JP2006351718A - Optical element and optical module using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element in which the optical element of a narrow pitch can be optically coupled to the optical waveguide of the narrow pitch at a high efficiency and high density. <P>SOLUTION: The optical element is used which comprises an optical element body 1, a first core 2a, and a first clad 2b. The optical element body 1 has an optical luminescent part 42 for emitting light. The first core 2a has a first refractive index, and is provided so as to come into contact with the optical luminescent part 42 for guiding waves of the light. The first clad 2b has a second refractive index differing from the first refractive index, and is provided so as to surround the first core 2a. An area of a first region where the first core 2a comes into contact with the optical luminescent part 42 is equal to or more than an area of a second region where the optical luminescent part 42 receives or emits the light, and the first region includes the second region. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical element, an optical element module, and an optical module, and more particularly to an optical element, an optical element module, and an optical module used for information communication.

  With the recent increase in information capacity of electronic devices, high-speed and large-capacity data transmission using high-frequency signals is performed. When transmitting such a high-speed and large-capacity signal, the conventional electric wiring has a large loss. Therefore, it is said that high-speed transmission of electrical signals will reach its limit in the near future. As means for solving such limitations of electric signals, development and practical application of optical communication and optical information transmission technologies are expected. As an example of means for transmitting information using light, an electrical signal emitted from a semiconductor element is converted into a low-loss optical signal in the immediate vicinity of the semiconductor element before the high-speed signal is attenuated, and the signal is transmitted using a low-loss transmission line. There are optical interconnect technologies for transmitting and receiving. As a typical example of the configuration of an optical interconnect, an electrical signal generated from an LSI is converted into an optical signal by a light emitting element which is one of the optical elements, and the optical signal is incident and propagated in the transmission line. The light receiving element which is one of the optical elements mounted on the other end of the optical signal is used to return to an electrical signal and transmit / receive to / from another LSI.

  As a related prior art, Japanese Patent Application Laid-Open No. 11-224953 (Patent Document 1) discloses an optical waveguide with a microlens for improving the coupling efficiency with an optical element. The configuration of the present invention includes an embedded optical waveguide and a condensing microlens. The embedded optical waveguide includes an optical waveguide core, a clad surrounding the core, and an end surface for light entering and exiting the core. The condensing microlens is provided on the cladding surface of the optical waveguide. Since the end face of the optical waveguide is processed into a 45 ° wedge shape, the light traveling direction is changed. It is disclosed that the coupling efficiency between the optical element and the optical waveguide can be increased by collecting the light whose traveling direction has been changed by the microlens formed on the surface of the waveguide.

  However, it is considered that the conventional technique disclosed in Patent Document 1 is difficult to cope with the narrowing of the transmission line. That is, the optical signal transmitted from the light emitting element has a certain spread angle. Therefore, when the light emitted from the light emitting element is received by the microlens of Patent Document 1, a microlens having a size larger than the area of the light emitting portion of the light emitting element is required. Accordingly, in order to receive all the emitted light, a larger microlens is required as the distance between the light emitting element and the microlens increases. Therefore, the inter-core pitch of the waveguide is limited by the microlens size. As described above, the invention disclosed in Patent Document 1 has a trade-off relationship between improvement in optical coupling efficiency and narrow pitch, and for modules that need to configure multi-channel signals with a narrow pitch. It is considered difficult to apply.

JP 11-248953 A

  Accordingly, an object of the present invention is to provide an optical element, an optical element module, and an optical module capable of optically coupling a narrow pitch optical element and a narrow pitch optical waveguide with high efficiency and high density.

  Another object of the present invention is to provide an optical element, an optical element module, and an optical module capable of transmitting an optical signal entering and exiting the optical element without entering and exiting a medium with a large loss. is there.

  Hereinafter, means for solving the problem will be described using the numbers and symbols used in the best mode for carrying out the invention. These numbers and symbols are added in parentheses in order to clarify the correspondence between the description of the claims and the best mode for carrying out the invention. However, these numbers and symbols should not be used for interpreting the technical scope of the invention described in the claims.

  In order to solve the above problems, an optical element of the present invention includes an optical element body (1), a first core part (2), and a first cladding part (2b). The optical element body (1) has a light emitting section (42) that emits light. The first core part (2) has a first refractive index, is provided in contact with the light emitting part (42), and guides light. The first cladding part (2b) has a second refractive index different from the first refractive index, and is provided so as to surround the first core part (2a).

  In the above optical element, the area of the first region where the first core portion (2a) contacts the light emitting portion (42) is equal to or greater than the area of the second region where the light emitting portion (42) emits light. The first region includes the second region.

  In the above optical element, the optical element body (1) has a plurality of light emitting portions (42). A plurality of cores (2a) are provided corresponding to the plurality of light emitting units (42).

  In order to solve the above problems, an optical element of the present invention includes an optical element body (2), a first core part (12a), and a first cladding part (12b). The optical element body (2) has a light receiving part (44) for receiving light. The first core portion (12a) has a first refractive index, is provided in contact with the light receiving portion (44), and guides light. The first cladding part (12b) has a second refractive index different from the first refractive index, and is provided so as to surround the first core part (12a).

  In the above optical element, the area of the fourth region where the light receiving portion (44) receives light is equal to or greater than the area of the third region where the first core portion (12a) contacts the light receiving portion (44). And the 4th field includes the 3rd field.

  In the above optical element, the optical element body (2) has a plurality of light receiving portions (44). A plurality of cores (12a) are provided corresponding to the plurality of light receiving portions (44).

  In the above optical element, the first core portion (2a) extends in a direction perpendicular to the surface of the optical element body (1/2).

  In the above optical element, the first core portion (2a) has a column shape.

  In the above optical element, the first cladding portion (2b) has a column shape.

  In the above optical element, the cross-sectional area perpendicular to the axis in which light is guided in the first core portion (2a) monotonously decreases along the direction in which light is guided.

  In the above optical element, the first core part (2a / 12a) and the first cladding part (2b / 12b) are made of synthetic resin.

  In the above optical element, the synthetic resin is a photosensitive synthetic resin.

  In the above optical element, the synthetic resin of the first core portion (2a / 12a) has a transmittance of 90% or more with respect to the wavelength of light.

