JP2004177521A - Optical and electrical combined circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical and electrical combined circuit board for optical communication aiming to communication at a relatively short distance such as between boards or devices, in which an optical fiber and an optical element can be optically coupled without using a lens, and thereby, precise positioning of a lens is not necessary during assembling. <P>SOLUTION: The circuit board is equipped with a core substrate 51 where grooves to house optical fibers are formed; optical fibers 55 arranged in one line, adhered and fixed with an adhesive in the groove with the clad face of the fiber or the adhesive face aligned to the same level as the surface of an insulating layer or the surface of an electric wiring surface of the core substrate 51; a V-groove which is formed on the opposite surface of the core substrate 51 to the surface where fibers are aligned, which obliquely cuts the core 55B of the optical fiber 55, and which has a metal film mirror 61 covering the cut face; and a surface light emitting semiconductor laser or a surface light receiving element mounted by using electric lines on the surface where the optical fibers 55 are aligned. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an opto-electric composite circuit board that incorporates an optical fiber, a surface emitting semiconductor laser, a surface receiving type light receiving element, an electronic device, and the like, and is suitable as an optical transmission module.
[0002]
[Prior art]
At present, an optical transmission module for converting an electric signal into an optical signal and transmitting and receiving the optical signal is being frequently used for backbone optical communication and signal transmission between apparatuses.
[0003]
As a conventional optical transmission module, a module in which an optical waveguide is formed of an inorganic material on a substrate and an optical component such as a semiconductor laser is mounted, or a module in which a polymer waveguide is formed on a substrate are known.
[0004]
FIG. 9 is a perspective view of a main part illustrating an optical transmission module using a quartz waveguide (for example, see Non-Patent Document 1).
[0005]
In the figure, 1 is a Si substrate, 1A is a terrace type portion of the Si substrate, 2 is a quartz waveguide, 3 is a bonding pad, 4 is a monitor composed of a photodiode, 5 is a transmitter composed of a semiconductor laser, Reference numeral 6 denotes a filter, and reference numeral 7 denotes a receiver including a photodiode.
[0006]
In this optical transmission module, for example, a quartz waveguide 2 is formed on a Si substrate 1 by applying a flame deposition method, and an optical component is mounted. When a signal is input, the signal passes through the filter 6 and reaches the receiver 7, and when an optical signal having a wavelength of 1.3 [μm] is emitted from the transmitter 5, the signal is reflected by the filter 6 and output. Things have been clarified.
[0007]
FIG. 10 is a main part cutaway side view illustrating an optical transmission module using a Si substrate itself as a waveguide (for example, see Non-Patent Document 2).
[0008]
In FIG. 10A, 11 is a first Si substrate, 12 is an incident side linear grating, 13 is an output side linear grating, 14 is a relay lens, 15A and 15B are second Si substrates, 16 And 17, a lens, 18 a light source, and 19 a light receiver.
[0009]
In FIG. 10 (B), reference numeral 15 denotes a second Si substrate, and reference numeral 20 denotes an LSI, respectively. The same symbols as those used in FIG. 10 (A) represent the same parts or have the same meanings. Shall have.
[0010]
FIG. 10 (B) shows an example in which the second Si substrates 15A and 15B shown in FIG. 10 (A) are integrated, an optical signal having a wavelength of 1.5 [μm] is emitted from a light source 18 composed of an LED, and a lens 16 is formed. 10A, the optical signal is made incident on the first Si substrate 11 shown in FIG. 10 (A), and the optical signal which has progressed while repeating reflection in the Si substrate 11 is received by the photodetector 19 composed of a PD. Note that light having a wavelength of 1.5 [μm] transmits through Si.
[0011]
FIG. 11 is a cutaway side view of an essential part illustrating an optical transmission module using an optical fiber (for example, see Non-Patent Document 3).
[0012]
In the figure, 21 is a supporting substrate, 22 is an OIC (optically connected integrated circuits), 23 is a driver, 24 is a logic part composed of an LSI, 25 is a receiver, 26 is a VCSEL (vertical cavity emitting, and 27 is a photo-equivalent emission 27). A diode 28 indicates a POF (plastic optical fiber).
[0013]
In the conventional examples described in Non-patent Documents 1 and 2, it is essential to use a Si substrate in any case, and there is a problem that the substrate is limited. Since the configuration is such that the light emitted to the optical fiber is received by the end face of the optical fiber, there is a problem that the structure becomes large and a member for stably fixing the optical fiber is required.
[0014]
FIGS. 12A and 12B are main-part cutaway side views illustrating an optical transmission module using a microlens, wherein FIG. 12A shows the entirety, and FIG. 12B shows an enlarged detail of a part thereof. ).
