JP2005037870A - Optical element loading substrate, its manufacturing method, optical element loading substrate with optical waveguide, its manufacturing method, optical element loading substrate with optical fiber connector, its manufacturing method, and optical element loading substrate with optical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element loading substrate having small optical transmission loss that can surely align without the deviation of an optical axis. <P>SOLUTION: The optical element loading substrate 10 is provided with a ceramic substrate 11, optical elements 14 and 16, a resin layer 22, and an aligning guide member 24 or the like. A first recess 21 is opened at the side of a principal surface 12 of the ceramic substrate 11. The optical elements 14 and 16 loaded on the principal surface 12 of the ceramic substrate 11 is optically connected in the state where an optical waveguide 31 or the like and an optical axis are matched. The resin layer 22 has a second recess 23 positioned in the first recess 21, having a smaller diameter than the first recess 21 and opened at the side of at least the principal surface 12. The aligning guide member 24 is supported by being fitted to the second recess 23, and a part thereof is protruded at the side of the principal surface 12. Aligning is performed by fitting the aligning guide member 24 to an alignment hole 36 of the optical waveguide 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical element mounting substrate and a manufacturing method thereof, an optical element mounting substrate with an optical waveguide and a manufacturing method thereof, an optical element mounting substrate with an optical fiber connector and a manufacturing method thereof, and an optical element mounting substrate with an optical component.

  In recent years, with the development of information communication technology represented by the Internet and the dramatic improvement in the processing speed of information processing apparatuses, there is an increasing need for transmitting and receiving large-capacity data such as images. An information transmission speed of 10 Gbps or higher is desirable to exchange such a large amount of data freely through an information communication facility, and great expectations are placed on optical communication technology as a technology that can realize such a high-speed communication environment. On the other hand, signals can be transmitted at high speeds even on signal transmission paths at relatively short distances, such as connections between wiring boards in equipment, connections between semiconductor chips in wiring boards, connections within semiconductor chips, etc. It has been desired in recent years. For this reason, it is considered that it is ideal to shift from a conventional metal cable or metal wiring to optical transmission using an optical fiber or an optical waveguide.

  Here, a wiring board that mounts an optical element and performs optical communication between the optical element and an optical fiber or an optical waveguide has been conventionally proposed (for example, see Patent Documents 1 and 2). In Patent Documents 1 and 2, the external board and the wiring board can be arranged at predetermined positions by the self-alignment action when the external board on which the optical element is mounted is connected to the wiring board with solder bumps and reflowed. This technique is disclosed. Moreover, as a means for connecting optical fibers, an instrument called an optical fiber connector has been conventionally proposed (for example, see Non-Patent Document 1).

JP 2002-236228 A

JP-A-8-250542

Fujikura Technical Review No. 97 October 1999

However, in the techniques of Patent Documents 1 and 2 described above, alignment (optical axis alignment) between the external substrate on which the optical element is mounted and the wiring substrate is merely performed by solder reflow. For this reason, the alignment accuracy is not sufficient, and an optical axis shift is likely to occur between the optical element and the optical waveguide, which in turn tends to cause a light transmission loss. Therefore, it is considered that this method cannot sufficiently cope with the higher speed and higher density expected in the future. Further, when the wiring substrate is a resin substrate, the heat dissipation of the optical element and its operation circuit is deteriorated, and as a result, the emission wavelength may be shifted. Therefore, in this case, stable operating characteristics cannot be obtained.
If the wiring board is a ceramic wiring board, the problem of heat dissipation is solved to some extent, but the workability is poor, and therefore there is a risk of increasing the cost.

  In addition, it is conceivable to apply the optical fiber connector described in Non-Technical Document 1 to the connection between the wiring board and the optical fiber, but the optical fiber connector itself is a resin molded product and therefore has poor heat dissipation. Therefore, in this case, there is a possibility that the emission wavelength is shifted as a result of the deterioration of the heat dissipation of the optical element and its operation circuit.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an optical element mounting substrate, a method for manufacturing the same, and a light guide that can be reliably aligned without optical axis misalignment and have a small light transmission loss. An optical element mounting substrate with a waveguide and a manufacturing method thereof, an optical element mounting substrate with an optical fiber connector and a manufacturing method thereof, and an optical element mounting substrate with an optical component are provided.

Means, actions and effects for solving the problem

  And as means for solving the above-mentioned problems, a ceramic substrate having a main surface and having a first recess opening at least on the main surface side, and mounted on the main surface of the ceramic substrate, a light emitting portion and a light receiving portion An optical element that has at least one of the parts and is to be optically connected in a state in which the optical axis is aligned with the optical waveguide or the optical fiber connector; A resin layer having a small diameter and having a second recess opening at least on the main surface side, and being supported by being fitted to the second recess, a part of the ceramic substrate protrudes on the main surface side, There is an optical element mounting substrate comprising an alignment guide member that can be fitted into an alignment hole of an optical waveguide or the optical fiber connector. In this problem solving means, the members “optical waveguide” and “optical fiber connector” are members formed separately from the optical element mounting substrate, and are objects to be aligned with the optical element mounting substrate. Neither is an essential component.

  Further, as another problem means, an optical waveguide, a ceramic substrate having a main surface and having a first recess opened at least on the main surface side, mounted on the main surface of the ceramic substrate, a light emitting unit, An optical element having at least one of the light receiving portions, optically connected in a state where the optical axis is aligned with the optical waveguide, and located in the first concave portion, having a diameter smaller than the first concave portion and at least A resin layer having a second recess opening on the main surface side and supported by being fitted into the second recess, a part of the ceramic substrate projecting on the main surface side, and the optical waveguide There is an optical element mounting substrate with an optical waveguide, characterized by including an alignment guide member that can be fitted into the alignment hole.

  Still another solution includes an optical fiber connector, a ceramic substrate having a main surface and having a first recess opening at least on the main surface side, mounted on the main surface of the ceramic substrate, and a light emitting unit, An optical element having at least one of the light receiving portions and optically connected in a state where the optical axis is aligned with the optical fiber connector, and located in the first concave portion and having a smaller diameter than the first concave portion; A resin layer having a second recess opening at least on the main surface side and supported by being fitted in the second recess, and a part of the ceramic substrate protrudes on the main surface side of the ceramic substrate, and the optical fiber There is an optical element mounting substrate with an optical fiber connector, characterized by including an alignment guide member that can be fitted into an alignment hole of the connector.

  Therefore, according to these inventions, the alignment guide member projecting on the ceramic substrate side is fitted into the alignment hole of the optical waveguide or the optical fiber connector, thereby more positively and accurately. The optical axis of the optical element is aligned. Therefore, it is possible to realize an optical element mounting substrate that has a small light transmission loss and can sufficiently cope with high speed and high density. In addition, since a ceramic substrate having higher thermal conductivity than that of the resin substrate is used, the heat of the optical element and its operation circuit is efficiently dissipated. Therefore, the shift of the emission wavelength due to the deterioration of the heat dissipation property can be avoided, and an optical element mounting substrate excellent in operational stability and reliability can be realized.

  As the ceramic substrate constituting the optical element mounting substrate, a substrate made of a material having physical and mechanical properties suitable for a wiring substrate (for example, having insulating properties and high thermal conductivity) is preferable. Examples of suitable materials include substrates made of alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite, low-temperature fired glass ceramic, glass ceramic, and the like. Among these, it is particularly preferable to select a substrate made of alumina or aluminum nitride.

  Such a ceramic substrate is preferably a ceramic wiring substrate provided with an insulating layer and a conductor layer (metal wiring layer). The conductor layer may be formed on the substrate surface or may be formed inside the substrate. In order to achieve interlayer connection between these conductor layers, via hole conductors may be formed inside the substrate. For the conductor layer and via hole conductor, for example, a conductive metal paste made of gold (Au), silver (Ag), copper (Cu), platinum (Pt), tungsten (W), molybdenum (Mo), etc. is printed. Or it is formed by filling. An electric signal flows through such a conductor layer. In addition to such a ceramic wiring board, for example, it is allowed to use a build-up wiring board provided with a build-up layer formed by alternately laminating resin insulating layers and conductor layers on the ceramic substrate.

  The ceramic substrate has a main surface and a first recess that opens at least on the main surface side. Accordingly, the first recess may be a non-through hole that opens only on the main surface side (that is, has one opening), and also opens on the surface side opposite to the main surface (that is, the opening). It may be a through hole. The size, shape, and the like of the first recess are not particularly limited as long as the resin layer described below can be formed and the alignment guide member can be supported.

  One or more optical elements are mounted on the main surface of the ceramic substrate. As the mounting method, for example, a method such as wire bonding or flip chip bonding, a method using an anisotropic conductive material, or the like can be employed. As an optical element (that is, light emitting element) having a light emitting portion, for example, a light emitting diode (LED), a semiconductor laser diode (LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL), etc. Can be mentioned. These light emitting elements have a function of converting an input electrical signal into an optical signal and then emitting the optical signal from a light emitting unit toward a predetermined portion of an optical waveguide or an optical fiber connector. On the other hand, examples of the optical element having a light receiving portion (that is, a light receiving element) include a pin photodiode (pin PD) and an avalanche photodiode (APD). These light receiving elements have a function of causing an optical signal emitted from a predetermined portion of the optical waveguide or the optical fiber connector to be incident on the light receiving unit, converting the incident optical signal into an electric signal, and outputting the electric signal. Accordingly, the light-emitting portion of the light-emitting element and the light-receiving portion of the light-receiving element are optically connected with the optical waveguide or the optical fiber connector aligned with each other. The optical element may have both a light emitting part and a light receiving part. Suitable materials used for the optical element include, for example, Si, Ge, InGaAs, GaAsP, GaAlAs and the like. Such an optical element (particularly a light emitting element) is operated by an operation circuit. The optical element and the operation circuit are electrically connected through, for example, a conductor layer (metal wiring layer) formed on a ceramic substrate.

  The optical waveguide refers to a plate-like or film-like member having a core serving as an optical path through which an optical signal propagates and a clad surrounding the core. For example, an organic optical waveguide made of a polymer material, quartz glass, There are inorganic optical waveguides made of compound semiconductors and the like. As the polymer material, a photosensitive resin, a thermosetting resin, a thermoplastic resin, or the like can be selected. Specifically, a polyimide resin such as a fluorinated polyimide, an epoxy resin, a UV curable epoxy resin, a PMMA ( Polymethyl methacrylate), acrylic resins such as deuterated PMMA, deuterated fluorinated PMMA, polyolefin resins, and the like are suitable.

  The optical fiber connector is essentially a means for connecting the optical fiber portions, but here, it is used as a means for connecting the optical fiber side and the substrate side. Such an optical fiber connector may be a single-core optical fiber connector or a multi-fiber optical fiber connector. The optical fiber connector may have an additional function of reflecting light and converting an optical path, for example, in addition to the original function of connecting to the substrate side.

  The resin layer is located in the first recess, and specifically, located on the inner surface in the first recess. The resin layer has a second recess having a smaller diameter than the first recess and opening at least on the main surface side. Therefore, the second recess may be a non-through hole that opens only on the main surface side (that is, has one opening), and also opens on the surface side opposite to the main surface (that is, the opening portion is open). It may be a through hole. The size, shape, and the like of the second recess are not particularly limited as long as the alignment guide member described later can be supported. In addition, the center line of the first recess and the center line of the second recess do not necessarily match.