  In the above optical element, the first refractive index is 1.0% or more larger than the second refractive index.

  In the above optical element, the wavelength of light is 1000 nm or less.

  In order to solve the above problems, an optical element module according to the present invention includes a substrate (5) and the optical element (10/10) according to any one of the above items provided on one surface of the substrate (5). 20).

  In the above optical element module, the light traveling direction in the optical element (10/20) is perpendicular to the substrate (5).

  The optical element module further includes an optical waveguide (3) provided on the other surface of the substrate (5). The optical waveguide (3) has a third refractive index, has a second core part (3a) for guiding light, and has a fourth refractive index different from the third refractive index, and the second core part (3a). And a second clad portion (3b) provided so as to surround. An end portion of the optical waveguide (3) having the optical path conversion mirror (4/14) is provided at a position opposite to the optical element (10/20) across the substrate (5). The direction in which light travels in the optical element (10/20) is the direction toward the substrate (5). The tips of the first core part (2a / 12a) and the first cladding part (2b / 12b) are in contact with the substrate (5).

  The optical element module further includes an optical waveguide (3) provided on the other surface of the substrate (5). The optical waveguide (3) has a third refractive index, has a second core part (3a) for guiding light, and has a fourth refractive index different from the third refractive index, and the second core part (3a). And a second clad portion (3b) provided so as to surround. An end portion of the optical waveguide (3) having the optical path conversion mirror (4/14) is provided at a position opposite to the optical element (10/20) across the substrate (5). The direction in which light travels in the optical element (10/20) is the direction toward the substrate (5). The tips of the first core part (2a / 12a) and the first cladding part (2b / 12b) are in contact with the end part of the optical waveguide (3).

  In the above optical element module, the second cladding part (3b) includes a recess (75). The concave portion (75) is aligned with a convex portion of a component related to another transmission path, thereby aligning the optical waveguide (3) with the other transmission path.

  In order to solve the above problems, an optical module of the present invention comprises a mother board (7) and the optical element module (28) according to any one of the above items, which is mounted on the mother board (7). To do.

  In order to solve the above problems, the method for manufacturing an optical element of the present invention includes (a) a step of forming an optical element body (47) having a light conversion part (46) that performs either one of light reception and light emission. And (b) the first core portion (50/57) on the light conversion portion (46) and the first cladding portion (50/57) in a predetermined region excluding the light conversion portion (46) of the optical element body (47). 48 ′ / 60). The first core part (50/57) has a first refractive index, is provided in contact with the light conversion part (46), and guides light. The first cladding part (48/60 ') has a second refractive index different from the first refractive index, and is formed so as to surround the first core part (50/57).

  In the method for manufacturing an optical element, the step (b) includes (b1) a step of applying a photosensitive synthetic resin (48) on the optical element body (47), and (b2) a light conversion section (46). A step of exposing the upper synthetic resin (48); and (b3) a step of heat-treating the synthetic resin (48).

  In the method for manufacturing an optical element, the step (b) includes (b4) a step of placing the first frame (55) on the optical element body (47), and (b5) a first in the first hole (56). (B6) a step of heat-treating the optical element body (47) and the first frame (55) containing the first synthetic resin to form the first core portion (57); b7) replacing the first frame (55) on the optical element body (47) with the second frame (58); (b8) inserting the second synthetic resin into the second hole (59); ) Heat-treating the optical element body (47) and the second frame (58) containing the second synthetic resin to form the first cladding part (60). Here, the first frame (55) has a cylindrical first hole (56), and the first hole (56) surrounds the space on the light conversion unit (46). The second frame (58) has a cylindrical second hole (59), and the second hole (59) surrounds the space on the light conversion unit (46) and is larger than the first hole (55). .

  In the method for manufacturing an optical element, in the step (b), the temperature to be applied is 100 ° C. or higher and 350 ° C. or lower.

  According to the present invention, it is possible to couple a signal received and transmitted from a multi-channel optical element (light emitting element, light receiving element) with a waveguide with low loss. In the present invention, a plurality of rows of waveguides can be formed without being limited to a single row, and high-efficiency high-density optical coupling between a narrow-pitch optical element and a narrow-pitch optical waveguide is possible. Module formation using multi-channel high-density optical elements is possible.

  Embodiments of an optical element, an optical element module, and an optical module according to the present invention will be described below with reference to the accompanying drawings. Here, the optical element is a light emitting element or a light receiving element.

(First embodiment)
DESCRIPTION OF EMBODIMENTS A first embodiment of an optical element, an optical element module, and an optical module according to the present invention will be described with reference to the accompanying drawings. First, the configuration of the first embodiment of the optical module including the optical element and the optical element module of the present invention will be described.

  1 to 4 are schematic views showing the configuration of the first embodiment of the optical module of the present invention. FIG. 1 is a schematic side view of the light emitting side of the optical module, and FIG. 2 is a schematic plan view thereof. On the other hand, FIG. 3 is a schematic side view of the light receiving side of the optical module, and FIG. 4 is a schematic plan view thereof. The optical module 38 includes a motherboard 7 and an optical element module 28.

  1 and 2, the optical element module 28 includes a light emitting element 10, a driver IC 6, an interposer substrate 5, and an optical waveguide 3 on the light emitting side.

  The optical waveguide 3 is provided on one surface of the interposer substrate 5. The optical waveguide 3 has a plurality of waveguide cores 3a and a waveguide cladding 3b. The waveguide core 3a has a third refractive index and guides light. The interposer substrate 5 extends parallel to each other in a direction parallel to one surface of the interposer substrate 5. The waveguide cladding 3b has a fourth refractive index different from the third refractive index, and is provided so as to surround the waveguide core 3a. The third refractive index is 0.5% or more larger than the fourth refractive index, more preferably 1.0% or more. If the refractive index difference is less than this, light confinement is incomplete. Therefore, crosstalk noise often becomes a problem when the pitch between the waveguide cores 3a is narrow.

  The light emitting element 10 is provided on the other surface on the interposer substrate 5. A light emitting element main body 1 and a coupling waveguide 2 are included. The light emitting element body 1 includes a light emitting unit 42 that emits light. The light-emitting element body 1 is connected to a power source (not shown) for driving the light-emitting element 10 via solder connection-wiring 21 of the interposer substrate 5-solder connection-wiring 31 of the mother board 7. For example, as shown in FIG. 2, the light emitting elements 10 are arranged in a form of 1 row × 3 columns.