[0015]
In the figure, 31 is a polymer waveguide, 32 is a VCSEL, 33 is a driver IC, 34 is an LSI, 35 is a PD, 36 is a receiver IC, 37 is a microlens, 37A and 37B are microlenses, 38 is a VCSEL or PD. And 39, solder bumps, respectively.
[0016]
FIGS. 13A and 13B are main-part cutting explanatory views illustrating an optical transmission module using a microlens and a mirror. FIG. 13A shows a main-part cutting plane, and FIG. See Patent Document 5.).
[0017]
In the drawing, 41 is a case for PETIT (photonic / electric tied interface), 42 is a VCSEL, 43 is a planar microlens (PML), 44 is a pin-PD, and 45 is an MT (mechanically transferable) type connector. Compatible guide holes, 46 is a housing with a V-groove, 47 is a 45-degree mirror, 48 is a guide pin, and 49 is an optical fiber (12 cores).
[0018]
In the conventional example described in Non-Patent Document 4, a polymer waveguide 31 which is an optical waveguide is built in an organic substrate, and light is transmitted between the polymer waveguide 31 and an optical element 37 such as a VCSEL or PD using micro lenses 37A and 37B. In the conventional example described in Non-Patent Document 5, light emitted to the space is reflected by a flat microlens 43 and a 45-degree mirror 47 for vertically bending light produced by precision plastic molding. Since the optical element and the waveguide are optically coupled to each other and are maintained for a long period of time, it is necessary to optically couple the optical element and the waveguide, since both use a microlens or a precision mirror. It's not easy.
[0019]
Regarding the optical transmission module, many inventions have been disclosed in addition to the techniques found in the above-mentioned documents.
[0020]
An optical circuit board in which an optical fiber is mounted and fixed in a circuit shape on the substrate surface, and the end of the optical fiber is cut so as to have an angle capable of refracting or reflecting light in the direction of 90 degrees with respect to the substrate surface. There is a hole penetrating the substrate just below the cut surface, and the inner wall of the hole is metallized (for example, see Patent Document 1).
[0021]
According to the present invention, light is propagated by a hole having a metalized inner wall instead of a lens, and there is a feature that an optical transmission path can be formed without using a lens. It is not easy to form a smooth metal film on the inner wall of the hole with less scattering.
[0022]
A substrate on which a plurality of optical fibers having a 45 ° inclined end face and grooves for inserting and fixing the ends of the respective optical fibers are formed, and a 45 ° inclined end face of the optical fiber inserted into each of the grooves. A flat lens member having a lens portion arrayed and formed at a corresponding position and adhered to the surface of the substrate, and a hole and a driving or amplifying circuit provided at a position corresponding to each of the lens portions. Characterized by comprising a circuit board layer formed on the surface of the substrate, and a photo / electric conversion element mounted on the circuit board layer so that outgoing light or incident light passes through the hole. An element-optical fiber coupling module is disclosed (for example, see Patent Document 2).
[0023]
In this example, the input / output light from the optical fiber having the inclined end face is coupled to the light receiving / emitting element by using a flat lens. However, a flat lens is required as a member. There is a problem that precision alignment is required.
[0024]
In an apparatus that forms a communication system or a measurement system by interconversion between light and electrons, an optical active element, an optical passive element, and an electronic circuit for driving at least the optical active element necessary for the system are provided. An optical-electronic composite laminated substrate device is disclosed in which at least three or more types of substrates are laminated, and optical elements between the laminated substrates are connected to each other by an optical fiber provided in the substrate. . In this case, a configuration in which a spherical lens is provided at an end of an optical fiber for optical coupling is disclosed (for example, see Patent Document 3).
[0025]
In this example, since the optical waveguide or optical fiber and the VCSEL or PD are coupled using a lens, a lens is required as a member, and a high-precision alignment is required when assembling the same. There is a problem.
[0026]
As a method of forming an optical circuit on a substrate, there is known a method in which an optical fiber is used as an optical waveguide, and an optical fiber is provided on the substrate through an adhesive layer using a tool (for example, a patent is known). Reference 4).
[0027]
When fixing the end of the optical fiber to a predetermined position on the substrate using an adhesive as in this example, the end of the optical fiber is at a height from the adhesive surface of the optical fiber. This is the part where the distribution is most likely to occur, and if the adhesive layer is not very thin, there is a problem in that the position and angle of the end portion will vary.
