mounted, the number of semiconductor chips 109 to be mounted is not limited to one. Further, as shown in FIG. 4B, a light emitting element array 107 and a light receiving element array 108 are mounted on the back surface of the interposer 106.

  As described above, since four optical waveguide arrays 103 can be installed in the IC socket 102 from a maximum of four directions, the optical waveguide array 103 installed from each direction is provided on the back surface of the interposer 106. Corresponding to the above, four sets of light emitting element array 107 and light receiving element array 108 are mounted. The light emitting element array 107 and the light receiving element array 108 are connected to the semiconductor chip 109 via the interposer 106.

  Also, on the back surface of the interposer 106, as shown in FIG. 4B, there are a plurality of electrode pads 151 for making electrical contact with the electrode pins 121 (see FIG. 3) provided on the convex surface of the IC socket 102 described above. One is provided.

  Further, as shown in FIG. 4B, twelve metal positioning pins 111 are planted downward on the back surface of the interposer 106. As described above, four optical waveguide arrays 103 (see FIG. 1) can be installed in the IC socket 102 from four directions at maximum using the cross-shaped groove-shaped recess 102d. Therefore, among the 12 positioning pins 111 described above, three positioning pins 111 corresponding to the respective directions are inserted into the positioning holes 112 of the optical waveguide array 103 installed from the respective directions. Used for.

  In this case, three positioning pins 111 corresponding to the respective directions are arranged at positions surrounding the optical elements (the light emitting element array 107 and the light receiving element array 108) mounted on the back surface of the interposer 106. In this embodiment, three positioning pins 111 are arranged corresponding to each direction, but four or more positioning pins 111 may be arranged so as to surround the optical element. However, when the number of positioning pins 111 is increased, the arrangement area of the electrode pads 151 is narrowed. When the number of positioning pins 111 is increased in this way, the number of positioning holes 112 in the optical waveguide array 103 and the number of insertion holes 102g in the IC socket 102 are increased accordingly.

  5A and 5B show the configuration of the optical waveguide array 103. FIG. FIG. 5A is a schematic perspective view of the optical waveguide array 103 as viewed from the surface side, and FIG. 5B is a schematic plan view of the optical waveguide array 103.

  As described above, the optical waveguide array 103 includes the waveguide main body portion 103a and the lens portion 103b, and the lens portion 103b is arranged at the end in the longitudinal direction of the waveguide main body portion 103a. Two concave portions having a rectangular cross section are formed in the lens portion 103b, and lens arrays 104 and 105 (lens illustration is omitted in FIGS. 5A and 5B) are formed on the bottom portion of the concave portion.

  The lens portion 103b is formed with three projecting pieces 131a to 131c at positions surrounding the lens arrays 104 and 105. The protruding piece 131a is formed at the tip, and the remaining protruding pieces 131b and 131c are formed at both ends. When the optical waveguide array 103 is disposed in the concave portion 102d of the IC socket 102, the protruding piece portions 131b and 131c are fitted into a groove portion 102f (see FIGS. 1 and 3) formed on the side surface of the concave portion 102d. Thereby, the horizontal position restriction of the optical waveguide array 103 is performed.

  As described above, in the case where the protrusions 131b and 131c for restricting the position of the optical waveguide array 103 in the horizontal direction are formed on the lens part 103b, the protrusions 131b and 131c are connected to the lens arrays 104 and 105, respectively. At the same time, it can be formed with high accuracy by, for example, injection molding.

  The positioning hole 112 described above is formed in each of the three protruding pieces 131a to 131c described above. As described above, since the projecting piece portions 131a to 131c are formed at positions surrounding the lens arrays 104 and 105, the three positioning holes 112 formed in these three projecting piece portions 131a to 131c are lenses. It is arranged at a position surrounding the arrays 104 and 105.

  The three positioning holes 112 are inserted with the pin portions 111b of the three positioning pins 111 installed so as to surround the optical elements (the light emitting element array 107 and the light receiving element array 108) of the interposer 106. The Accordingly, it can be said that the three positioning holes 112 formed in the three projecting pieces 131a to 131c are arranged at positions surrounding the optical element.

  In this way, the positioning hole 112 for inserting the positioning pin 111 of the interposer 106 is disposed at a position surrounding the lens arrays 104 and 105, and thus at a position surrounding the optical elements (the light emitting element array 107 and the light receiving element array 108). The expansion or contraction of the optical waveguide array 103 can be satisfactorily followed by the two-dimensional expansion or contraction of the interposer 106 due to the temperature change of the use environment. Thereby, it is possible to reduce the deviation between the optical axis of the optical element and the optical axis of the lens due to a temperature change, and it is possible to reduce the light amount loss due to the deviation of the optical axis.

  Next, detailed configurations of the optical waveguide array 103, the light emitting element array 107, and the light receiving element array 108 will be described with reference to FIGS.

  6C is a plan view of the optical waveguide array 103 as viewed from the front side, and FIG. 6D is a cross-sectional view of the optical waveguide array 103 cut in the lateral direction (longitudinal direction). 6C and 6D show only one end portion of the optical waveguide array 103, the other end portion is similarly configured.

  As described above, the optical waveguide array 103 is configured by bonding the lens portion 103b to the end portion in the longitudinal direction of the waveguide main body portion 103a. Two concave portions are formed in the lens portion 103b, and lens arrays 104 and 105 including a plurality of lenses 104a and 105a are formed on the bottom surface of the concave portion.

  The waveguide body 103 a has a structure in which a core layer 135 is sandwiched between upper and lower cladding layers 136 and 137. In this case, the optical waveguide is configured by making the refractive index of the core layer 135 higher than that of the cladding layers 136 and 137. For example, UV curing optical resin (for example, refractive index is 1.6) is used as the material for the core layer 135, and optical injection molding resin (for example, refractive index is 1.5) as the material for the cladding layers 136 and 137. Is used.

  Here, the clad layer 136 is made of a low-rigidity resin sheet, and the core layer 135 is imprinted on the resin sheet. The clad layer 137 is made of a low-rigidity resin sheet similarly to the clad layer 136 described above, and also has a function as a cover layer of the core layer 135.

  In the core layer 135, a plurality of optical waveguides, that is, a plurality of transmission optical waveguides 138 and a plurality of reception optical waveguides 139 are formed. At the other end, the transmission optical waveguide 138 becomes a reception optical waveguide 139, and the reception optical waveguide 139 becomes a transmission optical waveguide 138.

