JP2006060004A - Optical component supporting substrate and its production method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical component supporting substrate which can surely align components mutually and is readily manufactured. <P>SOLUTION: The optical supporting substrate 110 has a resin substrate 111, a through hole 115 provided to the resin substrate 111, an alignment guide member 44 or the like. The alignment guide member 44 can be fit to the alignment recess 36 of an optical waveguide 31 which is an optical component with optical transmission function. A guide member supporting hole 116 is formed corresponding to a place of the through hole 115. The guide member supporting hole 116 is opened in a major surface 12. The alignment guide member 44 is fit to the guide member supporting hole 116 and supported. The optical waveguide 31 and the resin substrate 111 are aligned by fitting the alignment guide member 44 to the alignment recess 36 of the optical waveguide 31. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical component supporting substrate and a manufacturing method thereof.

In recent years, with the development of information communication technology represented by the Internet and the dramatic improvement in the processing speed of information processing apparatuses, there is an increasing need for transmitting and receiving large-capacity data such as images. An information transmission speed of 10 Gbps or higher is desirable to exchange such a large amount of data freely through an information communication facility, and great expectations are placed on optical communication technology as a technology that can realize such a high-speed communication environment. On the other hand, signals can be transmitted at high speeds even on signal transmission paths at relatively short distances, such as connections between wiring boards in equipment, connections between semiconductor chips in wiring boards, connections within semiconductor chips, etc. It has been desired in recent years. For this reason, it is considered that it is ideal to shift from a conventional metal cable or metal wiring to optical transmission using an optical fiber or an optical waveguide.
Here, a wiring board that mounts an optical element and performs optical communication between the optical element and an optical fiber or an optical waveguide has been conventionally proposed (for example, see Patent Documents 1 and 2 and Non-Patent Document 1). ). In Patent Documents 1 and 2, the external board and the wiring board can be arranged at predetermined positions by the self-alignment action when the external board on which the optical element is mounted is connected to the wiring board with solder bumps and reflowed. This technique is disclosed. In Non-Patent Document 1, a polyimide tape on which an optical element is mounted is drilled to form a guide pin hole, and a guide pin for alignment is supported in the guide pin hole, and provided at the tip of the optical fiber. An optical module structure in which an MT connector and an optical element are aligned with respect to the guide pin is disclosed. In addition, if the alignment structure of patent documents 1 and 2 is a negative thing by the self-alignment effect | action at the time of reflow, the alignment structure of nonpatent literature 1 is an active thing by the fitting of a guide pin. It can be said that there is. Therefore, according to the alignment structure of Non-Patent Document 1, it is considered that the accuracy of optical axis alignment is easily improved.
JP 2002-236228 A JP-A-8-250542 2002 ICEP Proceedings p. 211-215 “Optical Packaging Module with Tape-Platform Technology”

  However, in order to realize the structure described in Non-Patent Document 1, it is necessary to perform precision drilling directly on the polyimide tape as a base material to form a guide pin hole, but the base material has sufficient rigidity. It does not have and is easy to cause deformation. Therefore, the accuracy of the guide pin hole tends to be deteriorated, and there is a drawback that the position accuracy of the guide pin cannot be increased.

  Therefore, if a resin substrate having a structure in which an inorganic fiber material such as glass cloth is used as a base material and impregnated with a resin is used, deterioration of the accuracy of the guide pin hole can be prevented as a result of low thermal expansion and high rigidity. Conceivable. However, when this type of resin substrate is used, precision drilling becomes difficult due to the presence of a glass cloth harder than the resin. Therefore, the difficulty in manufacturing the optical module increases.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical component support substrate that can reliably align components and can be easily manufactured, and a method for manufacturing the same.

  As a means for solving the above-mentioned problems, a resin substrate having a main surface, a through-hole portion provided in the resin substrate, and a part of the resin substrate project on the main surface side to transmit light. An alignment guide member that can be fitted to an alignment recess of an optical component having at least one of a function, a light collecting function, and a light reflecting function, and that is open on the main surface. There is an optical component supporting board characterized in that a hole is formed corresponding to a place where the through hole portion is provided, and the guide member for alignment is fitted and supported in the guide member supporting hole. The “resin substrate” preferably includes an inorganic fiber material, and further preferably includes a core portion in which a base material made of an inorganic fiber material is impregnated with a resin.