[0028]
[Patent Document 1]
JP-A-11-248976
[Patent Document 2]
JP-A-6-151903
[Patent Document 3]
JP-A-61-186908
[Patent Document 4]
JP-A-1-180505
[Non-patent document 1]
Latest Collection of Optical Communication Technologies III Optronics, 1998 1st edition p122
[Non-patent document 2]
Oki Electric, Real World Computing Project, Next Generation Information Processing Technology Development Comprehensive Report
[Non-Patent Document 3] Ghent University, L Vanwassenhove, et. Al. “Demonstration of 2-D Plastic Optical Fiber based Optical interconnect between CMOS IC's” OFC2001 WDD74
[Non-patent document 4]
NTT, Journal of Japan Institute of Electronics Packaging Vol. 5, No5. AUG, 2002
[Non-Patent Document 5]
NEC, Real World Computing Project, Next Generation Information Processing Board Technology Development Project General Report, Journal of Japan Institute of Electronics Packaging Vol. 5, No5. AUG, 2002
[0029]
[Problems to be solved by the invention]
According to the present invention, a lens is provided between an optical fiber and an optical element such as a VCSEL or a PD in a photoelectric composite circuit board for optical transmission intended for transmission over a relatively short distance between substrates or between devices. It seeks to allow optical coupling without use, and thus also eliminates the need for precise alignment of the lenses during assembly.
[0030]
[Means for Solving the Problems]
In the photoelectric composite circuit board according to the present invention, at least an electrical wiring, a marker, and a core substrate formed with grooves for incorporating optical fibers, and optical fibers arranged in a line and adhered and fixed to each other with an adhesive The cladding surface or the adhesive surface of the core substrate and the insulating layer surface or the electric wiring surface of the core substrate are aligned at substantially the same height, and the optical fiber is disposed in the groove and bonded and fixed; and the aligned surface A V-shaped groove formed obliquely from the core substrate surface on the opposite side and at least cutting the core of the optical fiber, and the cut surface being covered with a metal film; Or, it is basically provided with an optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light-receiving element mounted by using a spill-up wiring formed on the side where the surface is aligned with the optical fiber. That.
[0031]
By adopting the above-mentioned means, it becomes possible to optically couple an optical fiber and an optical element such as a VCSEL or a PD without using a lens, and therefore, it is not necessary to precisely align the lens at the time of assembly. As a result, it is possible to reduce both the cost of the members and the cost of the process, and the manufacturing advantage is extremely high.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
The core substrate used in the present invention is precisely cut and subjected to a precise adhesive process. That is, in order to incorporate a quartz optical fiber, cutting accuracy is high, and it is desirable that the thermal expansion is low in the in-plane direction. For example, glass, ceramic, aromatic polyamide resin having low thermal expansion in at least the in-plane direction An organic resin having a layer formed is known.
[0033]
Markers formed on the core substrate are used to form grooves for installing optical fibers, and when making diagonal cuts of the fiber core, use the diagonally cut surface to mount light receiving and emitting elements at predetermined positions for inputting and outputting light. The processing for forming the markers on both sides of the core substrate needs to be performed with high precision, and it is preferable to form through holes. Alternatively, a method may be employed in which a pattern is formed on both the front and back surfaces by using an exposure device capable of positioning the front and back surfaces with high precision.
[0034]
The light receiving and emitting elements are preferably a surface emitting semiconductor laser (VCSEL) and a surface receiving light receiving element (PD), and these elements use a marker to align the cladding surface of the optical fiber. It is mounted at a predetermined position for inputting and outputting light using the oblique cut surface.
[0035]
When the light emission angle of the VCSEL is 30 degrees or less, the cladding diameter of the optical fiber is 125 μm or more, and the core diameter is 50 μm or more, the build-up with a thickness of 25 μm or less is performed. It may be mounted via a layer, a build-up layer having a thickness of 40 [μm] if the core diameter is 62.5 [μm] or more, and 100 [μm] or less if the core diameter is 100 [μm] or more. Can be implemented via a build-up layer.
[0036]
The mounting of the electrical components mounted on the core substrate including at least the light emitting and receiving elements is a bare chip mounting, and since it is necessary to seal, around the light emitting and receiving elements, compared with the light emitting and receiving elements A layered material is laminated thickly and filled with a sealant mainly composed of an organic material or a thermally conductive insulating resin.
[0037]
When the light emitting / receiving element is to be wire-bonded, it is necessary to laminate a laminated material having a thickness exceeding the height of the wire from the chip. A prepreg layer or a core substrate in which a hole is formed in a region where the metal exists.
