JP2006195197A - Manufacturing method of optical waveguide and die used in manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easy, reliable and less costly manufacturing method of an optical waveguide and a manufacturing method of a die used in this manufacturing method. <P>SOLUTION: The manufacturing method of an optical waveguide 15 which is a junction 12 of a clad 11 and a core 9 made to guide light through the core 9 has a process of forming a photosensitive resist 2 on the support 1, a process of patterning the photosensitive resist 2 in the shape of the core, a process of machining the ends 3a of the patterned resist 2 into inclined surfaces 3, a process of providing die material 5 on this photosensitive resist 2, a process of separating the die material 5 and the photosensitive resist 2, a process of removing projections 6 formed around the inclined surfaces 3' made when transferring the inclined surfaces 3 on the die material 5, and a process of molding the core 9 by using the die 7 thus manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an optical waveguide suitable for a light source module, optical interconnection, optical communication, and the like, and a method for manufacturing a mold used in the method.

  Currently, signal propagation between semiconductor chips such as LSI (Large Scale Integrated Circuit) is all done by electrical signals via substrate wiring. However, with the recent increase in MPU functionality, the amount of data exchanged between chips has increased remarkably, and as a result, various high frequency problems have emerged. Typical examples thereof include RC signal delay, impedance mismatch, EMC / EMI, crosstalk, and the like.

  In order to solve the above problems, the mounting industry and others have so far taken the lead in solving various problems such as optimization of wiring layout and development of new materials.

  However, in recent years, the effects of optimization of the wiring layout and development of new materials have been hampered by physical limitations, and it is assumed that simple semiconductor chips will be mounted in order to realize further advanced system functionality in the future. It has become necessary to review the structure of the printed wiring board itself. In recent years, various drastic measures have been proposed to solve these problems, but the following are representative examples.

-Fine wiring bonding by multi-chip module (MCM) High-performance chip is mounted on a precision mounting substrate such as ceramic and silicon, and fine wiring bonding that cannot be formed on a motherboard (multilayer printed circuit board) is realized. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Sealing and integration of various semiconductor chips and electrical wiring bonding by integration Various semiconductor chips are two-dimensionally sealed and integrated using polyimide resin or the like, and fine wiring bonding is performed on the integrated substrate. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Three-dimensional bonding of semiconductor chips A through electrode is provided in various semiconductor chips, and each is bonded to form a laminated structure. Thereby, the connection between the different types of semiconductor chips is physically short-circuited, and as a result, problems such as signal delay are avoided. On the other hand, however, problems such as an increase in the amount of heat generated due to the lamination and thermal stress between the semiconductor chips occur.

  Furthermore, in order to realize high speed and large capacity of signal transmission / reception as described above, an optical transmission coupling technique using optical wiring has been developed (for example, see Non-Patent Document 1 and Non-Patent Document 2 described later). . The optical wiring can be applied to various places such as between electronic devices, between boards in an electronic device, or between chips in a board. For example, as shown in FIG. 18, for transmission of signals over a short distance such as between chips, an optical waveguide 51 is formed on a printed wiring board 50 on which the chips are mounted, and the optical waveguide 51 is subjected to signal modulation. In addition, it is possible to construct an optical transmission / communication system using a transmission path of laser light or the like.

  As shown in FIG. 19, the optical waveguide 51 includes clads 52 and 53 and a core 54 sandwiched between the clads 52 and 53, and a lens portion 55 is disposed at the end of the clad 52. ing. Further, the light incident / exit end surfaces 56a and 56b of the core 54 are each formed on an inclined surface, for example, a 45 ° mirror surface.

  Below, the manufacturing method of the optical waveguide 51 is demonstrated with reference to FIG.

  First, as shown in FIG. 20A, an upper mold 57 and a lower mold 58 having shapes corresponding to the clad 52 including the lens part 55 are used, and the clad with the lens part 55 as shown in FIG. 52 is produced.

  Next, as shown in FIG. 20C, a mold 60 having a recess 59 having a shape corresponding to the core 54 is used, and the recess 59 is filled with a core material 54a. Next, as shown in FIG. 20D, the core material 54a is cured by UV irradiation while pressing the clad 52 with the lens portion 55 produced as described above on the core material 54a. Next, as shown in FIG. 20E, the joined body composed of the clad 52 and the core 54 and the mold 60 are peeled off.

  And as shown in FIG.20 (f), if the clad 53 produced by injection molding etc. is joined to the core 54, the optical waveguide 51 can be obtained.

  Below, the manufacturing method of the type | mold 60 used for shaping | molding of the core 54 is demonstrated with reference to FIG.

  First, as shown in FIG. 21A, a resist 62 is provided on a support 61. Then, as shown in FIG. 21B, the end surface 63 of the resist 62 is processed into an inclined surface using a processing blade 64 or the like.

  Next, as shown in FIG. 21C, the resist 62 is plated with Ni or the like using Ni or the like, and then, as shown in FIG. If the plating 65 is peeled off, the mold 60 having the recess 59 having a shape corresponding to the core 54 can be produced.

Nikkei Electronics, “Encounter with Optical Wiring”, December 3, 2001, pages 122, 123, 124, 125, FIG. 4, FIG. 5, FIG. 6, FIG. NTT R & D, vol.48, no.3, pp.271-280 (1999)

  However, in the mold manufacturing method according to the above-described conventional example, as shown in FIG. 21B, in order to process the end surface 63 of the resist 62 into an inclined surface using the processing blade 64 or the like, the support body 61 is reached. Cuts must be made to the depth position. When the cut groove 67 is formed in the support 61 in this manner, as shown in FIG. 21 (d), in the mold 60, a protrusion is formed on the peripheral portion of the inclined surface 63 ′ formed by transferring the inclined surface 63 of the resist 63. The part 66 exists. In the mold 60, when the protrusion 66 is present in the peripheral portion of the inclined surface 63 ′, as shown in FIG. 20D, when the bonded body of the core 54 and the clad 52 is produced using the mold 60, The joint 66 between the core 54 and the clad 52 is weakened by the protrusion 66, and the reliability of the optical waveguide is lowered. Further, the protrusion 66 interferes with the fabrication of the joined body itself.