  The coupled waveguide 2 has a waveguide core 2a and a waveguide cladding 2b. The waveguide core 2a has a first refractive index, is provided in contact with the light emitting unit 42, and guides light. The waveguide cladding 2b has a second refractive index different from the first refractive index, and is provided so as to surround the waveguide core 2a. The waveguide core 2 a is formed in a columnar shape in a state in which the optical axis of the light emitting element 10 is aligned with the optical axis of the light emitting unit 42 in the vertical direction from the surface on the light emitting unit 42 side. The first refractive index is 0.5% or more larger than the second refractive index, more preferably 1.0% or more. If the refractive index difference is less than this, light confinement is incomplete. Therefore, crosstalk noise often becomes a problem when the pitch between the waveguide cores is narrow.

  The optical waveguide 3 at a position where the light emitted from the light emitting element 10 passes through the interposer substrate 5 is mirror-processed by 45 ° to form the optical path conversion mirror 4. The light emitted from the light emitting element 10 enters the optical path conversion mirror 4 and is optically converted to travel through the waveguide core 3a.

  The driver IC 6 is provided on the other surface of the interposer substrate 5. The driver IC 6 is connected to the light emitting element 10 through the electrode pad-solder connection-wiring 22 in the interposer substrate 5-solder connection-electrode pad of the light emitting element 10. The driver IC 6 drives the light emitting element 10.

  The interposer substrate 5 is made of a material having a transmittance of 90% or more for light emitted from the light emitting element 10. Specific examples include polyethylene naphthalate, polyimide, glass substrate and the like. However, it is not limited to the materials described above. In order to achieve high-efficiency optical coupling, the distance between the light emitting portion 42 of the light emitting element 10 and the optical path conversion mirror 4 (optical path conversion surface) is desirably as small as possible. Therefore, in the configuration in which the light transmitted through the interposer substrate 5 is coupled by the optical path conversion mirror 4 at the end of the optical waveguide 3, the interposer substrate 5 is desirably thin.

  The mother board 7 is mounted with an electronic circuit including the LSI 8 and an optical element module 28. The electronic circuit, for example, the LSI 8 is connected to the optical element module 28 via the electrode pad-solder connection-wiring 32 of the mother board 7-solder connection-electrode pad of the interposer substrate 5.

  Next, referring to FIG. 3 and FIG. 4, the optical element module 28 includes the light receiving element 20, the receiver IC 16, the interposer substrate 5, and the optical waveguide 3 on the light receiving side.

  The light receiving element 20 is provided on the other surface on the interposer substrate 5. A light receiving element main body 11 and a coupling waveguide 12 are included. The light receiving element body 11 has a light receiving portion 44 that receives light. The light receiving element main body 11 is connected to a power source (not shown) for driving the light receiving element 20 through the electrode pad-solder connection-wiring 24 of the interposer substrate 5-solder connection-wiring 33 of the mother board 7. Yes. For example, as shown in FIG. 4, the light emitting elements 20 are arranged in the form of 1 row × 3 columns corresponding to the light emitting elements 10.

  The coupling waveguide 12 has a waveguide core 12a and a waveguide cladding 12b. The waveguide core 12a has a first refractive index, is provided in contact with the light receiving unit 44, and guides light. The waveguide clad 12b has a second refractive index and is provided so as to surround the waveguide core 12a. The waveguide core 12 a is formed in a columnar shape with the optical axis thereof aligned with the optical axis of the light receiving unit 44 in the vertical direction from the surface on the light receiving unit 44 side of the light receiving element 20.

  The optical waveguide 3 is subjected to another 45 ° mirror processing at the end of the optical waveguide 3 opposite to the optical path conversion mirror 4 to form an optical path conversion mirror 14. The light emitted from the light emitting element 10 and traveling through the waveguide core 3 a is optical path converted by the optical path conversion mirror 14, passes through the interposer substrate 5, and enters the light receiving element 20. Others are as described on the light emitting side.

  The receiver IC 16 is provided on the other surface of the interposer substrate 5. The receiver IC 16 is connected to the light receiving element 20 via its electrode pad-solder connection-wiring 25 in the interposer substrate 5-solder connection-electrode pad of the light receiving element 20. The receiver IC 16 drives the light receiving element 20.

  In order for the interposer substrate 5 to achieve high-efficiency optical coupling, it is desirable that the distance between the light emitting / receiving unit 44 of the light receiving element 20 and the light path conversion mirror 14 (light path conversion surface) be as small as possible. Therefore, it is desirable that the interposer substrate 5 is thin.

  The mother board 7 is mounted with an electronic circuit including the LSI 18 and an optical element module 28. The electronic circuit, for example, the LSI 18 is connected to the optical element module 28 via the electrode pad-solder connection-wiring 34 of the mother board 7-solder connection-electrode pad of the interposer substrate 7.

FIG. 5 is a schematic sectional view showing the vicinity of the light emitting element 10 in FIG.
The waveguide core 2 a of the light-emitting element 10 extends in a columnar shape toward the optical path conversion mirror 4 in a state where the optical axis thereof matches the optical axis of the light-emitting portion 42. Here, the relationship between the area S1 of the light output portion 42 in the light emitting portion 42 and the cross-sectional area S2 of the region perpendicular to the optical axis in the waveguide core 2a is preferably S2 ≧ S1. And it is preferable that the area | region which outputs the light in the light emission part 42 is included by the area | region perpendicular | vertical to the optical axis in the waveguide core 2a. By doing in this way, the light output from the light emission part 42 can be output to the waveguide core 2a without leaking. In addition, the relationship between the cross-sectional area S2 of the region perpendicular to the optical axis in the waveguide core 2a and the cross-sectional area S3 of the region perpendicular to the optical axis in the waveguide core 3a is preferably S3 ≧ S2. By doing in this way, the light output from the waveguide core 2a can be input into the waveguide core 3a without leakage.
In the present embodiment, for example, the shape of each of the above regions is circular. In that case, the relationship between the diameter D1 of the light emitting portion 42 and the diameter D2 of the waveguide core 2a is D2 ≧ D1. Further, the relationship between the diameter D3 of the waveguide core 3a and the diameter D2 of the waveguide core 2a is D3 ≧ D2.