  In this case, the transmission optical waveguide 138 and the reception optical waveguide 139 are alternately arranged in the width direction of the optical waveguide array 103. Further, the end positions of the plurality of transmission optical waveguides 138 arranged in the width direction of the optical waveguide array 103 are sequentially shifted in the length direction. Similarly, the end positions of a plurality of receiving optical waveguides 139 arranged in the width direction of the optical waveguide array 103 are sequentially shifted in the length direction. Further, the end portions of the plurality of transmission waveguides 138 are positioned closer to the end portion side of the optical waveguide array 103 than the end portions of the plurality of reception waveguides 139.

  An end 138a of the transmission optical waveguide 138 is a 45 ° mirror surface. Thereby, the optical signal generated by the light emitting elements of the light emitting element array 107 can be reflected by the end 138a toward the longitudinal direction of the optical waveguide 138, and the optical signals can be transmitted efficiently. The end portion 139a of the receiving optical waveguide 139 is also a 45 ° mirror surface. Thus, the optical signal transmitted through the optical waveguide 139 can be reflected by the end 139a toward the light receiving element side of the light receiving element array 108, and the optical signal can be received efficiently.

  When the lens portion 103b is bonded to the waveguide main body 103a, the optical axis of each lens 104a of the lens array 104 and the end portion 138a of each transmission optical waveguide 138 coincide with each other, and each lens array 105 The position is adjusted so that the optical axis of the lens 105a and the end 139a of each transmission optical waveguide 139 coincide. In this case, the lens 104a corresponding to the end portion 138a of the transmission optical waveguide 138 functions as a condensing lens that condenses parallel light from the light emitting element side of the light emitting element array 107 on the end portion 138a. On the other hand, the lens 105a corresponding to the end portion 139a of the receiving optical waveguide 139 functions as a collimating lens that makes divergent light from the end portion 139a parallel.

  FIG. 6A shows a light emitting element array 107 and a lens array 141 (not shown in FIG. 1) attached to the light emitting element array 107. The light emitting element array 107 includes a plurality of light emitting elements 161 corresponding to the end portions 138a of the plurality of transmission optical waveguides 138 of the optical waveguide array 103 described above. The light emitting element 161 is, for example, a surface emitting laser, and a laser beam as an optical signal is emitted from the lower surface side. Further, on the upper surface side of the light emitting element array 107, electrode pads 162 connected to the respective light emitting elements 161 through metal wirings are provided. The lens array 141 is formed with a plurality of lenses 142 respectively corresponding to the plurality of light emitting elements 161 of the light emitting element array 107. The lens 142 functions as a collimating lens that changes the divergent light from the light emitting element 161 into parallel light.

  FIG. 6B shows the light receiving element array 108 and the lens array 143 (not shown in FIG. 1) attached thereto. The light receiving element array 108 includes a plurality of light receiving elements 163 corresponding to the end portions 139a of the plurality of receiving optical waveguides 139 of the optical waveguide array 103 described above. The light receiving element 163 is, for example, a photodiode, and a laser beam as an optical signal is incident from the lower surface side. Further, on the upper surface side of the light receiving element array 108, electrode pads 164 connected to the respective light receiving elements 163 through metal wirings are provided. The lens array 143 is formed with a plurality of lenses 144 respectively corresponding to the plurality of light receiving elements 163 of the light receiving element array 108. The lens 144 functions as a condensing lens that condenses parallel light from the receiving optical waveguide 139 side of the optical waveguide array 103 on the light incident surface of the light receiving element 163.

  Next, an example of a method for manufacturing the photoelectric composite device 100 illustrated in FIG. 1 will be described.

  First, IC sockets 102 a and 102 b are mounted on the printed wiring board 101. In this case, the electrodes on the printed wiring board 101 and the electrode contacts 122 on the back surfaces of the IC sockets 102a and 102b are aligned so that the electrodes on the printed wiring board 101 and the IC sockets 102a and 102b are electrically connected. Implement as follows. On the printed wiring board 101, other electronic components are mounted and electric wiring is performed in advance.

  Next, a coil spring 113 for pressing the portion of the positioning hole 112 against the positioning pins 111 of the interposers 106a and 106b is disposed in correspondence with the positioning holes 112 of the optical waveguide array 103 to be installed. That is, in this case, one end of each coil spring 113 is inserted into the insertion hole 102g of the IC sockets 102a and 102b corresponding to the positioning hole 112 of the installed optical waveguide array 103.

  Next, the optical waveguide array 103 is installed in the IC sockets 102a and 102b, and the optical waveguide array 103 is bridged between the IC sockets 102a and 102b. In this case, both end portions of the optical waveguide array 103 are disposed in the groove-like recesses 102d of the IC sockets 102a and 102b, respectively.

  In this case, the two projecting piece portions 131b and 131c formed at the side end of the lens portion 103b of the optical waveguide array 103 are fitted into the groove portions 102f formed on both side surfaces of the concave portion 102d, respectively. Thereby, the horizontal position restriction of the optical waveguide array 103 is automatically performed.

  The length of the optical waveguide array 103 installed in the IC sockets 102a and 102b is preferably longer than the distance between the IC sockets 102a and 102b. Thereby, the optical waveguide array 103 can be fixed in a bent state, and positioning errors on the printed wiring board 101 of the IC sockets 102a and 102b can be absorbed.

  Next, the interposer 106a is fixed on the convex surface of the IC socket 102a. In this case, of the twelve positioning pins 111 attached to the back surface of the interposer 106a, the flange portion 111a of the positioning pin 111 corresponding to the groove portion 102f formed on the side surface of the concave portion 102d of the IC socket 102a is the groove portion. 102f. Thereby, the horizontal position restriction of the interposer 106a is automatically performed.

  In this case, the pin portion 111 b of the positioning pin 111 of the interposer 106 a corresponding to the installed optical waveguide array 103 is inserted (press-fitted) into the positioning hole 112 of the lens portion 103 b of the optical waveguide array 103. Thereby, the relative positioning of the interposer 106a and the optical waveguide array 103 is performed. In this case, the coil spring 113 urges the positioning hole 112 of the optical waveguide array 103 to be pressed against the positioning pin 111 of the interposer 106a. This prevents the positioning pins 111 from coming out of the positioning holes 112 without bonding the positioning pins 111 of the interposer 106a to the positioning holes 112 of the lens portion 103b.