  In order to solve this, a method for controlling and processing the depth of the cut groove so as to suppress the height of the protrusion to a maximum film thickness of 1.5 μm or less that can suppress light leakage using a high-precision processing machine. There is. However, this method requires very high-accuracy device management, so that it is difficult to significantly reduce costs in the production of molds and optical waveguides.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing an optical waveguide having high reliability, easy and low cost, and a mold used in the method. It is to provide a manufacturing method.

That is, the present invention is a method of manufacturing an optical waveguide comprising a joined body of a clad and a core, wherein light is guided through the core.
Arranging the pattern material on the support;
Patterning the pattern material into a core shape;
Processing the end face of the patterned pattern material into an inclined surface;
Providing a mold material on the processed pattern material;
Peeling the mold material and the pattern material;
Removing the protrusions present on the periphery of the inclined surface formed by transferring the inclined surface in the mold material;
And a step of forming the core using the mold.

Moreover, in the manufacturing method of the mold used for molding the core,
Arranging the pattern material on the support;
Patterning the pattern material into a core shape;
Processing the end face of the patterned pattern material into an inclined surface;
Providing a mold material on the processed pattern material;
Peeling the mold material and the pattern material;
In the mold material, the present invention relates to a mold manufacturing method including a step of removing protrusions existing on a peripheral portion of the inclined surface formed by transferring the inclined surface.

  Here, in the present invention, the “core” is not limited to a single core, but includes a plurality of arrays.

  According to the present invention, when the end surface of the patterned pattern material is processed into an inclined surface, a notch is formed to a depth position reaching the support using a processing blade or the like, as in the conventional example described above. Even if the protrusion is present in the mold material, the protrusion has a step of removing the protrusion, so that the protrusion does not adversely affect the production of the joined body. Therefore, when processing the end face of the patterned pattern material into an inclined surface, the processing blade can be deeply cut into the support, the biting of the processing blade is improved, and blade edge vibration is reduced. As a result, the machined surface accuracy and surface roughness are improved.

  Furthermore, since it has the process of removing the said protrusion part, the depth of a notch groove is used so that the height of the said protrusion part may be suppressed to the maximum film thickness of 1.5 micrometers or less using a highly accurate processing machine like a prior art example. Since there is no need to suppress and control, it is possible to greatly reduce the cost.

  Therefore, the manufacturing method according to the present invention is highly reliable, easy and low cost.

  In the present invention, the core plays a role of guiding incident signal light, and the clad plays a role of confining the signal light in the core. The core is made of a material having a high refractive index, and the clad is made of a material having a lower refractive index than the core.

  In addition, it is desirable that the protrusions be removed and flattened by chemical mechanical polishing (CMP). Thereby, in the mold, the edge of the recess side wall formed by transferring the shape of the pattern material has an R cross-sectional shape of about 1 μm, and the release structure between the bonded body composed of the core and the clad and the mold Is greatly improved. Further, the bonding area between the core and the clad is increased, the product yield is improved, and the cost can be further reduced.

  Further, it is preferable that a photosensitive resist is used as the pattern material, the photosensitive resist is exposed and developed, and an end surface thereof is processed into the inclined surface.

  Moreover, it is preferable to perform plating (for example, Ni) as the mold material on the pattern material including the inclined surface.

  Then, the core material is filled in the mold, the clad is disposed on the core material, the core material is cured, and the mold is separated from the core and the clad, thereby the bonded body. It is preferable to obtain.

  The optical waveguide obtained by the manufacturing method according to the present invention is efficiently condensed into a predetermined light beam and emitted by the optical waveguide, or the signal light emitted after being efficiently incident on the optical waveguide is received by a light receiving element ( It can be suitably used as an optical information processing apparatus such as an optical wiring configured to be incident on an optical wiring or a photodetector.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

First Embodiment FIGS. 1 and 2 are schematic views showing an example of a mold manufacturing method according to the present invention in the order of steps. FIG. 3 is a schematic plan view (a) and a partial schematic cross-sectional view (b) of a mold obtained by the manufacturing method according to the present invention. FIG. 4 is a schematic cross-sectional view showing an example of a method of manufacturing an optical waveguide according to the present invention in the order of steps.

  First, as shown in FIG. 1A and FIG. 2A, a photosensitive resist 2 as the pattern material is disposed on a support 1. Next, as shown in FIG. 2B, the photosensitive resist 2 is exposed and developed to be patterned into a desired core shape. For example, a plurality of photosensitive resists 2 are arranged side by side on the support 1, and the positions of the end faces 3a of the photosensitive resists 2 are aligned in the length direction.

  Next, as shown in FIGS. 1B and 2C, the end surface 3a of the patterned photosensitive resist 2 is processed into an inclined surface (for example, 45 ° surface) 3 by using a processing blade 4 or the like.

  Next, as shown in FIG. 1C, plating (for example, Ni) as the mold material 5 is performed on the photosensitive resist 2 including the inclined surface 3. Specifically, after a thin film plating is formed on the photosensitive resist 2 by an electroless plating method, it may be thickened by an electroplating method, or a desired thickness may be formed by an electroless plating method. Plating may be formed. Thereby, the shape including the inclined surface 3 of the photosensitive resist 2 is transferred to the mold material 5. Next, as shown in FIG. 1 (d), the support 1, the photosensitive resist 2, and the mold material 5 are peeled off.