  Accordingly, the guide member support holes of the optical component support substrate are arranged corresponding to the positions where the through holes are provided in the resin substrate, and therefore can be formed without directly drilling the resin substrate itself. Therefore, even if an inorganic fiber material is included, it is possible to provide an optical component supporting substrate that can be precisely drilled easily and at low cost and can be easily manufactured. Further, when the resin substrate is configured to include the inorganic fiber material, the thermal expansion and the rigidity of the resin substrate are reduced, so that the positional accuracy of the guide member support hole and the alignment guide member can be improved. For this reason, it becomes possible to provide the optical component support substrate which can position components reliably.

  The resin substrate constituting the optical component supporting substrate is made of an inorganic fiber material, EP resin (epoxy resin), PI resin (polyimide resin), BT resin (bismaleimide-triazine resin), PPE resin (polyphenylene ether resin) And the like having a core part impregnated with a resin such as Examples of the inorganic fiber material include glass cloth.

  The resin substrate may be a build-up wiring substrate having a build-up layer formed by alternately laminating resin insulating layers and metal conductor layers on the surface layer of the core portion. Note that the build-up layer may exist only on one side of the core part, or may exist on both sides. When a part of guide member support hole is provided also in a buildup layer, it is preferable that the buildup layer is not comprised including an inorganic fiber material. Further, the shape of the resin substrate is not particularly limited, but preferably has at least one main surface. For example, it is preferable to use a flat resin substrate.

  The through-hole part which comprises an optical component support substrate is provided in the resin substrate. Such a through hole portion has a structure in which a material containing at least a metal is provided in a through hole that penetrates the core portion or a through hole that penetrates the resin substrate. More specifically, a structure in which copper, silver, nickel, or the like is deposited on the inner wall surface of the through hole, a structure in which a filler containing metal is filled in the through hole, or an inner wall surface of the through hole is plated. The structure etc. which filled with the filler after depositing are mentioned. In addition, from the viewpoint of ease of drilling, it is preferable that the through-hole portion does not include an inorganic fiber material. Further, the through-hole portion may be involved in conduction between conductors, and may not particularly participate in conduction.

  The resin substrate constituting the optical component support substrate has guide member support holes at predetermined positions. The guide member support hole may be a non-through hole that opens only on the main surface side (that is, has one opening), and also opens on the surface side opposite to the main surface (that is, two openings). It may be a through hole. The size of the guide member support hole is not particularly limited as long as the alignment guide member can be supported.

  Such a guide member support hole is formed corresponding to a portion having a through hole portion. As a preferable example of the guide member support hole, for example, a part formed by scraping off a part of the filler filled in the through hole part, or an inner peripheral surface of the plating applied to the through hole in the through hole part is used. Some are formed by scraping.

The alignment guide member constituting the optical component support substrate has a structure that can be fitted into the alignment recess of the optical component. The alignment guide member is supported by the resin substrate through the through-hole portion by being fitted into the guide member support hole. In such a support state, a part of the alignment guide member protrudes on the main surface side of the resin substrate. Here, the shape of the alignment guide member is not particularly limited, but, for example, a pin-shaped member (guide pin) is preferable, and a material that is hard to some extent is preferable. Such guide pins are preferably fitted into precision machined holes. The reason is that if the hole is a precision machined hole, the alignment guide member that serves as a reference for optical axis alignment can be supported at the correct position. Also, the diameter of the alignment guide member (particularly the diameter of the portion protruding on the main surface side of the resin substrate) is substantially the same as that of the alignment recess so that it can be fitted with the alignment recess of the optical component. It is preferable that The number of the alignment guide members is not particularly limited. However, from the viewpoint of improving alignment accuracy and fixing strength, it is preferable that the number of alignment guide members is more than one.
In the case where the alignment guide member is a guide pin, the end portion of the guide pin preferably has a flat surface perpendicular to the axial direction. Such a flat surface has an advantage that, for example, when the image of the end portion of the guide pin is recognized and used as a reference for alignment, image recognition can be easily performed. However, it is preferable to chamfer the outer edge of the end portion of the guide pin. And if it is this structure, it can be made easy to fit a guide pin with respect to the alignment recessed part of an optical component.
The optical component support substrate of the present invention may include an optical element to be optically coupled to the optical component. However, in the present invention, the optical element is an arbitrary component. One or more optical elements are mounted on the main surface of the resin substrate. As the mounting method, for example, a method such as wire bonding or flip chip bonding, a method using an anisotropic conductive material, or the like can be employed. As an optical element (that is, light emitting element) having a light emitting unit, for example, a light emitting diode (LED), a semiconductor laser diode (LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL), etc. Can be mentioned. These light emitting elements have a function of converting an input electric signal into an optical signal and then emitting the optical signal from a light emitting unit toward a predetermined portion. On the other hand, examples of the optical element having a light receiving portion (that is, a light receiving element) include a pin photodiode (pin PD) and an avalanche photodiode (APD). These light receiving elements have a function of making an optical signal incident on a light receiving unit, converting the incident optical signal into an electric signal, and outputting the electric signal. The optical element may have both a light emitting part and a light receiving part. Suitable materials used for the optical element include, for example, Si, Ge, InGaAs, GaAsP, GaAlAs and the like. Such an optical element (particularly a light emitting element) is operated by an operation circuit. The optical element and the operating circuit are electrically connected through a conductor formed on a resin substrate, for example. The optical element may be directly mounted on the resin substrate, or may be indirectly mounted via a support separate from the resin substrate.