  Here, the second recess is preferably a precision machined hole. This is because, if the hole is a precision machined hole, the alignment guide member serving as a reference for optical axis alignment can be supported at the correct position.

  The resin for forming the resin layer is not particularly limited, and for example, a thermosetting resin, a thermoplastic resin, a photosensitive resin, or the like can be used. Specific examples of the thermosetting resin include an epoxy resin, a polyimide resin, a fluorine resin, a bismaleimide resin, a phenol resin, a polyphenylene resin, a polyolefin resin, and a fluorine resin. In this case, it is preferable to select a thermosetting resin having a small amount of curing shrinkage. Specific examples of the thermoplastic resin include polysulfone (PSF), polyphenyl ether (PPE), polyphenylene sulfone (PPS), polyether sulfone (PES), polyphenylene sulfide (PPES), and the like.

  The resin layer may contain a filler in addition to the resin. Examples of such fillers include organic fillers made of resin and the like, and inorganic fillers made of ceramic, metal, glass and the like. In this case, from the viewpoint of ease of processing, it is relatively advantageous to select an organic filler. From the viewpoint of matching the thermal expansion coefficient with the ceramic substrate, it is relatively advantageous to select the inorganic filler. That is, in the case of a resin layer containing an inorganic filler, the thermal expansion coefficient matches with that of the ceramic substrate, so that cracks or the like are unlikely to occur at the interface with the ceramic substrate (ie, the interface with the inner wall surface of the first recess). Reliability is improved. Therefore, the support strength of the alignment guide member is improved. Further, even when the alignment guide member is supported on the resin layer, the positional accuracy of the alignment guide member is not easily lowered.

  Further, the resin layer preferably contains an inorganic filler having higher thermal conductivity than the resin constituting the resin layer. This is because in this case, the heat conductivity of the resin layer is improved, thereby improving the heat dissipation of the entire optical element mounting substrate. Further, even if heat is generated in the resin layer when the second recess is processed and formed, the heat can be released to the ceramic substrate side through the resin layer.

  Examples of the ceramic material suitable as the inorganic filler include alumina, aluminum nitride, boron nitride, silica, silicon nitride, silicon carbide, magnesia, beryllia, and titania. Examples of the metal material suitable as the inorganic filler include gold (Au), silver (Ag), copper (Cu), platinum (Pt), tungsten (W), and molybdenum (Mo). .

  The alignment guide member is supported by the resin layer (ceramic substrate) by being fitted into the second recess. In such a support state, a part of the alignment guide part protrudes on the main surface side of the ceramic substrate. Here, the shape of the alignment guide member is not particularly limited, but, for example, a pin-shaped member (guide pin) is preferable, and a material that is hard to some extent is preferable. The diameter of the alignment guide member (particularly, the diameter of the portion protruding on the main surface side of the ceramic substrate) is adjusted so that the alignment guide member can be fitted in the alignment hole of the optical waveguide or the optical fiber connector. The diameter should be almost the same as the matching hole.

  Further, the number of the alignment guide members is not particularly limited. However, from the viewpoint of improving alignment accuracy and fixing strength, it is preferable that the number of alignment guide members is more than one. When a plurality of alignment guide members are provided, they are preferably arranged close to the optical element, and particularly preferably arranged on both sides of the light emitting part or the light receiving part.

  Further, as another means for solving the above problems, a ceramic substrate having a main surface and having a first recess opening at least on the main surface side, and mounted on the main surface of the ceramic substrate, emits light. An optical element that has at least one of a light receiving portion and a light receiving portion, and is optically connected in a state where the optical axis is aligned with the optical waveguide or the optical fiber connector, and is located in the first recess, the first recess A resin layer having a second recess having a diameter smaller than that of the recess and opening at least on the main surface side is supported by being fitted to the second recess, and a part of the resin layer is supported on the main surface side of the ceramic substrate. In the manufacturing method of the optical element mounting substrate, the method includes: an alignment guide member that protrudes and can be fitted into the alignment hole of the optical waveguide or the optical fiber connector. A first drilling step for forming the first recess in the ceramic unsintered body, a firing step for sintering the ceramic unsintered body to form the ceramic substrate, and in the first recess A resin layer disposing step of providing the resin layer, a second drilling step of forming the second recess in the resin layer by drilling after the resin layer disposing step, and the position in the second recess And a guide member mounting step for supporting the alignment guide member. In this problem solving means, the members “optical waveguide” and “optical fiber connector” are members formed separately from the optical element mounting substrate, and are objects to be aligned with the optical element mounting substrate. Therefore, none is an essential component.

  Therefore, according to the present invention, the optical element mounting substrate having the above-described configuration can be manufactured reliably and at low cost.

  Further, as another means for solving the above problems, an optical waveguide, a ceramic substrate having a main surface and having a first recess opened at least on the main surface side, and on the main surface of the ceramic substrate An optical element mounted and having at least one of a light emitting part and a light receiving part, optically connected in a state where the optical axis is aligned with the optical waveguide, and located in the first recess, the first recess A resin layer having a second recess having a diameter smaller than that of the recess and opening at least on the main surface side is supported by being fitted to the second recess, and a part of the resin layer is supported on the main surface side of the ceramic substrate. In the method of manufacturing an optical element mounting substrate with an optical waveguide, which includes a positioning guide member that protrudes and can be fitted into an alignment hole of the optical waveguide, the alignment hole is formed in the optical waveguide. An alignment hole forming step, a first drilling step of forming the first recess in the ceramic unsintered body by drilling, and sintering the ceramic unsintered body to form the ceramic substrate. A firing step, a resin layer disposing step for providing the resin layer in the first recess, and a second hole for forming the second recess in the resin layer by performing hole processing after the resin layer disposing step. A dawn step; a guide member attaching step for supporting the alignment guide member in the second recess; and fitting the alignment guide member into the alignment hole, thereby allowing the optical waveguide and the optical And a method of manufacturing an optical element mounting substrate with an optical waveguide, which includes an alignment step of aligning the optical axis of the element.

  Further, as another means for solving the above problems, an optical fiber connector, a ceramic substrate having a main surface and having a first recess opened at least on the main surface side, and on the main surface of the ceramic substrate An optical element that has at least one of a light emitting part and a light receiving part and is optically connected in a state in which the optical axis is aligned with the optical fiber connector, and is located in the first recess, A resin layer having a second recess having a smaller diameter than the first recess and opening at least on the main surface side is supported by being fitted to the second recess, and one of the resin layers is supported on the main surface side of the ceramic substrate. A method of manufacturing an optical element mounting substrate with an optical fiber connector, the portion projecting, and an alignment guide member that can be fitted into an alignment hole of the optical fiber connector An alignment hole forming step for forming the alignment hole in the optical fiber connector; a first drilling step for forming the first recess in the ceramic unsintered body by performing hole processing; A firing step of sintering a sintered body to form the ceramic substrate, a resin layer disposing step of providing the resin layer in the first recess, and a hole processing after the resin layer disposing step. A second drilling step for forming the second recess in the layer; a guide member attaching step for supporting the alignment guide member in the second recess; and the alignment guide member with respect to the alignment hole. An optical element mounting substrate with an optical fiber connector, comprising: an alignment step of aligning an optical axis of the optical fiber connector and the optical element by fitting Manufacturing method, there is.

  Hereinafter, the manufacturing method of the optical element mounting substrate having the above-described configuration will be described along the steps.

  In the alignment hole forming step, the alignment hole is formed in the optical waveguide or the optical fiber connector. Here, a well-known technique can be employed as a hole machining method in the alignment hole forming step, and specific examples include drilling, punching, etching, and laser machining. However, from the viewpoint of low cost, mechanical processing such as drilling or punching is preferable. Moreover, it is more preferable that the hole processing performed here is a precision hole processing using a precision drill etc., for example. This is because if the alignment hole is formed by such a processing method, the optical axis can be aligned with high accuracy. The alignment hole may be a through hole that opens on both the front and back surfaces of the optical waveguide or the optical fiber connector, or may be a non-through hole that opens only on the back surface side. Further, after the alignment hole forming step, the hole diameter of the alignment hole may be finely adjusted by performing finishing as necessary.

  In the first drilling step, the first recess is formed in the ceramic green body by drilling. The reason for drilling the unsintered ceramic material is as follows. That is, since ceramic materials have the property of becoming extremely hard when completely sintered, processing becomes difficult and processing costs increase. On the other hand, it is because drilling a ceramic material in a green state that is not so hard can be performed relatively easily and at low cost. Here, a well-known technique can be adopted as the hole drilling method in the first drilling step, and specific examples include drilling, punching, and laser processing. However, from the viewpoint of low cost, mechanical processing such as drilling or punching is preferable, and punching is particularly preferable.

  In the first drilling step, the inner diameter of the first recess at the time of passing through the firing step is set to be larger than the inner diameter of the second recess and the diameter of the alignment guide member, It is preferable to perform hole processing of one recess. The reason is that the ceramic shrinks through the firing process, and the first recess is also reduced in diameter and displaced accordingly. Therefore, it is necessary to make the first recess larger in the calculation. It is.

  In the subsequent firing step, the ceramic green body is sintered at a high temperature to form a ceramic substrate. At this point, the ceramic hardens. The firing temperature, firing time, etc. are appropriately set according to the type of ceramic selected.

  In the subsequent resin layer disposing step, the resin layer is provided in the first recess. The method of providing the resin layer in the first recess is not particularly limited. For example, it is preferable to cure the resin material after filling the first recess with an uncured resin material. According to this method, there is no gap between the first recess and the resin layer, and the adhesion of the resin layer to the inner wall surface of the first recess is improved. Therefore, the resin layer can be reliably held in the first recess, and the alignment guide member can be reliably held on the ceramic substrate.

  For example, when a thermosetting resin is selected, the resin material is cured by heating after filling. When a photosensitive resin is selected, the resin material is cured by irradiating with ultraviolet rays after filling. To do. The filling of the resin material can be performed by a technique such as printing. Further, as the resin material, an uncured resin material containing various fillers may be used, and an uncured resin material containing an inorganic filler having higher thermal conductivity than the resin constituting the resin layer is used. May be. The reason is as described above. Furthermore, a method that does not involve filling with an uncured resin material, for example, a method in which a resin molded body in a completely cured state or a state of being cured to some extent is fitted into the first recess may be employed.

  Here, if necessary, polishing is performed to polish at least the main surface side of the ceramic substrate to remove the excess resin layer protruding from the opening of the first recess and the resin layer adhering to the surface of the ceramic substrate. You may perform a process. When this step is performed, the unevenness on the main surface of the ceramic substrate is eliminated and the ceramic substrate is flattened. Therefore, the optical element can be mounted in parallel to the main surface of the ceramic substrate in a later process. This is preferable for improving the accuracy of optical axis alignment. That is, if the optical element is inclined rather than parallel to the main surface of the ceramic substrate, it is difficult to align the optical axis.

  In the subsequent second drilling step, the second recess is formed in the resin layer by performing hole processing after the resin layer disposing step. As a method of drilling in the second drilling step, a well-known technique can be adopted. In this case, it is desirable to perform precision drilling. This is because if the second concave portion is formed by such a processing method, the alignment guide member serving as a reference for optical axis alignment can be supported at a desired correct position. Specific methods for precision hole drilling include drilling, punching, and laser processing. In consideration of cost and the like, drilling using a precision drill is most preferable. In addition, you may make it perform said grinding | polishing process after a 2nd drilling process, In this case, the burr | flash etc. which were generated by the 2nd drilling process can be removed reliably.