[0038]
The photoelectric composite circuit board according to the present invention incorporates an optical fiber, a VCSEL, a PD, and the like, and a driver IC for the VCSEL, an amplifier IC for the PD, and the like are three-dimensionally mounted in the vicinity including the upper part of the VCSEL and the PD. When this mounting method is adopted, the wiring distance between the VCSEL and the driver IC and between the PD and the amplifier IC are significantly reduced and the high-speed operation performance is improved as compared with the conventional surface mounting.
[0039]
In the photoelectric composite circuit board according to the present invention, a plurality of optical fibers are aligned at regular intervals, adhered and fixed, and formed into a tape shape for parallel optical signal transmission.
[0040]
This tape-shaped optical fiber is built into the substrate and receives or emits light from the side wall of the clad through a 45-degree mirror built into the optical fiber. To reduce the optical path length to the VCSEL or PD, Is desirably thin.
[0041]
Therefore, if the clad diameter of this tape-shaped optical fiber is, for example, 125 [μm], it may be used in parallel at intervals of 125 [μm], and every other fiber may be used. Since the fiber serves as a spacer for providing an interval of 250 [μm] between the optical fibers to be used, a length for transmitting an optical signal is not required.
[0042]
Furthermore, in the photoelectric composite circuit board according to the present invention, it is possible that the board containing the optical fiber is mounted on another board, but the optical fiber extending from the end of the board is made free or fixed. It is optional. When a quartz fiber is used as the optical fiber, a material having a low elastic modulus is preferably used for fixing. This is due to the fact that the coefficient of thermal expansion of the quartz fiber is lower than that of, for example, a glass epoxy material frequently used for boards, and the difference in the coefficient of thermal expansion between the quartz fiber and the board is absorbed to some extent. can do. In general, low modulus materials are more susceptible to deformation for the same stress and can therefore better absorb differences in thermal expansion coefficients. As a material having a low elastic modulus, for example, JCR6140 (Dow Corning Silicone Co., Ltd.) which is a silicone material and 3074 (Cookson Semiconductor Packaging Materials) which is an epoxy material are known.
[0043]
Example 1
FIG. 1 is a plan view of a main part showing a core substrate in a main part of a manufacturing process, and FIG. 2 is an explanatory view of a main part illustrating an optoelectronic circuit board in a main part of the manufacturing process. () Shows a cutaway side of a main part, and (B) and (C) show a main part plane and a main part front, respectively, for explaining a tape-shaped parallel optical fiber.
[0044]
See FIGS. 1 (A), (B) and 2 (A)
A hole 51A for press, a marker 51B for forming a groove, a marker 51C for forming a V-groove, and a marker for mounting a VCSEL on a 100 × 100 × 0.15 [mm] double-sided copper-clad organic core substrate 51 (manufactured by Aramika Asahi Kasei) 51D, a through via 52, a wiring 53 and the like are formed.
[0045]
Using a dicer, a groove 54 for incorporating a tape-shaped parallel fiber with a width of 1 [mm] is formed at a predetermined position using a groove forming marker 51B. Since the organic core substrate 51 has a low coefficient of thermal expansion in the in-plane direction at around room temperature of 4 to 7 ppm / ° C., it is suitable for incorporating a fiber made of quartz with low thermal expansion.
[0046]
See FIGS. 2B and 2C
FIG. 2B is a plan view of a main part, and FIG. 2C is a cut front view of the main part. The fiber 55 made of quartz having a core diameter of 62.5 μm and a clad diameter of 125 μm (G.62.5 / 125.3522 (made by Fujikura) are arranged in a line on a plane and fixed with an adhesive 56 to form a tape-shaped parallel fiber 57.
[0047]
Four of the fibers 55 are for optical signal transmission, and the other four are for spacers, 55A is a cladding, and 55B is a core.
[0048]
The tape-shaped parallel fiber 57 is partially inserted into the groove 54 of the core substrate 51 on a flat plate so as to align the surface of the wiring 53 on one surface of the core substrate 51 with the surface of the clad 55A. The inside is further filled with an adhesive to perform bonding. The symbol 58 indicates an adhesive layer.
[0049]
The surface of the cladding 55A of the fiber 57 may be aligned using the flat insulating surface or the metal surface of the core substrate 51. When the surface is aligned with the surface of the wiring 53, a height setting around the groove 54 is used. Alternatively, the same metal film made of copper as the wiring 53 may be left.
[0050]
Example 2
FIG. 3A is a cutaway side view showing a main part of an optoelectronic composite circuit board provided with a metal mirror, and the same symbols as those used in FIGS. 1 and 2 represent the same parts or have the same meanings. Shall have.
[0051]
A V-shaped groove 59 is formed by cutting the side surface of the quartz fiber 55 from the side of the adhesive layer 58 described with reference to FIG. Of course, in this case, positioning is performed using the V-groove forming marker 51C.