  Next, as shown in FIG. 1 (e), in the mold material 5, the protruding portions 6 existing on the periphery of the inclined surface 3 ′ formed by transferring the inclined surface 3 of the photosensitive resist 2 are removed. Specifically, it is desirable to remove the protrusion 6 by CMP and planarize it. For example, since the protrusion 6 is a minute protrusion having a height of several μm, it can be removed by CMP polishing for several tens of seconds. In general metal CMP, the polishing rate of Ni as the plating is 500 NM / Min, and the protrusion 6 is removed 3 to 5 times that, so in fact it can be sufficiently flattened in about 30 seconds. there were. Thus, if the projection 6 is removed and planarized by CMP, as shown in FIG. 3B, the edge of the side wall of the recess 8 formed by transferring the shape of the photosensitive resist 2 in the mold 7 is formed. The R cross-sectional shape is about 1 μm.

  As described above, as shown in FIGS. 1 (f) and 3, a mold 7 having a recess 8 corresponding to the shape of the core can be produced. 3A is a schematic plan view of the mold 7 shown in FIG. 1F viewed from the A direction, and FIG. 3B is a cross-sectional view of the mold 7 shown in FIG. It is a partial schematic cross-sectional view.

  Next, as shown in FIG. 4A, the core material 9 a is filled in the concave portion 8 of the mold 7. Next, as shown in FIG. 4B, the core material 9a is cured by UV irradiation or the like while pressing the clad 11 with the lens portion 10 produced by injection molding or the like on the core material 9a.

  Next, as shown in FIG. 4 (c), the joined body 12 including the clad 11 and the core 9 can be obtained by peeling the mold 7 from the core 9 and the clad 11. If the protrusion 6 is removed and flattened by CMP as in the manufacturing method according to the present invention, the shape of the photosensitive resist 2 is transferred in the mold 7 as shown in FIG. The edge of the side wall of the concave portion 8 has an R cross-sectional shape of about 1 μm, and the releasability between the joined body 12 composed of the core 9 and the cladding 11 and the mold 7 is greatly improved. In addition, the bonding area between the core 9 and the clad 11 is increased, the product yield is improved, and the cost can be further reduced.

  Next, although not shown, another clad may be disposed on the surface of the core 9 opposite to the clad 11.

  The optical waveguide can be manufactured as described above.

  According to the manufacturing method based on the present invention, when the end surface 3a of the patterned photosensitive resist 2 is processed into the inclined surface 3, the depth reaching the support 1 using the processing blade 4 or the like as in the conventional example described above. Even if the notch is formed up to this position and the protrusion 6 is present on the mold 5, the protrusion 6 is removed, so that the protrusion 6 does not adversely affect the production of the joined body 12. Therefore, when processing the end face 3a of the photosensitive resist 2 into the inclined surface 3, the processing blade 4 can be deeply cut into the support 1, the biting of the processing blade 4 is improved, and the blade edge vibration is reduced. As a result, the machined surface accuracy and surface roughness are improved.

  Furthermore, since it has the process of removing the projection part 6, the depth of the notch groove 14 is controlled so as to suppress the height of the projection part 6 to a maximum film thickness of 1.5 μm or less using a highly accurate processing machine as in the conventional example. Since it is not necessary to suppress and control the length, it is possible to significantly reduce the cost.

  Therefore, the manufacturing method according to the present invention is highly reliable, easy and low cost.

Second Embodiment An optical waveguide manufactured by the manufacturing method according to the present invention includes a light incident portion (for example, a light emitting element such as a laser) that makes light incident on the core of the optical waveguide, and an output from the core. It can be suitably used as an optical information processing apparatus such as an optical wiring composed of a light receiving section (for example, a light receiving element such as a photodiode) that receives incident light.

  FIG. 5 shows an optical waveguide 15 produced by the manufacturing method according to the first embodiment, a light incident portion (for example, a light emitting element such as a laser) 16 for making light incident on the core 9 of the optical waveguide 15, and 2 is a schematic diagram of an optical information processing apparatus 18 having a light receiving unit (for example, a light receiving element) 17 that receives light emitted from a core 9.

  In the present embodiment, a plurality of cores 9 having a light incident part 19a and a light emitting part 19b which are 45 ° mirror surfaces are arranged side by side as shown in FIG. The positions of the light incident / exit portions 19a and 19b are aligned in the length direction.

  Further, the light emitting elements 16 are arranged at positions corresponding to the light incident portions 19 a of the respective cores 9. Although not shown, through electrodes (not shown) for electrical connection between the light emitting elements 16 and the semiconductor chip (not shown) are arranged in the gaps between the light emitting elements 16. The light receiving element 17 is the same as the light emitting element 16 described above.

  In the optical information processing apparatus 18 shown in FIG. 5, the light emitting elements 16 and the light receiving elements 17 are arranged at the same pitch as the arrangement pitch of the cores 9.

  In this operation mechanism, an electrical signal transmitted from one semiconductor chip (not shown) is converted into an optical signal and emitted from each light emitting element 16 as an optical signal. The emitted optical signal is focused by the lens unit 10, is incident on the light incident part 19 a of the core 9, is reflected by the light incident part 19 a composed of a 45 ° mirror surface, and extends in the waveguide direction in which the core 9 extends. The light is guided again by the light emitting portion 19b composed of the other 45 ° mirror surface and is emitted from the light emitting portion 19b of the core 9. The optical signal emitted from the optical waveguide 15 is received by the corresponding light receiving element 17 via the lens unit 10 and converted into an electrical signal, and transmitted as an electrical signal to the other semiconductor chip (not shown) (hereinafter, referred to as “electrical signal”). The same applies to other embodiments.)

  In addition, although the example in which the positions of the light incident / exit portions 19a and 19b of the core 9 are aligned in the length direction has been described above, the present invention is not limited to this. For example, the structure shown in FIGS. May be.

  In FIG. 6, a plurality of cores 9 are arranged side by side, and the light incident / exit portions 19a, 19b of each core 9 are in the longitudinal direction with respect to the light incident / exit portions 19a, 19b of other adjacent cores 9. It is formed to be shifted. In this case, the light emitting element array 16a includes a plurality of light emitting elements 16 arranged at positions corresponding to the light incident portions 19a of the respective cores 9 (this is the same for the light receiving elements 17 of the light receiving element array 17a). ).

