JP4321267B2 - Photoelectric composite device, optical waveguide used in the device, and mounting structure of photoelectric composite device - Google Patents

Description

  The present invention relates to a photoelectric composite device, an optical waveguide used in the device, and a mounting structure of the photoelectric composite device.

  Currently, signal propagation between semiconductor chips such as LSIs (Large Scale Integrated Circuits) is all made by electrical signals via substrate wiring. However, with the recent increase in MPU functionality, the amount of data exchanged between chips has increased remarkably, and as a result, various high frequency problems have emerged. Typical examples thereof include RC signal delay, impedance mismatch, EMC / EMI, crosstalk, and the like.

  In order to solve the above problems, the mounting industry and others have so far taken the lead in solving various problems such as optimization of wiring layout and development of new materials.

  However, in recent years, the effects of optimization of the wiring layout and development of new materials have been hampered by physical limitations, and it is assumed that simple semiconductor chips will be mounted in order to realize further advanced system functionality in the future. It has become necessary to review the structure of the printed wiring board itself. In recent years, various drastic measures have been proposed to solve these problems, but the following are representative examples.

-Fine wiring bonding by multi-chip module (MCM) High-performance chip is mounted on a precision mounting substrate such as ceramic and silicon, and fine wiring bonding that cannot be formed on a motherboard (multilayer printed circuit board) is realized. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Sealing and integration of various semiconductor chips and electrical wiring bonding by integration Various semiconductor chips are two-dimensionally sealed and integrated using polyimide resin or the like, and fine wiring bonding is performed on the integrated substrate. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Three-dimensional bonding of semiconductor chips A through electrode is provided in various semiconductor chips, and each is bonded to form a laminated structure. Thereby, the connection between the different types of semiconductor chips is physically short-circuited, and as a result, problems such as signal delay are avoided. On the other hand, however, problems such as an increase in the amount of heat generated due to lamination and thermal stress between semiconductor chips occur.

  Furthermore, in order to realize high speed and large capacity of signal transmission / reception as described above, an optical transmission coupling technique using optical wiring has been developed (for example, see Non-Patent Document 1 and Non-Patent Document 2 described later). . The optical wiring can be applied to various places such as between electronic devices, between boards in an electronic device, or between chips in a board. For example, as shown in FIG. 25, for transmission of signals over a short distance such as between chips, an optical waveguide 51 is formed on a printed wiring board 57 on which the chips are mounted, and the optical waveguide 51 is subjected to signal modulation. In addition, it is possible to construct an optical transmission / communication system using a transmission path of laser light or the like.

  There are various types of optical wiring technologies corresponding to the above-mentioned semiconductor chips, but a typical example is shown below and will be discussed briefly.

Active interposer system This is an optical waveguide mounted on a printed wiring board (board), and an optical fiber connector is attached to the light incident / exit side of the optical waveguide, and transmission between them is performed by a fiber. The optical element is mounted on the back surface of the transceiver module and is precisely positioned with respect to the 45 ° total reflection mirror of the optical waveguide. As an advantage, it can be developed on the mounting structure of an existing printed wiring board, and since a fiber is used, it can be widely applied regardless of the inside or outside of the printed wiring board. Moreover, as a matter of concern, the structure is large, so that the cost is high, it is difficult to align the optical axis, and it is difficult to shorten the electric transmission path, which is not suitable for high-frequency transmission.

-Free space transmission method In this method, an optical wiring board (quartz) is mounted on the back surface of a printed wiring board, and light is reflected in a zigzag manner in the transmission board to propagate a signal. By optical element array + free space transmission, in principle, multi-channels of several thousand levels are possible. Further, in order to facilitate optical axis alignment, a hybrid optical system in which several lenses are combined is configured. As an advantage, in principle, multiplex transmission of several thousand channels is possible, and since a hybrid optical system is configured, optical axis alignment is easy. In addition, as a matter of concern, the optical wiring board is expensive, the signal is propagated by reflection, the waveform is easily disturbed, the propagation loss is large, and a lot of newly developed technologies are incorporated. Is almost absent.

Optical connector connection method This is an optical transmission module system in which a small optical connector is arranged around an LSI chip and an optical path can be freely set after the LSI chip is mounted. The advantages are that the accuracy is guaranteed by the connector, the costly optical axis alignment process is unnecessary, and the use of optical fiber enables middle-distance transmission between printed circuit boards, as well as existing It can be developed on a printed wiring board mounting structure. In addition, there are limits to the miniaturization of the connector module, it is difficult to shorten the electrical wiring between the semiconductor chip and the connector, it is not suitable for high-frequency transmission, and an optical fiber is used as the transmission medium Therefore, there is a limit to the number of buses, and there are many components and it is difficult to reduce the cost per bus.

Optical waveguide embedding method This is a method of embedding an optical waveguide in a printed wiring board and providing optical wiring while maintaining the form of the existing mounting structure of the printed wiring board. A microlens is used for optical path coupling, and the allowable optical axis deviation is relaxed to the general mounting accuracy level. As an advantage, since the light emitting element is mounted directly on the back surface of the LSI chip, the electrical wiring path between the LSI chip and the light emitting element can be shortened to the limit, and collimated optical coupling enables optical axis alignment with general mounting accuracy. It is possible. In addition, as a matter of concern, since the optical wiring is provided in the printed wiring board, it is difficult to manufacture and reduce the cost of the printed wiring board, the heat dissipation measures for the optical elements are unknown, and the printed wiring board is fragile. Therefore, there is a possibility that the optical coupling loss between the lens and the optical waveguide may fluctuate.

Surface mounting method In this method, an optical element is directly attached to the back surface of an LSI chip to function, and an optical waveguide is directly mounted on a printed wiring board. The structure of the existing printed wiring board can be maintained as it is, and an optical wiring can be provided. As an advantage, since the light emitting element is directly mounted on the back surface of the LSI chip, the electrical wiring path between the LSI chip and the light emitting element can be shortened to the limit, the structure is simple, and the cost can be reduced. It can be developed on an existing printed wiring board mounting structure. Also, as a matter of concern, since the optical element is directly attached to the LSI chip, it is necessary to develop a dedicated LSI chip, and because the optical element is directly attached to the high-temperature LSI chip, There is a concern about high temperature deterioration.

Nikkei Electronics, “Encounter with Optical Wiring”, December 3, 2001, pages 122, 123, 124, 125, FIG. 4, FIG. 5, FIG. 6, FIG. NTT R & D, vol.48, no.3, pp.271-280 (1999)

  However, the typical specifications shown above are currently lacking decisive power for the following reasons.

  First, the existing printed wiring board mounting structure is not a structure that can be used as it is. That is, the structure in which the optical path is directly laminated on the printed wiring board is not practical because the printed wiring board itself as a base is fragile, causing problems such as optical axis misalignment. On the other hand, if changes are made to the structure of the printed wiring board that has been cultivated up to now, enormous efforts are required to confirm performance, reliability, and high-frequency performance. Therefore, a system structure that cannot utilize an existing printed wiring board such as an embedded optical waveguide is not desirable.

  Secondly, it is not a structure that allows the existing mounting process to be used as it is. In general, optical modules such as optical waveguides are vulnerable to high temperature processes. In the method in which the printed wiring board and the optical wiring unit are integrated as described above, the optical module is exposed to a high-temperature process such as solder reflow and underfill resin sealing, which is actually difficult to implement. . In addition, materials and parts that take high temperature processes into account must be adopted, which is a major constraint.

  Third, it should not be a structure that excludes large-scale structures. That is, since the printed wiring board has low rigidity, the optical path structure with large parts is likely to cause an optical axis shift due to external stress. Therefore, the post structure based on the active interposer system as described above should be avoided.

  Fourth, it is not an optical wiring structure capable of high density. In other words, when specializing in optical wiring between semiconductor chips on a printed wiring board, it is considered that an optical fiber that cannot be densified should not be adopted. An optical connector connection method using an optical fiber is limited as a system for inter-device communication.

  Fifth, it is not a structure that can shorten the wiring length between the LSI chip and the optical element. That is, in the structure in which the electrical wiring length between the LSI chip and the optical element cannot be short-circuited, the high-frequency signal deteriorates before reaching the optical element, and the effect of light conversion is lost. Therefore, it is necessary to construct a system structure that can shorten this distance.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to use an existing printed wiring board mounting structure and mounting process as they are, and to eliminate a large-scale structure. , A high-density wiring, and a photoelectric composite device capable of realizing a structure capable of shortening the wiring length between a semiconductor chip and an optical element, an optical waveguide used in the device, and a mounting structure of the photoelectric composite device Is to provide.