  Moreover, you may finely adjust a hole diameter by performing a finishing process as needed after a 2nd drilling process. In addition, after performing a 2nd drilling process in the state which semi-hardened the resin layer, you may make it perform the said finishing process, after hardening a resin layer completely.

  Instead of the above method of performing the second drilling step after performing the resin layer arranging step, for example, a method of simultaneously performing the resin layer arranging step and the second drilling step as follows may be adopted. Good. Specifically, first, a spacer member is disposed in the first recess. As a suitable example of the spacer member, for example, there is a mold having pins. The pin has a shape corresponding to the shape of the alignment guide member. In this case, the mold and the substrate should be aligned with high accuracy. In this state, after filling and curing the uncured resin material, the spacer member is removed. According to this technique, the resin layer having the second recess can be formed at a very low cost.

  Then, after the positioning guide member is supported by the second recess in the guide member mounting step, the positioning guide member is fitted into the positioning hole. That is, if the optical axes of the optical waveguide and the optical element are aligned by the alignment step, a desired optical element mounting substrate with an optical waveguide can be obtained. Further, if the optical axes of the optical fiber connector and the optical element are aligned by the alignment step, a desired optical element mounting substrate with an optical fiber connector can be obtained.

  Instead of the above-described method of sequentially performing the resin layer disposing step, the second drilling step, and the guide member attaching step, for example, a method of simultaneously performing the resin layer disposing step and the guide member attaching step is adopted as follows. May be. Specifically, first, a part of the alignment guide member is held in the first recess. In this case, it is desirable to align the alignment guide member with high accuracy. It is more preferable to temporarily hold and fix a plurality of alignment guide members using a guide member holding jig or the like. Next, in this state, an uncured resin material is filled in the first recess and cured. As a result, the alignment guide member can be supported by the second recess while the resin layer having the second recess is provided. The guide member holding jig is removed after the resin is cured. This method is also extremely advantageous for cost reduction.

  Further, as another means for solving the above-mentioned problem, there is provided an optical component having at least one of an optical transmission function, a condensing function, and a light reflection function and having an optical component side alignment recess, and a substrate side A substrate having an alignment recess; and an optical element that is mounted on the substrate and has at least one of a light emitting unit and a light receiving unit, and is optically connected in a state where an optical axis is aligned with the optical component. There is an optical element mounting substrate with an optical component, comprising: an alignment guide member that can be fitted to the optical component side alignment recess and the substrate side alignment recess.

  As another means for solving the above-mentioned problems, there is provided a substrate having a substrate-side alignment recess, and at least one of a light emitting unit and a light receiving unit mounted on the substrate, and having an optical transmission function, a collecting unit, and the like. An optical element to be optically connected with an optical axis aligned with an optical component having at least one of an optical function and a light reflecting function, and supported by being fitted into the substrate side alignment recess. There is an optical element mounting substrate comprising an alignment guide member that can be fitted into an optical component side alignment recess of the optical component.

  Therefore, according to these inventions, the alignment guide member is fitted to both the optical component-side alignment recess and the substrate-side alignment recess, so that the optical component and the optical are more positively and highly accurate. The optical axis is aligned with the element. Therefore, it is possible to realize an optical element mounting substrate that has a small light transmission loss and can sufficiently cope with high speed and high density.

  Here, the optical component refers to a component having at least one of an optical transmission function, a condensing function, and a light reflecting function. As a specific example, examples of the optical component having an optical transmission function include an optical waveguide and an optical fiber. In addition, the base material which supports an optical waveguide also corresponds to the optical component which has an optical transmission function. An optical component including an optical fiber and an optical fiber connector that supports the optical fiber also corresponds to an optical component having an optical transmission function. Examples of the optical component having a condensing function include a lens component represented by a microlens array. As an optical component having a light reflection function, for example, there is an optical path conversion component. In addition, it can be said that the optical fiber connector in which the optical path changing part is formed is an optical component having a light reflecting function. It can be said that the optical waveguide in which the optical path conversion unit is formed is an optical component having an optical transmission function and an optical reflection function.

  The optical component-side alignment recess and the substrate-side alignment recess may be non-through holes that open only on one surface (that is, have one opening) or open on two surfaces (that is, It may be a through hole having two openings. However, when three or more components are arranged and fixed, it is desirable that the alignment concave portion be a through hole for the component located in the inner layer.

  When the optical component is a lens component, the optical component-side alignment concave portion may be directly formed on the lens component, but it is more preferable that the optical component is indirectly formed through a separate member. . Specifically, it is preferable to support the lens component on a lens support body configured separately, and to form an optical component side alignment recess on the lens support body. With such a configuration, cost reduction can be achieved. The lens support can be formed of, for example, a resin or metal, but it is particularly preferable to select a resin from the viewpoint of easy precision processing.

  As the substrate, a substrate made of metal, resin or ceramic can be used, and a substrate made of ceramic is particularly preferable. Preferable examples of such a ceramic substrate include substrates made of alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite, low-temperature fired glass ceramic, glass ceramic and the like. Among these, it is particularly preferable to select a substrate made of alumina or aluminum nitride.

[First Embodiment]

  Hereinafter, an optical element mounting substrate 10 with an optical waveguide (an optical element mounting substrate with an optical component) according to a first embodiment embodying the present invention will be described in detail with reference to FIGS.

  As shown in FIGS. 1 and 2, the ceramic substrate 11 constituting the optical element mounting substrate 10 of this embodiment is a substantially rectangular plate member having an upper surface 12 (main surface) and a lower surface 13. The ceramic substrate 11 is a so-called multilayer wiring substrate, and includes a metal wiring layer (not shown) on the upper surface 12 (main surface), the lower surface 13 and the inner layer. The ceramic substrate 11 also includes a via-hole conductor (not shown), and metal wiring layers having different layers are connected to each other through the via-hole conductor.

  In FIG. 2, a VCSEL 14 (optical element), which is a kind of optical element (light emitting element), is mounted on the left end of the upper surface 12 of the ceramic substrate 11 with the light emitting surface facing upward. The VCSEL 14 has a plurality of (here, four) light emitting units 15 arranged in a line in the light emitting surface. Accordingly, these light emitting portions 15 emit laser light having a predetermined wavelength in a direction orthogonal to the upper surface 12 of the ceramic substrate 11 (that is, the upward direction in FIG. 2). On the other hand, in FIG. 2, a photodiode 16 which is a kind of optical element (light receiving element) is mounted on the right end of the upper surface 12 of the ceramic substrate 11 with the light receiving surface facing upward. The photodiode 16 has a plurality of (here, four) light receiving portions 17 arranged in a line in the light receiving surface. Therefore, these light receiving portions 17 are configured to easily receive laser light from the upper side to the lower side in FIG.

  Note that the photodiode 16 and the VCSEL 14 are respectively joined to the metal wiring layer on the upper surface 12 of the ceramic substrate 11. In particular, the VCSEL 14 is electrically connected to an operation circuit IC (not shown) mounted on the upper surface 12 of the ceramic substrate 11 via the metal wiring layer.

  As shown in FIGS. 1 and 2, first through holes 21 as first recesses are provided at a plurality of locations (here, 4 locations) in the ceramic substrate 11. The first through hole 21 is circular and has an equal cross-sectional shape, and is open on both the upper surface 12 (main surface) and the lower surface 13 of the ceramic substrate 11. In the case of this embodiment, the diameter of the first through hole 21 is set to be about 1.0 mm to 2.0 mm. In the present embodiment, two of the four first through holes 21 are arranged close to the VCSEL 14 and the remaining two are arranged close to the photodiode 16. The pair of first through holes 21 arranged in the vicinity of the VCSEL 14 are substantially on the same straight line as the row of the light emitting units 15 and are arranged at positions sandwiching the row of the light emitting units 15 from both ends thereof. The pair of first through holes 21 arranged in the vicinity of the photodiode 16 are substantially on the same straight line as the row of the light receiving portions 17 and are arranged at positions sandwiching the row of the light receiving portions 17 from both ends thereof. .

  A resin layer 22 is provided inside these first through holes 21, and a second through hole 23 (second concave portion, substrate side alignment concave portion) is provided at substantially the center of the resin layer 22. Yes. The second through hole 23 is circular and has an equal cross-sectional shape, and is open on both the upper surface 12 (main surface) and the lower surface 13 of the ceramic substrate 11. In the case of this embodiment, the diameter of the second through hole 23 is smaller than that of the first through hole 21 and is set to about 0.7 mm. Inside the four second through holes 23, a guide pin 24 (alignment guide member) made of stainless steel having a circular cross section is fitted with one end protruding toward the upper surface 12 (main surface) side. Has been. Specifically, in this embodiment, a guide pin “CNF125A-21” (diameter 0.699 mm) defined in JIS C 5981 is used.

  As shown in FIGS. 1 and 2, a substantially rectangular and film-shaped optical waveguide 31 (optical component) that is slightly smaller than the ceramic substrate 11 is disposed on the upper surface 12 (main surface) side of the ceramic substrate 11. ing. A base material 32 constituting the optical waveguide 31 has a core 33 and a clad 34 surrounding the core 33 from above and below. The core 33 substantially becomes an optical path through which the optical signal propagates. In the case of the present embodiment, the core 33 and the clad 34 are formed of transparent polymer materials having different refractive indexes, specifically, PMMA (polymethyl methacrylate) having different refractive indexes. The number of the cores 33 serving as the optical path is four, the same as the number of the light emitting units 15 and the light receiving units 17, and they are formed so as to extend linearly and in parallel. An inclined surface having an angle of 45 ° with respect to the longitudinal direction of the core 33 is formed at both ends of the core 33, and a thin film made of a metal capable of totally reflecting light is deposited on the inclined surface. Therefore, both ends of each core 33 are provided with optical path conversion mirrors 35 and 37 that reflect light at an angle of 90 °. Circular alignment holes 36 are formed through the four corners of the optical waveguide 31. These alignment holes 36 are set to have a diameter of about 0.7 mm corresponding to the size of the guide pin 24. Each guide pin 24 protruding from the ceramic substrate 11 is fitted in each alignment hole 36 (optical component side alignment recess) of the optical waveguide 31. As a result, the optical waveguide 31 is fixed in an aligned state on the upper surface 12 (main surface) of the ceramic substrate 11. Here, the “aligned state” specifically means that each optical path conversion mirror 35 located on the left end side in FIG. 2 is directly above each light emitting unit 15, and each core 33 and each light emitting unit 15 is connected. A state in which the optical axes are aligned and a state in which each optical path conversion mirror 37 located on the right end side in FIG. 2 is directly above each light receiving portion 17 and the optical axes of each core 33 and each light receiving portion 17 are aligned. . In the present embodiment, the ceramic substrate 11 and the optical waveguide 31 are fixed to each other only by the fitting relationship between the alignment hole 36 and the guide pin 24.

  The general operation of the optical element mounting substrate 10 with the optical waveguide thus configured will be briefly described.