  FIG. 6 is a schematic cross-sectional view showing an example of the shape of the coupled waveguide 2 in FIG. In the example of (a), an example is shown in which the cross-sectional area perpendicular to the optical axis of the waveguide core 2a is constant regardless of the location (example: constant at the diameter D2). In the example of (b), the cross-sectional area perpendicular to the optical axis of the waveguide core 2a is large on the light emitting part 42 side (example: diameter D2) and small on the optical path conversion mirror 4 side (example: diameter D2a). An example is shown. That is, this is a structure with a taper that decreases in cross-sectional area along the light traveling direction of the picture coupling waveguide 2. In the structure (b), the waveguide core 2a can receive light without leakage by increasing the cross-sectional area on the light emitting portion 42 side. At the same time, since the cross-sectional area is reduced on the waveguide core 3a side, the waveguide core 3a can receive the light of the waveguide core 2a without leakage. Moreover, the cross-sectional area of the waveguide core 3a can be reduced.

FIG. 7 is a schematic sectional view showing the vicinity of the light receiving element 20 in FIG.
The waveguide core 12 a of the light receiving element 20 extends in a columnar shape toward the optical path conversion mirror 14 in a state where the optical axis thereof coincides with the optical axis of the light receiving unit 44. Here, the relation between the area S4 of the light receiving portion 44 in the light receiving portion 44 and the cross-sectional area S5 of the region perpendicular to the optical axis in the waveguide core 12a is preferably S4 ≧ S5. And it is preferable that the area | region which receives the light in the light-receiving part 44 includes the area | region perpendicular | vertical to the optical axis in the waveguide core 12a. By doing so, the light passing through the waveguide core 12a can be received by the light receiving unit 44 without leakage. In addition, the relationship between the cross-sectional area S5 of the region perpendicular to the optical axis in the waveguide core 12a and the cross-sectional area S3 of the region perpendicular to the optical axis in the waveguide core 3a is preferably S5 ≧ S3. By doing in this way, the light output from the waveguide core 3a can be input into the waveguide core 12a without leakage.
In the present embodiment, for example, the shape of each of the above regions is circular. In that case, the relationship between the diameter D4 of the light receiving portion 44 and the diameter D5 of the waveguide core 12a is D4 ≧ D5. Further, the relationship between the diameter D3 of the waveguide core 3a and the diameter D5 of the waveguide core 12a is D5 ≧ D3.

  FIG. 8 is a schematic cross-sectional view showing an example of the shape of the coupled waveguide 12 in FIG. In the example of (a), an example in which the cross-sectional area perpendicular to the optical axis of the waveguide core 12a is constant regardless of the location (example: constant at the diameter D5) is shown. In the example of (b), the cross-sectional area perpendicular to the optical axis of the waveguide core 12a is small on the light receiving unit 44 side (example: diameter D5a) and large on the optical path conversion mirror 14 side (example: diameter D5). An example is shown. That is, this is a structure having a taper in which the cross-sectional area decreases along the light traveling direction of the picture coupling waveguide 12. In the structure of (b), by reducing the cross-sectional area on the light receiving unit 44 side, the light receiving unit 44 can receive light without leakage. At the same time, by increasing the cross-sectional area on the side of the waveguide core 3a, the light of the waveguide core 3a can be received without leakage.

  Next, the operation of the first embodiment of the optical module of the present invention will be described.

  The LSI 8 transmits an electric signal to the driver IC 6. The driver IC 6 drives the light emitting element 10 based on the electric signal. The light emitting element 10 converts the electric signal into an electric light and converts it into an optical signal of laser light. The light emitting element 10 outputs the optical signal from the light emitting unit 42 to the waveguide core 2a. The optical signal is optical axis converted by the optical path conversion mirror 4 and transmitted through the waveguide core 3a with low loss. The optical signal transmitted through the waveguide core 3a is optically converted again by the optical path conversion mirror 14 and enters the waveguide core 12a. The light receiving element 20 photoelectrically converts the optical signal into an electric signal. The receiver IC 16 inputs the electric signal to an input port of another LSI 18. With such an operation, the LSI 8 on the motherboard 7 and the other LSI 18 can transmit and receive.

  Next, a first embodiment of the method for manufacturing an optical element of the present invention will be described with reference to FIGS. 9-12 is schematic which shows the process of 1st Embodiment of the manufacturing method of the light emitting element of this invention.

  In the method for manufacturing a light-emitting device, first, a gallium arsenide-based semiconductor device having a laser transmission wavelength with little absorption in a polymer optical waveguide (hereinafter referred to as “polymer waveguide”) is formed (FIG. 9). For example, twelve light emitting element bodies 47 are formed on the light emitting element wafer 45 shown in the drawing. The light emitting element body 47 has 3 × 5 light emitting portions 46 that emit light. The light emitting element main body 47 is a surface emitting type having a transmission wavelength of 1000 nm or less. Here, the surface light emitting element body 47 is the same as the light emitting surface (surface on the light emitting unit 46 side) in which the electrode (for solder connection: not shown) of the light emitting element body 47 is formed. An element is shown.

  Next, the base material of the polymer waveguide is applied to the light emitting surface side (light emitting portion 46 side) of the light emitting element main body 47 to form the polymer base material layer 48 (FIG. 10). Subsequently, the light emitting part 46 of the light emitting element body 47 is positioned on the light emitting element body 47 on which the polymer base material layer 48 is formed so as to overlap the opening of the glass mask 49, and then irradiated with UV light (FIG. 11 (a): sectional view, FIG. 11 (b): plan view). Since the polymer base material layer 48 has photosensitivity, the portion irradiated with UV light is exposed to light. Thereafter, the light-emitting element body 47 is heat-treated. The heat treatment temperature is 350 ° C. or lower. Since the temperature is low, adverse effects on the light emitting element body 47 due to heat treatment can be suppressed. By this step, the waveguide core 50 and the waveguide cladding 48 'are formed. The waveguide core 50 and the waveguide cladding 48 'form a coupled waveguide. At that time, the refractive index of the portion (waveguide core 50) irradiated with UV light and thermally cured is higher than that of the portion (waveguide clad 48 ′) thermally cured without being irradiated with UV light. Thereby, the optical signal can propagate only through the high refractive index portion. Next, the solder balls 51 are mounted on the electrode pads 52 of the obtained light emitting element main body 47. The solder ball 51 is used for electrical connection (solder connection) with the interposer substrate (FIG. 12). In this way, the light emitting device 10 having the light emitting device main body 47 and the coupling waveguide (48 '+ 50) is manufactured.