The optical component to be aligned with the optical component support substrate of the present invention has at least one of an optical transmission function, a condensing function, and a light reflecting function. As a specific example, examples of the optical component having an optical transmission function include an optical waveguide and an optical fiber. In addition, the base material which supports an optical waveguide also corresponds to the optical component which has an optical transmission function. An optical component including an optical fiber and an optical fiber connector that supports the optical fiber also corresponds to an optical component having an optical transmission function. Examples of the optical component having a condensing function include a lens component represented by a microlens array. As an optical component having a light reflection function, for example, there is an optical path conversion component. In addition, it can be said that the optical fiber connector in which the optical path changing part is formed is an optical component having a light reflecting function. It can be said that the optical waveguide in which the optical path conversion unit is formed is an optical component having an optical transmission function and an optical reflection function. Note that only one optical component may be supported on the optical component support substrate of the present invention, or two or more optical components may be supported.
The optical waveguide refers to a plate-like or film-like member having a core serving as an optical path through which an optical signal propagates and a clad surrounding the core. For example, an organic optical waveguide made of a polymer material, quartz glass, There are inorganic optical waveguides made of compound semiconductors and the like. As the polymer material, a photosensitive resin, a thermosetting resin, a thermoplastic resin, or the like can be selected. Specifically, a polyimide resin such as a fluorinated polyimide, an epoxy resin, a UV curable epoxy resin, a PMMA ( Polymethyl methacrylate), acrylic resins such as deuterated PMMA, deuterated fluorinated PMMA, polyolefin resins, and the like are suitable.
The optical fiber connector is essentially a means for connecting the optical fiber portions, but here, it is used as a means for connecting the optical fiber side and the substrate side. Such an optical fiber connector may be a single-core optical fiber connector or a multi-fiber optical fiber connector. The optical fiber connector may have an additional function of reflecting light and converting an optical path, for example, in addition to the original function of connecting to the substrate side.
And as another means for solving the above-mentioned problem, there is a manufacturing method of the above-mentioned optical component support substrate, in which a preparation step of preparing a resin substrate having the through-hole portion and a location corresponding to the through-hole portion A drilling step of forming the guide member support hole in the resin substrate by drilling a hole, and a guide member mounting step of fitting and supporting the alignment guide member in the guide member support hole. There is a manufacturing method of an optical component supporting substrate characterized by the following.

  Therefore, in the drilling process of this manufacturing method, the hole corresponding to the through hole portion is drilled, so even if the resin substrate contains an inorganic fiber material, the guide member support hole can be easily and precisely formed. It can be processed and formed. Therefore, the optical component support substrate can be easily manufactured.

  Hereinafter, a method for manufacturing the optical component supporting substrate will be briefly described.

  In the preparation step, a resin substrate having a through-hole portion is prepared and prepared based on a conventionally known method. In this case, the through hole portion may be filled with a filler such as a metal paste and cured.

  In the drilling step, the guide member support holes are formed in the resin substrate by drilling holes at locations corresponding to the through-hole portions. Conventionally well-known techniques can be employed as the hole drilling method. In this case, it is desirable to perform precision hole drilling. This is because if the guide member support hole is formed by precision hole machining, the alignment guide member serving as a reference for optical axis alignment can be supported at a desired correct position. Specific methods for precision hole drilling include drilling, punching, and laser processing. In consideration of cost and the like, drilling using a precision drill is most preferable. In addition, you may make it perform a grinding | polishing process after a drilling process, According to this, the burr | flash etc. which generate | occur | produced in the hole can be removed reliably. In addition, you may finely adjust a hole diameter by performing a finishing process as needed after a drilling process.