  The VCSEL 14 and the photodiode 16 become operable by supplying power through the metal wiring layer of the ceramic substrate 11. When an electrical signal is output from the operation circuit IC on the ceramic substrate 11 to the VCSEL 14, the VCSEL 14 converts the input electrical signal into an optical signal (laser light), and then converts the optical signal to the optical path at the left end of the core 33. The light is emitted from the light emitting unit 15 toward the mirror 35 for use. The optical signal emitted from the light emitting unit 15 enters from the lower surface side of the optical waveguide 31 and enters the optical path changing mirror 35 of the core 33. The traveling direction of the optical signal incident on the optical path changing mirror 35 is changed by 90 °. For this reason, the optical signal propagates along the longitudinal direction of the core 33. Then, the optical signal reaching the right end of the core 33 is incident on the optical path conversion mirror 37 formed at the right end of the optical waveguide 31 this time. The traveling direction of the optical signal incident on the optical path changing mirror 37 is changed by 90 °. For this reason, the optical signal is emitted from the lower surface side of the optical waveguide 31 and further enters the light receiving portion 17 of the photodiode 16. The photodiode 16 converts the received optical signal into an electric signal, and outputs the converted electric signal to another IC (not shown) or the like on the ceramic substrate 11.

  Next, a method for manufacturing the optical element mounting substrate 10 with the optical waveguide 31 having the above-described configuration will be described with reference to FIGS.

  First, an optical waveguide 31 is produced by a conventionally known method (see FIG. 3), and then alignment holes 36 are formed at the four corners by performing precision drilling on the waveguide 31 (see FIG. 4).

  Further, the ceramic substrate 11 is produced by the following procedure. A raw material slurry is prepared by uniformly mixing and kneading alumina powder, organic binder, solvent, plasticizer, etc., and this raw material slurry is used to form a sheet with a doctor blade device to form a green sheet having a predetermined thickness. . A predetermined portion of the green sheet is punched, and a metal paste for forming a via-hole conductor is filled in the formed hole. Moreover, the printing layer used as a metal wiring layer later is formed by printing a metal paste on the surface of a green sheet. Then, these green sheets are laminated and pressed to be integrated to obtain a green sheet laminate 18 in FIG. In the green sheet laminate 18 of FIG. 5, the metal wiring layers and via hole conductors are not shown and are omitted.

  Thereafter, the green sheet laminate 18 is punched to form first through holes 21 (first recesses) (first drilling step, see FIG. 6). Since it is still unsintered at this stage, drilling can be performed relatively easily and at low cost. In the first drilling step, the inner diameter of the first through hole 21 (first concave portion) at the time of passing through the firing step is the inner diameter (about 0.7 mm) of the second through hole 23 (second concave portion, substrate side alignment concave portion). ) And the diameter of the guide pin 24 (about 0.7 mm) is set to be larger than that. Specifically, the first through hole 21 is drilled by setting to about 1.2 mm to 2.4 mm. The reason is that the ceramic shrinks through the firing process, and accordingly, the first through hole 21 (first recess) is also reduced in diameter and misaligned. Therefore, the first through hole 21 ( This is because the first recess) needs to be formed larger.

  Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is further performed at a heating temperature at which alumina can be sintered. Thereby, the green sheet laminate 18 (ceramic unsintered body) is sintered to form the ceramic substrate 11. At this point, the ceramic hardens and shrinks (see FIG. 7).

  In the subsequent resin layer disposing step, the resin layer 22 is provided in the first through hole 21 (first recess) as follows. First, with respect to 80 parts by weight of bisphenol F type epoxy resin (“Epicoat 807” manufactured by JER) and 20 parts by weight of cresol novolac type epoxy resin (“Epicoat 152” manufactured by JER), a curing agent (“2P4MZ manufactured by Shikoku Kasei Kogyo Co., Ltd.) -CN ") 5 parts by weight, 200 parts by weight of a silica filler (" TSS-6 "manufactured by Tatsumori) treated with a silane coupling agent (" KBM-403 "manufactured by Shin-Etsu Chemical Co., Ltd.), an antifoaming agent (" Sannopco " Berenol S-4 "). The mixture is kneaded with three rolls to be a resin material for forming the resin layer 22. That is, in this embodiment, an uncured resin material containing an inorganic filler in a thermosetting resin is used.

  Next, the ceramic substrate 11 is set in a printing apparatus, and a predetermined metal mask (not shown) is placed in close contact with the upper surface 12 thereof. In such a metal mask, an opening is formed in advance at a location corresponding to the first through hole 21. By printing the resin material through such a metal mask, the resin material is completely filled in the first through holes 21 without any gaps. Thereafter, after the printed ceramic substrate 11 is removed from the printing apparatus, it is heated at 120 ° C. for 1 hour, and the resin layer 22 formed by filling the resin material is cured to some extent (semi-cured). 8). Here, the reason why the resin layer 22 is not completely cured is to perform the hole processing in the next second drilling process more easily.

  In the subsequent second drilling step, precision drilling using a precision drill is performed to form second through holes 23 (second recesses, substrate side alignment recesses) in the resin layer 22 (see FIG. 9). According to such a processing method, the guide pin 24 serving as a reference at the time of optical axis alignment can be the second through hole 23 that can be supported at a desired correct position.

  Next, the ceramic substrate 11 is set in a surface polishing apparatus, and the upper surface 12 and the lower surface 13 are polished to adhere to the surplus resin layer 22 protruding from the opening of the first through hole 21 or the substrate surface. The resin layer 22 is removed (see FIG. 10). When this polishing process is performed, the unevenness on the upper surface 12 (main surface) of the ceramic substrate 11 is eliminated and the ceramic substrate 11 is flattened.

  Next, the resin layer 22 is completely cured by performing a main curing process in which the ceramic substrate 11 is heated at 150 ° C. for 5 hours. Further, finishing is performed by a well-known method, and the hole diameter of the second through hole 23 is finely adjusted to 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm.

  Next, the VCSEL 14 and the photodiode 16 are mounted on the flattened upper surface 12 of the ceramic substrate 11 via an anisotropic conductive material (not shown) (see FIG. 11). As a result, a part of the metal wiring layer on the upper surface 12 of the ceramic substrate 11 and the connection terminals of the VCSEL 14 and the photodiode 16 are electrically connected. At this time, since the upper surface 12 is a flat surface without unevenness, the VCSEL 14 and the photodiode 16 are parallel to the upper surface 12. In the present embodiment, the optical element mounting step is performed after the finishing process and before the guide member mounting step. Therefore, there is an advantage that the VCSEL 14 and the photodiode 16 that are already mounted are not exposed to heat, vibration, dust, or the like that can be generated by drilling. Further, since the guide pin 24 is not yet standing near the optical element mounting portion, the VCSEL 14 and the photodiode 16 can be mounted relatively easily.

  In the subsequent guide member mounting step, a guide pin 24 is press-fitted into the second through hole 23 (second recess, substrate side alignment recess) using a dedicated jig or the like (see FIG. 12). .

  In the subsequent alignment step, the guide pins 24 of the ceramic substrate 11 are fitted into the alignment holes 36 of the optical waveguide 31. Thereby, the optical waveguide 31 is fixed to the ceramic substrate 11 while performing the optical axis alignment of the optical waveguide 31 and the VCSEL 14 and the optical axis alignment of the optical waveguide 31 and the photodiode 16 at the same time. As described above, the optical element mounting substrate 10 with the optical waveguide of the present embodiment is completed.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In this embodiment, the ceramic substrate 11 and the optical waveguide 31 are fixed to each other while achieving optical axis alignment with the fitting relationship between the guide pin 24 and the alignment hole 36. Therefore, the optical axis is more positively and accurately aligned as compared with the conventional passive optical axis alignment that relies only on the self-alignment action during reflow. Therefore, it is possible to realize the optical element mounting substrate 10 that has a small light transmission loss and can sufficiently cope with high speed and high density. In addition, since the ceramic substrate 11 having a higher thermal conductivity than the resin substrate is used, the heat generated by the VCSEL 14 and the operation circuit IC is efficiently dissipated. Therefore, the shift of the emission wavelength due to the deterioration of the heat dissipation property is avoided, and the optical element mounting substrate 10 excellent in operational stability and reliability can be realized.

(2) Moreover, according to the manufacturing method of this embodiment, the optical element mounting substrate 10 having the above-described configuration can be manufactured reliably and at low cost.
[Second Embodiment]

  Next, an optical element mounting substrate 10 with an optical waveguide (an optical element mounting substrate with an optical component) in the second embodiment will be described. The present embodiment is different from the first embodiment only in that the composition of the resin layer 22 is different from that of the first embodiment.

  In the resin layer disposing step, first, 5 parts by weight of a curing agent (“2P4MZ-CN” manufactured by Shikoku Kasei Kogyo Co., Ltd.) and copper filler (Nippon Atomize) per 100 parts by weight of epoxy resin (“Epicoat 828” manufactured by JER) 600 parts by weight of processed “SRF-Cu-10”), antifoaming agent (“Berenol S-4” manufactured by Sannopco), and thickener (“RY200” manufactured by Nippon Aerosil Co., Ltd.) are mixed. The mixture is kneaded with three rolls to be a resin material for forming the resin layer 22. That is, in the present embodiment, an uncured resin material containing a highly thermally conductive inorganic filler in the thermosetting resin is used. And after such resin material is printed and filled in the 1st through-hole 21, a heat-hardening process is performed and the process after a 2nd drilling process is implemented sequentially.

Therefore, even if it is the structure of this embodiment, there can exist the same effect as 1st Embodiment. Moreover, the resin layer 22 includes a filler made of copper having higher thermal conductivity than the epoxy resin. Therefore, the thermal conductivity of the resin layer 22 is improved, and as a result, the heat dissipation of the entire optical element mounting substrate 10 is improved. Further, the heat generated in the resin layer 22 when the second through hole 23 is formed is efficiently released to the ceramic substrate 11 side through the resin layer 22. For this reason, there is no worry that the processing accuracy of the resin layer 22 is lowered by the action of heat, and the guide pin 24 can be supported with high positional accuracy.
[Third Embodiment]

  14 to 16 show an optical element mounting substrate 50 with an optical fiber connector of a third embodiment embodying the present invention. Here, although the points different from the first embodiment will be described, the same points as those of the first embodiment are only given common member numbers.

  As shown in FIGS. 14 and 15, the optical fiber connector 52 in the optical element mounting substrate 50 with the optical fiber connector is provided at the tip of the optical fiber 51 having a multi-core structure (four cores in FIG. 14). This is a so-called MT connector. The end face of the optical fiber 51 (that is, the end of each core 33) is exposed at the lower end face of the optical fiber connector 52. A pair of alignment holes 54 opened at the lower end surface are provided at both ends of the lower end surface of the optical fiber connector 52. The guide pins 24 on the ceramic substrate 11 side are fitted into these alignment holes 54. As a result, the left optical fiber connector 52 is fixed to the upper surface 12 side of the ceramic substrate 11 with the optical axis aligned with the VCSEL 14. The right optical fiber connector 52 is fixed to the upper surface 12 side of the ceramic substrate 11 with the optical axis aligned with the photodiode 16.

Also in the present embodiment having the above-described configuration, the same operational effects as those of the first embodiment can be achieved.
[Fourth Embodiment]

  17 and 18 show an optical element mounting substrate 80 with an optical fiber connector (an optical element mounting substrate with an optical component) according to a fourth embodiment of the present invention. FIG. 17 is a schematic cross-sectional view of the optical element mounting substrate 80 with an optical fiber connector. FIG. 18 shows a state of fixing each component while aligning the ceramic substrate 91, the microlens array 101, and the optical fiber connector 111 in the manufacturing process of the optical element mounting substrate 80 with the optical fiber connector. It is a schematic sectional drawing.