  The above optical element uses a polymer waveguide. The polymer waveguide can be formed at a very low temperature (for example, 100 ° C. or more and 350 ° C. or less) compared to a waveguide made of a conventional quartz fiber. Examples of such materials include synthetic resins such as acrylic resins and epoxy resins. Therefore, when the optical element is directly formed on the optical element as in the present invention, it is preferable that the optical element is not adversely affected by heat.

  The light emitting element body 47 shown in FIG. 12 has a plurality of light emitting portions 46, but each light emitting element body 1 in FIG. 1 has one light emitting portion 42. Therefore, the light-emitting element body 47 is divided and used so that there is one light-emitting portion in order to correspond to the light-emitting element body 1 of FIG.

  The light emitting element main body 47, the waveguide core 50, and the waveguide clad 48 ′ are formed on the semiconductor element, the waveguide core 2a, and the waveguide clad 2b housed in the light emitting element main body 1 in FIGS. Equivalent to.

  In the present embodiment (FIGS. 9 to 12), an example in which a light emitting element is manufactured by forming a polymer coupling waveguide on the light emitting element body 47 is described. However, also in the light receiving element, it is possible to manufacture the coupling waveguide 12 on the light receiving element body 11 by the same process as described above. Moreover, even if it is produced by other processes, it can be used for the optical module of the present invention if it has the same structure.

  Next, a first embodiment of a method for manufacturing an optical element module according to the present invention will be described with reference to FIGS.

  With respect to the light-emitting element 10 obtained as described above with reference to FIGS. 9 to 12, the solder ball (51) is soldered to an electrode pad at a predetermined position on the interposer substrate 5. The optical waveguide 3 is attached to the back surface of the interposer substrate 5. The optical waveguide 3 is attached so that one end thereof is at a position where an optical signal is emitted from the light emitting element 10. The end portion of the optical waveguide 3 is wedge-shaped (mirror processed) at 45 ° and has an optical path conversion mirror 4. The optical waveguide 3 is wedge-shaped (mirrored) at 45 ° at the other end, and has an optical path conversion mirror 14. Then, the light receiving element 20 is solder-connected to the position where the light whose path has been changed enters the coupling waveguide 12 formed on the light receiving element body 11. Further, the driver IC 6 and the receiver IC 16 are soldered to electrode pads at predetermined positions on the interposer substrate 5. Thereby, the optical element module 28 shown in FIGS. 1 to 4 is manufactured.

  Next, a first embodiment of the optical module manufacturing method of the present invention will be described with reference to FIGS.

  The electrode pad under the light emitting element module 28 obtained as described above is soldered to the electrode pad on the mother board 7. Further, LSI 8 and LSI 18 are soldered on the mother board 7. Connect other necessary circuit components. Thereby, the optical module 38 shown in FIGS. 1-4 is manufactured.

  In the present embodiment, the polymer base material layer 48 is photosensitive and has a refractive index that changes by UV light irradiation. However, it is not an essential element that the base material layer of the optical waveguide (coupled waveguide) has photosensitivity. For example, another method such as a method of thermoforming using a mold having irregularities corresponding to the columnar waveguide core (2a) formed on the light emitting element body (1) may be used.

  On the other hand, the material used to form the optical waveguide (coupled waveguide) desirably has a process temperature of 350 ° C. or lower. When a temperature higher than this is required, the coupling waveguide 2 and the light near room temperature due to the difference in thermal expansion coefficient between the semiconductor element (light emitting element body 1) and the polymer waveguide (coupling waveguide 2). A large internal stress is generated at the interface with the light emitting element main body 1, and the mounting reliability of the light emitting element is impaired.

  In the present invention, the columnar optical waveguide in contact with the optical element is formed in a state where the optical axis of the optical element and the optical axis of the optical waveguide coincide with each other in the direction perpendicular to the light receiving and emitting part of the optical element. This makes it possible to complete the alignment with the optical element simultaneously with the formation of the optical waveguide. In addition, an optical signal that enters and exits the optical element can be transmitted without entering and exiting a medium with a large loss.

  In the present invention, the cross-sectional area of the waveguide core on the light-emitting part side formed on the light-emitting element is configured to be equal to or larger than the cross-sectional area of the light-emitting part, and is formed so as to include the light-emitting part of the light-emitting element. Has been. On the other hand, the cross-sectional area of the waveguide core on the light-receiving part side formed on the light-receiving element is configured to be equal to or smaller than the cross-sectional area of the light-receiving part, and the light-receiving part of the light-receiving element includes the cross-sectional area of the waveguide core It is formed to do. As a result, the optical signal output from the light emitting element can reliably reach the light receiving element without leakage.

  In the present invention, the cross-sectional area of the waveguide core on the light-emitting element side is equal to the cross-sectional area on the light-emitting portion side or has a taper that decreases in cross-sectional area along the light traveling direction of the optical waveguide. On the other hand, the cross-sectional area of the waveguide core on the light receiving element side is the same as the cross-sectional area on the light receiving part side, or has a taper with a smaller cross-sectional area along the light traveling direction of the optical waveguide. Thereby, a margin can be increased in the optical coupling between the optical element and the optical waveguide. Then, optical coupling at a narrow pitch can be facilitated.

  In the present invention, a photosensitive polymer base material layer is formed on an optical element wafer, and the position of the optical axis center of the optical element is exposed with UV light to form a waveguide core. Accordingly, it is possible to easily and accurately manufacture a highly efficient optical coupling element in a lump without requiring complicated alignment. Thereby, a columnar optical waveguide in contact with the optical element can be formed in a state where the optical axis of the optical element is coincident with the optical axis of the optical waveguide.

  Further, the columnar optical waveguide formed on the optical element is not limited to a single line, and can be formed in a similar manner even in a plurality of lines. In a structure in which a plurality of optical waveguides are formed, the optical waveguide length from the light emitting surface of the optical waveguide is assumed to be uniform. Since the optical waveguide length is uniform, optical coupling with other transmission lines can be performed without variations in signal delay, and mounting can be facilitated.