  According to this, since the light incident / exit parts 19a, 19b of each core 9 are formed to be shifted in the length direction with respect to the light incident / exit parts 19a, 19b of the other adjacent cores 9, The pitch between the light emitting elements 16 arranged in the length direction is as large as the shift amount in the length direction. For example, when the light incident / exit portions 19a and 19b of the adjacent cores 9 are shifted by 100 μm in the extending direction, the pitch between the light emitting elements 16 arranged in the length direction of the core 9 is 100 μm. The same applies to the light receiving element 17.

  Further, the pitch of the light emitting elements 16 arranged in the arrangement direction of the cores 9 is a size corresponding to the total arrangement pitch of the plurality of cores 9. For example, when the cores 9 are arranged at an arrangement pitch of 20 μm, the pitch of the light emitting elements 16 arranged in the arrangement direction of the cores 9 is 100 μm.

  In this way, the light incident / exit portions 19a, 19b of each core 9 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 19a, 19b of the other adjacent cores 9, so that Corresponding optical elements (light-emitting elements and light-receiving elements are collectively referred to) 16 and 17 can be two-dimensionally arranged, and the optical elements 16 and 17 are arranged at a pitch of about 100 μm. However, the core 9 can be integrated to a pitch of 20 μm.

  That is, the integration degree of the cores 9 can be improved while arranging the distance between the optical elements 16 and 17 at a pitch for avoiding the influence of crosstalk due to optical interference and element heat generation.

  Further, by making the cores 9 highly integrated and arranging the optical elements 16 and 17 two-dimensionally, useless space is eliminated and the area occupied by the substrate per element can be reduced. For this reason, further cost reduction can be achieved.

  In FIG. 7, the light incident / exit portions 19a and 19b of the cores 9-1 and 9-2 are in the length direction with respect to the light incident / exit portions 19a and 19b of the other adjacent cores 9-1 and 9-2. They are offset. In other words, the light incident / exit portions 19a and 19b are repeatedly arranged with the two first cores 9-1 and the second core 9-2 shifted in position. A light emitting element array 16a-1 having a plurality of light emitting elements 16 arranged corresponding to the light incident portions 19a of the first core 9-1 on one side in the length direction of each core 9, and a second A light receiving element array 17a-2 having a plurality of light receiving elements 17 arranged corresponding to the light emitting portions 19b of the core 9-2 is arranged. Further, on the other side in the length direction of each core 9, a light receiving element array 17a-1 having a plurality of light receiving elements 17 arranged corresponding to the light emitting portions 19b of the first core 9-1, A light emitting element array 16a-2 having a plurality of light emitting elements 16 arranged corresponding to the light incident portions 19a of the core 9-2 is arranged. That is, in the optical information processing apparatus 18, the light emitting elements 16 and the light receiving elements 17 are alternately arranged for the cores 9-1 and 9-2 arranged in parallel. Therefore, each of the cores 9-1 and 9-2 guides light in the opposite direction to the other adjacent cores 9-1 and 9-2.

  According to this, the same effect as the structure shown in FIG. 6 can be obtained, and the light emitting elements 16 and the light receiving elements 17 are alternately arranged for the cores 9-1 and 9-2 arranged in parallel. Therefore, for example, the positions of the light emitting element 16 and the light receiving element 17 corresponding to the input / output pads connected to a specific circuit of the semiconductor chip are arranged close to each other as shown in part C of FIG. Therefore, there is an effect that the length of the electric wiring can be shortened and the countermeasure against high frequency becomes easy.

  In FIG. 8, the light emitting elements 16 and the light receiving elements 17 are alternately arranged for the cores 9 arranged in parallel, and each core 9 conducts light in the opposite direction with respect to the other adjacent cores 9. To wave. In addition, as shown in FIG. 8C, the optical elements 16 and 17 in each optical element array 16a-1, 16a-2, 17a-1, and 17a-2 are in contrast to other adjacent optical elements 16 and 17, respectively. The core 9 is displaced in the length direction.

  According to this, compared with the case where the optical elements 16 and 17 are linearly arranged in each optical element array 16a-1, 16a-2, 17a-1, and 17a-2, it is between optical elements 16 and 17. Since the pitch can be increased, the distance between the optical elements 16 and 17 is arranged at a pitch to avoid the influence of optical interference and crosstalk due to element heating while maintaining the effect of the structure shown in FIG. Therefore, the integration degree of the core 9 can be improved.

Third Embodiment An optical waveguide manufactured by the manufacturing method according to the present invention can be directly mounted on a printed wiring board. In addition, the optical waveguide is installed in a socket to form a photoelectric composite device. The photoelectric composite device may be mounted on a printed wiring board.

  FIG. 9 is a schematic perspective view of the socket. FIG. 9A is a schematic perspective view seen from the side of the socket where the optical waveguide is installed, and FIG. 9B is a schematic perspective view seen from the side opposite to FIG. 9A. It is.

  As shown in FIG. 9, the socket 20 is provided with positioning means having a concavo-convex structure for positioning and fixing the optical waveguide manufactured by the manufacturing method according to the present invention. Specifically, the concavo-convex structure has a recess 21 for fitting the optical waveguide and positioning the width direction thereof, and a protrusion 22 for positioning the length direction of the optical waveguide. . Moreover, the depth of the recessed part 21 is larger than the thickness of the said optical waveguide.

  The convex surface 23 of the concavo-convex structure of the socket 20 is provided with a conduction means, for example, a terminal pin 24 for conducting the front and back surfaces of the socket 20. Then, an interposer on which the light emitting element and / or the light receiving element are mounted is fixed on the convex surface 23 of the concavo-convex structure, as will be described later.

