JP4202216B2 - Photoelectric composite wiring structure, optical element mounting substrate, optical waveguide layer, and optical path conversion component - Google Patents

Description

The present invention relates to an optical-electrical composite wiring structure, in which about the structure comprising an optical element mounting substrate and the optical waveguide layer and the optical path changing part.

  In recent years, with the development of information communication technology represented by the Internet and the dramatic improvement in the processing speed of information processing apparatuses, there is an increasing need for transmitting and receiving large-capacity data such as images. An information transmission speed of 10 Gbps or higher is desirable to exchange such a large amount of data freely through an information communication facility, and great expectations are placed on optical communication technology as a technology that can realize such a high-speed communication environment.

On the other hand, signals can be transmitted at high speeds even on signal transmission paths at relatively short distances, such as connections between wiring boards in equipment, connections between semiconductor chips in wiring boards, connections within semiconductor chips, etc. It has been desired in recent years. For this reason, it is considered that it is ideal to shift from a conventional metal cable or metal wiring to optical transmission using an optical fiber or an optical waveguide.

  In particular, optical waveguides have attracted attention in recent years because they have advantages such as a high degree of freedom in wiring compared to optical fibers. Therefore, recently, a main wiring board having a structure in which an optical waveguide is joined in a state substantially parallel to the surface of the main board has been proposed. An optical element mounting package including an optical element is mounted on this type of main wiring board (for example, see Patent Document 1). In Patent Document 1, a technique in which a package and a main wiring board can be arranged at a predetermined position by a self-alignment action when a package on which an optical element is mounted is connected to the main wiring board with solder bumps and reflowed is performed. Is disclosed. More specifically, a technique in which alignment (optical axis alignment) is performed between the optical element on the package side and the optical path conversion unit at the end of the optical waveguide on the main wiring board side by the alignment operation during reflow. Is disclosed.

JP 2002-250830 A

  However, in the technique disclosed in Patent Document 1, alignment (optical axis alignment) between the external substrate on which the optical element is mounted and the wiring substrate is merely performed by solder reflow. For this reason, the alignment accuracy is not sufficient, and an optical axis shift is likely to occur between the optical element and the optical waveguide, which in turn tends to cause a light transmission loss. Therefore, it is considered that this method cannot sufficiently cope with the higher speed and higher density expected in the future.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and its object is to provide an optical / electrical composite wiring structure and an optical element mounting that can be reliably aligned without optical axis misalignment and have a small light transmission loss. An object of the present invention is to provide a structure composed of a substrate, an optical waveguide layer, and an optical path conversion component, a structure composed of an optical element mounting substrate and an optical path conversion component, and a structure composed of an optical path conversion component and an optical waveguide layer. Another object of the present invention is to provide an optical path conversion component having an alignment structure and a microlens array having an alignment structure, which are suitable for realizing the above structure.

Therefore, as means for solving the above-mentioned problems, an optical element mounting substrate main body on which an optical element mounting substrate side alignment concave portion is formed, and mounted on the optical element mounting substrate main body, of the light emitting unit and the light receiving unit. An optical element mounting board having an optical element having at least one, an electric wiring board having an electric wiring board body in which an electric wiring board side alignment concave portion is formed, and an optical waveguide in which an optical waveguide layer side alignment concave portion is formed An optical waveguide layer having a layer body, a core formed on the optical waveguide layer body, and a clad formed on the optical waveguide layer body to surround the core; and an optical path conversion component side An optical path conversion component having an optical path conversion component main body formed with an alignment recess, the optical element mounting substrate side alignment recess, the electrical wiring substrate side alignment recess, And a guide pin as a common alignment guide member which can fit removably relative Kikoshirube waveguide layer side positioning recess and the optical path changing component side positioning recess, said optical element mounting substrate, the electrical wiring The substrate, the optical waveguide layer, the optical path conversion component, and the guide pin are individually manufactured, and the optical waveguide layer and the optical path conversion component that are stacked on each other are in contact with the electrical wiring substrate. photoelectric composite wiring structure characterized that you are supported Te, there is.

  Therefore, according to the said invention, the optical axis of components will be in the state where the optical axis of components matched more positively and with high precision because the alignment guide member fits with the alignment recessed part of each component. Therefore, it is possible to realize a photoelectric composite wiring structure that has a small light transmission loss and can sufficiently cope with high speed and high density. Moreover, since this opto-electric composite wiring structure is obtained by assembling individually produced parts, it is suitable for cost reduction. In addition, as a result of making each part individually, the room for selecting the material for forming each part is widened.

  Examples of the material for forming the optical element mounting substrate and the electric wiring substrate include resin, ceramic, glass, and metal. Among these, ceramic is particularly preferable. When a ceramic having a higher thermal conductivity than that of a resin is used, the generated heat is efficiently dissipated and the operational stability and reliability are improved. In particular, in the optical element mounting substrate, the shift in the emission wavelength due to the deterioration of the heat dissipation is avoided, so that the operational stability and reliability are improved. Examples of ceramics suitable as the substrate forming material include alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite, low-temperature fired glass ceramic, and glass ceramic. Among these, it is particularly preferable to select alumina or aluminum nitride as the substrate forming material.

  Examples of resins suitable as the substrate forming material include EP resin (epoxy resin), PI resin (polyimide resin), BT resin (bismaleimide-triazine resin), PPE resin (polyphenylene ether resin), and the like. be able to. In addition, a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used as the substrate forming material. Examples of metals suitable as the substrate forming material include copper, copper alloys, simple metals other than copper, alloys other than copper, and the like.

  The optical element mounting substrate and the electrical wiring substrate preferably include an insulating layer and a conductor layer. The conductor layer may be formed on the substrate surface or may be formed inside the substrate. In order to achieve interlayer connection between these conductor layers, via hole conductors may be formed inside the substrate. For the conductor layer and via hole conductor, for example, a conductive metal paste made of gold (Au), silver (Ag), copper (Cu), platinum (Pt), tungsten (W), molybdenum (Mo), etc. is printed. Or it is formed by filling. Note that the conductor layer and the via-hole conductor may be formed by plating or the like. An electric signal flows through such a conductor layer.