  As shown in FIGS. 17 and 18, the optical element mounting substrate 80 with an optical fiber connector of the present embodiment includes a VCSEL 14 (optical element), a ceramic substrate 11 (substrate), a microlens array 101, an optical fiber connector 111, a guide. The pin 24 (positioning guide member) is used.

  The ceramic substrate 11 is a substantially rectangular plate member having an upper surface 12 (main surface) and a lower surface 13. The ceramic substrate 11 is a so-called multilayer wiring board and includes a metal wiring layer. For example, a plurality of connection pads 92 for mounting various electronic components are formed on a part of the metal wiring layer 93 located on the upper surface 12 (main surface). Although not shown, the metal wiring layer is also formed on the inner layer of the ceramic substrate 11. The ceramic substrate 11 also includes a via-hole conductor (not shown), and metal wiring layers having different layers are connected to each other through the via-hole conductor. A plurality of solder bumps 95 connected to the via-hole conductor are provided on the lower surface 13 of the ceramic substrate 11.

  A VCSEL 14 (optical element), which is a kind of optical element (light emitting element), is mounted on the upper surface 12 of the ceramic substrate 11 with the light emitting surface facing upward. The VCSEL 14 has a plurality of (here, four) light emitting units 15 arranged in a line in the light emitting surface. Accordingly, these light emitting portions 15 emit laser light having a predetermined wavelength in a direction orthogonal to the upper surface 12 of the ceramic substrate 11 (that is, upward direction in FIGS. 17 and 18). The plurality of terminals of the VCSEL 14 are respectively joined to connection pads 92 provided on the upper surface 12 of the ceramic substrate 11. Note that a light receiving element such as a photodiode may be mounted in place of the light emitting element such as the VCSEL 14, but detailed description thereof is omitted here.

  An operation circuit IC 94 (so-called driver IC) for driving the VCSEL 14 is disposed in the vicinity of the VCSEL 14 on the upper surface 12 of the ceramic substrate 11. The plurality of terminals of the operating circuit IC 94 are respectively joined to connection pads 92 provided on the upper surface 12 of the ceramic substrate 11. Therefore, the VCSEL 14 and the operating circuit IC 94 are electrically connected via the metal wiring layer 93.

  As shown in FIGS. 17 and 18, a first through hole 21 serving as a first recess is provided in a region of the ceramic substrate 11 where no electronic component is mounted. Although not specifically shown, the first through holes 21 are provided in two places in the present embodiment. The first through hole 21 is circular and has an equal cross-sectional shape, and is open on both the upper surface 12 (main surface) and the lower surface 13 of the ceramic substrate 11. In the case of the present embodiment, the diameter of the first through hole 21 is set to be about 1.0 mm to 2.0 mm. A resin layer 22 is provided inside these first through holes 21, and a second through hole 23 (second concave portion, substrate side alignment concave portion) is provided at substantially the center of the resin layer 22. Yes. The second through hole 23 is circular and has an equal cross-sectional shape, and is open on both the upper surface 12 (main surface) and the lower surface 13 of the ceramic substrate 11. In the case of this embodiment, the diameter of the second through hole 23 is smaller than that of the first through hole 21 and is set to about 0.7 mm. One end of a guide pin 24 (alignment guide member) made of stainless steel and having a circular cross section is fitted into the two second through holes 23 (see FIG. 17). Specifically, in this embodiment, a guide pin “CNF125A-21” (diameter 0.699 mm) defined in JIS C 5981 is used.

  As shown in FIGS. 17 and 18, the microlens array 101 disposed on the upper surface 12 (main surface) side of the ceramic substrate 11 includes a lid-shaped microlens array main body 105 having an accommodation recess on the bottom surface side. Yes. The microlens array body 105 is a resin molded product, and a microlens mounting hole 104 is formed at a position above the VCSEL 15. A convex microlens 102 made of a translucent resin material is attached to the microlens mounting hole 104. In another part of the microlens array body 105, an alignment hole 103 (microlens array side alignment recess) is formed so as to penetrate the front and back. In the present embodiment, the diameter of the alignment hole 103 is set to about 0.7 mm. Then, the guide pin 24 is fitted in such an alignment hole 103. Note that the microlens array 101 of the present embodiment can be grasped as an optical component having a condensing function. The microlens 102 and the microlens array main body 105 may be configured as separate bodies as described above, but may be configured as a single body.

  As shown in FIGS. 17 and 18, the optical fiber connector 111 disposed on the upper side of the microlens array 101 is attached to the tip of the optical fiber 112. A notch 115 having an inclined surface of about 45 ° is provided on the lower left side of the optical fiber connector 111. An optical path conversion mirror 114 (optical path conversion section) made of a metal thin film that reflects light is formed on the inclined surface of the notch 115. The optical fiber connector 111 having the notch 115 can be formed, for example, by a mold forming process using a synthetic resin material, or by an etching process using a metal such as silicon. The optical fiber connector 111 of this embodiment in which the optical path conversion mirror 114 is formed can also be understood as an optical component having a light reflection function (that is, an optical path conversion component).

  A plurality of alignment holes 113 (optical component side alignment recesses) are formed at predetermined locations in the optical fiber connector 111 so as to penetrate the front and back surfaces. In the present embodiment, the diameter of the alignment hole 113 is set to about 0.7 mm. Then, the guide pin 24 is fitted in such an alignment hole 113.

  In the optical element mounting substrate 80 with the optical fiber connector configured as described above, the ceramic substrate 11, the microlens array 101, and the optical fiber connector 111 are aligned with each other by fitting the guide pins 24. It is fixed. Here, the “aligned state” specifically means that the optical axis of each light emitting unit 15 of the VCSEL 14, the optical axis of each microlens 102, and the optical axis of each core of the optical fiber 112 are aligned. State.

  A general operation of the optical element mounting substrate 80 with the optical fiber connector configured as described above will be briefly described.

  The VCSEL 14 becomes operable by supplying power from the ceramic substrate 11 side. When an electrical signal is output from the operating circuit IC 94 on the ceramic substrate 11 to the VCSEL 14, the VCSEL 14 converts the input electrical signal into an optical signal (laser light), and then directs the optical signal upward to emit the light emitting unit 15. Emanates from. The optical signal emitted from the light emitting unit 15 tries to travel while spreading, but is collected when passing through the microlens 102 and then reaches the optical path conversion mirror 114. The optical signal incident on the optical path conversion mirror 114 is incident on one end of the optical fiber 112 after the traveling direction is changed by 90 °. A photodiode (not shown) is provided near the other end of the optical fiber 112 so that the optical signal finally reaches the photodiode.

  Next, the manufacturing method of the optical element mounting substrate 80 with an optical fiber connector having the above configuration will be described.

  First, the notch 115 having an inclined surface is formed by etching the silicon substrate. Next, the optical path conversion mirror 114 is formed by sputtering gold on the inclined surface. Furthermore, the alignment through-hole 113 which penetrates the front and back is formed by performing a precision drill process with respect to a silicon base material. Since silicon substrates are not as hard as ceramic materials, high precision holes can be formed relatively easily by precision drilling. And the edge part of the optical fiber 112 is joined with the notch part 115 of the optical fiber connector 111 produced in this way. In addition, the precision drill process with respect to a silicon base material may be performed before the process of forming the optical path conversion mirror 114. Further, the optical path conversion mirror 114 may be formed by a technique other than sputtering (for example, vacuum deposition, CVD, etc.).

  On the other hand, after the microlens array main body 105 is manufactured by a mold molding method using a synthetic resin as a material, the microlens array main body 105 is subjected to precision drilling, thereby aligning through holes 103 penetrating the front and back. Form. In general, since a synthetic resin material is not as hard as a ceramic material, a highly accurate hole can be formed relatively easily by precision drilling. The microlens mounting hole 104 may be formed at the time of precision drilling, or may be formed at the time of mold forming. Then, the microlens 102 is attached to the microlens mounting hole 104 to complete the microlens array 101.

  Further, the ceramic substrate 11 is produced by the following procedure. A raw material slurry is prepared by uniformly mixing and kneading alumina powder, organic binder, solvent, plasticizer, etc., and this raw material slurry is used to form a sheet with a doctor blade device to form a green sheet having a predetermined thickness. . A predetermined portion of the green sheet is punched, and a metal paste for forming a via-hole conductor is filled in the formed hole. Moreover, the printing layer used as a metal wiring layer later is formed by printing a metal paste on the surface of a green sheet. Then, these green sheets are laminated and pressed to be integrated into a green sheet laminate. Thereafter, the green sheet laminate is punched to form first through holes 21 (first recesses) (first drilling step). Since it is still unsintered at this stage, drilling can be performed relatively easily and at low cost. In the first drilling step, the inner diameter of the first through hole 21 (first concave portion) at the time of passing through the firing step is the inner diameter (about 0.7 mm) of the second through hole 23 (second concave portion, substrate side alignment concave portion). ) And the diameter of the guide pin 24 (about 0.7 mm) is set to be larger than that. Specifically, the first through hole 21 is drilled by setting to about 1.2 mm to 2.4 mm. The reason is that the ceramic shrinks through the firing process, and accordingly, the first through hole 21 (first recess) is also reduced in diameter and misaligned. Therefore, the first through hole 21 ( This is because the first recess) needs to be formed larger. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is further performed at a heating temperature at which alumina can be sintered. As a result, the green sheet laminate (ceramic unsintered body) is sintered to form the ceramic substrate 11. At this point, the ceramic hardens and shrinks.

  In the subsequent resin layer disposing step, the resin layer 22 is provided in the first through hole 21 (first recess) as follows. First, with respect to 80 parts by weight of bisphenol F type epoxy resin (“Epicoat 807” manufactured by JER) and 20 parts by weight of cresol novolac type epoxy resin (“Epicoat 152” manufactured by JER), a curing agent (“2P4MZ manufactured by Shikoku Kasei Kogyo Co., Ltd.) -CN ") 5 parts by weight, 200 parts by weight of a silica filler (" TSS-6 "manufactured by Tatsumori) treated with a silane coupling agent (" KBM-403 "manufactured by Shin-Etsu Chemical Co., Ltd.), an antifoaming agent (" Sannopco " Berenol S-4 "). The mixture is kneaded with three rolls to be a resin material for forming the resin layer 22. That is, in this embodiment, an uncured resin material containing an inorganic filler in a thermosetting resin is used.

  Next, the ceramic substrate 11 is set in a printing apparatus, and a predetermined metal mask (not shown) is placed in close contact with the upper surface 12 thereof. In such a metal mask, an opening is formed in advance at a location corresponding to the first through hole 21. By printing the resin material through such a metal mask, the resin material is completely filled in the first through holes 21 without any gaps. Thereafter, after the printed ceramic substrate 11 is removed from the printing apparatus, the resin layer 22 formed by filling the resin material is cured to some extent (semi-cured) by heating at 120 ° C. for 1 hour. Here, the reason why the resin layer 22 is not completely cured is to perform the hole processing in the next second drilling process more easily.

  In the subsequent second drilling step, precision drilling using a precision drill is performed to form second through holes 23 (second recesses, substrate side alignment recesses) in the resin layer 22. According to such a processing method, the guide pin 24 serving as a reference at the time of optical axis alignment can be the second through hole 23 that can be supported at a desired correct position.