For example, the preparation process and the drilling process can be specifically performed as follows. 1) First, in the preparation step, a resin substrate having a through hole portion filled with a filler is prepared. In this case, after forming the through hole by drilling the resin substrate, the inner peripheral surface of the through hole may be plated and further filled with a filler. Then, in the subsequent drilling step, the guide member support hole is formed in the resin substrate by performing precision drilling at a location corresponding to the through-hole portion to scrape off a part of the filler. 2) First, in the preparation step, a through hole is formed by drilling the resin substrate, and then the inner peripheral surface of the through hole is plated to prepare a resin substrate having the through hole portion. . Then, in a subsequent drilling step, a guide member support hole having a smaller diameter than the through hole is formed in the resin substrate by performing precision drilling at a location corresponding to the through hole portion and scraping the inner peripheral surface of the plating. To do.
In the guide member attaching step, the positioning guide member is fitted and supported in the guide member support hole. As a result, at least a part of the alignment guide member protrudes on the main surface side of the resin substrate. Then, after the guide member mounting step, the alignment guide member is fitted into the alignment recess of the optical component. As a result, it is possible to support and fix the optical component to the resin substrate while aligning the optical axes of the optical component and the optical element.

[First Embodiment]

Hereinafter, an optical component supporting substrate 110 with an optical waveguide (optical component supporting substrate with an optical component) of a first embodiment embodying the present invention will be described with reference to FIGS.
As shown in FIG. 1, an optical component supporting substrate 110 with an optical waveguide of this embodiment includes a VCSEL 14 (optical element), a photodiode 17 (optical element), a resin substrate 111 (substrate), and guide pins 44 (for alignment). Guide member) or the like.
As shown in FIG. 1, the resin substrate 111 used in the present embodiment is a plate member having a substantially rectangular shape in plan view having an upper surface 12 (main surface) and a lower surface 13, and a core substrate 112 (core portion). This is a so-called build-up wiring board having build-up layers 113 and 114 on both surface layers. The core portion 112 has a structure in which a glass cloth as a base material is impregnated with an epoxy resin. Instead of the epoxy resin, for example, a resin impregnated with polyimide resin, bismaleimide-triazine resin, polyphenylene ether resin or the like may be used.

The build-up layer 113 on the upper surface side layer is constituted by a resin insulating layer 121 and a metal conductor layer 122. The resin insulating layer 121 formed on the upper surface of the core of the core substrate 112 has a thickness of about 30 μm and is made of, for example, a resin-resin composite material in which continuous porous PTFE is impregnated with an epoxy resin. A metal conductor layer 122 made of copper plating is patterned on the surface of the resin insulating layer 121.
The build-up layer 114 on the lower surface layer is composed of resin insulating layers 131 and 133 and metal conductor layers 132 and 134. The first resin insulating layer 131 formed on the lower surface of the core of the core substrate 112 has a thickness of about 30 μm, and is made of, for example, a resin-resin composite material obtained by impregnating continuous porous PTFE with an epoxy resin. A metal conductor layer 132 made of copper plating is patterned on the surface of the first resin insulating layer 131. On the first resin insulation layer 131, a second resin insulation layer 133 made of the same material and having a thickness of about 30 μm is formed. A metal conductor layer 134 made of copper plating is patterned on the surface of the second resin insulating layer 133.

  Through holes 115 for internal conduction that penetrate the core upper surface and the core lower surface are formed at a plurality of locations on the core substrate 112. These through-hole portions 115 are filled with the build-up layers 113 and 114, and the openings are not exposed on the surface of the resin substrate 111. These through-hole portions 115 have a structure in which a through-hole plating portion 117 is provided on the inner wall surface of the through-hole 116. In the case of this embodiment, the through-hole plating part 117 consists of copper plating, and the deposition thickness is set to about 20 μm. The through-hole portion 115 is filled with a filler 118 that is a cured body of a paste in which an epoxy resin is used as a base and a curing agent and a filler are added thereto. These through-hole portions 115 serve to electrically connect the conductor of the buildup layer 113 on the upper surface layer and the conductor of the buildup layer 114 on the lower surface layer.