That is, according to the present invention, a core layer is sandwiched between a first cladding layer and a second cladding layer, light is incident on the core layer through the second cladding layer, and the incident light is guided through the core layer. The light focusing or collimating means is integrated with the second cladding layer at a position corresponding to the light incident portion and the light emitting portion of the core layer and inside the end surface of the second cladding layer. The inclined mirror surface is formed in a state where the inclined mirror surface is exposed to the outside at an inner position from the end surface of the second cladding layer only on each end surface of the light incident portion and the light emitting portion of the core layer. the reflected incident light to the core layer is reflected to the further second cladding layer side after being guided, and parts corresponding to the light incident part and the light exit portion of the core layer by At each end containing, together is greater than the rigidity of the intermediate portion between both end portions by the rigidity of the second cladding layer is the light focusing or collimation means, between the thickness of the first cladding layer is both end portions And the rigidity of the first cladding layer is greater than the rigidity of the intermediate portion .

Also, it has a socket and an optical waveguide installed in the socket, and at least one of a light emitting element for making light incident on the optical waveguide and a light receiving element for receiving light emitted from the optical waveguide is , Disposed opposite the optical waveguide, and the optical waveguide is
Core layer by the first cladding layer and the second cladding layer is being clamped, the light incidence is made to the second the core layer through clad layer, it is configured as the incident light is guided through the core layer have been, optical focusing or collimation means in the inside position from the end face of the front Stories second cladding layer at a position corresponding to the light incident portion and the light emitting portion of the core layer is formed integrally with the second cladding layer, wherein the light incident portions and mini of the respective end faces of the light emitting portion of the core layer, is formed in a state of being exposed to the outside at a position inside from the end face of the inclined mirror surface the second cladding layer, fill front by the inclined mirror surface Shako been reflected to further the second cladding layer side after being guided is reflected into the core layer, and each end portion including a portion corresponding to the light incident part and the light exit portion of the core layer Oite, together are I Do greater than the stiffness of the intermediate portion between both end portions due to the rigidity of the second cladding layer is the light focusing or collimation means, the intermediate portion between the thickness of the first cladding layer is both end portions is larger than the rigidity of even the intermediate portion of the first cladding layer is larger than,
The present invention relates to a photoelectric composite device.

  Furthermore, the present invention relates to a photoelectric composite device mounting structure in which the photoelectric composite device of the present invention is fixed in a state of being electrically connected to a printed wiring board.

  According to the photoelectric composite device and the mounting structure thereof of the present invention, the photoelectric composite device has the socket and the optical waveguide installed in the socket, and at least one of the light emitting element and the light receiving element is Since this photoelectric composite device is fixed in a state where it is electrically connected to the printed wiring board, the light according to the conventional example described above is arranged as shown below. Various problems caused by the wiring technology can be solved.

  That is, since the optical waveguide is electrically connected to the printed wiring board in a state of being installed in the socket, the existing mounting structure of the printed wiring board can be used as it is. Therefore, if a region where the socket can be installed is provided on the printed wiring board, other general electric wiring can be formed by a conventional process.

  In addition, even if the optical waveguide is vulnerable to a high temperature process, for example, after fixing the socket to the printed wiring board, and after completing all mounting processes, including a high temperature process such as solder reflow and underfill resin sealing Since the optical waveguide can be installed in the socket, the optical waveguide can be mounted without suffering damage due to high temperature.

  In addition, the socket can use a socket structure similar to an IC (semiconductor integrated circuit) socket structure that has been widely used in the mounting industry, and in particular, can realize optical coupling in the vertical direction. The sockets already have a lot of data on materials, insulation, reliability, etc., and there are a wide variety of manufacturers that handle them. Therefore, it is a structure that is easy to accept in all of functions, costs, reliability, etc., and can be easily integrated with the existing printed wiring board mounting process, and a structure that eliminates a large-scale structure can be obtained.

  In addition, the socket can be made of a resin having a higher rigidity than the printed wiring board, and the light coupling between the light emitting element and / or the light receiving element and the optical waveguide can be performed on the socket. Mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Further, for example, since the semiconductor integrated circuit chip and the light emitting element and / or the light receiving element can be installed close to the upper and lower surfaces thereof via an interposer, the semiconductor integrated circuit chip, the light emitting element, / Or the wiring length between the light receiving elements can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, in the electrical wiring structure according to the conventional example, since the optical waveguide is directly provided on the printed wiring board, when the number of pins and wirings drawn from the semiconductor integrated circuit chip increases as the function of the semiconductor integrated circuit chip increases, the optical waveguide The degree of freedom in designing the printed wiring board was hindered by the waveguide. As a result, it has become difficult to increase the functionality of the printed wiring board, and as a result, it has become a situation that relies on SOC (system on chip) to store all functions in one chip. On the other hand, according to the present invention, since the optical waveguide is electrically connected to the printed wiring board in a state where it is installed in the socket, high-density wiring of the printed wiring board and freedom of design are ensured. However, the optical wiring system can be developed on the printed wiring board at a low cost and with a high degree of freedom. High-speed distributed processing on the printed wiring board, high functionality of the total electronic equipment, and short development TAT (Turn around time) can be expected.

  On the other hand, the optical waveguide according to the conventional example is generally a thin film made of resin. However, since the resin is hygroscopic, the optical waveguide gradually expands. When such a conventional optical waveguide is installed in the socket, the optical waveguide swells as described above, and as a result, the optical axis gradually shifts.

In order to solve such a problem, the present inventors diligently studied and found that the rigidity of the first and second cladding layers is intermediate between the light incident portion and the light emitting portion of the core layer. It has been found that by making it larger than the portion, the end portion can be prevented from swelling as in the above-described conventional example, and the bonding strength between the optical waveguide and the socket can be improved. Therefore, if the photoelectric composite device is configured using the optical waveguide of the present invention, the optical axis is not shifted, and efficient and stable light incidence and light emission can be performed. It is possible to reliably obtain the effect of the photoelectric composite device.

In the present invention, the thickness of the first cladding layer at both the end portions of the light incident portion and the light emitting portion is present, is greater than the thickness of the intermediate portion between said end portions, thereby, the in the end portions since it is the rigidity of the first cladding layer is also greater than said intermediate portion, said can effectively prevent swelling of the first cladding layer at both the end portions, the optical axis will not be shifted. Further, the bonding strength between the optical waveguide and the socket can be further improved.

Moreover, it is preferable that the intermediate part of said 1st and 2nd cladding layers other than the said edge part or the said both edge parts has flexibility.

  The core layer plays a role of guiding incident signal light, and the first cladding layer and the second cladding layer play a role of confining the signal light in the core layer. The core layer is made of a material having a high refractive index, and the first cladding layer and the second cladding layer are made of a material having a refractive index lower than that of the core layer. Specifically, the material of the first cladding layer is, for example, polycarbonate.

The optical waveguide of the present invention is configured so that light is incident on the core layer through the second cladding layer, and a light focusing means is provided at the position corresponding to the light incident portion of the core layer. However , since the rigidity of the second cladding layer can be increased by the light focusing means at a position corresponding to the light incident portion of the core layer, the swelling as described above. It is possible to effectively prevent the deviation of the optical axis due to.

  In the conventional optical transmission coupling technique using optical wiring, laser light or LED (light-emitting diode) light is used as a light source, and these light sources have a wide beam shape. As shown in FIGS. 25 and 26, in order to condense the signal light 53 emitted from the light source and efficiently enter the light into the optical waveguide 51, the conventional optical waveguide 51 includes a light emitting element 50 and an optical waveguide 51. An optical component 52 such as a lens is separately or retrofitted between the two. Such an optical waveguide 51 is formed, for example, by forming a joined body including a clad layer 54, a core layer 56, and a clad layer 55, and processing the incident end face into a 45 ° mirror surface by machining using a dicing saw or the like. It can be manufactured by dropping and solidifying a lens material as the optical component 52 on the clad layer 54.

  However, when the optical component 52 such as a lens is installed separately or retrofitted as in the conventional example described above, it is necessary to adjust the optical axis between the optical waveguide 51 and the optical component 52, and the positioning accuracy of the optical component 52 is difficult. It is. In addition, the manufacturing process becomes complicated, resulting in an increase in cost, and the number of parts is increased, thereby deteriorating productivity.