(Second Embodiment)
A second embodiment of the optical element, the optical element module, and the optical module of the present invention will be described with reference to the accompanying drawings. First, the configuration of a second embodiment of an optical module including the optical element and the optical element module of the present invention will be described.

  FIGS. 13-14 is a schematic side view which shows the structure of 2nd Embodiment of the optical module of this invention. The optical module 38a includes a mother board 7 and an optical element module 28a.

  In the first embodiment, the height of the coupling waveguide 2 on the light-emitting element body 1 and the height of the solder connection portion (solder ball) are substantially equal (FIG. 1), and the coupling waveguide on the light-receiving element body 11 is the same. An example in which the height of 12 and the height of the solder connection portion (solder ball) are substantially equal (FIG. 3) is shown. However, in the present embodiment, the height of the coupling waveguide 2 ′ from the light emitting surface of the light emitting element main body 1 is higher than the height of the solder connection portion (FIG. 13), and the light receiving surface of the light receiving element main body 11 An example of the case where the height of the coupling waveguide 12 ′ from the upper side is higher than the height of the solder connection portion (FIG. 14) will be described.

  Referring to FIG. 13, the light emitting element 10a includes a light emitting element body 1 and a coupling waveguide 2 '. The coupling waveguide 2 ′ penetrates the interposer substrate 5. The height is higher by the thickness of the interposer substrate 5 than the coupled waveguide 2 of the first embodiment. The coupling waveguide 2 ′ is in direct contact (coupling) with the optical waveguide 3. Thereby, compared with the first embodiment, even when the interposer substrate 5 is thick, it can be optically coupled with high efficiency. For example, as shown in FIG. 2, the light emitting elements 10a are arranged in a form of 1 row × 3 columns.

  The shape of the waveguide core 2a shown in FIGS. 5 to 6 can be similarly applied to the waveguide core 2a 'of the present embodiment. In this case, optical coupling can be performed with higher efficiency. The other structure of the light emitting element 10a is the same as that of the first embodiment (FIGS. 1 and 2).

  Referring to FIG. 14, the light receiving element 20a includes a light receiving element body 11 and a coupling waveguide 12 '. The coupling waveguide 12 ′ penetrates the interposer substrate 5. The height is higher by the thickness of the interposer substrate 5 than the coupled waveguide 12 of the first embodiment. The coupling waveguide 12 ′ is in direct contact (coupling) with the optical waveguide 3. Thereby, compared with the first embodiment, even when the interposer substrate 5 is thick, it can be optically coupled with high efficiency. For example, as shown in FIG. 4, the light receiving elements 20a are arranged in the form of 1 row × 3 columns corresponding to the light emitting elements 10a.

  The shape of the waveguide core 12a shown in FIGS. 7 to 8 can be similarly applied to the waveguide core 12a 'of the present embodiment. In this case, optical coupling can be performed with higher efficiency. The other structure of the light emitting element 20a is the same as that of the first embodiment (FIGS. 3 and 4).

  The interposer substrate 5 has a through-hole into which the coupling waveguide 2 ′ of the light emitting element 10 a and the coupling waveguide 12 ′ of the light receiving element 20 a enter. Other configurations of the interposer substrate 5 are the same as those in the first embodiment (FIGS. 1 to 4).

  Since the other structure in the optical module 38 is the same as that of 1st Embodiment (FIGS. 1-4), the description is abbreviate | omitted.

  In the present embodiment, it is possible to suppress the spread of light from the light emitting portion 42 of the light emitting element 10a to the optical path conversion mirror 4. Similarly, the spread of light from the optical path conversion mirror 14 to the light receiving portion 44 of the light receiving element 20a can be suppressed. That is, even when the interposer substrate 5 is thick, highly efficient optical coupling is possible. The light emitting element 10a has a positive divergence angle, and it is very effective in obtaining high-efficiency optical coupling to suppress the spread of light at a distance corresponding to the thickness of the interposer substrate 5 and to suppress light leakage. Is. By adopting a method of enlarging the core of the optical path conversion mirror 14, the spread light can be combined.

  Next, since the operation of the second embodiment of the optical module of the present invention is the same as that of the first embodiment, the description thereof is omitted.

  Next, a second embodiment of the optical element manufacturing method of the present invention will be described with reference to FIGS. FIGS. 15-17 is a perspective view which shows the process of 2nd Embodiment of the manufacturing method of the light emitting element of this invention.

  FIG. 15 shows a manufacturing process of the waveguide core according to this process. In the method for manufacturing a light emitting element, first, the light emitting element body 47 described with reference to FIG. 9 is prepared. Next, the first mold 55 is placed on the light emitting surface side (light emitting unit 46 side) of the light emitting element body 47. The first mold 55 has a plurality of columnar holes 56. The positions of the plurality of columnar holes 56 correspond to the positions of the plurality of light emitting units 46. When the first molding die 55 is placed on the light emitting element main body 47, the positions of the plurality of light emitting portions 46 and the corresponding ones of the plurality of columnar holes 56 are aligned. Subsequently, the base material of the waveguide core is poured into the holes 56 of the first mold 55. Thereafter, the first mold 55 and the light emitting element main body 47 into which the base material is poured are put into a cure oven, and the base material is cured to form the waveguide core 57. Since the waveguide core 57 is weakly shrunk due to the curing, it can be easily peeled off from the first mold 55.

  FIG. 16 shows a waveguide clad manufacturing process according to this process. Following the step of FIG. 15, the second mold 58 is placed on the light emitting element body 47. The second mold 58 has a plurality of columnar holes 59. The positions of the plurality of columnar holes 59 correspond to the positions of the plurality of light emitting portions 46 and have a size that encloses the waveguide core 57. When the second mold 58 is placed on the light emitting element main body 47, each of the plurality of light emitting portions 46 and the corresponding ones of the plurality of columnar holes 59 are overlapped (the optical axis of the waveguide core 57 is adjusted). Adjust the position). Next, the waveguide clad base material is poured into the holes 59 of the second mold 58. Thereafter, the second mold 58 and the light emitting element body 47 into which the base material has been poured are put into a cure oven, and the base material is cured to form the waveguide cladding 60. Since the waveguide clad 60 is weakly shrunk by curing, it can be easily peeled off from the second mold 58. This is shown in FIG. FIG. 17 shows a coupled waveguide according to this process. Thereafter, a solder ball 51 is mounted on an electrode pad (not shown) of the obtained light-emitting element body 47 to manufacture a light-emitting element.