  One or more optical elements are mounted on the optical element mounting substrate body of the optical element mounting substrate. As the mounting method, for example, a method such as wire bonding or flip chip bonding, a method using an anisotropic conductive material, or the like can be employed. As an optical element (that is, light emitting element) having a light emitting portion, for example, a light emitting diode (LED), a semiconductor laser diode (LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL), etc. Can be mentioned. These light emitting elements have a function of converting an inputted electric signal into an optical signal and then emitting the optical signal from a light emitting unit toward a predetermined portion. On the other hand, examples of the optical element having a light receiving portion (that is, a light receiving element) include a pin photodiode (pin PD) and an avalanche photodiode (APD). These light receiving elements have a function of causing an optical signal to be incident on the light receiving unit, converting the incident optical signal into an electric signal, and outputting the electric signal. The optical element may have both a light emitting part and a light receiving part. Suitable materials used for the optical element include, for example, Si, Ge, InGaAs, GaAsP, GaAlAs and the like. Such an optical element (particularly a light emitting element) is operated by an operation circuit. The optical element and the operation circuit are electrically connected through, for example, a conductor layer formed on the optical element mounting substrate.

  Various electronic components may be mounted on the electrical wiring board. Specific examples include a semiconductor integrated circuit chip, a semiconductor package, and various chip components (for example, a chip transistor, a chip diode, a chip resistor, a chip capacitor, and a chip coil). These electronic components are all electrically connected to a conductor layer formed on the electric wiring board.

  The optical waveguide layer body constituting the optical waveguide layer is a plate-like or film-like member, and has a core serving as an optical path through which an optical signal propagates and a clad surrounding the core. When the optical waveguide layer is roughly classified from the surface of the forming material, there are an organic optical waveguide layer made of a polymer material or the like and an inorganic optical waveguide layer made of quartz glass or a compound semiconductor. As the polymer material, a photosensitive resin, a thermosetting resin, a thermoplastic resin, or the like can be selected. Specifically, a polyimide resin such as a fluorinated polyimide, an epoxy resin, a UV curable epoxy resin, a PMMA ( Polymethyl methacrylate), acrylic resins such as deuterated PMMA, deuterated fluorinated PMMA, polyolefin resins, and the like are suitable. The advantages of the organic optical waveguide layer are that it can be formed into a flexible film, has excellent handleability, and is relatively inexpensive. On the other hand, the advantage of the inorganic optical waveguide layer is excellent heat resistance.

  The optical path conversion component has an optical path conversion component main body, and the optical path conversion component main body is preferably an optical path conversion component made of a light transmissive material and having a portion capable of reflecting light and converting the optical path. . In this case, a hole is provided in the middle of the core or at the end of the optical waveguide layer, and the optical path conversion component main body is inserted into the hole. The optical path conversion component main body preferably has a size and a shape that can be inserted into a hole provided in the optical waveguide structure. As a preferred example thereof, an optical path conversion component main body having an inclined surface and a substantially right-angled cross section can be cited. The inclined surface is located on the longest side in a substantially right triangle. In this case, the inclined surface substantially becomes a light reflecting portion of the optical path conversion component main body.

  Even if the optical path conversion component includes only the optical path conversion component main body, it is possible to reflect the light and convert the optical path, but it is more preferable to form a light reflector on the optical path conversion component main body. According to this configuration, it is possible to reflect light efficiently, and light transmission loss can be further reduced. The light reflector may be formed inside or on the surface of the optical path conversion component main body. Note that a structure in which a light reflector is formed on the surface of the optical path conversion component main body is easier to manufacture, which is advantageous for cost reduction. Specifically, the optical path conversion component main body has an inclined surface having a positional relationship inclined with respect to the extending direction of the core, and a metal film as the light reflector is formed on the surface of the inclined surface. It is preferable that Examples of the metal material used for forming the metal film include a glossy metal such as gold, silver, copper, nickel, and rhodium. This is because a glossy metal can reflect light efficiently and is suitable for use as an optical path conversion component. The metal film preferably reflects 90% or more of light, and particularly preferably totally reflects light.

  The photoelectric composite wiring structure may further include a microlens array. The microlens array refers to a member in which one or two or more microlenses made of a light transmitting material are formed on the microlens array main body. When the microlens array is provided, the light is condensed when passing through the microlens, so that the light transmission loss can be further reduced. The microlens may have a diameter of 100 μm or less. The microlens is preferably integrally formed using a light-transmitting material common to the optical path conversion component main body.

  Instead of such a configuration, for example, a microlens may be formed on the upper surface of the optical path conversion component main body. According to the above configuration, the microlens array body can be formed as thin as the main body is eliminated, and an increase in the distance between the optical waveguide layer and the optical element can be avoided. In addition, an increase in the number of parts can be prevented.

  Each component constituting the opto-electric composite wiring structure has an alignment recess. Specifically, in the optical element mounting substrate, an optical element mounting substrate side alignment recess is formed in the optical element mounting substrate body. In the electrical wiring board, an electrical wiring board side alignment recess is formed in the electrical wiring board body. In the optical waveguide layer, an optical waveguide layer side alignment recess is formed in the optical waveguide layer body. In the optical path conversion component, an optical path conversion component-side alignment recess is formed in the optical path conversion component main body. When a microlens array is provided, a microlens array side alignment recess is formed in the microlens body. An alignment guide member can be fitted into these alignment recesses.

  Each of the components (the optical element mounting substrate, the electrical wiring substrate, the optical waveguide layer, the optical path conversion component, and the microlens array) in which the alignment recess is formed is preferably a flat plate having a front surface and a back surface. In addition, the alignment recess in each component may be a non-through hole that opens on the front surface or the back surface of each member (that is, has one opening), or opens on both the front surface and the back surface (that is, It may be a through hole having two openings.

  The alignment recess can be formed using a conventionally known hole processing technique, and specific examples include drilling, punching, etching, and laser processing. In particular, mechanical processing such as drilling or punching makes it easy to achieve cost reduction. In this case, it is desirable to employ precision drilling using a precision drill or the like, and according to this method, it is possible to obtain an alignment recess capable of performing optical axis alignment with high accuracy. After forming the alignment recess, the hole diameter of the alignment recess may be finely adjusted by performing a finishing process as necessary. Fine adjustment of the hole diameter surely contributes to improvement of alignment accuracy.

  The alignment guide member is fitted and supported in an alignment recess of each component. Here, the shape of the alignment guide member is not particularly limited, but, for example, a pin-shaped member (guide pin) is preferable, and a material that is hard to some extent is preferable. In addition, if it is a metal which has electroconductivity among metals, a guide pin itself can be functioned as a part of conductor. Therefore, in this case, it is possible to achieve electrical conduction between the members via the guide pins. Preferable examples of the conductive metal include, for example, steel mainly composed of iron. Further, the diameter of the alignment guide member (particularly the diameter of the portion protruding on the main surface side of the substrate) is substantially the same as the inner diameter of the alignment recess so that it can be fitted to the alignment recess of each component. There must be. In addition, the number of alignment guide members used in one structure is not particularly limited. However, from the viewpoint of improvement in alignment accuracy and improvement in fixing strength, a plurality of alignment guide members is preferable to a single structure.