  On the other hand, in the optical waveguide according to the present invention, the light focusing means is integrally formed with the second cladding layer at a position corresponding to the light incident portion of the core layer. In addition, as compared with the case where an optical component such as a lens is installed separately or retrofitted, the positioning accuracy of the light focusing means is easy, and the manufacturing is easy and the cost can be reduced. Further, since the light focusing means is integrally formed with the second cladding layer, the number of parts does not increase and the productivity is high. Furthermore, the light converging means integrally formed with the second cladding layer can effectively make the light emitted from the light source incident on the core layer, thereby improving the optical coupling efficiency.

Further, at a position corresponding to the light emitting portion of the core layer, the light collimation or focusing means which is emitted through the second clad layer from the core layer is formed integrally with the second cladding layer, which Thus, the rigidity of the second clad layer can be increased by the light collimation or focusing means at a position corresponding to the light emitting portion of the core layer. Further, it can be effectively prevented. Further, the emitted light emitted from the optical waveguide according to the present invention can be collimated or focused effectively, and the light receiving means can efficiently receive the emitted light.

  The light focusing or collimation means is preferably made of the same material as the second cladding layer. Specifically, examples of the material of the second cladding layer and the light focusing or collimating means include an injection molding resin for optical elements (for example, a product name ZEONEX manufactured by Nippon Zeon Co., Ltd.).

  The light focusing or collimating means is preferably a convex lens, and the convex lens can be formed by stamping, for example.

  Further, it is desirable that at least the light incident portion of the core layer is formed on an inclined mirror surface, for example, a 45 ° mirror surface. The core layer with the inclined mirror surface can be formed by injection molding. If the core layer is formed by the injection molding, the inclined mirror surface can be formed without directly processing the core layer, so that there is no damage during production and the surface state can be made smooth. It is possible to manufacture a high-quality optical waveguide easily and accurately. In addition, by forming the light incident portion of the core layer on the inclined mirror surface, signal light emitted from a light source such as a laser or LED can be more efficiently incident on the core layer. As the material for the core layer, conventionally known materials can be used, and examples include UV (ultraviolet) curable resins such as fluorine-based polyimide.

  Further, it is preferable that the second cladding layer is formed longer than the first cladding layer in the light propagation direction.

  Furthermore, the optical waveguide based on this invention has a socket, and is used suitably for the photoelectric composite apparatus by which at least one of a light emitting element and a light receiving element is arrange | positioned facing.

  That is, the photoelectric composite device of the present invention includes a socket and the optical waveguide of the present invention installed in the socket, a light emitting element for making light incident on the optical waveguide, and light emitted from the optical waveguide At least one of the light receiving element for receiving light is disposed to face the optical waveguide.

  Desirably, positioning means for positioning and fixing the optical waveguide to the socket is provided. Specifically, it is desirable that the positioning means has an uneven structure.

  And it is desirable to fix the light emitting element (for example, laser) and / or the interposer which mounted the said light receiving element on the convex surface of this uneven structure. In this case, the convex surface may have a positioning mechanism for the interposer. Further, it is desirable that a semiconductor integrated circuit chip connected to the light emitting element and / or the light receiving element is mounted on the interposer. As a result, the semiconductor integrated circuit chip and the light emitting element and / or the light receiving element can be installed close to the upper and lower surfaces of the semiconductor integrated circuit chip and the light emitting element via the interposer. And / or the wiring length between the light receiving elements can be shortened. Therefore, countermeasures against noise and crosstalk of electric signals are facilitated, and the light modulation speed can be improved.

  Moreover, it is preferable that the said uneven | corrugated structure has a recessed part for positioning the width direction by fitting the said optical waveguide, and a projection part for positioning the length direction of the said optical waveguide. Here, the depth of the concave portion of the concave-convex structure is preferably larger than the thickness of the optical waveguide.

  Furthermore, it is desirable that an optical waveguide according to the present invention is bridged between the pair of sockets, and thereby an optical wiring system in which the optical waveguide is used as an optical wiring can be configured.

  In the mounting structure of the photoelectric composite device according to the present invention, it is preferable that the optical waveguide according to the present invention is not in contact with the printed wiring board. Thereby, it is possible to effectively prevent the optical waveguide from being broken by the heat radiation of the semiconductor integrated circuit chip.

In the light propagation direction of the optical waveguide, it is preferable that the lengths of the first and second cladding layers fixed to the socket are larger than a distance between the pair of sockets fixed to the printed wiring board.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

First Embodiment FIG. 1 is a schematic perspective view of a photoelectric composite device according to the present invention. FIG. 1A is a schematic perspective view of the photoelectric composite device, and FIG. 1B is an exploded view of FIG.

  As shown in FIG. 1, the photoelectric composite device 18 includes a pair of sockets 13 and an optical waveguide 1 according to the present invention installed in the socket 13, and the optical waveguide 1 is bridged between the pair of sockets 13. Has been passed. At this time, since the optical waveguide 1 is not in contact with a printed wiring board to be described later, it is possible to effectively prevent the optical waveguide 1 from being broken by heat dissipation of the semiconductor integrated circuit chip.

  As shown in FIGS. 1B and 2, the socket 13 is provided with positioning means having an uneven structure for positioning and fixing the optical waveguide 1 according to the present invention. Specifically, the concavo-convex structure has a recess 14 for fitting the optical waveguide 1 and positioning the width direction thereof, and a protrusion 15 for positioning the length direction of the optical waveguide 1. . Further, the depth of the recess 14 is larger than the thickness of the optical waveguide 1.

  The convex surface 16 of the concave-convex structure of the socket 13 is provided with conducting means, for example, a terminal pin 17 for conducting the front and back surfaces of the socket 13. The semiconductor integrated circuit chips 21a and 21b and the light emitting element (not shown) (for example, a laser) and / or the light receiving element (not shown) are mounted on the convex surface 16 of the concavo-convex structure of the socket 13. The positioner 20 is fixed.

  As the material of the socket 13, a conventionally known material can be used as long as it is an insulating resin. Examples thereof include glass-filled PES (polyethylene sulfide) resin, glass-filled PET (polyethylene terephthalate) resin, and the like. Such a material for the socket 13 already has a lot of data on its type, insulation, reliability, etc., and there are a wide variety of manufacturers. Therefore, it is a structure that is easy to accept in all of its functions, costs, reliability, etc., and can be easily integrated with the existing printed wiring board mounting process.

  Although the manufacturing method of the socket 13 is not specifically limited, For example, it can manufacture easily by shaping | molding using the metal mold | die which has a shape corresponding to the said uneven structure.

  In the optical waveguide 1 according to the present invention, as shown in FIGS. 1B and 3, the core layer 4 is sandwiched between the first cladding layer 2 and the second cladding layer 3. FIG. 3 is a cross-sectional view taken along line B-B ′ of the optical waveguide 1 in FIG. The core layer 4 serves to guide the incident signal light, and the cladding layers 2 and 3 serve to confine the signal light in the core layer 4. The core layer 4 is made of a material having a high refractive index, and the cladding layers 2 and 3 are made of a material having a refractive index lower than that of the core layer 4. The core layer 4 is arranged in parallel, for example, although not shown.

  Moreover, the thickness of the both ends 2a and 2b of the 1st clad layer 2 is formed larger than the thickness of the intermediate part 2c between both ends 2a and 2b.

  The optical waveguide according to the conventional example is generally a thin film made of resin. However, since the resin is hygroscopic, the optical waveguide gradually expands. As shown in FIG. 4, if such a conventional optical waveguide 51 is installed in the socket 13, if there is a gap between the optical waveguide 51 and the wall surface of the socket recess 14, the optical waveguide 51 is indicated by an arrow in the figure. As a result, the optical axis is gradually shifted.

  On the other hand, when the optical waveguide 1 according to the present invention is used, the thicknesses of both end portions 2a and 2b of the first cladding layer 2 are formed larger than the thickness of the intermediate portion 2c between both end portions 2a and 2b. Since the rigidity of the first clad layer 2 in the portions 2a and 2b can be made larger than that in the intermediate portion 2c, the first clad layer 2 in the both end portions 2a and 2b swells even if the above-described gap exists. This can be prevented more effectively, and the optical axis does not shift. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved. Further, the presence of the gap makes it easy to place the optical waveguide 1 on the socket 13. In addition, as a material of the 1st cladding layer 2, a polycarbonate etc. are mentioned, for example.