  When the interposer 106a is fixed on the convex surface of the IC socket 102a in this way, the interposer 106a is given a biasing force toward the IC socket 102a, for example, at its four corners, and the interposer 106a is applied to the IC socket 102a. It is in a pressed state.

  Next, aluminum fins 110 are installed on the upper surface of the semiconductor chip 109a mounted on the surface of the interposer 106a. Thereby, the heat generated in the semiconductor chip 109a can be efficiently radiated through the fins 110.

  Next, the interposer 106b is fixed on the convex surface of the IC socket 102b in the same manner as the case where the interposer 106a is fixed on the convex surface of the IC socket 102a. In this case, the interposer 106b is given a biasing force toward the IC socket 102b, for example, at its four corners, and the interposer 106b is pressed against the IC socket 102b.

  FIG. 7 is an enlarged view of a portion related to the positioning mechanism of the interposer 106a and the optical waveguide array 103 on the IC socket 102a side. In FIG. 7, parts corresponding to those in FIGS. 1 and 6 are given the same reference numerals.

  A semiconductor chip 109a is mounted on the surface of the interposer 106a. In this case, a solder bump 154 is interposed between the electrode pad 152 on the surface of the interposer 106a and the electrode pad 181 on the lower surface of the semiconductor chip 109a, and the semiconductor chip 109a is soldered to the surface of the interposer 106a.

  A light emitting element array 107 is mounted on the back surface of the interposer 106a. In this case, a solder bump 155 is interposed between the electrode pad 153 on the back surface of the interposer 106a and the electrode pad 162 on the top surface of the light emitting element array 107, and the light emitting element array 107 is soldered to the back surface of the interposer 106a. A lens array 141 is attached to the lower surface of the light emitting element array 107.

  Further, the end portion of the optical waveguide array 103 is disposed in the groove-shaped recess 102d of the IC socket 102a. The positioning pins 111 are planted downward on the back surface of the interposer 106a by being soldered to metal pads 156 provided on the back surface of the interposer 106a. The pin portion 111 b of the positioning pin 111 is inserted (press-fit) into the positioning hole 112 formed in the lens portion 103 b of the optical waveguide array 103. Thereby, the relative positioning of the interposer 106a and the optical waveguide array 103 is performed.

  Further, the other end of the coil spring 113 having one end inserted into the insertion hole 102g of the IC socket 102a is brought into contact with the positioning hole 112 portion of the lens portion 103b, and the other end of the coil spring 113 is a portion of the positioning hole 112. Is pressed against the positioning pin 111 of the interposer 106a, and the positioning pin 111 is prevented from coming out of the positioning hole 112.

  FIG. 7 described above shows a portion related to the positioning mechanism of the interposer 106a and the optical waveguide array 103 on the IC socket 102a side. Although the description is omitted, the same applies to the part related to the positioning mechanism of the interposer 106b and the optical waveguide array 103 on the IC socket 102b side.

  The operation of the above-described photoelectric composite device 100 (see FIGS. 1, 6, and 7) will be described.

  On the IC socket 102a side, an electrical signal from the semiconductor chip 109a passes through the interior of the interposer 106a and is supplied to a light emitting element (for example, a surface emitting laser) 161 of the light emitting element array 107 mounted on the back surface thereof. Generates an optical signal whose intensity is modulated in response to the electrical signal.

  The light signal from the light emitting element 161 is converted from divergent light into parallel light by the lens 142 of the lens array 141 attached to the light emitting element array 107. The parallel light is condensed on the end portion (45 ° mirror surface) 138a of the transmission optical waveguide 138 by the lens 104a of the lens array 104 formed in the lens portion 103b constituting the optical waveguide array 103, and the length of the optical waveguide 138 is increased. Reflected in the direction side. Thereby, the optical signal generated by the light emitting element 161 of the light emitting element array 107 on the IC socket 102a side is transmitted to the IC socket 102b side through the transmission optical waveguide 138.

  On the IC socket 102b side, an optical signal transmitted through the receiving optical waveguide 139 (on the IC socket 102a side transmitting optical waveguide 138) is received at the end (45 ° mirror surface) 139a at the light receiving element 163 of the light receiving element array 108. Reflected to the side. The reflected optical signal is converted from divergent light into parallel light by the lens 105 a of the lens array 105 formed in the lens portion 103 b constituting the optical waveguide array 103. The parallel light is collected by the lens 144 of the lens array 143 attached to the light receiving element array 108 and is incident on the light incident surface of the light receiving element (eg, photodiode) 163.

  The optical signal is converted from an optical signal to an electrical signal by the light receiving element 163. This electrical signal passes through the interposer 106b and is supplied to the semiconductor chip 109b mounted on the surface thereof. Thereby, an electrical signal from the semiconductor chip 109a mounted on the interposer 106a on the IC socket 102a side is supplied to the semiconductor chip 109b mounted on the interposer 106b on the IC socket 102b side.

  Although not described, an electrical signal is supplied in the same manner from the semiconductor chip 109b on the IC socket 102b side to the semiconductor chip 109a on the IC socket 102a side.

  According to the above-described photoelectric composite device 100, the pin portion 111b of the positioning pin 111 fixed to the back surface of the interposers 106a and 106b is inserted into the positioning hole 112 formed in the lens portion 103b constituting the optical waveguide array 103. Thus, the relative positioning of the interposers 106a and 106b and the optical waveguide array 103 is performed, and the interposers 106a and 106b and the optical waveguide array 103 are directly connected by the positioning pins 111. Therefore, the relative positioning accuracy between the interposers 106a and 106b and the optical waveguide array 103 can be improved.

  Thereby, the space between adjacent elements in the light emitting element array 107 and the light receiving element array 108 can be reduced, the number of elements arranged in the same area can be increased, and the number of channels can be increased. Alternatively, when the number of elements is the same, the lens diameter corresponding to each element of the light-emitting element array 107 and the light-receiving element array 108 can be increased to reduce the light amount loss, thereby reducing power consumption.

  Further, according to the photoelectric composite device 100 described above, when the pin portion 111b of the positioning pin 111 of the interposers 106a and 106b is inserted into the positioning hole 112 of the optical waveguide array 103, the resin deformation of the positioning hole 112 is performed. Therefore, the play of the optical waveguide array 103 after positioning can be satisfactorily suppressed.