  The light emitting element body 47, the waveguide core 57, and the waveguide cladding 60 correspond to the semiconductor element, the waveguide core 2a ′, and the waveguide cladding 2b ′ that are housed in the light emitting element body 1 in FIG. .

  In the present embodiment (FIGS. 15 to 17), an example in which an optical element is manufactured by forming a coupling waveguide on the light emitting element body 47 is described. Also in the light receiving element, it is possible to manufacture the coupled waveguide 12 ′ on the light receiving element body 11 by the same process as described above. Moreover, even if it is produced by other processes, it can be used for the optical module of the present invention if it has the same structure.

  Next, the second embodiment of the method for manufacturing an optical element module according to the present invention is the same as the first embodiment except that the interposer substrate 5 is provided with a through hole. Is omitted. The through hole of the interposer substrate 5 is provided at the position of the coupling waveguide 2 'of the light emitting element 10a and the position of the coupling waveguide 12' of the light receiving element 20a. Examples of the method for providing the through hole include laser processing, drilling, and etching.

  Next, the second embodiment of the optical module manufacturing method of the present invention is the same as the first embodiment except that the optical module shown in FIGS. .

  Also in this embodiment, it is possible to obtain the same effect as that of the first embodiment. In addition, since the light emitting element 10a and the optical waveguide 3 can be directly connected without interposing the interposer substrate 5, the spread of light from the light emitting portion can be suppressed and highly efficient optical coupling can be achieved.

(Third embodiment)
A third embodiment of the optical element, the optical element module, and the optical module of the present invention will be described with reference to the accompanying drawings. First, the configuration of the third embodiment of the optical module including the optical element and the optical element module of the present invention will be described.

  FIG. 18 is a schematic side view showing the configuration of the optical element module according to the third embodiment of the optical module of the present invention. The optical element module 28 ′ of the optical module includes an interposer substrate 5 ′ and a light emitting element 65.

  In the third embodiment, an example of an optical module when optically coupling light emitted from a backside light emitting element without optical path conversion is shown. Here, the back-emitting light emitting element is defined as a light emitting element in which the surface on which an electrode for driving the light emitting element is formed and the surface on which the light emitting part is formed are opposite to each other. .

  Referring to FIG. 18, in the present embodiment, the light emitting element 65 is formed in a form in which a plurality of light emitting elements 64 are arranged in parallel. The light emitting element 65 is sealed with a molded sealing body 66. The molded sealing body 66 is fixed to the interposer substrate 5 ′ with pins 68 at both ends thereof.

  The light emitting element 64 has a coupling waveguide 62 in a direction perpendicular to the surface of the light emitting element 64 opposite to the surface of the electrode connection (solder ball). The coupled waveguide 62 includes a waveguide core 62a and a waveguide cladding 62b. The coupling waveguide 62 is formed in a columnar shape in a state where the optical axis of the waveguide core 62 a is aligned with the optical axis of the light emitting unit 63. The rest of the light emitting element 64 is the same as the light emitting element 1 of the first embodiment.

  The optical waveguide 3 ′ includes a plurality of waveguide cores 3 a ′, a waveguide cladding 3 b ′ surrounding the waveguide core 3 a ′, and a connector 69 at the end thereof. The connector 69 includes a hole 69a into which the pin 68 can be inserted.

  FIG. 19 is a schematic diagram showing the configuration of the optical element in the third embodiment of the optical module of the present invention. (A) is a plan view, and (b) is a cross-sectional view. The light emitting elements 64 are arranged in an array on the molded sealing body 66. Cylindrical holes 67 are formed at both ends of the molded sealing body 66. By inserting the pins 68 into the holes 67, the molded sealing body 66 can be positioned on the interposer substrate 5 '. Then, when the pin 68 enters the hole of another part, the other part and the molded sealing body 66 can be positioned.

  In the light emitting element main body 47 of the light emitting element 65, a coupling waveguide 62 (waveguide core 62 a and waveguide clad 62 b) is provided on the light emitting portion 46. An electrical connection portion (electrode pad 52 and solder ball 51) for supplying power for driving the light emitting element 65 is provided on the surface opposite to the surface where the light emitting portion 46 is located.

  The positions of the holes 67 are formed so that, for example, the center of the waveguide core 62 a of the light emitting element 64 coincides with the line connecting the centers of the holes 67. Another component, for example, the optical waveguide 3 'is aligned so that the waveguide core 3a' is aligned on a line connecting the centers of the holes 69a. The hole 67 and the hole 69a have the same dimensions such as size and distance between holes. Therefore, by inserting the pin 68 into the hole 69a, the waveguide core 3a ′ of the optical waveguide 3 ′ and the waveguide core 62a of the coupling waveguide 62 of the light emitting element 65 can be positioned in an appropriate positional relationship. . Thereby, the optical signal emitted from the light emitting element 65 can be optically coupled with the optical waveguide 3 ′ and transmitted with high efficiency.

  The shape of the waveguide core 2a shown in FIGS. 5 to 6 can be similarly applied to the waveguide core 62a of the present embodiment. In this case, optical coupling can be performed with higher efficiency.

  The interposer substrate 5 ′ is the same as that of the first embodiment except that the light emitting element 65 is used as the light emitting element and the optical waveguide 3 ′ is used as the optical waveguide.

  In the above description, only the light emitting side is described, but the same applies to the light receiving side.

  Since the optical module and the light emitting element module are the same as those in the first embodiment except that the interposer substrate 5 ′ is used, the description thereof is omitted.