  Further, as shown in FIG. 5, the second cladding layer 3 is preferably formed longer than the first cladding layer 2 in the light propagation direction.

  Furthermore, it is preferable that the intermediate portion 2c of the first cladding layer 2 other than both end portions 2a and 2b has flexibility.

  A convex lens 7 as the light focusing means is integrally formed with the second cladding layer 3 at a position corresponding to the light incident part 5 of the core layer 4. As a result, the rigidity of the second cladding layer 3 can be increased by the convex lens 7 at a position corresponding to the light incident portion 5 of the core layer 4, so that the displacement of the optical axis due to swelling can be more effectively prevented. it can. The convex lenses 7 are preferably provided in a plurality of rows in each of the light incident portion and / or the light emitting portion, but in FIG. 3, one (one row) is shown for simplification (also in the following other drawings). The same may be shown).

  As shown in FIGS. 3 and 6, an optical component 12 may be installed in a light emitting element 81 such as a laser, and signal light (for example, laser light) 30 emitted from the light emitting element 81 by the optical component 12 is parallel. Collimated into light. Then, the parallel light is focused by the convex lens 7 as the light focusing means and is effectively incident on the core layer 4. In this case, as shown in FIG. 6, since the optical waveguide 1 according to the present invention has the convex lens 7 as the light focusing means, even when the positions of the light emitting element 81 and the optical component 12 are slightly shifted, the light emitting element The signal light 30 from 81 can be effectively focused and incident on the core layer 4 so that optical coupling can be performed efficiently.

  A convex lens 7 as a means for collimating or focusing light emitted from the core layer 4 through the second cladding layer 3 is integrally formed with the second cladding layer 3 at a position corresponding to the light emitting portion 6 of the core layer 4. Preferably it is. Furthermore, the optical component 12 may be installed in the light receiving element 91. As a result, the rigidity of the second cladding layer 3 can be increased by the convex lens 7 at a position corresponding to the light emitting portion 6 of the core layer 4, thereby further effectively preventing the deviation of the optical axis due to swelling. it can. In addition, the light emitted from the optical waveguide 1 according to the present invention can be collimated or focused effectively, and the light receiving element (optical wiring, photodetector, etc.) 91 serving as the light receiving means can efficiently receive the signal light. Can do.

  Further, it is desirable that the convex lens 7 is made of the same material as that of the second cladding layer 3. Specifically, examples of the material of the second cladding layer 3 and the convex lens 7 include an injection molding resin for an optical element (for example, product name ZEONEX manufactured by Nippon Zeon Co., Ltd.).

  Further, it is desirable that the light incident / exit portions 5 and 6 of the core layer 4 are formed on an inclined mirror surface, for example, a 45 ° mirror surface. The core layer 4 with the inclined mirror surface can be formed by injection molding. By the injection molding, the inclined mirror surface can be formed without directly processing the core layer 4, so that there is no damage during production, the surface state can be smoothed, and good quality easily and accurately. A simple optical waveguide 1 can be produced. Further, by forming the light incident / exit portions 5 and 6 of the core layer 4 on the inclined mirror surface, the signal light 30 emitted from the light emitting element 81 such as a laser can be incident on the core layer 4 more efficiently. Further, the incident signal light 30 can be guided and emitted to the light receiving element 91 effectively. As the material for the core layer 4, conventionally known materials can be used, and examples thereof include UV (ultraviolet) curable resins such as fluorine-based polyimide.

  Here, for example, as shown in FIG. 7, the length A of both end portions 2 a and 2 b of the first cladding layer 2 is 1 with respect to the length a of the lens group (or mirror group) composed of the plurality of lenses 7. It is preferable to be in the range of ˜5 times. Further, the thickness T of the first cladding layer 2 at both end portions 2a and 2b is preferably a value that maintains sufficient mechanical strength and is smaller than the depth D of the recess 14 of the socket 13. Specifically, the thickness t of the intermediate portion 2c of the first cladding layer 2 can be set to 100 μm, and the thickness T of both end portions 2a and 2b can be set to 2 to 3 mm. Further, the thickness of the convex lens 7 can be 50 μm, and the lens diameter can be about Φ100 μm. Furthermore, the thickness b of the second cladding layer 3 (excluding the thickness of the convex lens 7) can be 500 μm, and the thickness m of the core layer 4 can be 15 μm and the width can be 5 μm. In FIG. 7, the plurality of core layers 4 are arranged in parallel, and the convex lenses 7 are respectively provided in the light incident part and / or the light emitting part of the corresponding core layer 4.

  Below, an example of the manufacturing method of the optical waveguide 1 based on this invention is demonstrated with reference to FIG.8 and FIG.9.

  First, as shown in FIG. 8A, a clad material 3a that forms the basis of the second clad layer 3 is formed. Examples of the clad material 3a include injection molding resins for optical elements (for example, product name ZEONEX manufactured by Nippon Zeon Co., Ltd.). Next, as shown in FIG. 8B, stamping is performed using a Ni mold 10 having a shape corresponding to the convex lens 7. Thereby, the convex lens 7 can be integrally formed with the second cladding layer 3 as shown in FIG. According to this, the positioning of the convex lens 7 is easy, and the manufacturing is easy, and the cost can be reduced. Further, since the convex lens 7 is integrally formed with the second cladding layer 3, the number of parts does not increase and the productivity is high.

  On the other hand, as shown in FIG. 8D, the core material 4 a is filled in the quartz mold 11 having a shape corresponding to the light incident portion 5 and the light emitting portion 6 of the core layer 4. A conventionally well-known thing can be used as the core material 4a, and UV (ultraviolet ray) curable resin, for example, a fluorine-type polyimide etc. are mentioned. The quartz mold 11 can be easily manufactured, for example, by binary mask exposure and dry etching. Although not shown, the core layer 4 may have a structure in which a plurality of core layers 4 are arranged in parallel.

  Next, as shown in FIG. 9 (e), the second clad layer 3 produced above is placed on the quartz mold 11 filled with the core material 4a with the surface having the convex lens 7 facing upward, The core material 4a is solidified by irradiating ultraviolet rays or the like. Then, as shown in FIG. 9 (f), the core layer 4 bonded to the second cladding layer 3 is peeled from the quartz mold 11. In this way, by forming the light incident / exit portions 5 and 6 of the core layer 4 on an inclined mirror surface, for example, a 45 ° mirror surface by molding, the inclined mirror surface is formed without directly processing the core layer 4. Therefore, there is no damage at the time of production, the surface state can be smoothed, and the high-quality optical waveguide 1 can be produced easily and accurately.

  On the other hand, as shown in FIG. 9G, a cavity 33 having a shape corresponding to the first cladding layer 2 is formed using the upper mold 31 and the lower mold 32. That is, the thickness of both end portions 33a and 33b of the cavity 33 is larger than the thickness of the intermediate portion 33c between both end portions 33a and 33b. This cavity is filled with a clad material 2 '. Then, by solidifying the clad material 2 ′ and peeling the upper mold 31 and the lower mold 32, the first clad layer 2 can be produced as shown in FIG. 9 (h). Thereby, the thickness of the both ends 2a and 2b of the 1st cladding layer 2 can be formed more largely than the thickness of the intermediate part 2c between the both ends 2a and 2b. Examples of the material of the first cladding layer 2 include polycarbonate.

  Next, as shown in FIG. 9 (i), the first clad layer 2 separately prepared as described above is disposed on the surface of the core layer 4 produced above opposite to the second clad layer 3. . As described above, the optical waveguide 1 according to the present invention can be manufactured.

  For example, as shown in FIG. 9, the interposer 20 has a semiconductor integrated circuit chip 21 mounted on one surface side (FIG. 10A), and the light incident on the optical waveguide 1 on the other surface side. A light emitting element array 8 for performing and a light receiving element array 9 for receiving light emitted from the optical waveguide 1 are mounted, and a rewiring electrode 22 is provided in the peripheral portion (FIG. 10B). The light emitting element array 8 and the light receiving element array 9 include a plurality of light emitting elements and light receiving elements respectively arranged at positions corresponding to the light incident / exit portions 5 and 6 of each core layer 4 (not shown). A through electrode for electrical connection between the light emitting element and the light receiving element and the semiconductor integrated circuit chip is disposed in the gap between each light emitting element and the light receiving element (not shown).