  In the case where the alignment recess is formed in each component (optical element mounting substrate, electrical wiring substrate, optical waveguide layer, optical path conversion component, microlens array), for example, the following may be used.

  First, the first recess is processed and formed on a component in which the recess is to be formed (for convenience, it is referred to as a “first recess formed component” here). The first recess in this case needs to have a larger diameter than the second recess (positioning recess) to be formed later. Next, a second recess forming portion made of a material having better workability than the main material for forming the first recess forming component is provided in the first recess formed in the first recess forming component. Specifically, for example, if the first recessed portion forming component is a ceramic substrate such as alumina, a material (for example, resin, metal) having better workability than the ceramic is formed in the first recessed portion formed on the ceramic substrate. , Glass, silicon, brazing material, machinable ceramics, etc.). Next, a hole is formed in the second recessed portion forming portion to form a second recessed portion (alignment recessed portion).

  Here, the “good workability” material specifically refers to a material that is relatively easy to process for drilling (for example, drilling, punching, etching, laser processing, etc.). For example, it can be said that a material having a lower hardness than the main material forming the first recessed portion forming part is a material with good workability. When such a material is used, highly accurate drilling can be performed easily and at low cost.

Further, as another means for solving the above-described problems, an optical element mounting substrate body in which an optical element mounting substrate side alignment recess is formed, and a light emitting unit and a light receiving unit mounted on the optical element mounting substrate body. An optical element mounting substrate having an optical element having at least one of the above, an optical waveguide layer body in which an optical waveguide layer side alignment recess is formed, a core formed in the optical waveguide layer body, and the core An optical waveguide layer having a clad formed on the optical waveguide layer body to surround, an optical path conversion component having an optical path conversion component body made of a light transmitting material and having an optical path conversion component side alignment recess, optical element mounting substrate side alignment recess, a common alignment which can fit removably relative to the optical waveguide layer side positioning recess and the optical path changing component side alignment recess A guide pin as a guide member, wherein the optical element mounting substrate, the optical waveguide layer, the optical path conversion component, and the guide pin are individually manufactured, and the optical waveguide layer and the stacked optical waveguide layer, optical path changing component, such as wherein the this that can be supported in contact with the separately configured electrical interconnect on the substrate, the structure consisting of an optical element mounting substrate and the optical waveguide layer and the optical path changing component, but is there. Further, as another means, an optical element mounting substrate main body on which an optical element mounting substrate side alignment recess is formed, and an optical device mounted on the optical element mounting substrate main body and having at least one of a light emitting portion and a light receiving portion. An optical element mounting substrate having an element, an optical path conversion component having an optical path conversion component body made of a light transmissive material and having an optical path conversion component side alignment recess, the optical element mounting substrate side alignment recess, and the There is a structure comprising an optical element mounting substrate and an optical path conversion component, characterized in that it includes an alignment guide member that can be fitted into the optical path conversion component side alignment recess. As another means, the optical waveguide layer body formed with the optical waveguide layer side alignment recess, the core formed in the optical waveguide layer body, and the optical waveguide layer body formed to surround the core. An optical waveguide layer having a cladding, an optical path conversion component having an optical path conversion component body made of a light transmissive material and having an optical path conversion component side alignment recess, and the optical waveguide layer side alignment recess and the optical path conversion There is a structure composed of an optical path conversion component and an optical waveguide layer, which is provided with an alignment guide member that can be fitted into the component-side alignment recess.

  Therefore, according to these inventions, when the alignment guide member is fitted into the alignment recess of each component, the optical axes of the components are more positively and accurately aligned. Therefore, it is possible to realize structures that have a small optical transmission loss and can sufficiently cope with high speed and high density. Any of the above structures may further include a microlens array.

  Further, as another means for solving the above-mentioned problems, the optical path conversion component main body is made of a light transmissive material and formed with an optical path conversion component side alignment recess, and the optical path conversion component side alignment recess On the other hand, there is an optical path conversion component having an alignment structure characterized in that an alignment guide member configured separately can be fitted.

  For example, when there is one or two or more other parts having the same alignment recess, and it is necessary to align with this (or these), the alignment guide member is positioned on the optical path conversion component side position. The mating recess is fitted and supported, and is also fitted and supported in a positioning recess of another component. As a result, the optical axes of the parts can be aligned more positively and with high accuracy. Therefore, the above-described structure composed of a plurality of parts can be realized relatively easily.

Further, as another means for solving the above problems, a microlens array body formed with a microlens array side alignment recess, a microlens formed on the microlens array body, and the microlens array body In the surface opposite to the microlens, the microlens array body and the optical path conversion unit integrally formed using the light transmissive material common to the microlens are provided, and the microlens array side alignment is performed. There is a microlens array with an optical path conversion unit having an alignment structure, in which a separate alignment guide member can be fitted to the recess.

  For example, when there is one or two or more other parts having similar alignment recesses and it is necessary to align with this (or these), the alignment guide member is positioned on the microlens array side position. The mating recess is fitted and supported, and is also fitted and supported in a positioning recess of another component. As a result, the optical axes of the parts can be aligned more positively and with high accuracy. Therefore, the above-described structure composed of a plurality of parts can be realized relatively easily.

  [First Embodiment]

  Hereinafter, the optoelectric composite wiring structure 10 according to the first embodiment embodying the present invention will be described in detail with reference to FIGS.

  FIG. 1 shows a photoelectric composite wiring structure 10 of the present embodiment. This optical / electrical interconnect structure 10 includes an optical interposer 41 (optical element mounting substrate), an electrical wiring substrate 11, an optical waveguide layer 61, an optical path conversion component 71, a microlens array 81, and guide pins 31 (positioning guide members). It is composed of a plurality of parts.

  As shown in FIG. 2, the electric wiring board 11 includes an electric wiring board main body 22 having a substantially rectangular flat plate shape having an upper surface 12 and a lower surface 13. The electric wiring board 11 is a so-called ceramic multilayer wiring board, and includes conductor circuits 16 and 17 on the upper surface 12 and the inner layer. The conductor circuit 16 is a signal layer, and the conductor circuit 17 is a power supply layer. The electrical wiring board 11 includes a via-hole conductor 15 for interlayer connection. A plurality of connection pads 14 are provided on the lower surface 13 of the electrical wiring board body 22.