[0052]
Then, by applying a sputtering method, for example, an Au film having a thickness of 1 [μm] is deposited on the inner surface of the V-shaped groove formed by the oblique 45-degree cut, and the Au film is buried with a resin 60 to form a metal film mirror. 61 is completed. According to this configuration, it is possible to input and output optical signals from the front side of the core substrate 51.
[0053]
Example 3
FIG. 3B is a cutaway side view of a main part showing an optoelectronic composite circuit board provided with a resin-coated copper foil, and the same symbols as those used in FIGS. 1 to 3A denote the same parts. Or have the same meaning.
[0054]
A build-up layer 62 (made by Aramica Asahi Kasei), which is a copper foil with resin, is laminated on both surfaces of the photoelectric composite circuit board described as the second embodiment. Here, 62A indicates a resin layer, and 62B indicates a copper layer.
[0055]
The layer thickness of the resin layer 62A may be 15 [μm] to 85 [μm], which is frequently used, and the layer thickness of the copper layer 62B is 9 [μm], 12 [μm], 18 [Μm], and a vacuum press can be used for lamination, and the pressing conditions are preferably about 120 [minutes] at a temperature of 180 [° C.].
[0056]
The resin layer 62A may be a resin such as an epoxy resin, a PPE (polyphenylene ether), or a BT (bismaleimide triazine resin) as long as the material can withstand the temperature at which the VCSEL or PD is mounted.
[0057]
In the build-up layer 62, a hole through which light passes is formed in advance in a region where light is introduced into the quartz fiber 55 using the metal film mirror 61. The holes are unnecessary if the resin layer 62A is transparent to the emission wavelength of the VCSEL, for example, but must be formed in the copper layer 62B. Aramica (manufactured by Asahi Kasei) and Iupirex (manufactured by Ube Industries) are known as resins having translucency with respect to the emission wavelength.
[0058]
According to the third embodiment, an opto-electric composite circuit board in which build-up layers are formed one by one on both sides of a board containing a fiber is realized.
[0059]
Example 4
FIG. 4A is a cutaway side view of a main part showing an optoelectronic composite circuit board in which all layers of a multilayer are connected by an IVH (interstitial via-hole), and is used in FIGS. 1 to 3. The symbol and the same symbol represent the same part or have the same meaning.
[0060]
Via holes are formed in the build-up layer 62 in the photoelectric composite circuit board described as the third embodiment, and electroless copper plating and electrolytic copper plating are performed to establish conduction with the wiring 53 in the core board 51. Then, the lithography technique is used, the copper layer 62B in the build-up layer 62 is etched to form the wiring 62C, and the chip component mounting pad 62D is formed. An optical-electrical composite circuit board with a built-in optical fiber having layer wiring is realized. Note that the material forming the pad 62D can be selected from metals such as Ag, Sn, Pb, Ni, Bi, and In, and the lithography technique can be applied when the pad 62D is manufactured. It suffices to perform resist film formation, exposure of a pad pattern, resist development, Cu plating, metal plating for bonding, resist peeling, and the like.
[0061]
Example 5
FIG. 4B is a cutaway side view of a main part showing an opto-electric composite circuit board on which a VCSEL or the like is mounted, and the same symbols as those used in FIGS. 1 to 4A indicate the same parts or Shall have the same meaning.
[0062]
The VCSEL 63 is mounted on the photoelectric composite circuit board described as the fourth embodiment. As the VCSEL 63 in this case, a surface-emitting type flip chip mountable chip chip is preferable, and for example, a surface-emitting type 850 [nm] light emitting VCSLE (U04T: manufactured by ULM Photonics) can be used.
[0063]
Various metals for low-temperature mounting such as Ag-Sn can be used as the metal for bonding to the pad 62D when mounting the VCSLE 63. Incidentally, the junction temperature of Ag-Sn is about 240 ° C.
[0064]
After mounting the VCSLE 63, die bonding of the VCSEL driver IC 64 is performed, and an electric signal is converted into an optical signal by bonding to a required portion, for example, the VCSEL 63 or other wiring 62C using the bonding wire 65. In addition, it is possible to realize a photoelectric composite circuit board having a transmitting function capable of transmitting. As the VCSEL driver IC 64, for example, HXT2312A (manufactured by Helix) can be used. It is optional to install a capacitor for the driver IC.
[0065]
Example 6
FIG. 5A is a cutaway side view showing a main part of an opto-electric composite circuit board on which a VCSEL or the like is mounted. The same symbols as those used in FIGS. 1 to 4 indicate the same parts or have the same meanings. Shall have.