  As the material of the socket 20, a conventionally known material can be used as long as it is an insulating resin. Examples thereof include glass-filled PES (polyethylene sulfide) resin and glass-filled PET (polyethylene terephthalate) resin. Such a material of the socket 20 already has a lot of data such as its type, insulation, reliability and the like, and there are various manufacturers dealing with it. Therefore, it is a structure that is easy to accept in all of its functions, costs, reliability, etc., and can be easily integrated with the existing printed wiring board mounting process.

  FIG. 10 is a schematic view of a photoelectric composite device 25 in which an optical waveguide 15 manufactured by a manufacturing method according to the present invention is installed in a socket 20. 10 (a) is a schematic perspective view of the photoelectric composite device 25, and FIG. 10 (b) is an exploded view of FIG. 10 (a).

  As shown in FIG. 10, the photoelectric composite device 25 includes a pair of sockets 20 and an optical waveguide 15 installed in the socket 20, and the optical waveguide 15 is bridged between the pair of sockets 20. . The optical waveguide 15 is manufactured by the manufacturing method based on the present invention. At this time, since the optical waveguide 15 is not in contact with a printed wiring board to be described later, it is possible to effectively prevent the optical waveguide 15 from being destroyed by heat dissipation of the semiconductor chip.

  Further, an interposer 27 on which the semiconductor chips 26a and 26b and the light emitting element (not shown, for example, laser) and / or the light receiving element (not shown) are mounted is fixed on the convex surface 23 of the concave-convex structure of the socket 20. Has been.

  For example, as shown in FIG. 11, the interposer 27 has a semiconductor chip 26 mounted on one surface side (FIG. 11A), and makes light incident on the optical waveguide 15 on the other surface side. The light emitting element array 16a and the light receiving element array 17a for receiving the light emitted from the optical waveguide 15 are mounted, and other signal wiring electrodes (for example, power supply wiring, DC signal, etc.) 28 are provided in the periphery. (FIG. 11B). The light emitting element array 16a and the light receiving element array 17a include a plurality of light emitting elements and light receiving elements arranged at positions corresponding to the respective light incident / exit portions of the optical waveguide 15 (not shown). In the gap between each light emitting element and the light receiving element, a through electrode for electrical connection between the light emitting element and the light receiving element and the semiconductor chip is disposed (not shown).

  Then, when fixing the pair of sockets 20 in which the optical waveguide 15 is installed in the recess 21 and the interposer 27, the surface side of the interposer 27 on which the light emitting element array 16a and / or the light receiving element array 17a is mounted is arranged. The socket 20 is configured to be in contact with the convex surface 23, and the terminal pin 24 of the socket 20 and the other signal wiring electrodes 28 of the interposer 27 are fixed so as to be electrically connected.

  Further, as described above, by forming the depth of the recess 21 of the socket 20 to be larger than the thickness of the optical waveguide 15, as shown in FIG. A space 30 can be formed between the light emitting element array 16a and / or the light receiving element array 17a of the interposer 27 mounted on the surface side.

  As described above, the semiconductor chip 26 is mounted on the socket 20 via the interposer 27, the one surface 29 side of the optical waveguide 15, and the light emitting element array 16a and / or the light receiving element array 17a of the interposer 27. By forming the space 30 between the surface where the optical waveguide 15 is mounted, even if the semiconductor chip 26 generates heat when the photoelectric composite device 25 is used, the optical waveguide 15 is effectively destroyed by this heat. Can be prevented.

  Such a photoelectric composite device 25 can constitute an optical wiring system in which the optical waveguide 15 is used as an optical wiring. That is, as shown in FIG. 12, the photoelectric composite device 25 is fixed while being electrically connected to the printed wiring board 31.

  In this operation mechanism, an electrical signal transmitted from one semiconductor chip 26a is converted into an optical signal and emitted from each light emitting element (not shown) of the light emitting element array 16a as an optical signal by laser light. The emitted optical signal is focused by the corresponding lens portion 10 in the optical waveguide 15, enters the light incident portion 19 a of the core 9, is guided in the waveguide direction in which the core 9 extends, and the light of the other core 9 The light is emitted from the emission part 19b. Then, the optical signal emitted from the optical waveguide 15 is received by a corresponding light receiving element (not shown) of the light receiving element array 17a, converted into an electric signal, and transmitted to the other semiconductor chip 26b as an electric signal.

  According to such a photoelectric composite device 25, the optical waveguide 15 produced by the manufacturing method according to the present invention can be electrically connected to the printed wiring board 31 in a state where it is installed in the recess 21 of the socket 20. In this structure, the existing mounting structure of the printed wiring board 31 can be used as it is. Therefore, if a region where the socket 20 can be installed is provided on the printed wiring board 31, other general electric wiring can be formed by a conventional process.

  Even if the optical waveguide 15 is vulnerable to a high heat process, for example, after fixing the socket 20 to the printed wiring board 31, and after completing all mounting processes including a high temperature process such as solder reflow and underfill resin sealing. Since the optical waveguide 15 can be installed in the concave portion 21 of the socket 20, the optical waveguide 15 can be self-propelled without suffering damage due to high temperature.

  In addition, since the socket 20 can be made of a resin having higher rigidity than the printed wiring board 31, the light coupling between the light emitting element and / or the light receiving element and the optical waveguide 15 can be performed on the socket 20. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Furthermore, since the semiconductor chip 26 and the light emitting element array 16a and / or the light receiving element array 17a can be installed close to the upper and lower surfaces via the interposer 27, the semiconductor chip 26, the light emitting element, / Or the wiring length between the light receiving elements can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 15 can be electrically connected to the printed wiring board 31 in a state where the optical waveguide 15 is installed in the recess 21 of the socket 20, the high-density wiring of the printed wiring board 31 and the degree of design freedom are secured. The optical wiring system can be developed on the printed wiring board 31 at a low cost and with a high degree of freedom. High-speed distributed processing on the printed wiring board 31, high functionality in total electronic equipment, and short development TAT (turn around time).