  A via hole portion 138 having a structure in which copper plating is deposited in a via recess is formed at a predetermined position of the resin insulating layer 121 of the buildup layer 113. A plurality of solder bumps 139 are provided immediately above the via hole portions 138. The VCSEL 14 and the photodiode 17 are soldered to the upper surface 12 side of the resin substrate 111 through these solder bumps 139. Note that a portion where the solder bump 139 is not formed on the upper surface of the resin substrate 111 is covered with a solder resist 137.

  The VCSEL 14 which is a kind of optical element (light emitting element) is mounted on the resin substrate 111 with the light emitting surface facing upward. The VCSEL 14 has a plurality of (here, four) light emitting units 15 arranged in a line in the light emitting surface. Accordingly, these light emitting portions 15 emit laser light having a predetermined wavelength in a direction orthogonal to the upper surface 12 of the resin substrate 111 (that is, the upward direction in FIG. 1). The photodiode 17 which is a kind of optical element (light receiving element) is mounted on the resin substrate 111 with the light receiving surface facing upward. The photodiode 17 has a plurality of (here, four) light receiving portions 18 arranged in a line in the light receiving surface. Accordingly, these light receiving portions 18 receive laser light coming from a direction orthogonal to the upper surface 12 of the resin substrate 111. Also, an operation circuit IC (not shown) for driving the VCSEL 14 (so-called driver IC) is disposed in the vicinity of the VCSEL 14. In the vicinity of the photodiode 17, a receiving IC (so-called receiver IC) (not shown) that amplifies the signal received by the photodiode 17 is arranged.

  The resin substrate 111 of this embodiment has through-hole portions 155 for supporting pins at a plurality of spaced locations (four locations in this embodiment). The through hole portion 155 has a structure in which a through hole plating portion 157 made of copper plating is deposited on the inner wall surface of the through hole 156. The through hole 156 has a diameter of about 0.75 mm to 0.85 mm and opens at the upper surface 12 and the lower surface 13 of the resin substrate 111. A plated portion central hole 146 (guide member support hole) that opens at the upper surface 12 and the lower surface 13 is formed at a substantially central portion of the through-hole plated portion 157. The plated portion center hole 146 in the present embodiment is formed by scraping the inner peripheral surface of the through-hole plated portion 157. In addition, the diameter of the plating part center hole 146 is smaller than the through-hole 156, and is set to about 0.7 mm.

And in these through hole portions 155 for supporting pins, a guide pin 44 (alignment guide member) made of stainless steel having a circular cross section is fitted and supported with one end protruding toward the upper surface 12 side. Has been. These guide pins 44 have flat surfaces perpendicular to the axial direction at both ends, and the outer edges of both ends are chamfered. Specifically, in this embodiment, a guide pin “CNF125A-21” (diameter 0.699 mm) defined in JIS C 5981 is used.
As shown in FIG. 1, a film-like optical waveguide 31 (optical component) is disposed on the upper surface 12 side of the resin substrate 111. A base material 32 constituting the optical waveguide 31 has a core 33 and a clad 34 surrounding the core 33 from above and below. The core 33 substantially becomes an optical path through which the optical signal propagates. In the case of the present embodiment, the core 33 and the clad 34 are formed of transparent polymer materials having different refractive indexes, specifically, PMMA (polymethyl methacrylate) having different refractive indexes. The number of cores 33 serving as an optical path is four, the same as the number of light emitting portions 15, and they are formed so as to extend linearly and in parallel.
A V-shaped groove 35 that opens on the upper surface of the optical waveguide 31 is formed at a predetermined location in the optical waveguide 31. The tip of the V-shaped groove 35 extends to a certain depth of the core 33. The inner surface of the V-shaped groove 35 is an inclined surface having an angle of about 45 ° with respect to the upper surface 12 of the resin substrate 111, and a thin film 37 made of a metal capable of totally reflecting light is deposited on the inclined surface. Yes. As a result, an optical path changing mirror that reflects light at an angle of 90 ° is configured. Circular alignment holes 36 are formed through the four corners of the optical waveguide 31. These alignment holes 36 have a diameter of about 0.7 mm corresponding to the size of the guide pins 44. Each guide pin 44 protruding on the resin substrate 111 side is fitted in each alignment hole 36 of the optical waveguide 31. As a result, the optical waveguide 31 is fixed in an aligned state on the upper surface 12 of the resin substrate 111. Here, “fixed in an aligned state” specifically means that the optical axis of each light emitting section 15 of the VCSEL 14 matches the optical axis of each core 33 of the optical waveguide 31 and each of the photodiodes 17. This means that the optical waveguide 31 is supported and fixed on the resin substrate 111 in a state where the optical axis of the light receiving unit 18 and the optical axis of each core 33 of the optical waveguide 31 are aligned.