  Next, the resin layer 22 is completely cured by performing a main curing process in which the ceramic substrate 11 is heated at 150 ° C. for 5 hours. Further, finishing is performed by a well-known method, and the hole diameter of the second through hole 23 is finely adjusted to 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm.

  Next, after solder paste is printed on the connection pads 92 on the upper surface 12 of the ceramic substrate 11, the VCSEL 14 and the operating circuit IC 94 are mounted and reflow is performed. As a result, the connection pad 94 and the terminals of the VCSEL 14 and the operation circuit IC 94 are joined via solder.

  In the subsequent guide member mounting step, the guide pin 24 is first fitted into the second through hole 23 (second recess, substrate side alignment recess) using a dedicated jig or the like.

  In the subsequent alignment step, each guide pin 24 protruding from the ceramic substrate 11 is first inserted into each alignment hole 103 (optical component side alignment recess) of the microlens array 101. Thus, the microlens array 101 is fixed to the ceramic substrate 11 while aligning the optical axes of the light emitting units 15 of the VCSEL 14 and the microlenses 102. At this time, the interface between the microlens array 101 and the ceramic substrate 11 may be reliably bonded using an adhesive or the like. Further, the guide pins 24 are inserted into the alignment holes 113 (optical component side alignment recesses) of the optical fiber connector 111. Thereby, the optical axes of the light emitting units 15 of the VCSEL 14, the microlenses 102 and the cores of the optical fibers 112 are aligned, and the optical fiber connector 111 is fixed to the ceramic substrate 11. And the optical element mounting substrate 80 with an optical fiber connector of this embodiment is completed as mentioned above.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the present embodiment, the ceramic substrate 11 and the microlens array are achieved while achieving optical axis alignment with the fitting relationship between the guide pin 24 fitted in the second through hole 23 and the alignment holes 103 and 113. 101 and the optical fiber connector 111 are mutually fixed. Therefore, the optical axis is more positively and accurately aligned as compared with the conventional passive optical axis alignment that relies only on the self-alignment action during reflow. Therefore, it is possible to realize the optical element mounting substrate 80 with an optical fiber connector that has a small light transmission loss and can sufficiently cope with high speed and high density. Further, since the ceramic substrate 11 having higher thermal conductivity than the resin substrate is used, the heat generated by the VCSEL 14 and the operating circuit IC 94 is efficiently dissipated. Therefore, the shift of the emission wavelength due to the deterioration of the heat dissipation property can be avoided, and the optical element mounting substrate 80 with an optical fiber connector excellent in operational stability and reliability can be realized.

(2) Moreover, according to the manufacturing method of this embodiment, the optical element mounting substrate 80 with an optical fiber connector which has the said structure can be manufactured reliably and at low cost.
[Fifth Embodiment]

  Next, an optical element mounting substrate 60 with an optical waveguide (an optical element mounting substrate with an optical component) in the fifth embodiment will be described with reference to FIGS.

In the first embodiment, the first through hole 21 is formed as the first recess and the second through hole 23 is formed as the second recess. However, in the present embodiment, the first non-penetration is used as the first recess. A hole 61 is formed, and a second non-through hole 63 is formed as a second recess. Other configurations are common. Hereinafter, a method of manufacturing the optical element mounting substrate 60 with an optical waveguide having such a configuration will be described.
(First manufacturing method)

  First, the ceramic substrate 11 is produced according to the procedure of the first embodiment. Here, the green sheet laminate is drilled to form first non-through holes 61 (first recesses) at predetermined locations (first drilling step). Since it is still unsintered at this stage, drilling can be performed relatively easily and at low cost. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is further performed at a heating temperature at which alumina can be sintered. Thereby, the green sheet laminate (ceramic unsintered body) is sintered to form the ceramic substrate 11 (see FIG. 20). At this point, the ceramic hardens and shrinks.

  Next, the upper ends of the plurality of guide pins 24 that are alignment guide members are held and fixed by a chuck 121 that is a guide member holding jig. And the guide pin 24 is hold | maintained in the state which inserted the lower end part of the grasped guide pin 24 in the 1st non-through-hole 61. FIG. At that time, the guide pin 24 is aligned with high accuracy in the XY axis direction. Furthermore, the uncured resin material 123 is filled into the first non-through hole 61 using a dispenser 122 or the like (see FIG. 21). In the present embodiment, as in the first embodiment, an uncured resin material containing an inorganic filler in a thermosetting resin is used. Then, after the filled resin material 123 is heated and cured, the holding by the chuck 121 is released. As a result, the resin layer 22 having the second non-through hole 63 can be disposed substantially at the center, and the guide pin 24 can be supported in the second non-through hole 63 (see FIG. 22, resin layer arrangement and Guide member attaching process).

  Therefore, according to the first manufacturing method, since the resin layer arranging step and the guide member attaching step are performed at the same time, the number of steps is reduced as compared with the manufacturing method of the first embodiment. Therefore, it is extremely advantageous for cost reduction.

In the first manufacturing method, a guide member holding jig other than the chuck 121 may be used. Further, when filling the uncured resin material 123 into the first non-through hole 61, means other than the dispenser 122 may be used. Further, the following changes are possible. That is, the uncured resin material 123 is filled in the first non-through hole 61 first, and then the lower end portion of the guide pin 24 is inserted and held in the first non-through hole 61. In such an order, the guide pin 24 does not get in the way when the resin material 123 is filled, so the range of options for filling the resin material 123 is widened. Therefore, it is possible to adopt a technique such as a printing method.
(Second manufacturing method)

  First, the ceramic substrate 11 is produced according to the procedure of the first embodiment. Here, the green sheet laminate is drilled to form first non-through holes 61 (first recesses) at predetermined locations (first drilling step). Since it is still unsintered at this stage, drilling can be performed relatively easily and at low cost. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is further performed at a heating temperature at which alumina can be sintered. Thereby, the green sheet laminate (ceramic unsintered body) is sintered to form the ceramic substrate 11 (see FIG. 23). At this point, the ceramic hardens and shrinks.

  Next, a mold 126 as a spacer member is prepared. The mold 126 has a plurality of pins 127 having a shape corresponding to the shape of the guide pins 24 (see FIG. 24). Then, in a state where the ceramic substrate 11 and the mold 126 are aligned with high accuracy in the XY axis direction, the mold 126 is inserted with the lower end portion of each pin 127 inserted into the first non-through hole 61. Hold. Furthermore, the uncured resin material 123 is filled into the first non-through hole 61 using a dispenser 122 or the like. In the present embodiment, as in the first embodiment, an uncured resin material containing an inorganic filler in a thermosetting resin is used. Then, after the filled resin material 123 is heated and cured, the mold 126 is pulled up and removed. As a result, the resin layer 22 having the second non-through hole 63 in the substantially central portion is formed (see FIG. 25, resin layer arrangement and second drilling step). Finally, the guide pins 24 are fitted and supported in the respective second non-through holes 63 (see FIG. 26, guide member attaching step).

  Therefore, according to the second manufacturing method, since the resin layer disposing step and the second drilling step are performed at the same time, the number of steps is reduced compared to the manufacturing method of the first embodiment. Therefore, it is extremely advantageous for cost reduction.

In the second manufacturing method, means other than the dispenser 122 may be used to fill the uncured resin material 123 into the first non-through hole 61. Further, the following changes are possible. That is, the uncured resin material 123 is first filled in the first non-through hole 61, and then the lower end portion of the pin 127 of the mold 126 is inserted and held in the first non-through hole 61. . In such an order, the mold 126 does not get in the way when the resin material 123 is filled, so the range of options for filling the resin material 123 is widened. Therefore, it is possible to adopt a technique such as a printing method.
[Sixth Embodiment]

  27 to 29 show a sixth embodiment of an optical element mounting substrate 130 with an optical waveguide (an optical element mounting substrate with an optical component) embodying the present invention. FIG. 27 is a schematic sectional view of the optical element mounting substrate 130 with an optical waveguide. 28 is a cross-sectional view taken along line AA in FIG. FIG. 29 shows a state in which each component is fixed while the ceramic substrate 11, the lower optical waveguide 141, and the upper optical waveguide 151 are aligned in the manufacturing process of the optical element mounting substrate 130 with the optical waveguide. It is a schematic sectional drawing.

  As shown in FIGS. 27 and 28, the optical element-mounted substrate 130 with an optical waveguide of this embodiment includes a VCSEL 14 (optical element), a ceramic substrate 11 (substrate), a lower optical waveguide 141 (optical component), and an upper optical waveguide. A waveguide 151 (optical component), a guide pin 24 (positioning guide member), and the like are included. Note that the VCSEL 14 according to the present embodiment has two light emitting unit rows each including four light emitting units 15.

  The ceramic substrate 11 is a substantially rectangular plate member having an upper surface 12 (main surface) and a lower surface 13. The ceramic substrate 11 is a so-called multilayer wiring board, and includes a metal wiring layer (that is, a wiring pattern 134 and a via-hole conductor 135) therein. A cavity 136, which is a chip accommodating portion, is provided at a substantially central portion on the upper surface 12 side. On the other hand, a plurality of external connection terminals 132 are formed on the lower surface 13 side. A first through hole 21 as a first recess is provided in the outer peripheral portion of the ceramic substrate 11, and a resin layer 22 is provided inside the first through hole 21. A second through hole 23 (second concave portion, substrate-side alignment concave portion) is provided at a substantially central portion of the resin layer 22, and a guide pin 24 is fitted into the second through hole 23.

  The lower optical waveguide 141 is disposed in close contact with the upper surface 12 of the ceramic substrate 11. The base material 32 constituting the lower optical waveguide 141 has a core 33 and a clad 34. A V-shaped groove 153 having an inner angle of about 90 ° is formed in a predetermined portion of the base material 32, and a thin film 152 made of a metal capable of totally reflecting light is deposited on the inner surface (inclined surface) of the V-shaped groove 153. Yes. As a result, an optical path changing mirror that converts the traveling direction of the light emitted from the VCSEL 14 by about 90 ° is configured. Such an optical path changing mirror is arranged immediately above one light emitting section row in the VCSEL 14. An alignment hole 146 (optical component side alignment recess) is formed through the outer peripheral portion of the base material 32 constituting the lower optical waveguide 141. The guide hole 24 is fitted in the alignment hole 146 while being inserted.

  On the lower surface side of the lower optical waveguide 141, a wiring layer (connection pad 92 and metal wiring layer 93) is formed. On the lower surface side of the lower optical waveguide 141, a VCSEL 14 (optical element) which is a kind of optical element (light emitting element) and an operating circuit IC 94 (so-called driver IC) are mounted. Accordingly, the light emitting portion 15 of the VCSEL 14 is disposed upward, and laser light is incident from the lower surface side of the lower optical waveguide 141 during light emission. Since the lower optical waveguide 141 is basically a transparent member, the incident laser light can pass through to the upper surface side of the lower optical waveguide 141. The VCSEL 14 and the operating circuit IC 94 are arranged in a state of being accommodated in the cavity 136. Silicone oil or the like may be filled in a gap between the lower surface of the VCSEL 14 and the operating circuit IC 94 and the bottom surface of the cavity 136 for the purpose of improving heat dissipation. In the present embodiment, the lower optical waveguide 141 can be grasped as a support that directly supports the optical element. It is also possible to grasp that the ceramic substrate 11 is a substrate that indirectly supports the optical element via the lower optical waveguide 141.