  Further, according to the above-described photoelectric composite device 100, the three positioning holes 112 are formed in the lens portion 103b constituting the optical waveguide array 103, and the positioning holes 112 for positioning the interposers 106a and 106b are formed in the three positioning holes 112. The pin portion 111b of the pin 111 is inserted, and the three positioning holes 112 are arranged so as to surround the lens arrays 104 and 105. Therefore, the interposers 106a and 106b of the interposers 106a and 106b due to the temperature change of the use environment. The extension or contraction of the optical waveguide array 103 can be satisfactorily followed with respect to the two-dimensional extension or contraction, and thereby the optical axis of the optical element (the light-emitting element array 107 and the light-receiving element array 108) due to temperature change. The deviation of the lens portion 103b from the optical axis of the lens is reduced, and the amount of light loss due to the deviation of the optical axis is reduced. It can be.

  In addition, according to the above-described photoelectric composite device 100, the projecting pieces 131b and 131c are formed on the lens portion 103b constituting the optical waveguide array 103, and at the time of assembly, the projecting pieces 131b and 131c are connected to the IC sockets 102a and 102b. By fitting into the groove 102f formed on the side surface of the recess 102d, the horizontal position regulation of the optical waveguide array 103 is automatically performed, and the horizontal alignment of the optical waveguide array 103 is adjusted. Save time and effort. Further, since the projecting piece portions 131b and 131c are formed on the lens portion 103b, the projecting piece portions 131b and 131c can be formed with high accuracy by, for example, injection molding simultaneously with the lens.

  Further, according to the above-described photoelectric composite device 100, the positioning pins 111 attached to the back surfaces of the interposers 106a and 106b are composed of the flange portion 111a and the pin portion 111b, and when assembled, the flange portion 111a is connected to the IC sockets 102a and 102b. The horizontal position of the interposers 106a and 106b is automatically regulated by being fitted into the groove 102f formed on the side surface of the concave portion 102d, and the horizontal alignment of the interposers 106a and 106b is performed. Save time and effort.

  Further, according to the photoelectric composite device 100 described above, the positioning holes 112 of the optical waveguide array 103 are formed in the protruding pieces 131a to 131c of the lens portion 103b, and are the same as the protruding pieces 131a to 131c. In addition, it can be formed at the same time as the lens with high accuracy, for example, by injection molding.

  Further, according to the above-described photoelectric composite device 100, the coil spring 113 urges the positioning hole 112 portion of the optical waveguide array 103 to be pressed against the positioning pins 111 of the interposers 106a and 106b. Even if the 111 is not bonded to the positioning hole 112, the positioning pin 111 can be prevented from coming out of the positioning hole 112.

  In the above embodiment, the coil spring 113 is used as the biasing means for biasing the portion of the positioning hole 112 of the optical waveguide array 103 so as to press the positioning pin 111 of the interposers 106a and 106b. However, the present invention is not limited to this.

  For example, an elastic piece integrally formed with the IC sockets 102a and 102b, an O-ring, a washer, a urethane sheet, or the like is also conceivable. Further, as an urging means, not only is it arranged between the IC sockets 102a, 102b and the optical waveguide array 103 and the optical waveguide array 103 is pressed toward the interposers 106a, 106b, but also the interposers 106a, 106b and the optical waveguides. It may be arranged between the waveguide array 103 and attract the optical waveguide array 103 toward the interposers 106a and 106b.

  FIG. 8 shows an example in which the biasing means is an elastic piece 114 formed integrally with the IC sockets 102a and 102b. By using such an elastic piece 114, there are the advantages that the number of members can be reduced, and that there is no need for arrangement work as in the case of using the coil spring 113.

  In the above-described embodiment, both the light emitting element array 107 and the light receiving element array 108 are mounted on the back surfaces of the interposers 106a and 106b. In the present invention, only one of them is mounted. It can be applied to the same thing.

As described above, it is conceivable to extend the optical waveguide by connecting another optical waveguide array 103 to the other end of the optical waveguide array 103 whose one end is fixed to the IC sockets 102a and 102b. Two optical waveguide array 103, that is, the optical waveguide coupling chip 500 for connecting the end of the first optical waveguide array 103 _-1 and the second optical waveguide array 103 _-2 explained.

9 and 10 show the configuration of the optical waveguide coupling chip 500. FIG. FIG. 9 is a schematic plan view of the optical waveguide coupling chip 500. FIG. 10 is a schematic side view of the optical waveguide coupling chip 500. 9 and 10 also show two optical waveguide arrays 103 (first optical waveguide array 103 _-1 and second optical waveguide array 103 _-2 ) connected by the optical waveguide coupling chip 500. Has been.

  The optical waveguide coupling chip 500 includes a lens forming portion 510 and a waveguide portion 520 bonded to the surface side of the lens forming portion 510. The waveguide portion 520 includes optical waveguides for a plurality of channels by imprinting a core layer on a low-rigidity resin sheet, similarly to the waveguide main body portion 103a of the optical waveguide array 103 described above.

The lens forming portion 510 is formed by injection molding using an optical resin, similarly to the lens portion 103b of the optical waveguide array 103 described above. The lens forming portion 510 includes lens arrays 504 _-1 and 505 _-1 corresponding to the lens arrays 104 and 105 included in the lens portion 103b of the first optical waveguide array 103 _-1 on the back surface side. Lens arrays 504 _-2 and 505 _-2 corresponding to the lens arrays 104 and 105 included in the lens portion 103b of the second optical waveguide array 103 _-2 are provided.

Each of the lens arrays 504 _-1 and 504 _-2 includes a plurality of lenses (collimator lenses) for outputting an optical signal from the optical waveguide. Each of the lens arrays 505 _-1 and 505 _-2 includes a plurality of lenses (condensing lenses) for inputting an optical signal to the optical waveguide. In this case, four concave portions having a rectangular cross section are formed on the back surface side of the lens forming portion 510, and lens arrays 505 _-1 , 504 _-1 , 504 _-2 , 505 _-2 (see FIG. 9, the lens is not shown in FIG.