  As shown in FIGS. 1 and 2, first recesses 24 are provided at a plurality of locations in the electrical wiring board body 22. The first recess 24 is circular and has an equal cross-sectional shape, and is open only on the upper surface 12 of the electrical wiring board body 22. In the case of this embodiment, the diameter of the first recess 24 is set to be about 1.0 mm to 2.0 mm. In the present embodiment, four first recesses 24 are arranged on each of the light emitting side and the light receiving side.

  The first recess 24 is filled with a conductive filler 23 (second recess formation portion). In the present embodiment, the conductive filler 23 is formed of a conductive resin paste in which a filler in which copper, which is conductive particles, is coated with silver is dispersed in an epoxy resin. And the conductive circuit 17 allocated as a power supply layer is electrically connected to the conductive filler 23 located on the left side in FIG. The conductive circuit 16 assigned as the signal layer is electrically connected to the conductive filler 23 located on the right side in FIG. 2 via the via-hole conductor 15 in the inner layer of the electric wiring board 11.

  An alignment hole 28 that is a second recess (electrical wiring board side alignment recess) is provided at substantially the center of the conductive filler 23. The alignment hole 28 is circular and has an equal cross-sectional shape, and is opened only on the upper surface 12 of the electric wiring board body 22. In the case of the present embodiment, the diameter of the alignment hole 28 is smaller than the first recess 24 and is set to about 0.7 mm. Inside the eight alignment holes 28, a guide pin 31 (alignment guide member) made of stainless steel and having a circular cross section is fitted and supported with one end protruding toward the upper surface 12 side. Specifically, in this embodiment, a guide pin “CNF125A-21” (diameter 0.699 mm) defined in JIS C 5981 is used. In addition, since this guide pin consists of stainless steel, it has suitable intensity | strength and suitable electroconductivity.

  As shown in FIGS. 1, 2, and 3, an optical waveguide layer 61 is disposed on the upper surface 12 of the electrical wiring substrate 11. The optical waveguide layer 61 is composed of an organic optical waveguide layer body 62 having a film shape, and has a lower clad 64, a core 63, and an upper clad 64. The core 63 is a portion that substantially becomes an optical path through which an optical signal propagates, and is surrounded by a lower clad 64 and an upper clad 64. In the case of the present embodiment, the clad 64 and the core 63 are formed of transparent polymer materials having different refractive indexes, specifically, PMMA (polymethyl methacrylate) having different refractive indexes. Such PMMA has thermosetting properties. As shown in FIG. 3, in the case of the present embodiment, there are two cores 63 serving as an optical path, and they are formed so as to extend linearly and in parallel. The number of cores 63 may be one, or may be three or more. The material forming the core 63 is set so that the refractive index is higher by several percent than the material forming the clad 64. The thicknesses of the clad 64 and the core 63 are each set to about several tens of μm, and as a result, the thickness of the optical waveguide layer body 62 is about 150 μm to 200 μm.

In the middle of the core 43, component insertion holes 65 that open at the upper and lower surfaces of the optical waveguide layer main body 62 are formed so as to penetrate therethrough. The component insertion hole 65 of this embodiment is formed so as to cross (straddle) two cores 63 (see FIG. 3). One component insertion hole 65 is located directly below the light-emitting side optical interposer 41, and the other component insertion hole 65 is located directly below the light-receiving side optical interposer 41. In addition, the shape of the component insertion hole 65 when viewed from the thickness direction of the optical waveguide layer 61 is a substantially rectangular shape, and the dimension of one side thereof is set to about 150 μm. The depth of the component insertion hole 65 is set to about 150 μm to 200 μm.

  Circular alignment holes 68 (optical waveguide layer side alignment recesses) penetrating the upper surface and the lower surface are formed at a plurality of locations in the optical waveguide layer body 62. These alignment holes 68 are set to have a diameter of about 0.7 mm corresponding to the size of the guide pin 31. Each guide pin 31 is fitted and supported in each alignment hole 68.

  1 to 3 show an optical path conversion component 71 used in the present embodiment. The optical path conversion component 71 is disposed between the optical waveguide layer 61 and the microlens array 81. The optical path conversion component main body 72 constituting the optical path conversion component 71 is a flat plate member having an upper surface and a lower surface, and is made of a light transmissive material (PMMA in this embodiment). A projection 73 having a substantially right-angled triangular cross-section that can be inserted into the component insertion hole 65 is integrally formed at a substantially central portion on the lower surface side of the optical path conversion component main body 72. The shape of the protrusion 73 when viewed from the thickness direction of the optical path conversion component main body 72 is substantially rectangular, and is equal to the shape of the component insertion hole 65 when viewed from the same direction. A metal film 75 as a light reflector is formed on an inclined surface 74 of about 45 ° in the protrusion 73. In this embodiment, the metal film 75 having a thickness of about 0.1 μm to 10 μm is formed using glossy rhodium. Such a metal film 75 can totally reflect light. The height of the protrusion 73 is set to about 150 μm to 200 μm, which is substantially equal to the depth of the component insertion hole 65.

  Circular alignment holes 78 (optical path conversion component side alignment recesses) penetrating the upper surface and the lower surface are formed at the four corners of the optical path conversion component main body 72, respectively. These alignment holes 78 are set to have a diameter of about 0.7 mm corresponding to the size of the guide pin 31. Each guide pin 31 is fitted and supported in each alignment hole 78.

  1 to 3 show a microlens array 81 used in the present embodiment. The microlens array 81 is disposed between the optical path conversion component 71 and the optical interposer 41. The microlens array body 82 constituting the microlens array 81 is a flat plate member having an upper surface and a lower surface, and is made of a light transmissive material (PMMA in the present embodiment). Two hemispherical microlenses 83 having a diameter of about 100 μm are integrally formed at a substantially central portion on the upper surface side of the microlens array body 82.

  Circular alignment holes 88 (microlens array side alignment recesses) penetrating the upper surface and the lower surface are formed at the four corners of the microlens array body 82, respectively. These alignment holes 88 are set to have a diameter of about 0.7 mm corresponding to the size of the guide pin 31. The guide pins 31 are fitted and supported in the alignment holes 88.

  1 to 3 show an optical interposer 41 in the present embodiment. These optical interposers 41 are arranged on the upper surface of the microlens array main body 82. As shown in FIG. 2 and the like, the optical interposer 41 includes an optical interposer body 42 having a substantially rectangular flat plate shape having an upper surface and a lower surface. The optical interposer body 42 is a ceramic wiring board having a cavity on the lower surface side, and includes a via-hole conductor 45 and a conductor circuit 46. In the cavity on the lower surface of the optical interposer body 42, optical elements are mounted in a face-down manner. More specifically, a VCSEL 51 which is a kind of light emitting element is mounted on the light interposer 41 on the light emitting side, and a photodiode 56 which is a kind of light receiving element is mounted on the light interposer 41 on the light receiving side.