  The upper optical waveguide 151 is disposed in close contact with the upper surface of the lower optical waveguide 141. The base material 32 constituting the upper optical waveguide 151 has an optical path changing mirror formed by depositing a thin film 152 on the core 33, the clad 34, and the V-shaped groove 151. However, the optical path conversion mirror in the upper optical waveguide 151 is disposed at a position different from the optical path conversion mirror in the lower optical waveguide 141, specifically, directly above the other light emitting section row in the VCSEL 14. That is, in this embodiment, the optical path conversion mirror of the lower optical waveguide 141 and the optical path conversion mirror of the upper optical waveguide 151 are parallel to the lower surface (specifically, for example) so as not to overlap when viewed from the lower surface side of the lower optical waveguide 141. Specifically, they are arranged shifted in the longitudinal direction of the core 33. Therefore, interference of incident light can be avoided, and the optical coupling between each core 33 and the VCSEL 14 is not hindered. An alignment hole 156 (optical component side alignment recess) is formed through the outer peripheral portion of the base material 32 constituting the upper optical waveguide 151. The guide pin 24 is fitted in the alignment hole 156 while being inserted therethrough.

  In this embodiment, the ceramic substrate 11, the lower optical waveguide 141, and the upper optical waveguide 151 are fixed in a state of being aligned with each other by fitting with the guide pins 24. Here, the “aligned state” specifically refers to a state in which the optical axis of each light emitting portion 15 of the VCSEL 14 and the optical axis of each core 33 of the lower optical waveguide 141 and the upper optical waveguide 151 are aligned. Say.

  Therefore, according to this embodiment, there exist the following effects.

  (1) In this embodiment, the ceramic substrate 11, the lower optical waveguide 141, and the upper optical waveguide 151 are fixed to each other while achieving optical axis alignment with a fitting relationship with the guide pin 24. . Therefore, the optical axis is more positively and accurately aligned as compared with the conventional passive optical axis alignment that relies only on the self-alignment action during reflow. Therefore, it is possible to realize the optical element mounting substrate 130 with an optical waveguide that has a small light transmission loss and can sufficiently cope with high speed and high density. Further, since the ceramic substrate 11 having higher thermal conductivity than the resin substrate is used, the heat generated by the VCSEL 14 and the operating circuit IC 94 is efficiently dissipated. Therefore, the shift of the emission wavelength due to the deterioration of the heat dissipation property can be avoided, and the optical element mounting substrate 130 with an optical waveguide excellent in operational stability and reliability can be realized.

  (Modification)

  30 and 31 show a modification of the optical element mounting substrate 130 (optical component mounting substrate with optical components) of the sixth embodiment. FIG. 30 is a schematic cross-sectional view of a modified optical element mounting substrate 130 with an optical waveguide. 31 is a cross-sectional view taken along the line BB of FIG.

  In the optical element mounting substrate 130 with an optical waveguide, the wiring layer (the connection pad 92 and the metal wiring layer 93) of the lower optical waveguide 141 is omitted, and a connection pad 158 is provided on the bottom surface of the cavity 136 instead. The VCSEL 14 and the operating circuit IC 94 are soldered onto the connection pads 158. Further, the cores 33 of the upper optical waveguide 151 and the cores 33 of the lower optical waveguide 141 are arranged shifted in the width direction of the core 33 so as not to overlap when viewed from the lower surface side (see FIG. 31). . In this case, the shift amount is set to a value that is half the distance between the center lines of the adjacent cores 33. Therefore, also in this modification, interference of incident light and outgoing light can be avoided, and optical coupling between each core 33 and the VCSEL 14 is not hindered.

  In addition, you may change embodiment of this invention as follows.

  -Finishing may be omitted as long as a sufficiently accurate hole can be formed only by precision drilling in the second drilling step.

  -In 1st Embodiment, the process of mounting VCSEL14 and the photodiode 16 which are optical elements was performed in the stage after implementation of a finishing process and before implementation of a guide member attachment process. However, the present invention is not limited to this, and the optical element mounting process may be performed after the guide member mounting process or before the finishing process.

In the sixth embodiment, the optical waveguides 141 and 151 are used as the optical components having the light transmission function and the light reflection function. Instead, the optical waveguide 141 or 151 is used as an optical component having the light transmission function. May be. Furthermore, instead of the optical waveguides 141 and 151, an optical component having a condensing function such as a microlens array may be used.
In the first embodiment, as shown in FIGS. 8 to 10, the step of filling the second recess with the resin layer 22 → the second drilling for forming the second recess by drilling the resin layer 22 Although the process is performed in the order of removing the surplus resin layer 22 by surface polishing, the order may be changed. For example, the second drilling step may be performed before the surface polishing step. In this case, since the drilling is performed on the flat surface, the processing accuracy of the second recess can be improved. Further, the opening of the second recess is less likely to be chipped than when surface polishing is performed after drilling.

  -In 1st-6th embodiment, although the resin layer 22 which is a 2nd recessed part formation part was formed in the 1st recessed part, the 2nd recessed part penetrated or not penetrated in the resin layer 22 was formed. It is also possible to use the material other than the resin as the second recessed portion formation portion. In the first to sixth embodiments, it is preferable to use the material having better workability than the ceramic such as alumina, which is the main material for forming the ceramic substrate 11, as the second recessed portion formation portion. Specific examples thereof include glass material, machinable ceramic, silicon, brazing material, and conductive paste. Here, the machinable ceramic refers to a ceramic that can be machined using a machine. Preferable examples of machinable ceramics include mica ceramics (artificial mica crystals grown in glass), composite mica ceramics with a glassy matrix and uniform fluor-phlogopite zirconia microcrystals, porous nitriding The thing which impregnated resin with ceramics, such as aluminum, can be mentioned.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) A ceramic substrate having a first main surface and a second main surface and having first through holes opened on both sides of the first main surface and the second main surface, and the first main surface of the ceramic substrate. An optical element mounted on a surface and having at least one of a light emitting part and a light receiving part, and to be optically connected in a state where the optical axis is aligned with an optical waveguide or an optical fiber connector; and in the first through hole And a resin layer having a second through hole that is smaller in diameter than the first through hole and opens on both sides of the first main surface and the second main surface, and is fitted into the second through hole. An alignment guide member that is partly protruded at the first main surface side of the ceramic substrate and can be fitted into an alignment hole of the optical waveguide or the optical fiber connector. It is characterized by having Optical element mounting substrate.

  (2) A ceramic substrate having a main surface and having a first recess opening at least on the main surface side; and mounted on the main surface of the ceramic substrate and having at least one of a light emitting portion and a light receiving portion. An optical element to be optically connected with the optical axis aligned with the optical waveguide or the optical fiber connector, and located in the first recess, having a smaller diameter than the first recess and opening at least on the main surface side A resin layer having a second recess to be supported by being fitted into the second recess, and a part of the ceramic substrate protrudes on the main surface side, and the optical waveguide or the optical fiber connector has In the manufacturing method of the optical element mounting substrate provided with the alignment guide member that can be fitted into the alignment hole, the ceramic green body is formed by performing hole processing. A first drilling step for forming one recess, a firing step for sintering the ceramic unsintered body to form the ceramic substrate, and a resin layer arrangement for providing the semi-cured resin layer in the first recess A second step of drilling the second recess in the resin layer by drilling after the resin layer disposing step, and the resin layer is completely cured after the second drilling step. A step of performing a main curing process, a finishing step of finishing the second recess after the step of performing the main curing process, an optical element mounting step of mounting the optical element after the finishing step, and the optical element And a guide member mounting step of supporting the alignment guide member in the second recess after the mounting step.

  (3) A substrate having a substrate-side alignment recess, a first optical component having at least a light reflection function and having a first optical component-side alignment recess, and disposed between the substrate and the first optical component A second optical component having at least a light collecting function and having a second optical component side alignment recess, and mounted on the substrate and having at least one of a light emitting unit and a light receiving unit, and the optical component And an optical element to be optically connected with the optical axis aligned with the first optical component-side alignment recess, the second optical component-side alignment recess, and the substrate-side alignment recess An optical element mounting substrate with an optical component, comprising: an alignment guide member capable of alignment.

  (4) A ceramic substrate having a main surface and having a first recess opening at least on the main surface side; a first optical component having at least a light reflecting function and having a first optical component side alignment recess; A second optical component disposed between the substrate and the first optical component, having at least a light collecting function and having a second optical component side alignment recess; and mounted on a main surface of the ceramic substrate; An optical element having at least one of a light emitting part and a light receiving part, to be optically connected in a state where the optical axis is aligned with the optical component, and located in the first concave part, A resin layer having a second recess having a small diameter and opening at least on the main surface side, the second optical component side alignment recess, the second optical component side alignment recess, and the substrate side alignment recess. Fit against recess Optical parts with the optical element mounting substrate, characterized in that it comprises position and alignment guide member capable, the.

  (5) The first optical component includes an optical path conversion unit and is an optical fiber connector connected to an end portion of an optical fiber according to the technical idea (3) or (4), Optical element mounting substrate with optical components.

  (6) A ceramic substrate having a main surface and having a first recess opening at least on the main surface side; and mounted on the main surface of the ceramic substrate, and having at least one of a light emitting portion and a light receiving portion. An optical element to be optically connected with the optical axis aligned with the optical waveguide or the optical fiber connector, and located in the first recess, having a smaller diameter than the first recess and opening at least on the main surface side A resin layer having a second recess to be supported by being fitted into the second recess, and a part of the ceramic substrate protrudes on the main surface side, and the optical waveguide or the optical fiber connector has In the manufacturing method of the optical element mounting substrate provided with the alignment guide member that can be fitted into the alignment hole, the ceramic green body is formed by performing hole processing. A first drilling step for forming one recess, a firing step for sintering the ceramic unsintered body to form the ceramic substrate, a spacer member is disposed in the first recess, and in this state, uncured After the resin material is filled and cured, by removing the spacer member, the resin layer having the second recess is provided, the resin layer arrangement and the second drilling step, and the second recess And a guide member mounting step for supporting the alignment guide member.

  (7) A ceramic substrate having a main surface and having a first recess opening at least on the main surface side; and mounted on the main surface of the ceramic substrate, and having at least one of a light emitting portion and a light receiving portion. An optical element to be optically connected with the optical axis aligned with the optical waveguide or the optical fiber connector, and located in the first recess, having a smaller diameter than the first recess and opening at least on the main surface side A resin layer having a second recess to be supported by being fitted into the second recess, and a part of the ceramic substrate protrudes on the main surface side, and the optical waveguide or the optical fiber connector has In the manufacturing method of the optical element mounting substrate provided with the alignment guide member that can be fitted into the alignment hole, the ceramic green body is formed by performing hole processing. A first drilling step for forming one recess, a firing step for sintering the ceramic unsintered body to form the ceramic substrate, and a part of the alignment guide member inserted into the first recess. In this state, the resin layer having the second recess is provided by filling and curing the uncured resin material in the first recess, and the second recess is used for the alignment. A method of manufacturing an optical element mounting substrate, comprising: a resin layer arrangement and a guide member mounting step for supporting a guide member.