A general operation of the optical component supporting substrate 110 with the optical waveguide configured as described above will be briefly described.
The VCSEL 14 becomes operable by supplying power from the resin substrate 111 side. When an electrical signal is output from the operating circuit IC on the resin substrate 111 to the VCSEL 14, the VCSEL 14 converts the input electrical signal into an optical signal (laser light), and then directs the optical signal upward to emit the light emitting unit 15. Emanates from. An optical signal incident from the lower surface of the optical waveguide 31 changes its traveling direction by 90 ° in the optical path conversion mirror and travels in the core 33 toward the light receiving side. Thereafter, the optical signal changes its traveling direction by 90 ° in the optical path conversion mirror, and proceeds toward the photodiode 17 located below. The optical signal incident on the light receiving unit 18 is converted into an electrical signal and amplified by the receiving IC.

Next, a method for manufacturing the optical component supporting substrate 110 with an optical waveguide having the above configuration will be described.
First, the resin substrate 111 is prepared and prepared by a conventionally known method.

  As a specific example, first, copper foil etching, electroless copper plating, or the like is performed using a copper clad laminate as a starting material to form a core substrate 112 having metal conductor layers 122 and 132 and through-hole portions 115. Next, build-up layers 113 and 114 are laminated on the surface layer of the core substrate 112, and a solder resist 137 is further formed. And solder bump 139 is provided by apply | coating a solder paste to the via-hole part 138, and reflowing (refer FIG. 2).

  On the other hand, the optical waveguide 31 is formed by sequentially laminating the clad 34 and the core 33 according to a conventionally known method, and then performing precision hole processing using a precision drill to form alignment holes 36 at predetermined four locations. deep. Further, by performing V-groove processing and sputtering on the portion, an optical path conversion mirror made of the metal thin film 37 is formed. When forming the optical path conversion mirror, it is preferable to use the position of the alignment hole 36 as a reference, whereby the alignment accuracy can be further improved.

  Next, by drilling the prepared resin substrate 111 using a drill, a through hole 156 for forming a through hole portion is formed (first drilling step, see FIG. 3). . At this point, the portion where the glass cloth is present is drilled, but the first drilling process is not as precise as the second drilling process. Therefore, the hole processing can be performed relatively easily and at a low cost. Note that the first drilling step may be performed by laser processing.

  Next, electroless copper plating or the like is performed on the resin substrate 111 according to a conventionally known method to form a through-hole plating part 157 having a thickness of about 10 μm to 50 μm on the inner wall surface of the through hole 156 (through-hole plating part formation) Process, see FIG. It is not preferable that the plating thickness is less than 10 μm because most or all of the through-hole plating part 157 may be scraped off when performing the hole processing in the next second drilling step. Moreover, when it is going to make plating thickness larger than 50 micrometers, plating time will become long and productivity may fall.