The VCSEL 51 is mounted with the light emitting surface facing downward, and has a plurality of (here, two) light emitting units 52 arranged in a line in the light emitting surface. Accordingly, these light emitting sections 52 emit laser light having a predetermined wavelength in the downward direction of FIGS. The photodiode 56 is mounted with the light receiving surface facing downward, and has a plurality (two in this case) of light receiving portions 57 arranged in a line in the light receiving surface. Accordingly, these light receiving portions 57 are configured to easily receive laser light from the lower side to the upper side in FIG.

  On the other hand, a driver IC 53 is mounted in a face-up manner at a substantially central portion on the upper surface of the light-side optical interposer 41. The driver IC 53 and the VCSEL 51 are electrically connected to each other through a via-hole conductor 45 that is a high-speed signal transmission unit. A receiver IC 58 is mounted in a face-up manner at a substantially central portion of the upper surface of the light interposer 41 on the light receiving side. The receiver IC 58 and the photodiode 56 are electrically connected to each other via a via-hole conductor 45 that is a high-speed signal transmission unit.

As shown in FIGS. 1 and 2, first recesses 44 are provided at four corners of the optical interposer body 42. The first recess 44 is circular and has an equal cross-sectional shape, and is open on both the upper surface and the lower surface of the optical interposer body 42. In the case of this embodiment, the diameter of the first recess 44 is set to be about 1.0 mm to 2.0 mm.

  Inside the first recess 44, a conductive filler 43 (second recess formation portion) is formed by filling with tungsten paste. As shown in FIG. 2, one end of the conductor circuit 46 is connected to the conductive filler 43. A connection pad is formed at the other end of the conductor circuit 46, and terminals of the driver IC 53 and the receiver IC 58 are connected to the connection pad, respectively. In the present embodiment, the conductor circuit 46 located on the left side of FIG. 2 corresponds to the signal layer and is therefore connected to the signal terminals of the driver IC 53 and the receiver IC 58. Since the conductor circuit 46 located on the right side of FIG. 2 corresponds to the power supply layer, it is connected to the power supply terminals of the driver IC 53 and the receiver IC 58.

  In addition, an alignment hole 48 that is a second recess (optical interposer side alignment recess) is provided substantially at the center of the conductive filler 43. The alignment hole 48 is circular and has an equal cross-sectional shape, and opens on both the upper surface and the lower surface of the optical interposer body 42. In the present embodiment, the diameter of the alignment hole 48 is smaller than that of the first recess 44 and is set to about 0.7 mm. The guide pins 31 are fitted and supported in the alignment holes 48.

  The electrical wiring board 11 side and the optical interposer 41 side are electrically connected to each other via conductive guide pins 31. Therefore, power can be supplied from the electrical wiring board 11 side to the optical interposer 41 side. Further, signals can be exchanged between the electric wiring board 11 and the optical interposer 41.

  A general operation of the thus configured photoelectric composite wiring structure 10 will be briefly described.

  The VCSEL 51 and the photodiode 56 become operable by supplying power from the electric wiring board 11 side via the guide pins 31. When an electrical signal from the electrical wiring board 11 side is transmitted to the VCSEL 51 via the guide pins 31 and the driver IC 53, the VCSEL 51 converts the electrical signal into an optical signal (laser light) and then transmits the light including the signal downward. Exit toward The light first passes through the microlens 83 of the microlens array 81. Since the light spot size is reduced by the light collecting action at that time, the light transmission loss is reduced. The light that has passed through the microlens array 81 then enters the inside from the upper surface of the optical path conversion component 71 and reaches the metal film 75 on the inclined surface 74. Therefore, after changing the traveling direction of about 45 °, the light further passes through the projection 73 of the optical path conversion component 71, exits from the side surface, and enters the core 63 of the optical waveguide layer 61. Thereafter, the light propagates along the longitudinal direction of the core 63 and reaches the light path conversion component 71 on the light receiving side. In the light path conversion component 71 on the light receiving side, light first enters the inside from the side surface of the protrusion 73 and reaches the metal film 75 on the inclined surface 74. Therefore, after the light has changed its traveling direction by about 45 °, it further passes through the protrusion 73 and is emitted from the upper surface of the optical path conversion component 71. The light that has passed through the optical path conversion component 71 then enters from the lower surface side of the microlens array 81, passes through the microlens 83, and exits from the upper surface side. Since the light spot size is reduced by the light collecting action at that time, the light transmission loss is reduced. Finally, the light enters the light receiving portion 57 of the photodiode 56. The photodiode 56 converts the received optical signal into an electrical signal and outputs it to the receiver IC 58. The receiver IC 58 returns the signal to the state of the original electric signal, amplifies it, and outputs it. The output electrical signal is transmitted to the electrical wiring board 11 side through the guide pins 31.

  Next, an example of a method for manufacturing the photoelectric composite wiring structure 10 having the above-described configuration will be described.

  First, the optical path conversion component 71 is prepared in advance by the following procedure (optical path conversion component manufacturing step). First, a mold is formed using PMMA as a material, and an optical path conversion component 71 having a protrusion 73 is integrally formed. At this time, the alignment hole 78 may be formed at the same time. Next, a paste containing rhodium is prepared, and the paste is applied to the inclined surface 74 of the protrusion 73 and dried to be cured. As a result, a metal film 75 having a thickness of several μm is formed, and the optical path conversion component 71 is completed. Of course, the alignment hole 78 may be formed by precision drilling after the mold is formed.

  Further, by performing mold molding using PMMA as a material, a microlens array 81 having microlenses 83 is prepared in advance (microlens array manufacturing step). At this time, the alignment hole 88 may be formed at the same time, but it is of course possible to form the alignment hole 88 by performing precision drilling after the mold is formed.