[0066]
The driver IC 64 thinned to about 100 [μm] is mounted on the opto-electric composite circuit board described as the fifth embodiment, and bonding is performed while the height of the bonding wire 65 is suppressed to 150 μm or less above the driver IC 64.
[0067]
After filling the translucent underfill agent 66 below the VCSEL 63, the core substrate 68 on which the receiving hole 68A corresponding to the area where the VCSEL 63, the driver IC 64, the capacitor and the like are installed is formed, and the wiring is formed. (Aramika Asahi Kasei Co., Ltd.) are laminated via a prepreg layer 67.
[0068]
As the translucent underfill agent 66, for example, JCR6140 and JCR6122 (manufactured by Dow Corning Toray Silicone Co., Ltd.) may be used.
[0069]
The sealing agent 69 is filled in the accommodation hole 68A formed in the laminated core substrate 68. As the sealant 69, a material that is frequently used in an organic package can be used, and it is preferable that the sealant 69 is a thermally conductive resin. Above the sealant 69, a fin for heat dissipation may be provided.
[0070]
Example 7
FIG. 5B is a cutaway side view showing a main part of an opto-electric composite circuit board on which a PD and a PD amplifier IC are mounted, and the same symbols as those used in FIGS. 1 to 5A are the same. Indicate parts or have the same meaning.
[0071]
In the photoelectric composite circuit board described as the sixth embodiment, a PD 70 is mounted in place of the VCSEL 63, and a PD amplifier IC 71 is mounted in place of the driver IC 64, and receives an optical signal introduced from an optical fiber. Has the ability to
[0072]
Example 8
FIG. 6A is a cutaway side view showing a main part of an interposer-type optoelectronic composite circuit board on which a high-speed LSI is mounted, and the same symbols as those used in FIGS. Shall have the same meaning.
[0073]
The eighth embodiment is different from the first to sixth embodiments in that an area for mounting a high-speed LSI is secured on the core substrate 51 having a built-in optical fiber, and wiring and mounting pads for the high-speed LSI are formed. Has realized an interposer-type photoelectric composite circuit board that can convert an electric signal from the high-speed LSI 72 into an optical signal and transmit the optical signal. The symbol 73 indicates a connector connected to the optical fiber.
[0074]
Example 9
FIG. 6B is a cutaway side view of a main part showing an interposer-type optoelectronic composite circuit board on which a high-speed LSI is mounted, and the same symbols as those used in FIGS. 1 to 6A denote the same parts. It shall be shown or have the same meaning.
[0075]
The ninth embodiment is different from the seventh embodiment in that an area for mounting a high-speed LSI is secured on the core substrate 51 having a built-in optical fiber, and wiring and mounting pads for the high-speed LSI are formed and the high-speed LSI 72 is mounted. By doing so, an interposer-type opto-electric composite circuit board capable of converting a high-speed optical signal from the optical fiber 55 into an electric signal and transmitting the electric signal to the high-speed LSI 72 has been realized.
[0076]
Example 10
FIG. 7A is a cutaway side view of a main part showing an opto-electric composite circuit board for optical wiring in a board, and the same symbols as those used in FIGS. 1 to 6 represent the same parts or have the same meanings. Shall have.
[0077]
In the tenth embodiment, the transmission module 74 described as the eighth embodiment and the reception module 75 described as the ninth embodiment are formed on the same substrate, thereby realizing the optical wiring in the substrate.
[0078]
Example 11
FIG. 7B is a cutaway side view of a main part showing an optoelectronic composite circuit board on which driver ICs are mounted in a stack. The same symbols as those used in FIGS. 1 to 7A denote the same parts. Shall represent or have the same meaning.
[0079]
The eleventh embodiment is different from the sixth embodiment in that the build-up layer is laminated without mounting the VCSEL driver IC 64 and the capacitor on the same wiring layer as the VCSEL 63, and the wiring and the IVH are formed. A VCSEL driver IC 77 is mounted, and a capacitor is installed in the vicinity as necessary.
[0080]
According to the eleventh embodiment, since the VCSEL 76 and the driver IC 77 for the VCSEL are mounted in a stack, the wiring can be shortened, which is suitable for use when high speed is required.
[0081]
Example 12
FIG. 8 is a cutaway side view showing a main part of another example of an optoelectronic composite circuit board on which driver ICs are mounted in a stack. The same symbols as those used in FIGS. 1 to 7B denote the same parts. Or have the same meaning.