  Here, FIG. 13 is a schematic diagram illustrating an example in which the photoelectric composite device 25 is developed on the printed wiring board 31. For example, by standardizing the optical waveguide module, it can be freely deployed in four directions.

Fourth Embodiment An optical waveguide manufactured by a manufacturing method according to the present invention, the light incident portion for allowing light to enter the core of the optical waveguide, and the light receiving portion for receiving light emitted from the core. By providing a circuit element for supplying an input signal on the input side of the optical information processing apparatus, and providing a circuit element for receiving the output signal on the output side, an electronic apparatus can be configured. In this case, a converter that converts a parallel input signal into a serial input signal is connected to the light incident part via a driver amplifier, and a converter that converts a serial output signal into a parallel output signal is transimpedance to the light receiving part. It is preferable to connect via an amplifier and an I / V conversion amplifier.

  FIG. 14 shows a configuration of a computer system 200 as the electronic apparatus. The computer system 200 includes a CPU (Central Processing Unit) 201, a North Bridge 202 as a memory controller, a DRAM (Dynamic Random Access Memory) 203, a South Bridge 204 as an I / O controller, a bus 205, a network An interface (network I / F) 206, a storage device 207, and other input / output devices (I / O devices) 208 are provided.

  The north bridge 202 is connected to the CPU 201 via the optical information processing apparatus 210a configured as an optical wiring. The south bridge 204 is connected to the north bridge 202 via an optical information processing apparatus 210b configured as an optical wiring, and is further connected to the CPU 201 via an optical wiring 210a. The DRAM 203 is connected to the north bridge 202 via an optical information processing apparatus 210c configured as an optical wiring. The CPU 201 controls each unit based on an OS (Operating System) and application programs. The north bridge 202 performs overall control of access to the memory 203.

  The bus 205 is connected to the south bridge 204 via an electric wiring 214. The network interface 206, the storage device 207, and other I / O devices 208 are each connected to the bus 205. The storage device 207 is an HDD (Hard Disk Drive), a DVD (Digital Versatile Disk) drive, a CD (Compact Disk) drive, or the like. The I / O device 208 is a video input / output device, a serial or parallel interface, or the like.

  FIG. 15 shows a configuration example of the optical information processing apparatuses 210a, 210b, and 210c configured as the optical wiring in FIG. 14 (however, described as the optical wiring 210 in FIG. 15). The optical wiring 210 has optical transmission systems 220-1 to 220-N for N channels. Each of the optical transmission systems 220-1 to 220-N transmits an optical signal from the first circuit to the second circuit, and transmits an optical signal from the second circuit to the first circuit. And a second transmission system 222. Here, when considering the optical wiring 210 a in FIG. 14, the first circuit indicates the CPU 201, and the second circuit indicates the north bridge 202. When considering the optical wiring 210b in FIG. 14, the first circuit indicates the north bridge 202, and the second circuit indicates the south bridge 204. When considering the optical wiring 210 c in FIG. 14, the first circuit indicates the DRAM 203, and the second circuit indicates the north bridge 202. Moreover, the optical wiring 210 gives the example comprised so that it might have an optical waveguide direction as shown in FIG.

  The first transmission system 221 includes a parallel / serial converter (P / S converter) 221a, a driver amplifier 221b, a semiconductor laser 221c as the light emitting element, an optical waveguide 221d manufactured by the manufacturing method according to the present invention, A photodiode 221e as an element, a transimpedance amplifier (TIA) 221f, an I / V conversion amplifier (IVA) 221g, and a serial / parallel converter (S / P converter) 221h are provided. In this case, the P / S converter 221a, the driver amplifier 221b, and the semiconductor laser 221c are arranged on the first circuit side, and the photodiode 221e, TIA 221f, IVA 221g, and the S / P converter 221h are on the second circuit side. Be placed. The optical waveguide 221d is manufactured by the manufacturing method according to the present invention described in each of the above embodiments, and is arranged so as to effectively enter the optical signal emitted from the semiconductor laser 221c, and the optical waveguide 221d. Is arranged so that the optical signal emitted by being guided by the light is effectively received by the photodiode 221e.

  Similarly to the first transmission system 221, the second transmission system 222 includes a P / S converter 222a, a driver amplifier 222b, a semiconductor laser 222c, an optical waveguide 222d manufactured by the manufacturing method according to the present invention, a photo A diode 222e, a TIA 222f, an IVA 222g, and an S / P converter 222h are provided. In this case, the P / S converter 222a, the driver amplifier 222b, and the semiconductor laser 222c are arranged on the second circuit side, and the photodiode 222e, TIA 222f, IVA 222g, and the S / P converter 222h are on the first circuit side. Be placed. The optical waveguide 222d is manufactured by the manufacturing method according to the present invention described in each of the above embodiments, and is arranged so as to effectively enter the optical signal emitted from the semiconductor laser 222c, and the optical waveguide 222d. Is arranged so that the optical signal emitted from the laser beam is effectively received by the photodiode 222e.

Here, it converts the P / S converter 221a, respectively 222a, data to be transmitted, for example, the 8-bit parallel data b ₀ ~b ₇ into serial data. The driver amplifiers 221b and 222b drive the semiconductor lasers 221c and 222c based on the serial data obtained by the P / S converters 221a and 222a, respectively, and generate optical signals corresponding to the serial data from the semiconductor lasers 221c and 222c. Let The TIAs 221f and 222f take impedance matching when supplying current signals generated by photoelectric conversion from the photodiodes 221e and 222e to the subsequent IVAs 221g and 222g, respectively. The IVAs 221g and 222g convert current signals, which are output signals of the TIAs 221f and 222f, into voltage signals, respectively. The S / P converters 221h and 222h convert the transmitted serial data, which are output signals of the IVAs 221g and 222g, into parallel data, respectively.