  Further, the optical waveguide layer 61 is prepared in advance by the following procedure (optical waveguide layer manufacturing step). On a base material (not shown), a resin material (PMMA) for the lower clad 64 is applied to a thickness of 50 μm to 70 μm by a well-known method and dried to form the lower clad 64 first. The core 63 is applied and formed on the surface of the lower clad 64 by the same method, and the upper clad 64 is applied and formed on the surfaces of the core 63 and the lower clad 64. Thereafter, the whole is heated at a predetermined temperature for a predetermined time, and the clad 64 and the core 63 constituting the optical waveguide layer 61 are cured. Next, by subjecting the optical waveguide layer 61 to laser drilling with a carbon dioxide laser, rectangular component insertion holes 65 as shown in FIG. 3 are formed at two locations. Note that etching using photolithography may be performed instead of laser drilling. Specifically, after a clad 64 and core 63 forming material is applied and dried, a photomask is formed on the upper surface, and exposure and development are performed in this state.

  Also, the optical interposer 41 made of ceramic is prepared in advance by the following procedure. A raw material formed by uniformly mixing and kneading alumina powder, an organic binder, a solvent, and the like is produced, and a green compact is formed by performing press molding using the raw material. A predetermined portion of the molded body is punched to form a via hole and a first recess 44.

  At this stage, since the ceramic is still unsintered, drilling can be performed relatively easily and at low cost. In the first drilling step, the inner diameter of the first recess 44 at the time of passing through the firing process is such that the inner diameter (about 0.7 mm) of the alignment hole 48 (second recess) and the diameter of the guide pin 31 (about 0.7 mm). Is set to be larger than that, and drilling is performed. Specifically, it is set to about 1.2 mm to 2.4 mm. The reason is that the ceramic shrinks through the firing process, and accordingly, the first concave portion 44 is also reduced in diameter and misaligned. Therefore, the first concave portion 44 needs to be formed larger in consideration of this. Because there is.

  Then, using a paste printing apparatus, the via hole hole is filled with the tungsten paste for the via hole conductor, and at the same time, the first paste 44 is filled with the tungsten paste. Further, a printing layer that will later become the conductor circuit 46 is formed by printing a tungsten paste on the surface of the molded body. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is performed at the temperature which can further sinter a ceramic. As a result, the compact is sintered to form an optical interposer body 42 having a cavity. At this point, the ceramic hardens and shrinks, and at the same time, the tungsten paste also sinters and hardens. However, the conductive filler 43 made of sintered tungsten paste has lower hardness than alumina. Therefore, machining with respect to the conductive filler 43 is less difficult than machining with respect to alumina.

Then, the VCSEL 51 and the driver IC 53 are soldered to the obtained optical interposer body 42 to complete the light-emitting side optical interposer 41, and the photodiode 56 and the receiver IC 58 are soldered to complete the light-receiving side optical interposer 41. .

  In addition, the electrical wiring board 11 is prepared in advance by the following procedure. A raw material slurry is prepared by uniformly mixing and kneading alumina powder, organic binder, solvent, plasticizer, etc., and this raw material slurry is used to form a sheet with a doctor blade device to form a green sheet having a predetermined thickness. . A predetermined portion of the green sheet is punched to form a via hole and a first recess 24. At this stage, since the ceramic is still unsintered, drilling can be performed relatively easily and at low cost. In the first drilling step, the inner diameter of the first recess 24 at the time of passing through the firing process is such that the inner diameter (about 0.7 mm) of the alignment hole 28 (second recess) and the diameter of the guide pin 31 (about 0.7 mm). Is set to be larger than that, and drilling is performed. Specifically, it is set to about 1.2 mm to 2.4 mm. The reason is that the ceramic shrinks through the firing process, and accordingly, the first recess 24 is also reduced in diameter and misaligned. Therefore, it is necessary to make the first recess 24 larger by taking this into account. Because there is.

  Then, using a paste printing apparatus, the via hole hole is filled with a tungsten paste for a via hole conductor, and at the same time, the tungsten paste is filled into the first recess 24. In addition, by printing a tungsten paste on the surface of the green sheet, printed layers that will later become conductor circuits 16 and 17 are formed. Then, these green sheets are laminated and pressed to be integrated into a green sheet laminate. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is performed at the temperature which can further sinter a ceramic. Thereby, the green sheet laminate (ceramic unsintered body) is sintered to form the electric wiring board main body 22. At this point, the ceramic hardens and shrinks, and at the same time, the tungsten paste also sinters and hardens. However, the conductive filler 23 made of a sintered tungsten paste has a lower hardness than alumina. Therefore, the machining for the conductive filler 23 is less difficult than the machining for alumina. In other words, the conductive filler 23 is more workable than alumina.

  Next, the components are fixed while being aligned in order according to the following procedure.

  First, the guide pins 31 are supported on the electric wiring board 11.

Using a dedicated jig or the like, the guide pin 31 is press-fitted and supported in each alignment hole 28 (second recess) of the electrical wiring board 11 (see FIG. 4). Next, the optical waveguide layer 61 is laminated on the upper surface of the electrical wiring board 11 so that the guide pins 31 are fitted and supported in the alignment holes 68 of the optical waveguide layer 61. Subsequently, the optical path conversion component 71 is laminated on the upper surface of the optical waveguide layer 61 so that the guide pin 31 is fitted and supported in each alignment hole 78 of the optical path conversion component 71. At this time, a part (projection 73) of the optical path conversion component 71 is inserted into the component insertion hole 65 of the optical waveguide layer 61. As a result, the metal film 75 formed on the inclined surface 74 of the protrusion 73 is disposed in the middle of the core 63 and the optical axes of the metal film 75 and the core 63 are aligned. Subsequently, the microlens array 81 is stacked on the upper surface of the optical path conversion component 71 so that the guide pins 31 are fitted and supported in the respective alignment holes 88 of the microlens array 81. As a result, the optical axes of the core 63, the metal film 75, and the micro lens 83 are aligned. Finally, the guide pin 31 so as to fit the support for each alignment holes 48 of the optical interposer 41 is stacked light interposer 4 1 on the upper surface of the microlens array 81. As a result, the optical axes of the core 63, the metal film 75, the microlens 83, and the light emitting unit 52 (or the light receiving unit 57) are aligned, and the desired photoelectric composite wiring structure 10 is completed.

  In addition, about the procedure of the said alignment process, it is not limited to said thing, For example, you may change into the following procedures.

  In the first modification shown in FIG. 5, first, a structure in which the three components, the optical path conversion component 71, the microlens array 81, and the optical interposer 41 are fixed to each other via the guide pins 31 is manufactured. After that, the lower end side of the guide pin 31 protruding from the structure is fitted and supported in the alignment hole 68 of the optical waveguide layer 61, and is further fitted and supported in the alignment hole 28 of the electric wiring board 11. .