  When the pair of sockets 13 in which the optical waveguide 1 is installed in the recess 14 and the interposer 20 are fixed, the surface side of the interposer 20 on which the light emitting element array 8 and / or the light receiving element array 9 is mounted is arranged. The socket 13 is configured to be in contact with the convex surface 16, and the terminal pin 17 of the socket 13 and the rewiring electrode 22 of the interposer 20 are fixed so as to be electrically connected.

  Further, as described above, the depth of the recess 14 of the socket 13 is formed to be larger than the thickness (for example, 1 mm) of the optical waveguide 1 (for example, the depth is set to 2 mm). ) And FIG. 7, a space (for example, 500 μm) is formed between one surface 23 side of the optical waveguide 1 and the surface side of the interposer 20 on which the light emitting element array 8 and / or the light receiving element array 9 is mounted. ) 25 can be formed (when the thickness of the light emitting element array 8 and / or the light receiving element array 9 is 500 μm).

  As described above, the semiconductor integrated circuit chip 21 is mounted on the socket 13 via the interposer 20, the one surface 23 side of the optical waveguide 1, the light emitting element array 8 and / or the light receiving element of the interposer 20. By forming a space 25 between the surface on which the array 9 is mounted, even if the semiconductor integrated circuit chip 21 generates heat when the photoelectric composite device 18 is used, the optical waveguide 1 is broken by this heat. Can be effectively prevented.

  In this operation mechanism, an electrical signal transmitted from one semiconductor chip 21a is converted into an optical signal and emitted from each light emitting element (not shown) of the light emitting element array 8 as an optical signal by laser light. The emitted optical signal is focused by a corresponding convex lens 7 of the optical waveguide 1, is incident on the light incident portion 5 of the core layer 4, is guided in the waveguide direction in which the core layer 4 extends, and the core layer 4 The light is emitted from the light emitting portion 6. Then, the optical signal emitted from the optical waveguide 1 is received by a corresponding light receiving element (not shown) of the light receiving element array 9, converted into an electric signal, and transmitted to the other semiconductor chip 21b as an electric signal.

  This photoelectric composite device 18 can constitute an optical wiring system in which the optical waveguide 1 according to the present invention is used as an optical wiring. That is, the photoelectric composite device 18 is fixed in a state of being electrically connected to the printed wiring board.

  According to the photoelectric composite device 18 according to the present invention, the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board in a state where the optical waveguide 1 is installed in the recess 14 of the socket 13. This is a structure in which the mounting structure of the wiring board can be used as it is. Therefore, if a region where the socket 13 can be installed is provided on the printed wiring board, other general electric wiring can be formed by a conventional process.

  Even if the optical waveguide 1 is vulnerable to a high-temperature process, for example, after fixing the socket 13 to the printed wiring board, and after completing all mounting processes including a high-temperature process such as solder reflow and underfill resin sealing Since the optical waveguide 1 according to the present invention can be installed in the recess 14 of the socket 13, the optical waveguide 1 can be mounted without causing damage due to high temperature.

  Further, since the socket 13 can be made of a resin having higher rigidity than the printed wiring board, and the light coupling between the light emitting element and / or the light receiving element and the optical waveguide 1 can be performed on the socket 13. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Furthermore, since the semiconductor integrated circuit chip 21 and the light emitting element array 8 and / or the light receiving element array 9 can be installed close to the upper and lower surfaces thereof via the interposer 20, the semiconductor integrated circuit chip 21, The wiring length between the light emitting element and / or the light receiving element can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board in a state where the optical waveguide 1 is installed in the recess 14 of the socket 13, the high-density wiring of the printed wiring board and the degree of freedom of design thereof. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high speed, high-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and development Short TAT (turn around time) can be expected.

  Moreover, the thickness of the both ends 2a and 2b of the 1st clad layer 2 is formed larger than the thickness of the intermediate part 2c between both ends 2a and 2b. As a result, the rigidity of the first cladding layer 2 at both end portions 2a and 2b can be made larger than that of the intermediate portion 2c, so that the first cladding layer 2 at both end portions 2a and 2b can be more effectively prevented from swelling. can do. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved. Therefore, when the photoelectric composite device 18 is configured using the optical waveguide 1 according to the present invention, the optical axis is not shifted, and efficient and stable light incidence and / or light emission can be performed. It is possible to reliably obtain the effect of the photoelectric composite device 18 according to the present invention as described above.

  Below, an example of the manufacturing method and mounting structure of the photoelectric composite apparatus 18 based on this invention is demonstrated with reference to FIGS. 11 and 12 are cross-sectional views taken along the line A-A ′ of the photoelectric composite device 18 of FIG.

  First, as shown in FIGS. 11A and 11B, a pair of sockets 13 is mounted on the printed wiring board 19. At this time, an electrode (not shown) on the printed wiring board 19 and the terminal pin 17 of the socket 13 are aligned and mounted so that the electrode and the socket 13 are electrically connected.

  Although not shown in the figure, other electronic components and electrical wiring are formed on the printed wiring board 19 in advance.

  Next, as shown in FIG. 11C, the optical waveguide 1 according to the present invention is installed in the recess 14 of the socket 13, and the optical waveguide 1 is bridged between the pair of sockets 13. At this time, the projections 15 as the concavo-convex structure provided on the socket 13 can easily position the optical waveguide 1 in the length direction, and the concave portions 14 can easily position the optical waveguide 1 in the width direction. It can be carried out. In addition, since the optical waveguide 1 is installed in the recess 14 of the socket 13, the optical waveguide 1 and the printed wiring board 19 are in a non-contact state.

  At this time, as shown in a somewhat exaggerated manner in FIG. 14, when the optical waveguide 1 is mounted, the length of the optical waveguide 1 fixed to the socket 13 in the light propagation direction is fixed to the printed wiring board 19. It is desirable that the distance between the pair of sockets 13 is larger. As shown in the figure, by fixing the optical waveguide 1 in a bent state, it is possible to absorb positioning errors of the socket 13 on the printed wiring board 19 and always perform stable and efficient optical waveguide. Can do. This can be easily realized by the flexibility of the intermediate portion 2c other than both end portions 2a and 2b of the first cladding layer 2 and the intermediate portions of the second cladding layer 3 and the core layer 4.

  The means for fixing the optical waveguide 1 to the socket 13 is not particularly limited, and for example, an adhesive resin can be used. Specifically, first, as shown in FIG. 13A, a groove 27 is formed in an arbitrary shape on the bottom surface of the recess 14 of the socket 13. At this time, the end of the groove 27 is formed so as to be located up to the periphery of the protrusion 15 of the socket 13. Next, as shown in FIG. 13 (b), the optical waveguide 1 according to the present invention is installed in the recess 14 of the socket 13. As described above, the positioning in the length direction and the width direction of the optical waveguide 1 can be easily performed by the protrusions 15 and the recesses 14 provided in the socket 13. Here, since the groove 27 is formed so as to be located up to the peripheral portion of the protrusion 15, a part of the groove 27 is not covered with the optical waveguide 1. Next, as shown in FIG. 13C, the adhesive resin is injected from a part of the groove 27 not covered with the optical waveguide 1 by using a dispenser 28 or the like and solidified, whereby the concave portion of the socket 13 is obtained. The optical waveguide 1 can be bonded and fixed to 14.

  After the optical waveguide 1 according to the present invention is installed in the socket 13 as described above, for example, an MPU (micro processor) as the semiconductor integrated circuit chip is formed on the convex surface 16 of the socket 13 as shown in FIG. unit) 21a or DRAM (dynamic random access memory) 21b and interposer 20 on which light emitting element array 8 and / or light receiving element array 9 are mounted are fixed. At this time, the surface of the interposer 20 on which the light emitting element array 8 and / or the light receiving element array 9 is mounted is configured to be in contact with the convex surface 16 of the socket 13, and terminal pins (not shown) exposed on the convex surface 16 of the socket 13 are illustrated. And the rewiring electrode 22 of the interposer 20 are fixed so as to be electrically connected.

  Next, as shown in FIG. 12E, cooling mechanisms such as aluminum fins 26 are installed on the MPU 21a and the DRAM 21b.