Next, a precision drilling process is performed on the resin substrate 111 at a location corresponding to the pin-supporting through-hole portion 155, and a part on the inner peripheral surface side of the through-hole plating portion 157 is scraped off, thereby obtaining a central portion of the plating portion. A hole 146 is formed (second drilling step, see FIG. 5). At this time, in this embodiment, the place where the glass cloth does not exist and only the copper plating exists is used as the processing object. Therefore, the load received by the precision drill 49 is reduced as compared with the case where the portion where the glass cloth exists is used as the processing object. Therefore, precision drilling can be performed relatively easily, with high accuracy, and at low cost. And according to such a processing method, the plating part center hole 146 which can support the guide pin 44 used as the reference | standard at the time of optical axis alignment in the correct position desired can be obtained. Further, finish processing is performed by a conventionally known method, and fine adjustment is performed so that the hole diameter of the plated portion central hole 146 becomes 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm.
Hereinafter, the one end side of the guide pin 44 is fitted and supported in the plated portion central hole 146 (guide member attaching step). As a result, a part of the guide pin 44 protrudes from the upper surface 12 of the resin substrate 111. Thereafter, components such as the VCSEL 14 are mounted using a component mounting device (not shown) and reflowed to solder each component onto the resin substrate 111 (mounting process). Further, each guide pin 44 protruding from the upper surface 12 of the resin substrate 111 is fitted into each alignment hole 36 in the optical waveguide 31 (support fixing step). As a result, the optical waveguide 31 can be supported and fixed to the resin substrate 111 while aligning the optical axis of the optical waveguide 31 and the VCSEL 14 and aligning the optical axis of the optical waveguide 31 and the photodiode 17.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) The optical component supporting substrate 110 with an optical waveguide has a configuration in which the optical waveguide 31 is supported and fixed to the resin substrate 111 while achieving optical axis alignment with the fitting relationship between the guide pin 44 and the alignment hole 36. ing. Therefore, unlike the conventional optical axis alignment that relies only on the self-alignment action during reflow, the optical axis alignment can be performed positively. In addition, since the resin substrate 111 is a build-up wiring substrate having a so-called glass epoxy substrate as the core portion 112, the thermal expansion coefficient is low and the rigidity is high. Therefore, the positional accuracy of the plated portion center hole 146 and the guide pin 44 can be reliably improved. From the above, it is possible to reliably align the components and align the optical axes of each other. Accordingly, it is possible to realize the optical component supporting substrate 110 with an optical waveguide that has a small light transmission loss and can sufficiently cope with high speed and high density.

(2) In the present embodiment, a method of forming a plated portion central hole 146 by performing precision drilling at a location corresponding to the through hole portion 155 is employed. Therefore, the plated portion central hole 146 can be easily and precisely formed in the resin substrate 111 which is a glass epoxy substrate. Therefore, the optical component supporting substrate 110 with an optical waveguide having a desired structure can be manufactured easily and at low cost.
[Second Embodiment]

  Hereinafter, an optical component supporting substrate 210 with an optical waveguide according to a second embodiment embodying the present invention will be described in detail with reference to FIGS. Here, the points different from the first embodiment will be mainly described, and the same points will be assigned to the common points.

  As shown in FIG. 6, in this optical component supporting substrate 210 with an optical waveguide, the pin supporting through hole portion 155 having the plated portion central hole 146 which is a guide member supporting hole is omitted. Instead, a guide member support hole 216 is formed corresponding to a location where the through hole 115 for internal conduction is present, and the guide pin 44 is fitted and supported in the guide member support hole 216.

  A method for manufacturing the optical component supporting substrate 210 with the above-described optical waveguide will be described. First, the resin substrate 111 and the optical waveguide 31 are prepared in accordance with the procedure of the first embodiment, and then the resin substrate 111 is precision drilled. In this precision hole drilling, the center portion of the through hole 115 is drilled using a precision drill 49 having a diameter slightly smaller than the through hole 116 in the through hole 115 to form the guide member support hole 216 (FIG. 7). reference). In the present embodiment, care is taken not to scrape the through-hole plated portion 117 during the drilling, and the center portion of the filler 118 is mainly scraped off. The reason is to maintain the original function of the through hole 115 for internal conduction. In this hole processing, since the part where the glass cloth does not exist is used as the processing object, the load applied to the precision drill 49 is smaller than when the part where the glass cloth exists is used as the processing object. Therefore, precision drilling can be performed relatively easily, with high accuracy, and at low cost. And according to such a processing method, the guide member support hole 216 which can support the guide pin 44 used as the reference | standard at the time of optical axis alignment in the correct position desired can be obtained. Further, according to the first embodiment, the optical component supporting substrate 210 with an optical waveguide that can be surely aligned without optical axis misalignment by performing a finishing process, a guide member attaching process, a mounting process, a support fixing process, and the like. It can be manufactured easily.

In addition, you may change embodiment of this invention as follows.
The number and shape of the guide pins 44 can be arbitrarily changed without departing from the spirit of the present invention.
-Finishing may be omitted as long as sufficiently precise holes can be formed only by precision drilling.
In the above embodiment, the optical waveguide 31 is used as an optical component having an optical transmission function and an optical reflection function. However, an optical component having an optical transmission function such as an optical fiber connector may be used instead. . Furthermore, instead of the optical waveguide 31, an optical component having a light collecting function such as a microlens array may be used.
Next, in addition to the technical ideas described in the claims, a part of the technical ideas grasped by the embodiment described above will be listed below.