  For example, the optical waveguide coupling chip 500 is manufactured by adhering a low-rigidity resin sheet to the injection-molded lens forming portion 510 and then imprinting a core layer on the resin sheet to obtain the waveguide portion 520. Is done. Further, for example, the optical waveguide coupling chip 500 is manufactured by imprinting a core layer on a low-rigidity resin sheet to obtain a waveguide portion 520, and then aligning and bonding an injection-molded lens forming portion 510. The

The optical waveguide coupling chip 500, which has three connecting pins 506 _-1 for insertion respectively into the first optical waveguide array 103 _-1 of the lens portion 103b three positioning holes 112 provided in, first It has three connecting pins 506 _-2 for the three positioning holes 112 provided in the second optical waveguide array 103 _-2 lens portion 103b inserted respectively. These connecting pins 506 _-1 and 506 _-2 are respectively planted on the back side of the lens forming portion 510.

In this case, the diameters of the connecting pins 506 _-1 and 506 _-2 are slightly larger than the diameter of the positioning hole 112. As a result, when the connecting pins 506 _-1 and 506 _-2 are inserted into the positioning holes 112, the positioning holes 112 are in a press-fitted state due to resin deformation, and play after positioning is suppressed.

11A and 11B are schematic cross-sectional views of the optical waveguide coupling chip 500 cut in the lateral direction (longitudinal direction). Figure 11A is a portion corresponding to the first optical waveguide array 103 _-1 (hereinafter referred to as "left side portion"), FIG. 11B is a portion corresponding to the second optical waveguide array 103 ₂ (hereinafter referred to as " Right side part). The optical waveguide coupling chip 500 will be further described with reference to FIGS. 11A and 11B.

  The waveguide section 520 has a structure in which a core layer 521 is sandwiched between upper and lower cladding layers 522 and 533. In this case, the optical waveguide is configured by making the refractive index of the core layer 521 higher than that of the cladding layers 522 and 523. For example, UV curing optical resin (for example, refractive index is 1.6) is used as the material for the core layer 521, and optical injection molding resin (for example, refractive index is 1.5) as the material for the cladding layers 522 and 523. Is used.

  Here, the clad layer 522 is made of a low-rigidity resin sheet, and the core layer 521 is imprinted on the resin sheet. The clad layer 523 is made of a low-rigidity resin sheet similarly to the clad layer 522 described above, and also has a function as a cover layer of the core layer 521.

  In the core layer 521, a plurality of optical waveguides, that is, a plurality of optical waveguides 524 and a plurality of optical waveguides 525 are formed. The optical waveguide 524 constitutes a transmission optical waveguide in the left side portion (see FIG. 11A) of the optical waveguide coupling chip 500, and constitutes a reception optical waveguide in the right side portion (see FIG. 11B). The optical waveguide 525 constitutes a receiving optical waveguide in the left part (see FIG. 11A) of the optical waveguide coupling chip 500, and constitutes a transmitting optical waveguide in the right part (see FIG. 11B).

  Although the detailed description of the arrangement relationship between the plurality of optical waveguides 524 and the plurality of optical waveguides 525 is omitted, the arrangement of the plurality of optical waveguides 138 and the plurality of optical waveguides 139 in the optical waveguide array 103 described above is omitted. This is the same as the relationship (see FIG. 6C).

The end 524a of the optical waveguide 524 is a 45 ° mirror surface. Therefore, in the left portion of the optical waveguide coupling chip 500 (see FIG. 11A), reflecting the longitudinal side of the optical waveguide 524 at the end 524a of the optical signal from the lens array 105 of the first optical waveguide array 103 _-1 be able to. Also, the right side portion thereof (see FIG. 11B), it is possible to reflect light signals the sent optical waveguides 524 to lens array 104 side of the second optical waveguide array 103 _-2 this end 524a.

Similarly, the end 525a of the optical waveguide 525 is a 45 ° mirror surface. Therefore, the right portion of the optical waveguide coupling chip 500 (see FIG. 1B), is reflected in the longitudinal direction of the optical waveguide 525 at the end 525a of the optical signal from the lens array 105 of the second optical waveguide array 103 _-2 be able to. Further, the in the left part (see FIG. 11A), it is possible to reflect light signals the sent optical waveguides 525 to the first lens array 104 side of the optical waveguide array 103 _-1 at this end 525a.

When the lens forming portion 510 is bonded to the waveguide portion 520, the optical axes of the lenses 505a _-1 and 504a _-2 of the lens arrays 505 _-1 and 504 _-2 and the end portion 524a of the optical waveguide 524 are connected. The positions of the lens arrays 505 _-2 and 504 _-1 are adjusted so that the optical axes of the lenses 505a _-2 and 504a _-1 coincide with the end portion 525a of the optical waveguide 525.

In this case, the lens 505a _-1 corresponding to the end portion 524a of the optical waveguide 524 of the lens array 505 _-1, condensing the collimated light from the lens array 105 of the first optical waveguide array 103 _-1 to the end 524a It works as a condenser lens. Further, the lens 504a _-2 corresponding to the end 524a of the optical waveguide 524 of the lens array 504 _-2 functions as a collimating lens that makes divergent light from the end 524a parallel.

Similarly, the lens 505a _-2 corresponding to the end portion 525a of the optical waveguide 525 of the lens array 505 _-2, condenses the parallel light from the lens array 105 of the second optical waveguide array 103 _-2 the end 525a It works as a condenser lens. The lens 504a _-1 corresponding to the end portion 525a of the optical waveguide 525 of the lens array 504 _-1 serves a collimator lens for a divergent light from the end portion 525a into parallel light.

The optical waveguide coupling chip 500 is configured as described above. When this optical waveguide coupling chip 500 connecting the ends of the first optical waveguide array 103 _-1 and the second optical waveguide array 103 _-2 as shown in FIG. 12, the lens of the optical waveguide coupling chip 500 three connecting pin 506 _-1 three formed in the left side portion of the forming portion 510 is inserted into the three positioning holes 112 of the first optical waveguide array 103 _-1, respectively, also formed in the right portion thereof The connecting pins 506 _-2 are respectively inserted into the three positioning holes 112 of the second optical waveguide array 103 _-2 .

FIG. 13 is a schematic cross-sectional view in which a joint portion between the right side portion of the optical waveguide coupling chip 500 and the second optical waveguide array 103 _-2 is cut in the lateral direction (longitudinal direction). Although not shown, the same applies to the joint portion between the left portion and the first optical waveguide array 103 _-1 of the optical waveguide coupling chip 500.

If the end of the first optical waveguide array 103 _-1 and the second optical waveguide array 103 _-2 are connected by an optical waveguide coupling chip 500, the first optical waveguide array 103 _-1 and the second optical waveguide array 103 is optically connected to realize extension of the optical waveguide.