  As described above, an optical wiring system in which the optical waveguide 1 according to the present invention is used as an optical wiring can be configured using the photoelectric composite device 18 according to the present invention.

  Here, FIG. 15 is a schematic diagram showing an example in which the photoelectric composite device 18 according to the present invention is developed on the printed wiring board 19. For example, by standardizing the optical waveguide module, it can be freely deployed in four directions.

  According to the present embodiment, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board 19 in a state where it is installed in the recess 14 of the socket 13, the existing printed wiring board 19 is mounted. The structure can be used as it is. Therefore, if an area where the socket 13 can be installed is provided on the printed wiring board 19, other general electric wiring can be formed by a conventional process.

  Moreover, even if the optical waveguide 1 according to the present invention is vulnerable to a high temperature process, as described above, the socket 13 is fixed to the printed wiring board 19 and further includes a high temperature process such as solder reflow and underfill resin sealing. After the mounting process is completed, the optical waveguide 1 according to the present invention is installed in the recess 14 of the socket 13, so that the optical waveguide 1 can be mounted without suffering damage due to high temperature.

  Further, the socket 13 can be made of a resin having higher rigidity than the printed wiring board 19, and the light coupling between the light emitting element and / or the light receiving element and the optical waveguide 1 can be performed on the socket 13. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Further, since the semiconductor integrated circuit chips 21a and 21b and the light emitting element array 8 and / or the light receiving element array 9 can be installed close to the upper and lower surfaces via the interposer 20, the semiconductor integrated circuit chip 21a. , 21b and the wiring length between the light emitting element and / or the light receiving element can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board 19 in a state where the optical waveguide 1 is installed in the recess 14 of the socket 13, the high-density wiring of the printed wiring board 19 and the degree of freedom of design thereof. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high speed, high-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and development Short TAT (turn around time) can be expected.

  Further, the semiconductor integrated circuit chips 21a and 21b are mounted on the socket 13 via the interposer 20, and the one surface 23 side of the optical waveguide 1 according to the present invention, the light emitting element array 8 of the interposer 20, and / or Alternatively, by forming a space 25 between the surface on which the light receiving element array 9 is mounted, even if the semiconductor integrated circuit chip 21 generates heat when the photoelectric composite device 18 is used, this heat causes light based on the present invention. It is possible to effectively prevent the waveguide 1 from being broken.

  Moreover, the thickness of the both ends 2a and 2b of the 1st clad layer 2 is formed larger than the thickness of the intermediate part 2c between both ends 2a and 2b. As a result, the rigidity of the first cladding layer 2 at both end portions 2a and 2b can be made larger than that of the intermediate portion 2c, so that the first cladding layer 2 at both end portions 2a and 2b can be more effectively prevented from swelling. can do. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved. Therefore, when the photoelectric composite device 18 is configured using the optical waveguide 1 according to the present invention, the optical axis is not shifted, and efficient and stable light incidence and / or light emission can be performed. It is possible to reliably obtain the effect of the photoelectric composite device 18 according to the present invention as described above.

Second Embodiment FIG. 16A is a diagram showing the arrangement of a light emitting element, a light receiving element, and an optical waveguide 1 as viewed from the first cladding layer 2 (not shown here) side in FIG. 16 (b) is a side view seen from the X direction in FIG. 16 (a), and FIG. 16 (c) is a side view seen from the Y direction in FIG. 16 (a). In FIGS. 16B and 16C, the top and bottom are reversed. Although not shown in FIG. 16, the thickness of the both ends 2a and 2b of the first cladding layer 2 is equal to that of the intermediate portion 2c between the ends 2a and 2b, as shown in FIG. It is formed larger than the thickness. As a result, the rigidity of the first cladding layer 2 at both end portions 2a and 2b can be made larger than that of the intermediate portion 2c, so that the first cladding layer 2 at both end portions 2a and 2b can be more effectively prevented from swelling. The optical axis is not shifted. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved.

  In the optical waveguide 1 shown in FIG. 16, a plurality of core layers 4 each having a light incident portion 5 and a light emitting portion 6 which are 45 ° mirror surfaces are arranged in parallel. 6 positions are aligned in the length direction.

  The light emitting element array 8 includes a plurality of light emitting elements 81 arranged at positions corresponding to the light incident portions 5 of the respective core layers 4. In the gaps between the light emitting elements 81, penetrating electrodes (not shown) for electrical connection between the light emitting elements 81 and the semiconductor integrated circuit chip (not shown) are arranged. The light receiving element array 9 is the same as the light emitting element array 8 described above.

  In the optical waveguide 1 shown in FIG. 16, the light emitting elements 81 of the light emitting element array 8 and the light receiving elements 91 of the light receiving element array 9 are arranged at the same pitch as the arrangement pitch of the core layers 4.

  In this case, the convex lens 7 as the light focusing means in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 17 and the second cladding layer 3 may be integrally formed.

  In this operation mechanism, an electrical signal transmitted from one semiconductor integrated circuit chip (not shown) is converted into an optical signal and emitted from each light emitting element 81 of the light emitting element array 8 as an optical signal. The emitted optical signal is focused by a corresponding convex lens 7 of the optical waveguide 1, is incident on the light incident part 5 of the core layer 4, is reflected by the light incident part 5 composed of a 45 ° mirror surface, and the core The light is guided in the waveguide direction in which the layer 4 extends, and is reflected again by the light emitting part 6 composed of the other 45 ° mirror surface and emitted from the light emitting part 6 of the core layer 4. The optical signal emitted from the optical waveguide 1 is received by the corresponding light receiving element 91 of the light receiving element array 9 through the convex lens 7 and converted into an electrical signal, and is sent to the other semiconductor integrated circuit chip (not shown) as an electrical signal. Is transmitted (hereinafter, the same applies to other embodiments).

  According to the present embodiment, the convex lenses 7 in the second cladding layer 3 are integrally formed with the second cladding layer 3 so as to be arranged as shown in FIG. Can be effectively focused and incident on the core layer 4 to efficiently perform optical coupling. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

Third Embodiment FIG. 18A is a diagram showing a schematic configuration of a light-emitting element, a light-receiving element, and an optical waveguide 1 as viewed from the first cladding layer 2 (not shown here) side in FIG. 18B is a side view seen from the X direction in FIG. 18A, and FIG. 18C is a side view seen from the Y direction in FIG. 18A. 18B and 18C are shown upside down. Although not shown in FIG. 18, the first cladding layer has a thickness of both end portions 2a, 2b of the first cladding layer 2 as shown in FIG. It is formed larger than the thickness. As a result, the rigidity of the first cladding layer 2 at both end portions 2a and 2b can be made larger than that of the intermediate portion 2c, so that the first cladding layer 2 at both end portions 2a and 2b can be more effectively prevented from swelling. The optical axis is not shifted. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved.

  As shown in FIG. 18A, the optical waveguide 1 has a plurality of core layers 4 arranged in parallel. The end portions of each core layer 4 are a light incident portion 5 and a light emitting portion 6 each having a 45 ° mirror surface. In the optical waveguide 1 according to the present embodiment, the light incident / exit portions 5 and 6 of each core layer 4 are shifted in the length direction with respect to the light incident / exit portions 5 and 6 of other adjacent core layers 4. Has been.

  The light emitting element array 8 includes a plurality of light emitting elements 81 arranged at positions corresponding to the light incident / exit portions 5 and 6 of each core layer 4. In the gaps between the light emitting elements 81, penetrating electrodes (not shown) for electrical connection between the light emitting elements 81 and the semiconductor integrated circuit chip (not shown) are disposed (this corresponds to the light receiving element array 9). The same applies to the light receiving element 91.)

  In this case, the convex lens 7 as the light focusing means in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 19 and the second cladding layer 3 may be integrally formed.

  According to the present embodiment, the convex lenses 7 in the second cladding layer 3 are integrally formed with the second cladding layer 3 so as to be arranged as shown in FIG. Can be effectively focused and incident on the core layer 4 to efficiently perform optical coupling. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

  In addition, the light incident / exit portions 5 and 6 of each core layer 4 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 5 and 6 of the other adjacent core layers 4. The pitch between the light emitting elements 81 arranged in the length direction is as large as the amount of deviation in the length direction. For example, when the light incident / exit portions 5 and 6 of the adjacent core layer 4 are shifted by 100 μm in the extending direction, the pitch between the light emitting elements 81 arranged in the length direction of the core layer 4 is 100 μm. The same applies to the light receiving element 91.