[0082]
In the twelfth embodiment, a through hole is formed in the substrate of the surface emission type VCSEL 76 itself, which is found in the eleventh embodiment, and the through hole is filled with a conductive material to form a conductive plug 78. A VCSEL 76 is mounted so that the light emitting portion 76A faces downward, fixed with epoxy resin, and inner vias, wiring, pads, etc. are formed, and then the VCSEL driver IC 77 is flip-chip mounted. It is.
[0083]
According to the twelfth embodiment, similarly to the eleventh embodiment, the VCSEL 76 and the driver IC 77 for the VCSEL are mounted in a stack, and the electric wiring on the light emitting portion 76A side is led to the opposite side through the inside of the VCSEL 76. This configuration is more advantageous in terms of speeding up as compared with the configuration in which the electric wiring is routed outside the VCSEL 76.
[0084]
The present invention can be embodied in many forms including the above-described embodiment, and will be exemplified below as additional notes.
[0085]
(Appendix 1)
At least an electric wiring, a marker, a core substrate formed with a groove for incorporating an optical fiber,
The cladding surface or the adhesive surface of the optical fiber and the insulating layer surface or the electric wiring surface of the core substrate are aligned at substantially the same height and are arranged in the groove. An optical fiber bonded and fixed together with
A V-shaped groove formed obliquely from the core substrate surface opposite to the aligned surface and at least cutting the core of the optical fiber, and the cut surface covered with a metal film;
An optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light-receiving element mounted using the electrical wiring on the side where the optical fiber and the surface are aligned.
An opto-electric composite circuit board comprising:
[0086]
(Appendix 2)
A build-up wiring layer composed of an insulating layer and a metal foil laminated on a core substrate having a built-in optical fiber, and an optical element such as a surface emitting semiconductor laser or a surface receiving light receiving element mounted on the build-up wiring layer The photoelectric composite circuit board according to (Supplementary Note 1), comprising:
[0087]
(Appendix 3)
The core substrate has an in-plane expansion coefficient of about 10 × 10 around room temperature. ^-6 Selected from an organic substrate, a glass substrate, and a ceramic substrate containing an aromatic polyamide resin of not more than / deg.
The photoelectric composite circuit board according to (Appendix 1) or (Appendix 2), characterized in that:
[0088]
(Appendix 4)
One side of the optical fiber, including the vicinity of the optical input / output section, is fixed to the core substrate, and the other side is unfixed or covered with a low elastic material.
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 3), characterized in that:
[0089]
(Appendix 5)
Build-up wiring layer where wiring is formed based on the position where the core of the optical fiber is cut obliquely
The photoelectric composite circuit board according to (Supplementary Note 2), comprising:
[0090]
(Appendix 6)
The surface-emitting type semiconductor laser is located on the wiring side of the build-up wiring layer and is installed at a position where light reflected by the metal film covering the V-shaped groove is incident on the optical fiber. The insulating layer has an optical path for optically coupling between the metal film and the surface emitting semiconductor laser by making the material itself transparent or forming an opening.
The photoelectric composite circuit board according to any one of (Appendix 2) to (Appendix 5), characterized in that:
[0091]
(Appendix 7)
The surface light receiving type light receiving element is located on the wiring side in the build-up wiring layer and is installed at a position where light reflected by the metal film covering the V-shaped groove is emitted from the optical fiber. The insulating layer has an optical path for optically coupling between the metal film and the surface light receiving element by making the material itself translucent or by forming an opening.
The photoelectric composite circuit board according to any one of (Appendix 2) to (Appendix 5), characterized in that:
[0092]
(Appendix 8)
A light-transmitting resin is filled in an optical path between an optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light-receiving element and a metal film covering the V-shaped groove.
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 7), characterized in that:
[0093]
(Appendix 9)
One end of the optical fiber is installed inside the core substrate, and the other end is exposed as a free end outside the core substrate and an optical connector is attached.
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 8), characterized in that:
[0094]
(Appendix 10)
A laminated material having a thickness equal to or greater than the thickness of the optical element is provided around an optical element such as a surface emitting semiconductor laser or a surface receiving light receiving element.
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 9), characterized in that:
[0095]
(Appendix 11)
An optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light-receiving element is sealed with a sealing agent mainly composed of an organic material or a thermally conductive insulating resin.
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 10), characterized in that:
[0096]
(Appendix 12)
An IC for operating an optical element or an IC for operating an optical element and a capacitor, which are located near an optical element such as a surface emitting semiconductor laser or a surface receiving type light receiving element and are installed on the same wiring layer
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 11), characterized in that:
[0097]
(Appendix 13)
An optical element operating IC or an optical element operating IC and a capacitor are provided near and including an optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light receiving element and installed in different wiring layers. thing
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 12), characterized in that:
[0098]
(Appendix 14)
The optical fiber must have a core diameter of 50 μm or more and a cladding diameter of 125 μm.