In this case, an optical signal emitted from the lens array 105 of the first optical waveguide array 103 _-1 is incident on the lens array 505 _-1 of the lens forming section 510, is transmitted by the optical waveguide 524 of the waveguide 520, emitted from the lens array portion 504 _-2 lens forming section 510, it is incident on the lens array 104 of the second optical waveguide array 103 _-2. Similarly, an optical signal emitted from the lens array 105 of the second optical waveguide array 103 _-2 is incident on the lens array 505 _-2 lens forming section 510, is transmitted by the optical waveguide 525 of the waveguide 520, emitted from the lens array portion 504 _-1 of the lens forming section 510, it is incident on the lens array 104 of the first optical waveguide array 103 _-1.

  Next, an example of an electronic apparatus to which the above-described photoelectric composite device can be actually applied will be briefly described.

  FIG. 14 shows the configuration of the computer system 200. The computer system 200 includes a CPU (Central Processing Unit) 201, a north bridge 202 as a memory controller, a DRAM (Dynamic Random Access Memory) 203, a south bridge 204 as an I / O controller, a bus 205, a network An interface (network I / F) 206, a storage device 207, and other input / output devices (I / O devices) 208 are provided.

  The north bridge 202 is connected to the CPU 201 via the optical wiring 211. The south bridge 204 is connected to the north bridge 202 via the optical wiring 212 and further connected to the CPU 201 via the optical wiring 211. The DRAM 203 is connected to the north bridge 202 through the optical wiring 213. The CPU 201 controls each unit based on an OS (Operating System) and application programs. The north bridge 202 performs overall control of access to the memory 203.

  The bus 205 is connected to the south bridge 204 via an electric wiring 214. The network interface 206, the storage device 207, and other I / O devices 208 are each connected to the bus 205. The storage device 207 is an HDD (Hard Disk Drive), a DVD (Digital Versatile Disk) drive, a CD (Compact Disc) drive, or the like. The I / O device 208 is a video input / output device, a serial or parallel interface, or the like.

FIG. 15 shows a configuration example of the optical wiring 210 (corresponding to each of the optical wirings 211 to 213). The optical wiring 210 has N-channel optical transmission systems 220 _{-1 to} 220 _-N . Each of the optical transmission systems 220 _{-1 to} 220 _-N includes a first transmission system 221 that transmits an optical signal from a first circuit (first electronic component) to a second circuit (second electronic component). The second transmission system 222 transmits an optical signal from the second circuit to the first circuit.

  The first transmission system 221 includes a parallel / serial converter (P / S converter) 221a, a driver amplifier 221b, a semiconductor laser 221c as a light emitting element, an optical waveguide 221d, a photodiode 221e as a light receiving element, and a transimpedance amplifier ( TIA) 221f, I / V conversion amplifier (IVA) 221g, and serial / parallel converter (S / P converter) 221h. In this case, the P / S converter 221a, the driver amplifier 221b, and the semiconductor laser 221c are arranged on the first circuit side, and the photodiode 221e, TIA 221f, IVA 221g, and the S / P converter 221h are arranged on the second circuit side. The optical waveguide 221d is disposed between the first circuit and the second circuit.

  Similarly, the second transmission system 221 includes a P / S converter 222a, a driver amplifier 222b, a semiconductor laser 222c, an optical waveguide 222d, a photodiode 222e, a TIA 222f, an IVA 222g, and an S / P converter 222h. In this case, the P / S converter 222a, the driver amplifier 222b, and the semiconductor laser 222c are arranged on the second circuit side, and the photodiode 222e, TIA 222f, IVA 222g, and the S / P converter 222h are arranged on the first circuit side. The optical waveguide 222d is disposed between the second circuit and the first circuit.

Here, S / P converter 221a, 222a, respectively, and converts data to be transmitted, for example, the 8-bit parallel data b ₀ ~b ₇ into serial data. The driver amplifiers 221b and 222b drive the semiconductor lasers 221c and 222c based on the serial data obtained by the S / P converters 221a and 222a, respectively, and output optical signals corresponding to the serial data from the semiconductor lasers 221c and 222c. generate. The TIAs 221f and 222f take impedance matching when supplying current signals generated by photoelectric conversion from the photodiodes 221e and 222e to the subsequent I / V conversion amplifiers 221g and 222g, respectively. The IVAs 221g and 222g convert current signals that are output signals of the TIAs 221f and 222f into voltage signals, respectively. The S / P converters 221h and 222h convert the transmitted serial data, which are output signals of the IVAs 221g and 222g, into parallel data.

  An operation when data is transmitted from the first circuit to the second circuit will be described. On the first circuit side, 8-bit parallel data to be transmitted is converted into serial data by the P / S converter 221a, and this serial data is supplied to the driver amplifier 221b. The driver amplifier 221b drives the semiconductor laser 221c, and an optical signal corresponding to the serial data is generated from the semiconductor laser 221c. Then, this optical signal is transmitted to the second circuit side through the optical waveguide 221d.

  On the second circuit side, the optical signal transmitted through the optical waveguide 221d is applied to the photodiode 221e. A current signal by photoelectric conversion from the photodiode 221e is supplied to the IVA 221g via the impedance matching TIA 221f and converted into a voltage signal. The transmitted serial data, which is an output signal of the IVA 221g, is converted into parallel data by the S / P converter 221h.

In this way, data is transmitted from the first circuit to the second circuit. Although detailed description is omitted, the operation for transmitting data from the second circuit to the first circuit is similarly performed. In optical wiring 210 shown in FIG. 15, since it has a light transmission system 220 _-1 to 220 _-N of N channels can be performed in parallel data transmission and reception of N channels.

  In the computer system 200 described above, semiconductor chips constituting the CPU 201, the north bridge 202, the DRAM 203, the south bridge 204, and the bus 205 as electronic components described above are mounted on a printed wiring board (motherboard) (not shown). In this case, the photoelectric composite device 100 shown in FIG. 1 can be applied to the CPU 201, the north bridge 202, the DRAM 203, and the south bridge 204, between the CPU 201 and the north bridge 202, between the DRAM 203 and the north bridge 202, and the north bridge 202. Signal transmission using an optical signal can be satisfactorily performed between the south bridges 204.