  Further, the pitch of the light emitting elements 81 arranged in the arrangement direction of the core layers 4 is a size corresponding to the total arrangement pitch of the five core layers 4. For example, when the core layers 4 are arranged at an arrangement pitch of 20 μm, the pitch of the light emitting elements 81 arranged in the arrangement direction of the core layers 4 is 100 μm.

  As described above, the light incident / exit portions 5 and 6 of each core layer 4 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 5 and 6 of the other adjacent core layers 4. Optical elements (a light emitting element and a light receiving element are collectively referred to) 81 and 91 arranged corresponding to the layer 4 can be secondarily arranged, and the optical elements 81 and 91 are arranged at a pitch of about 100 μm. The core layer 4 can be integrated up to a pitch of 20 μm.

  That is, it is possible to improve the degree of integration of the core layer 4 while arranging the distance between the optical elements 81 and 91 at a pitch to avoid the influence of optical interference and crosstalk due to element heat generation.

  Further, by arranging the optical elements 81 and 91 two-dimensionally while highly integrating the core layer 4, useless space is eliminated, and the area occupied by the substrate per element can be reduced. For this reason, further cost reduction can be achieved.

Fourth Embodiment FIG. 20A shows a light-emitting element array and a light-receiving element as viewed from the opposite side to the surface of the core layer where the second clad layer integrally formed with the light focusing means is joined. It is a figure which shows schematic structure of an array and an optical waveguide, FIG.20 (b) is the side view seen from X direction in Fig.20 (a), FIG.20 (c) is from Y direction in Fig.20 (a). FIG. 20B and 20C are shown upside down. Although not shown in FIG. 20, the thickness of both ends 2a, 2b of the first cladding layer 2 is equal to that of the intermediate portion 2c between both ends 2a, 2b, as shown in FIG. It is formed larger than the thickness. As a result, the rigidity of the first cladding layer 2 at both end portions 2a and 2b can be made larger than that of the intermediate portion 2c, so that the first cladding layer 2 at both end portions 2a and 2b can be more effectively prevented from swelling. The optical axis is not shifted. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved.

  As illustrated in FIG. 20, the optical waveguide 1 includes light incident / exit portions of the core layers 4-1 and 4-2, and light incident / exit portions of the other adjacent core layers 4-2 and 4-1. 5 and 6 are shifted in the length direction. In the present embodiment, the two first core layers 4-1 and the second core layer 4-2 whose positions of the light incident / exit sections 5 and 6 are shifted are repeatedly arranged as a unit.

  A light emitting element array 8-1 having a plurality of light emitting elements 81 arranged corresponding to the light incident portions 5 of the first core layer 4-1, on one side in the length direction of each core layer 4, and a second A light receiving element array 9-2 having a plurality of light receiving elements 91 arranged corresponding to the light emitting portions 6 of the core layer 4-2 is arranged.

  A light receiving element array 9-1 having a plurality of light receiving elements 91 arranged corresponding to the light emitting portions 6 of the first core layer 4-1, on the other side in the length direction of each core layer 4; A light emitting element array 8-2 having a plurality of light emitting elements 81 arranged corresponding to the light incident portions 5 of the core layer 4-2 is arranged.

  That is, in the optical waveguide 1, the light emitting elements 81 and the light receiving elements 91 are alternately arranged for the core layers 4-1 and 4-2 arranged in parallel. Therefore, each of the core layers 4-1 and 4-2 guides light in the opposite direction to the other adjacent core layers 4-2 and 4-1.

  In this case, the convex lens 7 as the light focusing means in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 21 and the second cladding layer 3 may be integrally formed. Thereby, the optical signal from the light emitting element 81 can be effectively focused and incident on the core layer 4, and the optical coupling can be performed efficiently. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

  Further, since the light emitting elements 81 and the light receiving elements 91 are alternately arranged with respect to the core layers 4-1 and 4-2 arranged in parallel, for example, they are connected to a specific circuit of a semiconductor integrated circuit chip. Since the positions of the light emitting element 81 and the light receiving element 91 corresponding to the input / output pads are close to each other as shown in part B of FIG. 20, the length of the electric wiring can be shortened, and high frequency countermeasures are easy. There is an effect of becoming. In addition, it has the same effect as the third embodiment.

Fifth Embodiment FIG. 22A shows a light-emitting element array and a light-receiving element as viewed from the opposite side of the surface of the core layer to which the second clad layer integrally formed with the light focusing means is joined. It is a figure which shows schematic structure of an array and an optical waveguide, FIG.22 (b) is the side view seen from X direction in Fig.22 (a), FIG.22 (c) is from Y direction in Fig.22 (a). FIG. 22D is a side view as seen, and FIG. 22D is a diagram showing the arrangement of light receiving elements in the light receiving element array and the arrangement of light emitting elements in the light emitting element array. In FIGS. 22B and 22C, the upper and lower sides are reversed. Although not shown in FIG. 22, the thickness of the both end portions 2a and 2b of the first cladding layer 2 is equal to that of the intermediate portion 2c between the both end portions 2a and 2b, as shown in FIG. It is formed larger than the thickness. As a result, the rigidity of the first cladding layer 2 at both end portions 2a and 2b can be made larger than that of the intermediate portion 2c, so that the first cladding layer 2 at both end portions 2a and 2b can be more effectively prevented from swelling. The optical axis is not shifted. Further, the bonding strength between the optical waveguide 1 and the socket 13 can be further improved.

  In the present embodiment, the configuration of the third embodiment and the fourth embodiment is combined. That is, similarly to the fourth embodiment, in the optical waveguide 1, the light emitting elements 81 and the light receiving elements 91 are alternately arranged for the core layers 4 arranged in parallel. Therefore, each core layer 4 guides light in the opposite direction with respect to the other adjacent core layers.

  Further, as in the third embodiment, the optical elements 81 and 91 in each of the optical element arrays 8-1, 8-2, 9-1 and 9-2 are adjacent to each other as shown in FIG. The other optical elements 81 and 91 are arranged so as to be shifted in the length direction of the core layer 4.

  In this case, the convex lens 7 as the light focusing means in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 23 and the second cladding layer 3 may be integrally formed. Thereby, the optical signal from the light emitting element 81 can be effectively focused and incident on the core layer 4, and the optical coupling can be performed efficiently. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

  Also, as shown in FIG. 16, the pitch between the optical elements can be increased as compared with the case where the optical elements are linearly arranged in each optical element array. Since the distance between the optical elements can be arranged at a pitch to avoid the influence of crosstalk due to optical interference or element heat generation while maintaining the effect, the integration degree of the core layer 4 can be improved. In addition, the effects of the third embodiment can be achieved.

  As mentioned above, although embodiment of this invention was described, the above-mentioned example can be variously modified based on the technical idea of this invention.

For example , the shape of the convex lens 7 as the light converging means is not particularly limited, and for example, besides a spherical lens, a cylindrical lens or the like can be applied.

  Moreover, although the example of stamping was demonstrated as a method of integrally molding the convex lens 7 with the 2nd cladding layer 3, you may shape | mold by casting etc., for example.

  8 and 9, the example in which the second cladding layer 3 is disposed on the quartz mold 11 filled with the core material 4a to solidify the core material 4a has been described. A mold may be disposed on the second cladding layer 3 to introduce a core material from the gate into the cavity.

  Further, the example in which the terminal pin 17 is provided as the conducting means for conducting the front and back surfaces of the socket 13 has been described. However, in addition to this, the through-electrode is provided in the socket 13, and the socket 13 and the printed wiring The plate and the interposer may be electrically connected by solder.

  As shown in FIG. 24, the socket 13 may have the interposer positioning mechanism 24 (for example, a fitting boss) on the convex surface 16, and the shape, size, and the like are not particularly limited.

  Furthermore, the shape, size, etc. of the protrusion 15 provided in the socket recess 14 are not particularly limited.

  The present invention is suitable for the above-described optical wiring system in which a signal is placed on a laser beam. However, the present invention can also be applied to a display or the like by selecting a light source or the like.

  The present invention efficiently collects and emits a predetermined light flux by an optical waveguide, or causes signal light emitted after being efficiently incident on the optical waveguide to enter a light receiving element (such as an optical wiring or a photodetector) of the next stage circuit. Thus, it can be effectively used for optical information processing such as optical communication.