  (1) A resin substrate having a main surface and having a core part in which a base material made of an inorganic fiber material is impregnated with a resin, a through-hole part provided in the resin substrate, an optical transmission function, a light collecting function And an optical component having at least one of a light reflection function and having an alignment recess, and a part of the optical component that protrudes on the main surface side of the resin substrate and is fitted to the alignment recess An alignment guide member, and a guide member support hole that opens in the main surface is formed corresponding to a location where the through hole portion is located, and the alignment guide member is fitted into the guide member support hole. An optical component supporting substrate with an optical component, wherein the optical component supporting substrate is supported by the optical component.

1 is a schematic sectional view showing an optical component supporting substrate with an optical waveguide according to a first embodiment embodying the present invention. The schematic sectional drawing which shows the resin substrate before the 1st drilling process in the manufacture process of the optical component supporting substrate with an optical waveguide of 1st Embodiment. FIG. 3 is a schematic cross-sectional view showing a resin substrate during a first drilling step in the manufacturing process. In the said manufacture process, the schematic sectional drawing which shows the resin substrate after a through-hole plating part formation process. In the said manufacture process, the schematic sectional drawing which shows a mode at the time of forming a plating part center hole in a through-hole plating part. The schematic sectional drawing which shows the optical component support substrate with an optical waveguide of 2nd Embodiment. The schematic sectional drawing which shows the resin substrate at the time of a drilling process in the manufacture process of the optical component supporting substrate with an optical waveguide of 2nd Embodiment.

Explanation of symbols

12 ... Upper surface as main surface 14 ... VCSEL as optical element
DESCRIPTION OF SYMBOLS 15 ... Light-emitting part 17 ... Photodiode as an optical element 18 ... Light-receiving part 31 ... Optical waveguide as an optical component 36 ... Positioning recessed part 44 ... Guide pin as an alignment guide member 110, 210 ... Optical component support with an optical component Optical component support substrate with optical waveguide as substrate 111... Resin substrate 112... Core portion 113, 114... Build-up layer 115, 155... Through hole portion 116, 156 ... Through hole 117, 157. ... Filler 126 ... Plated part central hole 121, 131, 133 as guide member supporting hole 121, resin insulating layer 122, 132, 134 ... Metal conductor layer 216 ... Guide member supporting hole

Claims (7)

A resin substrate having a main surface;
A through hole provided in the resin substrate;
A position where a part of the resin substrate protrudes on the main surface side and can be fitted to an alignment recess of an optical component having at least one of a light transmission function, a light collecting function, and a light reflecting function. A guide member for alignment,
A guide member support hole that opens in the main surface is formed corresponding to a portion where the through hole portion is provided, and the alignment guide member is fitted and supported in the guide member support hole. Optical component support substrate.   2. The optical component support according to claim 1, wherein the resin substrate is a build-up wiring substrate having a build-up layer formed by alternately laminating resin insulating layers and metal conductor layers on a surface layer of a core portion. substrate.   The optical component support substrate according to claim 1, wherein the guide member support hole is a precision processing hole, and the alignment guide member is a guide pin fitted into the precision processing hole.   4. An optical element having at least one of a light emitting part and a light receiving part and to be optically coupled with the optical component is mounted on a main surface side of the resin substrate. The optical component support substrate according to any one of the above. A method for manufacturing an optical component supporting substrate according to any one of claims 1 to 4,
A preparation step of preparing a resin substrate having the through-hole portion;
A drilling step of forming the guide member support hole in the resin substrate by drilling a hole corresponding to the through hole portion;
And a guide member attaching step of fitting and supporting the alignment guide member in the guide member support hole. In the preparation step, preparing a resin substrate having a through hole portion filled with a filler,
In the drilling step, the guide member supporting hole is formed in the resin substrate by performing a precision drilling process on a portion corresponding to the through-hole portion to scrape off a part of the filler. Item 6. A method for manufacturing an optical component supporting substrate according to Item 5. In the preparation step, after forming a through hole by drilling the resin substrate, by plating the inner peripheral surface of the through hole, to prepare a resin substrate having the through hole portion,
In the drilling step, the guide member support hole having a smaller diameter than the through hole is formed in the resin substrate by performing precision drilling at a location corresponding to the through hole portion and scraping the inner peripheral surface of the plating. The method for manufacturing an optical component supporting substrate according to claim 5, wherein:

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