In the second modification shown in FIG. 6, firstly, the optical waveguide layer 61, an optical path changing part 71, the 4 components of the microlens array 81 and the optical interposer 41, to produce a structure which is fixed to one another via a guide pin 31 Keep it. Then, the lower end side of the guide pin 31 protruding from the structure is fitted and supported in the alignment hole 28 of the electric wiring board 11.

In Modification 3 shown in FIG. 7, first, the optical waveguide layer 6 1, 3 parts of the optical path changing part 71 and the microlens array 81 in advance to produce the structure fixed to one another via a guide pin 31. Thereafter, the upper end side of the guide pin 31 protruding from the structure is fitted and supported in the alignment hole 48 of the optical interposer 41. Further, the lower end side of the guide pin 31 is fitted and supported in the alignment hole 28 of the electric wiring board 11.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the photoelectric composite wiring structure 10 according to the present embodiment, the guide pin 31 is fitted to the alignment holes 28, 48, 68, 78, 88 of each component, so that it is more positive and expensive. The optical axes of the parts are aligned with accuracy. Therefore, it is possible to realize the photoelectric composite wiring structure 10 that has a small light transmission loss and can sufficiently cope with high speed and high density.

  (2) Since this optoelectric composite wiring structure 10 can be obtained by assembling individually produced parts, it is suitable for cost reduction. Further, in the case of this embodiment, each component is only fixed via the guide pin 31 without using an adhesive or the like, and can be attached and detached as necessary. Therefore, even when some of the components are defective, it is possible to easily perform a correction operation for removing and replacing only the defective components. Of course, this can also contribute to the low cost of the photoelectric composite wiring structure 10.

  (3) According to this optoelectric composite wiring structure 10, it is possible to individually manufacture each component, and as a result, there is a wide range of choice of materials for forming each component. Specifically, since the electrical wiring substrate 11 and the optical interposer 41 and the optical waveguide layer 61 can be configured as separate parts, it is not necessary to provide the optical waveguide layer 61 with high heat resistance, and the selection of the material The room for is widened.

  [Second Embodiment]

  Next, based on FIG. 8, FIG. 9, the optoelectric composite wiring structure 10 of 2nd Embodiment is demonstrated. Here, only the differences from the first embodiment will be referred to, and the common points will only be denoted by the same member numbers, and detailed description thereof will be omitted.

  In the first embodiment, the optical path conversion component 71 and the microlens array 81 are configured as separate components. On the other hand, in this embodiment, an optical path conversion component 91 with a microlens (a microlens array with an optical path conversion unit), which is a component having both functions, is used. That is, the optical path conversion component 91 with a microlens has a configuration in which a microlens 83 is integrally formed on the upper surface of the optical path conversion component main body 72 of the optical path conversion component 71 of the first embodiment.

  Therefore, according to this configuration, it is possible to make the entire component thin as much as the microlens array main body 82 is eliminated. Therefore, an increase in the distance between the optical waveguide layer 61 and the optical element can be avoided, leading to a reduction in light transmission loss. Further, according to this configuration, an increase in the number of parts can be prevented.

  In addition, you may change embodiment of this invention as follows.

  In the above embodiment, the electrical wiring board 11 and the optical interposer 41 are alumina wiring boards, but this may be changed to a wiring board made of ceramic other than alumina, or may be changed to a resin wiring board or the like. Good.

  In the above embodiment, the conductive fillers 23 and 43 are formed by filling the first recesses 24 and 44 of the electrical wiring substrate 11 and the optical interposer 41 with the tungsten paste for via hole conductors. However, as an alternative to the tungsten paste, for example, a copper paste or the like can be used. Moreover, if the electrical wiring board 11 and the optical interposer 41 are low-temperature fired glass ceramic wiring boards, the copper paste can be simultaneously sintered when the ceramic is sintered through the firing process.

  In the above embodiment, the guide pin 31 that is the alignment guide member functions as a kind of conductor, but it does not need to function in particular. In this case, the first recesses 24 and 44 may be filled using a material having no conductivity, and the second recesses may be formed there. In addition, when the structure which does not function the guide pin 31 as a conductor is employ | adopted, the optical interposer 41 side and the electrical wiring board 11 side should just be electrically connected through a bonding wire, for example.

  In the first embodiment, the components are stacked and arranged in the order of the electrical wiring substrate 11, the optical waveguide layer 61, the optical path conversion component 71, the microlens array 81, and the optical interposer 41. Of course, the order in which the components are stacked is not limited to this. For example, the electrical wiring substrate 11, the optical interposer 41, the microlens array 81, the optical path conversion component 71, and the optical waveguide layer 61 may be used in this order from the bottom.

  Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiment described above are listed below.

  (1) The optical element mounting substrate side alignment recess, the electrical wiring substrate side alignment recess, the optical waveguide layer side alignment recess, and the optical path conversion component side alignment recess are precision processing holes, and are used for the alignment. The photoelectric composite wiring structure according to claim 1 or 2, wherein the guide member is a guide pin made of a conductive metal fitted and supported in the precision machined hole.

  (2) The optical element mounting substrate side alignment recess, the electrical wiring substrate side alignment recess, the optical waveguide layer side alignment recess, the optical path conversion component side alignment recess, and the microlens array side alignment recess are precise. 4. The composite photoelectric structure according to claim 3, wherein the alignment guide member is a guide pin made of a conductive metal fitted and supported in the precision machining hole.

  (3) An optical element mounting substrate body made of a ceramic substrate on which an optical element mounting substrate side alignment recess is formed, and an optical element mounted on the optical element mounting substrate body and having at least one of a light emitting portion and a light receiving portion. An optical element mounting substrate having an element, an electric wiring substrate having an electric wiring substrate body made of a ceramic substrate on which an electric wiring substrate side alignment recess is formed, and an optical waveguide layer having an optical waveguide layer side alignment recess An optical waveguide layer having a main body, a core formed in the optical waveguide layer main body, and a clad formed in the optical waveguide layer main body so as to surround the core, and an optical path conversion component side position An optical path conversion component having an optical path conversion component main body formed with an alignment recess, the optical element mounting substrate side alignment recess, and the electrical wiring substrate side alignment An alignment guide member that can be fitted to the optical waveguide layer side alignment recess and the optical path conversion component side alignment recess, and the optical element mounting substrate main body includes an optical element mounting substrate first recess. Is formed in the first concave portion of the optical element mounting substrate, and the filler is more excellent in workability than ceramic as a substrate material. A small-diameter optical element mounting substrate-side alignment recess is formed, and an electrical wiring board first recess is formed in the electrical wiring board body, and the filling body is formed inside the electrical wiring board first recess. The photoelectric composite wiring structure according to claim 1, wherein the filling body is formed with an alignment recess on the electric wiring board side having a smaller diameter than the first recess of the electric wiring board.