  Next, an operation when data is transmitted from the first circuit to the second circuit will be described. The 8-bit parallel data to be transmitted from the first circuit is converted into serial data by the P / S converter 221a, and this serial data is supplied to the driver amplifier 221b. The semiconductor laser 221c is driven by the driver amplifier 221b, and an optical signal corresponding to the serial data is generated from the semiconductor laser 221c. Then, this optical signal is guided through the optical waveguide 221d and transmitted to the second circuit side.

  On the second circuit side, an optical signal guided through the optical waveguide 221d is received by the photodiode 221e. A current signal by photoelectric conversion from the photodiode 221e is supplied to the IVA 221g via the impedance matching TIA 221f and converted into a voltage signal. Then, the transmitted serial data, which is an output signal of the IVA 221g, is converted into parallel data by the S / P converter 221h and transmitted to the second circuit.

  In this way, data is transmitted from the first circuit to the second circuit. Although not described in detail, the operation for transmitting data from the second circuit to the first circuit is performed in the same manner as described above. Since the optical wiring 210 shown in FIG. 15 has optical transmission systems 220-1 to 220-N for N channels, data transmission / reception for N channels can be performed in parallel.

  The above-described computer system 200 is configured as a semiconductor chip and optical wiring that respectively configure the CPU 201, the north bridge 202, the DRAM 203, the south bridge 204, the bus 205, and the like as electronic components on a printed wiring board (motherboard) (not shown). The optical information processing apparatus 210 is mounted.

  According to the present embodiment, since the optical information processing apparatus configured as an optical wiring is applied between chips in an electronic device, it is possible to realize high speed and large capacity of signal transmission / reception.

  In addition, since the optical waveguides 221d and 222d in the optical wiring 210 are manufactured by the manufacturing method based on the present invention, the same effects as those of the above-described embodiments can be obtained.

  Therefore, an electronic device configured using the optical waveguides 221d and 222d manufactured by the manufacturing method according to the present invention can perform stable light incidence and light emission.

Fifth Embodiment FIG. 16 shows a configuration of a game machine 300 as the above electronic device. The game machine 300 includes an interface between a main CPU 301 that performs signal processing and control of internal components based on various application programs such as a game application program, a graphic processor (GP) 302 that performs image processing, and a network such as the Internet. A network interface (network I / F) 303, an IO processor (IOP) 304 that performs interface processing, and an optical disk control unit that performs read control of the optical disk 305 such as a DVD or CD and decodes the read data 306, a DRAM 307 as a main memory connected to the main CPU 301, an IOP memory 308 for holding instructions and data executed by the IO processor 304, and an operating system mainly The OS-ROM 309 in which a program use is stored, and includes a basic structure and a sound buffer 311 for storing the compressed waveform data with the sound processor unit (SPU) 310 for performing audio signal processing.

  The main CPU 301 and the network I / F 303 are connected by an optical wiring 210d. The main CPU 301 and the graphic processor 302 are connected by an optical wiring 210e.

  Each of the optical wirings 210d and 210e is configured as shown in FIG. 15, and data transmission / reception is performed between the main CPU 301 and the network I / F 303 and between the main CPU 301 and the graphic processor 302 by optical signals. Is done.

  The main CPU 301 and the IO processor 304 are connected by an SBUS 314. The IO processor 304, the optical disk control unit 306, the OS-ROM 309, and the sound processor unit 310 are connected by an SSBUS 315.

  The main CPU 301 executes programs stored in the OS-ROM 309, various game application programs that are read from the optical disk 305 and loaded into the DRAM 307, or downloaded through a communication network. The graphic processor 302 performs a rendering process in a video game, for example, and outputs a video signal to a display.

  Connected to the IO processor 304 are a controller port 321 to which a controller (not shown) is connected, a memory card slot 322 in which a memory card (not shown) is loaded, a USB connection terminal 323 and an IEEE 1394 connection terminal 324. . As a result, the IO processor 304 is connected to the controller connected via the controller port 321, the memory card connected via the memory card slot 322, and the mobile phone or personal computer (not shown) connected via the USB connection terminal 323. Data transmission / reception, protocol conversion, etc.

  The sound processor unit 310 synthesizes various sounds by reproducing the compressed waveform data stored in the sound buffer 311 at a predetermined sampling frequency based on a command from the main CPU 301, and the audio signal is output to the speaker. Output.

  In the above-described game machine 300, a semiconductor chip as a basic configuration electronic component such as the main CPU 301 and optical information processing devices 210d and 210e configured as optical wiring are mounted on a printed wiring board (motherboard) (not shown). .

  According to the present embodiment, since the optical information processing apparatus configured as an optical wiring is applied between chips in an electronic device, it is possible to realize high speed and large capacity of signal transmission / reception.

  Moreover, since the optical waveguide produced by the manufacturing method based on this invention mentioned above is applied as the said optical waveguide in optical wiring 210d, 210e, the electronic device comprised using this is stable light incidence and light emission. It can be performed.

Sixth Embodiment FIG. 17 shows a configuration of a server 400 as the electronic apparatus. The server 400 includes CPUs 401 and 402, a chip set 403, a network interface (network I / F) 404, a memory 405, a PCI bridge 406, and a router 407 as basic configurations.

  CPUs 401 and 402 are connected to the chip set 403 through optical wirings 210f and 210g, and a network I / F 404 is connected through optical wiring 210h. A network I / F 404 interfaces with a network. The chip set 403 controls the CPUs 401 and 402, the network I / F 404, the memory 405, the PCI bridge 406, and the like.

  Note that the optical wirings 210f, 210g, and 210h are respectively configured as shown in FIG. 15, and optical signals are transmitted between the CPUs 401 and 402 and the chip set 403 and between the chip set 403 and the network I / F 404. Data transmission / reception is performed by.

  Further, a memory 405, a PCI bridge 406, and a router 407 are connected to the chip set 403 by electric wiring.