  FIG. 16 shows the configuration of the game machine 300. The game machine 300 includes an interface between a main CPU 301 that performs signal processing and control of internal components based on various application programs such as a game application program, a graphic processor (GP) 302 that performs image processing, and a network such as the Internet. Network interface (network I / F) 303 for performing the I / O, I / O processor (IOP) 304 for performing interface processing, and optical disc control for performing read control of the optical disc 305 such as a DVD or CD and decoding of the read data 306, DRAM 307 as main memory connected to main CPU 301, IOP memory 308 for holding instructions and data executed by IO processor 304, and operating system mainly. The OS-ROM 309 in which a program for Temu is stored, a sound processor unit (SPU) 310 for performing audio signal processing, and includes as a basic configuration and a sound buffer 311 for storing the compressed waveform data.

  The main CPU 301 and the network I / F 303 are connected by an optical wiring 312. The main CPU 301 and the graphic processor 302 are connected by an optical wiring 313. The main CPU 301 and the IO processor 304 are connected by an SBUS 314. The IO processor 304, the optical disc control unit 306, the OS-ROM 309, and the sound processor unit 310 are connected by an SSBUS 315.

  The main CPU 301 executes programs stored in the OS-ROM 309, various game application programs that are read from the optical disk 305 and loaded into the DRAM 307, or downloaded via a communication network. The graphic processor 302 performs a rendering process in a video game, for example, and outputs a video signal to a display.

  Connected to the IO processor 304 are a controller port 321 to which a controller (not shown) is connected, a memory card slot 322 in which a memory card (not shown) is loaded, a USB connection terminal 323 and an IEEE 1394 connection terminal 324. . As a result, the IO processor 304 is connected to the controller connected via the controller port 321, the memory card connected via the memory card slot 322, and the mobile phone or personal computer (not shown) connected via the USB connection terminal 323. Data transmission / reception, protocol conversion, etc.

  The sound processor unit 310 synthesizes various sounds by reproducing the compressed waveform data stored in the sound buffer 311 at a predetermined sampling frequency based on a command from the main CPU 301, and the audio signal is output to the speaker. Output.

  Note that the optical wirings 312 and 313 are respectively configured as shown in FIG. 15 described above. Between the main CPU 301 and the network I / F 303 and between the main CPU 301 and the graphic processor 302, data is transmitted by optical signals. Transmission / reception is performed.

  In the game machine 300 described above, a semiconductor chip as a basic configuration electronic component such as the main CPU 301 described above is mounted on a printed wiring board (motherboard) (not shown).

  In this case, the photoelectric composite device 100 shown in FIG. 1 can be applied to the main CPU 301, the graphic processor 302, and the network I / F 303, and between the main CPU 301 and the network I / F 303, between the main CPU 301 and the graphic processor 302, Signal transmission using an optical signal can be performed satisfactorily.

  FIG. 17 shows the configuration of the server 400. The server 400 includes CPUs 401 and 402, a chip set 403, a network interface (network I / F) 404, a memory 405, a PCI bridge 406, and a router 407 as basic configurations.

  CPUs 401 and 402 are connected to the chip set 403 through optical wirings 411 and 412, and a network I / F 404 is connected through optical wiring 413. Further, the memory 405, the PCI bridge 406, and the router 407 are connected to the chip set 403 by electric wiring. A network I / F 404 interfaces with a network. The chip set 403 controls the CPUs 401 and 402, the network I / F 404, the memory 405, the PCI bridge 406, and the like.

  PCI devices 415 to 416 such as storage devices are connected to the PCI bridge 406 via a PCI bus 414. The router 407 includes, for example, a switch card 421 and line cards 422 to 425. The line cards 422 to 425 are processors that perform preprocessing of packets, and the switch card 421 is a switch that switches the destination of packets according to addresses.

  Note that the optical wirings 411 to 413 are configured as shown in FIG. 15 described above. Between the CPUs 401 and 401 and the chip set 403 and between the chip set 403 and the network I / F 404, optical signals are used. Data is transmitted and received.

  In the server 400 described above, semiconductor chips as basic constituent electronic components such as the main CPUs 401 and 402 and the chip set 403 described above are mounted on a printed wiring board (motherboard) (not shown).

  In this case, the photoelectric composite device 100 shown in FIG. 1 can be applied to the CPUs 401 and 401, the chip set 403, and the network I / F 404, and between the CPUs 401 and 401 and the chip set 403, and between the chip set 403 and the network I / F 404. , The signal transmission using the optical signal can be performed satisfactorily.

  According to the present invention, an interposer on which an optical element is mounted on the back surface is fixed to an IC socket, and an optical waveguide is disposed on the IC socket so as to face the optical element. As a structure inserted into the positioning hole of the waveguide, the relative positioning accuracy between the interposer and the optical waveguide is increased, and can be applied to signal transmission between semiconductor chips such as LSIs.

It is a schematic sectional drawing of the photoelectric composite apparatus as embodiment. 1 is a schematic perspective view of a photoelectric composite device as an embodiment. It is a schematic perspective view which shows the structure of IC socket. It is a schematic perspective view which shows the structure of an interposer. It is the schematic perspective view and schematic plan view which show the structure of an optical waveguide array. It is a figure which shows detailed structure of an optical waveguide array, a light emitting element array, and a light receiving element array. It is a figure which shows the part which concerns on the positioning mechanism of an interposer and an optical waveguide array. It is a figure which shows the other example of the urging means of an optical waveguide array. It is a schematic plan view which shows the structure of an optical waveguide coupling chip. It is a schematic side view which shows the structure of an optical waveguide coupling chip. It is a schematic sectional drawing which shows the structure of a light guide waveguide coupling chip. It is a schematic side view which shows the connection state of two optical waveguide arrays by an optical derivation waveguide coupling chip. It is a schematic sectional drawing which shows the junction part of an optical waveguide guide chip and an optical waveguide array. It is a block diagram which shows the structure of a computer system. It is a figure for demonstrating the structural example of an optical wiring. It is a block diagram which shows the structure of a game machine. It is a block diagram which shows the structure of a server.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Photoelectric compound apparatus, 101 ... Printed wiring board, 102, 102a, 102b ... IC socket, 102d ... Recessed part, 102f ... Groove part, 102g ... Insertion hole, 103 ... Optical waveguide array, 103a ... Wave body, 103b ... Lens, 104,105 ... Lens array, 104a, 105a ... Lens, 106,106a, 106b ... Interposer, 107 ... -Light emitting element array, 108 ... Light receiving element array, 109, 109a, 109b ... Semiconductor chip, 111 ... Positioning pin, 111a ... Flange part, 111b ... Pin part, 112 ... Positioning hole 113... Coil spring 114. Elastic piece 131 a to 131 c Projection piece 135 135 Core layer 136 37 ... clad layer, 138 ... transmission optical waveguide, 138a ... end of transmission optical waveguide (45 [deg.] Mirror surface), 139 ... reception optical waveguide, 139a ... reception light Waveguide end (45 ° mirror surface), 141, 143 ... lens array, 142, 144 ... lens, 161 ... light emitting element, 163 ... light receiving element, 200 ... computer system, 210 ... Optical wiring, 300 ... Game machine, 400 ... Server, 500 ... Optical waveguide coupling chip, 504 _-1 , 504 _-2 , 505 _-1 , 505 _-2 ... Lens array, 504a _-1 , 504a _-2 , 505a _-1 , 505a _-2 ... lens, 506 _-1 , 506 _-2 ... connecting pin, 510 ... lens forming part, 520 ... waveguide part, 524 525 ... Optical waveguide, 524a, 25a ··· end