1 is a schematic plan view showing an optical element mounting substrate with an optical waveguide of a first embodiment embodying the present invention. The schematic sectional drawing which shows the said optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing an optical waveguide in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a state in which an alignment hole is formed in the optical waveguide in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a green sheet laminate in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a state in which a first through hole is formed in the green sheet laminate in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a state in which a green sheet laminate is fired into a ceramic substrate in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a state in which a resin layer is formed by filling a ceramic substrate with a resin material in the manufacturing process of the optical element mounting substrate. FIG. 5 is a schematic cross-sectional view showing a state in which a second through hole is formed in the resin layer in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a state where the surface of the ceramic substrate is polished in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view showing a state where a VCSEL and a photodiode are mounted on a ceramic substrate in the manufacturing process of the optical element mounting substrate. FIG. 5 is a schematic cross-sectional view showing a state where guide pins are fitted into second through holes in the manufacturing process of the optical element mounting substrate. FIG. 3 is a schematic cross-sectional view illustrating a state in which the optical waveguide is fixed while the ceramic substrate and the optical waveguide are aligned in the manufacturing process of the optical element mounting substrate. The schematic plan view which shows the optical element mounting substrate with an optical fiber connector of 3rd Embodiment. The schematic sectional drawing which shows the said optical element mounting board | substrate with an optical fiber connector. FIG. 4 is a schematic cross-sectional view showing a state in which the optical fiber connector is fixed while the ceramic substrate and the optical fiber connector are aligned in the manufacturing process of the optical element mounting substrate with the optical fiber connector. The schematic sectional drawing which shows the optical element mounting substrate with an optical fiber connector of 4th Embodiment. FIG. 3 is a schematic cross-sectional view showing a state in which each component is fixed while aligning the ceramic substrate, the microlens array, and the optical fiber connector in the manufacturing process of the optical element mounting substrate with the optical fiber connector. The schematic plan view which shows the optical element mounting substrate with an optical waveguide of 5th Embodiment. The schematic sectional drawing which shows the ceramic substrate in which the 1st non-through-hole was formed in the manufacture process of the optical element mounting board | substrate with an optical waveguide of 5th Embodiment. FIG. 5 is a schematic cross-sectional view showing a state when a resin layer arrangement and a guide member attaching step are performed in the manufacturing process of the optical element mounting substrate with an optical waveguide. The schematic sectional drawing which shows the state which the resin layer arrangement | positioning and the guide member attachment process were completed in the manufacture process of the said optical element mounting board | substrate with an optical waveguide. The schematic sectional drawing which shows the ceramic substrate in which the 1st non-through-hole was formed in the manufacture process of the optical element mounting board | substrate with an optical waveguide of 5th Embodiment. FIG. 5 is a schematic cross-sectional view showing a state when a resin layer is disposed and a second drilling step is performed using a mold in the manufacturing process of the optical element mounting substrate with an optical waveguide. The schematic sectional drawing which shows the state which the resin layer arrangement | positioning and the 2nd drilling process were completed in the manufacture process of the said optical element mounting board | substrate with an optical waveguide. FIG. 6 is a schematic cross-sectional view showing a state where guide pins are fitted and supported in second non-through holes in the manufacturing process of the optical element mounting substrate with an optical waveguide. The schematic sectional drawing which shows the optical element mounting substrate with an optical waveguide of 6th Embodiment. AA line sectional view of Drawing 27. FIG. 5 is a schematic cross-sectional view showing a state in which each component is fixed while aligning the ceramic substrate, the lower optical waveguide, and the upper optical waveguide in the manufacturing process of the optical element mounting substrate. The schematic sectional drawing which shows the optical element mounting substrate with an optical waveguide which is a modification of 6th Embodiment. FIG. 31 is a sectional view taken along line B-B in FIG. 30.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 60, 130 ... (with optical waveguide) Optical element mounting substrate 11 ... Ceramic substrate 12 ... Upper surface as main surface (of ceramic substrate) 14 ... VCSEL as optical element
DESCRIPTION OF SYMBOLS 15 ... Light-emitting part 16 ... Photodiode as an optical element 17 ... Light-receiving part 18 ... Green sheet laminated body as ceramic unsintered body 21 ... 1st through-hole as 1st recessed part 22 ... Resin layer 23 ... As 2nd recessed part Second through hole 24 (as a substrate-side alignment recess) 24. Guide pin as a positioning guide member 31. Optical waveguide as an optical component 36, 54, 103, 113, 146, 156. Alignment holes 50, 80 ... (with optical fiber connector) Optical element mounting substrate 52 ... Optical fiber connector 61 ... First non-through hole as first recess 63 ... Substrate side alignment recess Second non-through hole 101... Microlens array as optical component 111... Optical fiber connector 141 as optical component 141. Lower optical waveguide 151... Upper optical waveguide as an optical component

Claims (14)

A ceramic substrate having a main surface and having a first recess opening at least on the main surface side;
An optical element mounted on the main surface of the ceramic substrate, having at least one of a light emitting part and a light receiving part, and optically connected in a state where the optical axis is aligned with the optical waveguide or the optical fiber connector;
A resin layer having a second recess located in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side;
The ceramic substrate is supported by being fitted into the second recess, and a part of the ceramic substrate protrudes on the main surface side, and can be fitted into an alignment hole of the optical waveguide or the optical fiber connector. An optical element mounting substrate comprising an alignment guide member.   2. The optical element mounting substrate according to claim 1, wherein the second recess is a precision processing hole, and the alignment guide member is a guide pin fitted in the precision processing hole.   The optical element mounting substrate according to claim 1, wherein the resin layer includes an inorganic filler having higher thermal conductivity than the resin constituting the resin layer. A ceramic substrate having a main surface and having a first recess opening at least on the main surface side, and mounted on the main surface of the ceramic substrate, and having at least one of a light emitting portion and a light receiving portion, and an optical waveguide Alternatively, the optical element to be optically connected with the optical fiber connector and the optical axis aligned, and the second element located in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side. A resin layer having a recess and a support hole supported by being fitted into the second recess, a part of which protrudes on the main surface side of the ceramic substrate, and an alignment hole of the optical waveguide or the optical fiber connector In the manufacturing method of the optical element mounting substrate provided with the alignment guide member that can be fitted to,
A first drilling step of forming the first recess in the ceramic green body by drilling;
A firing step of sintering the ceramic green body to form the ceramic substrate;
A resin layer disposing step of providing the resin layer in the first recess;
A second drilling step of forming the second recesses in the resin layer by performing hole processing after the resin layer disposing step;
And a guide member attaching step of supporting the alignment guide member in the second recess.   In the first drilling step, the inner diameter of the first recess at the time of passing through the firing step is set to be larger than the inner diameter of the second recess and the diameter of the alignment guide member, The method for manufacturing an optical element mounting substrate according to claim 4, wherein a hole is formed in one recess.   6. The method of manufacturing an optical element mounting substrate according to claim 4, wherein in the second drilling step, the second recess is formed by performing precision drilling.   The optical according to any one of claims 4 to 6, wherein in the resin layer disposing step, the resin material is cured after filling the uncured resin material in the first recess. Manufacturing method of element mounting substrate.   The resin layer disposing step uses, as the resin material, an uncured resin material containing an inorganic filler having higher thermal conductivity than the resin constituting the resin layer. Manufacturing method of optical element mounting substrate. An optical waveguide;
A ceramic substrate having a main surface and having a first recess opening at least on the main surface side;
An optical element mounted on the main surface of the ceramic substrate, having at least one of a light emitting part and a light receiving part, and optically connected in a state where the optical axis is aligned with the optical waveguide;
A resin layer having a second recess located in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side;
An alignment guide member that is supported by being fitted into the second recess, part of which protrudes on the main surface side of the ceramic substrate, and can be fitted into an alignment hole of the optical waveguide. And an optical element mounting substrate with an optical waveguide. An optical fiber connector;
A ceramic substrate having a main surface and having a first recess opening at least on the main surface side;
An optical element mounted on a main surface of the ceramic substrate, having at least one of a light emitting part and a light receiving part, and optically connected in a state in which an optical axis is aligned with the optical fiber connector;
A resin layer having a second recess located in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side;
An alignment guide that is supported by being fitted into the second recess, a part of which protrudes on the main surface side of the ceramic substrate, and can be fitted into an alignment hole of the optical fiber connector. And an optical element mounting substrate with an optical fiber connector. An optical waveguide;
A ceramic substrate having a main surface and having a first recess opening at least on the main surface side, and mounted on the main surface of the ceramic substrate, and having at least one of a light emitting portion and a light receiving portion, A resin having an optical element optically connected with the optical axis aligned with the waveguide, and a second recess located in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side Positioning that is supported by being fitted to the layer and the second recess, part of which protrudes on the main surface side of the ceramic substrate, and can be fitted to the positioning hole of the optical waveguide In the manufacturing method of the optical element mounting substrate with an optical waveguide comprising a guide member for,
An alignment hole forming step of forming the alignment hole in the optical waveguide;
A first drilling step of forming the first recess in the ceramic green body by drilling;
A firing step of sintering the ceramic green body to form the ceramic substrate;
A resin layer disposing step of providing the resin layer in the first recess;
A second drilling step of forming the second recesses in the resin layer by performing hole processing after the resin layer disposing step;
A guide member attaching step for supporting the alignment guide member in the second recess;
An optical element with an optical waveguide, comprising: an alignment step of aligning an optical axis of the optical waveguide and the optical element by fitting the alignment guide member into the alignment hole. Manufacturing method of mounting substrate. An optical fiber connector;
A ceramic substrate having a main surface and having a first recess opening at least on the main surface side, mounted on the main surface of the ceramic substrate, and having at least one of a light emitting portion and a light receiving portion, and the light An optical element that is optically connected with the optical axis aligned with the fiber connector, and a second recess that is located in the first recess and has a smaller diameter than the first recess and opens at least on the main surface side. The resin layer is supported by being fitted into the second recess, and a part of the ceramic substrate protrudes on the main surface side and can be fitted into the alignment hole of the optical fiber connector. In the manufacturing method of the optical element mounting substrate with an optical fiber connector provided with an alignment guide member,
An alignment hole forming step of forming the alignment hole in the optical fiber connector;
A first drilling step of forming the first recess in the ceramic green body by drilling;
A firing step of sintering the ceramic green body to form the ceramic substrate;
A resin layer disposing step of providing the resin layer in the first recess;
A second drilling step of forming the second recesses in the resin layer by performing hole processing after the resin layer disposing step;
A guide member mounting step for supporting the alignment guide member in the second recess;
With an optical fiber connector comprising an alignment step of aligning the optical axis of the optical fiber connector and the optical element by fitting the alignment guide member into the alignment hole Manufacturing method of optical element mounting substrate. An optical component having at least one of an optical transmission function, a condensing function, and a light reflection function, and having an optical component side alignment recess;
A substrate having a substrate-side alignment recess;
An optical element mounted on the substrate, having at least one of a light emitting unit and a light receiving unit, and to be optically connected in a state where the optical axis is aligned with the optical component;
An optical element mounting substrate with an optical component, comprising: an alignment guide member for alignment that can be fitted to the optical component side alignment recess and the substrate side alignment recess. A substrate having a substrate-side alignment recess;
Mounted on the substrate, having at least one of a light emitting part and a light receiving part, and in a state where the optical axis is aligned with an optical component having at least one of a light transmission function, a light collecting function, and a light reflecting function An optical element to be optically connected;
An optical element mounting comprising: an alignment guide member that is supported by being fitted into the substrate-side alignment recess and can be fitted into the optical component-side alignment recess of the optical component. substrate.

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