  (4) In the method for manufacturing an opto-electric composite wiring structure according to the technical idea (3), a ceramic unsintered body that later becomes the optical element mounting substrate body, and a ceramic unsintered body that later becomes the electrical wiring substrate body A green body manufacturing step for manufacturing each sintered body, and a first hole for forming the optical element mounting substrate first recess and the electrical wiring substrate first recess in the ceramic unsintered body by performing hole processing, respectively. A dawn step, a firing step in which the ceramic unsintered body is sintered to form the optical element mounting substrate body and the electrical wiring substrate body, and the optical element mounting substrate first recess and the electrical wiring substrate first recess. A filling step for providing the filling body, and a hole forming after the filling step form the optical element mounting substrate side alignment recess and the electrical wiring board side alignment recess in the filling body. Method of manufacturing a photoelectric composite wiring structure which comprises the second drilling step.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic front view which shows the optoelectric composite wiring structure of 1st Embodiment which actualized this invention. The partial schematic sectional drawing of the photoelectric composite wiring structure of 1st Embodiment. FIG. 3 is an exploded perspective view of an optical waveguide layer, an optical path conversion component, and a microlens array that constitute the optoelectric composite wiring structure according to the first embodiment. The partial schematic sectional drawing which shows the mode at the time of aligning each component in the manufacturing process of the photoelectric composite wiring structure of 1st Embodiment. The fragmentary schematic sectional drawing which shows a mode at the time of aligning each component in the manufacturing process of the photoelectric composite wiring structure of the example 1 of a change. The fragmentary schematic sectional drawing which shows the mode at the time of aligning each component in the manufacturing process of the photoelectric composite wiring structure of the example 2 of a change. The fragmentary schematic sectional drawing which shows the mode at the time of aligning each component in the manufacturing process of the photoelectric composite wiring structure of the example 3 of a change. The partial schematic sectional drawing which shows the photoelectric composite wiring structure of 2nd Embodiment. The perspective view of the optical path conversion component with a micro lens used for the photoelectric composite wiring structure of 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Photoelectric composite wiring structure 11 ... Electric wiring board 22 ... Electric wiring board main body 28 ... Alignment hole as an electric wiring board side alignment recessed part 31 ... Guide pin as an alignment guide member 41 ... Optical element mounting board Optical interposer 42 ... Optical element mounting substrate body 48 ... Optical element mounting substrate side alignment recess 51 as alignment element 51 ... VCSEL as optical element (light emitting element)
52 ... Light emitting part 56 ... Photodiode as optical element (light receiving element) 57 ... Light receiving part 61 ... Optical waveguide layer 62 ... Optical waveguide layer main body 63 ... Core 64 ... Cladding 68 ... Positioning as an alignment recess on the optical waveguide layer side Holes 71, 91 ... (with alignment structure) Optical path conversion component 72 ... Optical path conversion component body 75 ... Light reflector 78 ... Optical path conversion component-side alignment recess 81 (with alignment structure) Micro Lens array 82 ... Micro lens array body 83 ... Micro lens 88 ... Alignment hole as micro lens array side alignment recess

Claims (7)

An optical element mounting comprising: an optical element mounting substrate main body on which an optical element mounting substrate side alignment recess is formed; and an optical element mounted on the optical element mounting substrate main body and having at least one of a light emitting portion and a light receiving portion. A substrate,
An electrical wiring board having an electrical wiring board body in which an electrical wiring board side alignment recess is formed;
An optical waveguide layer having an optical waveguide layer body formed with an alignment recess on the optical waveguide layer side, a core formed on the optical waveguide layer body, and a clad formed on the optical waveguide layer body to surround the core When,
An optical path conversion component having an optical path conversion component body made of a light transmissive material and having an optical path conversion component side alignment recess formed therein;
Common alignment that can be removably fitted to the optical element mounting substrate side alignment recess, the electrical wiring substrate side alignment recess, the optical waveguide layer side alignment recess, and the optical path conversion component side alignment recess Guide pins as guide members for
The optical element mounting substrate, the electrical wiring substrate, the optical waveguide layer, the optical path conversion component, and the guide pin are individually manufactured, and the optical waveguide layer and the optical path that are stacked on each other The conversion component is supported in contact with the electric wiring board.
Light electrical interconnect structure characterized and this.   The optoelectric composite wiring structure according to claim 1, wherein the optical path conversion component further includes a light reflector formed on the optical path conversion component main body. A microlens array body having a microlens array-side alignment recess and a microlens array made of a light-transmitting material and formed on the microlens array body, and the common position 3. The photoelectric composite wiring structure according to claim 1, wherein a guide pin as an alignment guide member can be detachably fitted to the alignment recess on the microlens array side . 4. An optical element mounting comprising: an optical element mounting substrate main body on which an optical element mounting substrate side alignment recess is formed; and an optical element mounted on the optical element mounting substrate main body and having at least one of a light emitting portion and a light receiving portion. A substrate,
An optical waveguide layer having an optical waveguide layer body formed with an alignment recess on the optical waveguide layer side, a core formed on the optical waveguide layer body, and a clad formed on the optical waveguide layer body to surround the core When,
An optical path conversion component having an optical path conversion component body made of a light transmissive material and having an optical path conversion component side alignment recess formed therein;
A guide pin as a common alignment guide member that can be detachably fitted to the optical element mounting substrate side alignment recess, the optical waveguide layer side alignment recess, and the optical path conversion component side alignment recess ;
The optical element mounting substrate, the optical waveguide layer, the optical path conversion component, and the guide pin are individually manufactured, and the optical waveguide layer and the optical path conversion component, which are stacked on each other, And can be supported in contact on an electric wiring board configured separately
Characterized the this, the structure consisting of an optical element mounting substrate and the optical waveguide layer and the optical path changing part.   The structure comprising the optical element mounting substrate, the optical waveguide layer, and the optical path conversion component according to claim 4, wherein the optical path conversion component includes a microlens.   The optical element mounting according to claim 4, wherein the guide pin is made of a metal having conductivity, and alignment and electrical connection between members are achieved through the guide pin. A structure comprising a substrate, an optical waveguide layer, and an optical path conversion component.   The optical element mounting substrate side alignment recess, the optical waveguide layer side alignment recess, and the optical path conversion component side alignment recess are through-holes that are open on both the front surface and the back surface of each member. A structure comprising the optical element mounting substrate according to any one of claims 4 to 6, an optical waveguide layer, and an optical path conversion component.

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