Claims (20)

IC socket,
An interposer in which an optical element is mounted on the back surface and fixed to the IC socket;
A photoelectric composite device comprising an optical waveguide installed in the IC socket so as to face the optical element,
The interposer has a positioning pin on the back surface,
The optical waveguide has a positioning hole for inserting the positioning pin,
The interposer positioning pin is inserted into the positioning hole of the optical waveguide. The interposer positioning pin is press-fitted into the positioning hole of the optical waveguide. The optical element is one or both of a light emitting element for emitting an optical signal incident on the optical waveguide and a light receiving element for receiving an optical signal emitted from the optical waveguide. Item 2. The photoelectric composite device according to Item 1. 2. The photoelectric composite device according to claim 1, wherein the optical waveguide has at least three positioning holes at a position surrounding an optical element mounted on a back surface of the interposer. The optical waveguide includes a waveguide main body portion and a lens portion disposed at an end portion in the longitudinal direction of the waveguide main body portion,
The photoelectric composite device according to claim 1, wherein the positioning hole is formed in the lens unit. The optical waveguide has a protruding piece portion protruding on the side surface in the longitudinal direction,
The IC socket has a groove-like recess for placing the optical waveguide, and a groove extending in the vertical direction for fitting the protruding piece to the side surface of the recess to regulate the position of the optical waveguide in the horizontal direction. The photoelectric composite device according to claim 1, wherein the photoelectric composite device is provided. The optical waveguide includes a waveguide main body portion and a lens portion disposed at an end portion in the longitudinal direction of the waveguide main body portion,
The photoelectric composite device according to claim 6, wherein the lens portion has the protruding piece portion on a side surface. The photoelectric composite device according to claim 7, wherein the positioning hole is formed in the projecting piece. The positioning pin includes a flange portion fixed to the back surface of the interposer with a first diameter, and a pin portion connected to the flange portion and having a second diameter smaller than the first diameter. The pin portion of the positioning pin is inserted into the positioning hole of the waveguide,
The IC socket has a groove-like concave portion in which the optical waveguide is disposed, and the flange portion of the positioning pin is fitted to a side surface of the concave portion to vertically regulate the interposer in the horizontal direction. The photoelectric composite device according to claim 1, further comprising an extending groove. 2. The photoelectric composite device according to claim 1, further comprising an urging unit that urges the positioning hole portion of the optical waveguide so as to press the positioning pin of the interposer. The biasing means is a coil spring disposed between the IC socket and the optical waveguide;
The photoelectric composite device according to claim 10, wherein the IC socket has an insertion hole into which one end side of the coil spring is inserted. 11. The photoelectric composite device according to claim 10, wherein the biasing means is an elastic piece that is formed integrally with the IC socket and disposed between the IC socket and the optical waveguide. An IC socket having a groove-shaped recess, an optical waveguide disposed in the recess, and an interposer having an optical element mounted on the back surface thereof, so that the optical element faces the optical waveguide,
An IC socket, comprising: a groove portion extending in a vertical direction for restricting a position in a horizontal direction of at least the optical waveguide or the interposer on a side surface of the groove-shaped concave portion. The interposer is inserted into the positioning hole of the optical waveguide with a flange portion fixed to the back surface of the interposer with a first diameter, connected to the flange portion, and with a second diameter smaller than the first diameter. Having a pin portion
The IC socket according to claim 13, wherein a flange portion of the positioning pin is fitted into the groove portion to restrict the position of the interposer in the horizontal direction. The optical waveguide has a protruding piece portion protruding on the side surface in the longitudinal direction,
The IC socket according to claim 13, wherein the projecting piece is fitted into the groove, and the horizontal position of the optical waveguide is restricted. It consists of a waveguide body part and a lens part disposed at the end in the longitudinal direction of the waveguide body part,
An optical waveguide characterized in that a positioning hole is formed in the lens portion. The lens part has a protruding piece part protruding from the side surface,
The optical waveguide according to claim 16, wherein the positioning hole is formed in the projecting piece. The optical waveguide according to claim 16, wherein at least three positioning holes are formed in the lens portion so as to surround the lens. Each of the first optical waveguide and the second optical waveguide is composed of a waveguide main body and a lens portion that is disposed at the longitudinal end of the waveguide main body and has a positioning hole. An optical waveguide coupling chip for connecting the ends,
A first lens corresponding to the lens of the lens portion of the first optical waveguide and a second lens corresponding to the lens of the lens portion of the second optical waveguide are formed, and the first optical waveguide and the first optical waveguide are formed. A lens forming portion having a connecting pin for insertion into a positioning hole formed in the lens portion of the optical waveguide of 2;
An optical waveguide coupling chip, comprising: a waveguide portion fixed to the lens forming portion and optically connecting between the first lens and the second lens. An electronic device comprising a plurality of electronic components,
A photoelectric composite device for performing signal transmission using an optical signal between the first electronic component and the second electronic component included in the plurality of electronic components is provided,
The photoelectric composite device is
IC socket,
An electronic component mounted on the front surface and an optical element mounted on the back surface, and an interposer fixed to the IC socket;
An optical waveguide installed in the IC socket so as to face the optical element,
The interposer has a positioning pin on the back surface,
The optical waveguide has a positioning hole for inserting the positioning pin,
The interposer positioning pin is inserted into the positioning hole of the optical waveguide.

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