  PCI devices 415 to 417 such as storage devices are connected to the PCI bridge 406 via a PCI bus 414. The router 407 includes, for example, a switch card 421 and line cards 422 to 425. The line cards 422 to 425 are processors that perform preprocessing of packets, and the switch card 421 is a switch that switches the destination of packets according to addresses.

  In the server 400 described above, on a printed wiring board (motherboard) not shown, the CPU 401, 402, the semiconductor chip as the basic configuration electronic component such as the chip set 403, and the optical information processing devices 210f, 210g configured as optical wiring. 210h are implemented.

  According to the present embodiment, since the optical information processing apparatus configured as an optical wiring is applied between chips in an electronic device, it is possible to realize high speed and large capacity of signal transmission / reception.

  Moreover, since the optical waveguide manufactured by the manufacturing method based on this invention mentioned above is applied as the said optical waveguide in optical wiring 210f, 210g, 210h, the electronic device comprised using this is stable light incidence and Light emission can be performed.

  As mentioned above, although embodiment of this invention was described, the above-mentioned example can be variously modified based on the technical idea of this invention.

  For example, the optical waveguide manufactured by the manufacturing method according to the present invention is suitable for the above-described optical wiring system in which a signal is placed on a laser beam. Is possible.

It is a schematic sectional drawing which shows an example of the manufacturing method based on this invention by 1st Embodiment in process order. It is a schematic plan view which shows an example of the manufacturing method based on this invention in order of a process. It is the schematic of the type | mold obtained by the manufacturing method based on this invention. It is a schematic sectional drawing which shows an example of the manufacturing method based on this invention in order of a process. It is the schematic of the optical information processing apparatus comprised using the optical waveguide produced by the manufacturing method based on this invention by 2nd Embodiment. It is the schematic of the optical information processing apparatus of the other example comprised using the optical waveguide produced by the manufacturing method based on this invention. It is the schematic of the optical information processing apparatus of the other example comprised using the optical waveguide produced by the manufacturing method based on this invention. It is the schematic of the optical information processing apparatus of the other further example comprised using the optical waveguide produced by the manufacturing method based on this invention. It is a schematic perspective view of the socket which installs the optical waveguide produced by the manufacturing method based on this invention by 3rd Embodiment. FIG. 2 is a schematic perspective view of a photoelectric composite device in which an optical waveguide manufactured by the manufacturing method according to the present invention is installed in the socket. It is a schematic perspective view of the interposer joined to the socket. FIG. 2 is a schematic cross-sectional view in which the photoelectric composite device is arranged on a printed wiring board. It is a schematic plan view of an example of the mounting structure of the photoelectric composite device. It is a schematic diagram which shows an example of the electronic device comprised using the optical waveguide produced by the manufacturing method based on this invention by 4th Embodiment. FIG. 3 is a schematic diagram illustrating an example of a configuration of the optical information processing apparatus configured as an optical wiring in the electronic device. It is a schematic diagram which shows an example of the electronic device comprised using the optical waveguide produced by the manufacturing method based on this invention by 5th Embodiment. It is a schematic diagram which shows an example of the electronic device comprised using the optical waveguide produced by the manufacturing method based on this invention by 6th Embodiment. It is the schematic which shows the mounting structure of the optical waveguide by a prior art example. It is the schematic of an optical waveguide same as the above. It is a schematic sectional drawing which shows the manufacturing method of an optical waveguide in order of a process. It is a schematic sectional drawing which shows the manufacturing method of the type | mold used for shaping | molding of a core in order of a process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body, 2 ... Photosensitive resist, 3a ... End surface, 3 '... Inclined surface, 4 ... Processing blade,
5 ... Mold material, 6 ... Projection, 7 ... Mold, 8 ... Recess, 9a ... Core material, 9 ... Core, 10 ... Lens part,
DESCRIPTION OF SYMBOLS 11 ... Cladding, 12 ... Bonded body, 13 ... Cladding, 14 ... Cut groove, 15 ... Optical waveguide,
31 ... Printed wiring board

Claims (9)

In the method of manufacturing an optical waveguide, which is composed of a joined body of a clad and a core, and is configured so that light is guided through the core,
Arranging the pattern material on the support;
Patterning the pattern material into a core shape;
Processing the end face of the patterned pattern material into an inclined surface;
Providing a mold material on the processed pattern material;
Peeling the mold material and the pattern material;
Removing the protrusions present on the periphery of the inclined surface formed by transferring the inclined surface in the mold material, and producing a mold;
And a step of forming the core using the mold.   The method for manufacturing an optical waveguide according to claim 1, wherein the protrusion is removed and flattened by a chemical mechanical polishing method.   The method for manufacturing an optical waveguide according to claim 1, wherein a photosensitive resist is used as the pattern material, the photosensitive resist is exposed and developed, and an end surface thereof is processed into the inclined surface.   The method for manufacturing an optical waveguide according to claim 1, wherein plating as the mold material is performed on the pattern material including the inclined surface.   Filling the mold with a core material, disposing the clad on the core material, curing the core material, and peeling the mold, the core and the clad to obtain the joined body, A method for manufacturing an optical waveguide according to claim 1. In a method for manufacturing a mold used for forming a core,
Arranging the pattern material on the support;
Patterning the pattern material into a core shape;
Processing the end face of the patterned pattern material into an inclined surface;
Providing a mold material on the processed pattern material;
Peeling the mold material and the pattern material;
A method of manufacturing a mold, comprising: removing a protrusion existing in a peripheral portion of the inclined surface formed by transferring the inclined surface in the mold material.   The mold manufacturing method according to claim 6, wherein the protrusion is removed and flattened by a chemical mechanical polishing method.   The mold manufacturing method according to claim 6, wherein a photosensitive resist is used as the pattern material, the photosensitive resist is exposed and developed, and an end surface thereof is processed into the inclined surface.   The mold manufacturing method according to claim 6, wherein plating as the mold material is performed on the pattern material including the inclined surface.

Images