The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 18), characterized in that:
[0099]
(Appendix 15)
Optical fibers must be tape-shaped by aligning them at equal intervals and bonding and fixing them
20. The photoelectric composite circuit board according to any one of (Appendix 1) to (Appendix 19).
[0100]
【The invention's effect】
In the opto-electric composite circuit board according to the present invention, at least a core board in which a groove for incorporating an electric wiring, a marker, and an optical fiber is formed; The cladding surface or the adhesive surface of the core substrate and the insulating layer surface or the electric wiring surface of the core substrate are aligned at substantially the same height, and the optical fiber is disposed in the groove and bonded and fixed; A V-shaped groove formed obliquely from the surface of the core substrate on the opposite side and at least cutting the core of the optical fiber and having the cut surface covered with a metal film; It is basically provided with an optical element such as a surface emitting semiconductor laser or a surface light receiving type light receiving element mounted thereon.
[0101]
By adopting the above-mentioned means, it becomes possible to optically couple an optical fiber and an optical element such as a VCSEL or a PD without using a lens, and therefore, it is not necessary to precisely align the lens at the time of assembly. As a result, it is possible to reduce both the cost of the members and the cost of the process, and the manufacturing advantage is extremely high.
[Brief description of the drawings]
FIG. 1 is a plan view of a main part showing a core substrate in a main part of a manufacturing process.
FIG. 2 is an explanatory view of a main part for explaining an opto-electric composite circuit board in a main part of a manufacturing process.
FIG. 3 is a cutaway side view showing a main part of the photoelectric composite circuit board;
FIG. 4 is a cutaway side view showing a main part of the photoelectric composite circuit board.
FIG. 5 is a cutaway side view showing a main part of the photoelectric composite circuit board.
FIG. 6 is a cutaway side view showing a main part of the photoelectric composite circuit board;
FIG. 7 is a cutaway side view showing a main part of the photoelectric composite circuit board.
FIG. 8 is a cutaway side view of an essential part showing the photoelectric composite circuit board.
FIG. 9 is a perspective view of an essential part illustrating an optical transmission module using a quartz waveguide.
FIG. 10 is a cutaway side view of an essential part illustrating an optical transmission module using a Si substrate itself as a waveguide.
FIG. 11 is a cutaway side view illustrating a main part of an optical transmission module using an optical fiber.
FIG. 12 is a cutaway side view of an essential part illustrating an optical transmission module using a microlens.
FIG. 13 is a fragmentary explanatory view illustrating an optical transmission module using a microlens and a mirror.
[Explanation of symbols]
51 core board
51A Hole for Press Machine
51B Groove forming marker
51C V-groove forming marker
51D VCSEL mounting marker
52 Through Via
53 wiring
54 grooves
55 fiber
55A clad
55B core
56 adhesive
57 Tape-shaped parallel fiber
58 Adhesive layer
59 V-shaped groove
60 resin
61 Metal film mirror
62 Build-up layer

Claims (5)

At least an electric wiring, a marker, a core substrate formed with a groove for incorporating an optical fiber,
The cladding surface or the adhesive surface of the optical fiber and the insulating layer surface or the electric wiring surface of the core substrate are aligned at substantially the same height and are arranged in the groove. An optical fiber bonded and fixed together with
A V-shaped groove formed obliquely from the core substrate surface opposite to the aligned surface and at least cutting the core of the optical fiber, and the cut surface covered with a metal film;
An opto-electric composite circuit board comprising: an optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light receiving element mounted using the optical fiber and electric wiring on the side of which the surface is aligned. A build-up wiring layer composed of an insulating layer and a metal foil laminated on a core substrate having a built-in optical fiber, and an optical device such as a surface emitting semiconductor laser or a surface receiving light receiving device mounted on the build-up wiring layer The opto-electric hybrid circuit board according to claim 1, comprising: 3. A laminated material having a thickness equal to or greater than the thickness of an optical element, such as a surface-emitting type semiconductor laser or a surface-receiving type light-receiving element, is provided around the optical element. The opto-electric composite circuit board as described in the above. An IC for operating an optical element or an IC for operating an optical element and a capacitor which are provided near an optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light receiving element and which are provided on the same wiring layer. The photoelectric composite circuit board according to claim 1, wherein: An optical element operating IC or an optical element operating IC and a capacitor are provided near and including an optical element such as a surface-emitting type semiconductor laser or a surface-receiving type light receiving element and installed in different wiring layers. The photoelectric composite circuit board according to any one of claims 1 to 3, wherein:

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