1 is a schematic perspective view of a photoelectric composite device according to the present invention according to a first embodiment. It is a schematic perspective view of a socket. 1 is a schematic sectional view of an optical waveguide according to the present invention. FIG. 6 is a schematic view when an optical waveguide according to a conventional example is incorporated in the socket. 1 is a schematic sectional view of an optical waveguide according to the present invention. 1 is a schematic sectional view of an optical waveguide according to the present invention. 1 is a schematic sectional view of an optical waveguide according to the present invention. FIG. 5 is a schematic cross-sectional view showing an example of a method for manufacturing an optical waveguide according to the present invention in the order of steps. FIG. 5 is a schematic cross-sectional view showing an example of a method for manufacturing an optical waveguide according to the present invention in the order of steps. It is a schematic perspective view of an interposer. FIG. 2 is a schematic cross-sectional view showing an example of a method for manufacturing a photoelectric composite device and a mounting structure according to the present invention in the order of steps. FIG. 2 is a schematic cross-sectional view illustrating an example of a method for manufacturing a photoelectric composite device and a mounting structure according to the present invention in the order of processes. It is a schematic sectional drawing which shows the partial process of the manufacturing method of the photoelectric composite apparatus based on this invention. It is a schematic sectional drawing which shows an example of the mounting structure of the photoelectric composite apparatus based on this invention. FIG. 2 is a schematic plan view showing an example of a mounting structure of a photoelectric composite device according to the present invention. FIG. 3 is a schematic view of an optical waveguide according to the present invention according to a second embodiment. FIG. 4 is a schematic plan view of the second cladding layer. FIG. 4 is a schematic view of an optical waveguide according to the present invention according to a third embodiment. FIG. 4 is a schematic plan view of the second cladding layer. FIG. 6 is a schematic view of an optical waveguide according to the present invention according to a fourth embodiment. FIG. 4 is a schematic plan view of the second cladding layer. FIG. 6 is a schematic view of an optical waveguide according to the present invention according to a fifth embodiment. FIG. 4 is a schematic plan view of the second cladding layer. It is a schematic perspective view which shows the other example of the socket by embodiment. It is a schematic sectional drawing which shows the mounting structure of the optical waveguide by a prior art example. It is a schematic sectional drawing of an optical waveguide same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical waveguide, 2 ... 1st cladding layer, 2a, 2b ... End part of 1st cladding layer,
2c: intermediate portion of the first cladding layer, 3 ... second cladding layer, 2 ', 3a ... cladding material,
4, 4-1, 4-2 ... core layer, 4a ... core material, 5 ... light incident part, 6 ... light emitting part,
7 ... convex lens, 8, 8-1 and 8-2 ... light emitting element array,
9, 9-1, 9-2 ... light receiving element array, 10 ... mold, 11 ... quartz type, 12 ... optical component,
13 ... Socket, 14 ... Recess, 15 ... Projection, 16 ... Convex surface, 17 ... Terminal pin,
18 ... Photoelectric composite device, 19 ... Printed wiring board, 20 ... Interposer,
21, 21 a, 21 b... Semiconductor integrated circuit chip, 22... Redistribution electrode,
24 ... Interposer positioning mechanism, 25 ... Space, 30 ... Signal light, 31 ... Upper mold,
32 ... Lower mold, 33 ... Cavity, 33a, 33b ... End of cavity,
33c: middle part of cavity, 81 ... light emitting element, 82 ... penetrating electrode, 91 ... light receiving element

Claims (22)

A core layer is sandwiched between the first cladding layer and the second cladding layer, and light is incident on the core layer through the second cladding layer, and the incident light is guided through the core layer. A light converging or collimating means is integrally formed with the second cladding layer at a position corresponding to the light incident portion and the light emitting portion of the core layer and at a position inside the end surface of the second cladding layer, The inclined mirror surface is formed on only the end surfaces of the light incident portion and the light emitting portion of the second cladding layer so as to be exposed to the outside at a position inside the end surface of the second cladding layer, and the incident light is transmitted by the inclined mirror surface. is reflected to the core layer is further reflected to the second cladding layer side after being guided, and in each end portion including a portion corresponding to the light incident part and the light exit portion of the core layer There are, the conjunction is greater than the rigidity of the intermediate portion between both end portions due to the rigidity of the second cladding layer is the light focusing or collimation means, than the intermediate portion between both end portions the thickness of the first cladding layer An optical waveguide which is formed large and has a rigidity of the first cladding layer larger than that of the intermediate portion . The optical waveguide according to claim 1, wherein an intermediate portion between the first and second cladding layers has flexibility. The optical waveguide according to claim 1 , wherein the light focusing or collimating means is made of the same material as the second cladding layer. The optical waveguide according to claim 1 , wherein the light focusing or collimating means is a convex lens. It said second cladding layer in the light propagation direction is formed longer than the first cladding layer, an optical waveguide according to claim 1.   The optical waveguide according to claim 1, wherein the optical waveguide is configured as a photoelectric composite device that is installed in a socket and in which at least one of a light emitting element and a light receiving element is arranged to face each other. A socket and an optical waveguide installed in the socket, and at least one of a light-emitting element for performing light incidence on the optical waveguide and a light-receiving element for receiving light emitted from the optical waveguide, Disposed opposite the optical waveguide, and the optical waveguide is
Core layer by the first cladding layer and the second cladding layer is being clamped, the light incidence is made to the second the core layer through clad layer, it is configured as the incident light is guided through the core layer have been, optical focusing or collimation means in the inside position from the end face of the front Stories second cladding layer at a position corresponding to the light incident portion and the light emitting portion of the core layer is formed integrally with the second cladding layer, wherein the light incident portions and mini of the respective end faces of the light emitting portion of the core layer, is formed in a state of being exposed to the outside at a position inside from the end face of the inclined mirror surface the second cladding layer, fill front by the inclined mirror surface Shako been reflected to further the second cladding layer side after being guided is reflected into the core layer, and each end portion including a portion corresponding to the light incident part and the light exit portion of the core layer Oite, together are I Do greater than the stiffness of the intermediate portion between both end portions due to the rigidity of the second cladding layer is the light focusing or collimation means, the intermediate portion between the thickness of the first cladding layer is both end portions is larger than the rigidity of even the intermediate portion of the first cladding layer is larger than,
Photoelectric composite device. The photoelectric composite device according to claim 7 , wherein an intermediate portion between the first and second cladding layers has flexibility. The photoelectric composite device according to claim 7 , wherein the light focusing or collimating means is made of the same material as the second cladding layer. The photoelectric composite device according to claim 7 , wherein the light focusing or collimating means is a convex lens. The photoelectric composite device according to claim 7 , wherein the second cladding layer is formed longer than the first cladding layer in a light propagation direction. The photoelectric composite device according to claim 7 , wherein positioning means for positioning and fixing the optical waveguide to the socket is provided. The photoelectric composite device according to claim 12 , wherein the positioning unit has a concavo-convex structure, and an interposer on which the light emitting element and / or the light receiving element is mounted is fixed on a convex surface of the concavo-convex structure. The photoelectric composite device according to claim 13 , wherein a semiconductor integrated circuit chip connected to the light emitting element and / or the light receiving element is mounted on the interposer. 14. The concave-convex structure according to claim 13 , wherein the concave-convex structure has a recess for fitting the optical waveguide and positioning the width direction thereof, and a protrusion for positioning the length direction of the optical waveguide. Photoelectric composite device. The photoelectric composite device according to claim 15 , wherein a depth of the concave portion of the concave-convex structure is larger than a thickness of the optical waveguide. The photoelectric composite device according to claim 13 , further comprising a positioning mechanism for the interposer on the convex surface. The photoelectric composite device according to claim 7 , wherein the optical waveguide is bridged between the pair of sockets. The photoelectric composite device according to claim 7 , constituting an optical wiring system in which the optical waveguide is used as an optical wiring. A mounting structure for a photoelectric composite device, wherein the photoelectric composite device according to any one of claims 7 to 19 is fixed in a state of being electrically connected to a printed wiring board. The mounting structure of the photoelectric composite device according to claim 20 , wherein the optical waveguide is not in contact with the printed wiring board. In light propagation direction of the optical waveguide, the length of the first and second cladding layer is fixed to the socket, wherein the larger pair of socket distance which is fixed to the printed wiring board, according to claim 20 The mounting structure of the photoelectric composite device.

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