Next, the operation of the third embodiment of the optical module of the present invention will be described.
The electrical signal of the LSI 8 is transmitted from the output port of the LSI 8 to the driver IC 6 to drive the light emitting element 65. The light emitting element 65 converts an electric signal into an electric signal to be an optical signal of a laser beam. The light emitting element 65 outputs an optical signal from the light emitting unit 63 to the waveguide core 62a. The optical signal propagates through the waveguide core 62 and reaches the end portion of the waveguide core 62 a formed on the light emitting element 65. The optical signal passes through the connector 69 aligned by the positioning holes 67 formed at both ends of the molded sealing body 66, and enters the other waveguide core 3a '. An optical signal incident on another waveguide core 3a ′ passes through a connector 69 provided at the other end of the waveguide 3a ′, and is a waveguide core (not shown) formed on a light receiving element (not shown). Not incident). The light receiving element (not shown) photoelectrically converts the optical signal of the laser into an electrical signal and drives the receiver IC 16. Then, by entering the input port of another LSI 18, transmission / reception with the other LSI 18 can be performed.

  The third embodiment of the optical element manufacturing method of the present invention is the same as the first embodiment except that the electrode pad 52 of the light emitting element body 47 is provided on the opposite surface. Therefore, the description is omitted. However, as an additional step, the obtained light-emitting element is molded and sealed with a synthetic resin or the like, a positioning hole is drilled at a predetermined position of the molded sealing body, A solder ball is mounted on the electrode pad.

  Next, in the third embodiment of the method for manufacturing an optical element module of the present invention, an interposer substrate 5 ′ is used as shown in FIGS. 18 and 19, and the light emitting element 65 is used as the light emitting element, and the optical waveguide is used. Since the optical waveguide 3 ′ is the same as in the first embodiment except that the optical waveguide 3 ′ is used, the description thereof is omitted.

  Next, the third embodiment of the method for manufacturing an optical module of the present invention is the same as the first embodiment except that the above-described optical element module is used.

  In the present embodiment, as shown in FIG. 18, the light emitting element 64 is attached to the interposer substrate 5 'so that the waveguide core 62a extends in a direction perpendicular to the interposer substrate 5'. However, the light emitting element 64 may be attached to the interposer substrate 5 ′ so that the waveguide core 62 a extends in a horizontal direction with respect to the interposer substrate 5 ′.

  Also in the present invention, the same effect as that of the first embodiment can be obtained. In addition, the optical waveguides on the light emitting element are formed in a plurality of rows, and a large number of optical signals can be transmitted at once.

(Fourth embodiment)
A fourth embodiment of an optical element, an optical element module, and an optical module according to the present invention will be described with reference to the accompanying drawings. First, the configuration of a fourth embodiment of an optical module including the optical element and the optical element module of the present invention will be described.

  20 to 21 are schematic views showing the configuration of the fourth embodiment of the optical module of the present invention. FIG. 20 is a schematic side view of the light emitting side of the optical module, and FIG. 21 is a schematic plan view thereof. The optical module 38b includes a mother board 7 and an optical element module 28b.

  In the second embodiment, the example in which the light emitting element 10a is optically coupled to the one-layer waveguide core 2a (FIGS. 13 and 14) is shown. In the present embodiment, a plurality of lights emitted from a plurality of light emitting elements 10a are optically coupled to a multi-channel optical waveguide 3 that forms a multilayer waveguide core 3a, and a connector 72 formed at the other end is connected. The example of the optical module 38b in the case of transmitting / receiving between the some light receiving element 20 mounted in the other board via is shown (FIG. 20, FIG. 21).

  The light emitting element 70 includes a plurality of light emitting elements 10a. Each light emitting element 10a is the same as the light emitting element 10a of the second embodiment. That is, the light emitting element 10a includes the light emitting element main body 1 and the coupling waveguide 2 '. The coupling waveguide 2 ′ penetrates the interposer substrate 5. The height is higher by the thickness of the interposer substrate 5 than the coupled waveguide 2 of the first embodiment. The coupling waveguide 2 ′ is directly coupled to the optical waveguide 3. Thereby, compared with the first embodiment, even when the interposer substrate 5 is thick, it can be optically coupled with high efficiency. However, the light emitting elements 10a are arranged in the form of 2 rows × 6 columns in the present embodiment. The light emitting element 10a is driven by a driver IC 6 provided for each column. Other than the light emitting element 10a, it is the same as that of 2nd Embodiment (FIG. 1, FIG. 2).

  The shape of the waveguide core 2a shown in FIGS. 5 to 6 can be similarly applied to the waveguide core 2a 'of the present embodiment. In this case, optical coupling can be performed with higher efficiency.

  The optical waveguide 3 has two layers in which the waveguide cores 3a are arranged in six rows. That is, the optical waveguide 3 has a plurality (2 rows × 6 columns) of waveguide cores 3 a. The end portion is subjected to 45 ° mirror processing, and each waveguide core 3a transmits an optical signal emitted from a corresponding one of the plurality of light emitting elements 10a. Other than the optical waveguide 3, it is the same as that of 2nd Embodiment (FIG. 1, FIG. 2).

  The optical waveguide 3 in the present embodiment has waveguide cores 3a formed in multiple stages. Therefore, it is possible to optically couple multi-channel signals with higher density than in the case where the waveguide core 3a is in one stage (first and second embodiments).

  A substrate 73 is provided below the optical waveguide cladding 3b at the end of the optical waveguide 3 on the side that receives light emitted from the light emitting element 10a and changes the optical path. This is to increase the strength of this portion of the optical waveguide 3. This portion of the waveguide cladding 3b and the substrate 73 is inserted into a connector 72 attached to another board (not shown).

  Since other configurations in the optical module 38b are the same as those in the second embodiment (FIG. 13), description thereof is omitted.

FIG. 22 is a front view showing a state of connection between the optical waveguide 3 and the connector 72. (A) shows a state of only the connector, and (b) shows a state where the connector 72 and the optical waveguide 3 are connected. Referring to (a), the connector 72 has a housing 78, a coupling hole 74, a protrusion 75, and a pin hole 76. The coupling hole 74 is a hole for inserting the optical waveguide 3. The protrusion 75 fits into a V groove 79 (described later) of the optical waveguide 3 and is used for alignment of the optical waveguide 3. The pin hole 76 is a cylindrical hole for a pin that fixes the housing 78 to another board (not shown).
Referring to (b), V-grooves 79 are formed on both sides of the optical waveguide 3 (waveguide cladding 3b and substrate 73) with the waveguide core 3a interposed therebetween. The V-groove 79 is accurately aligned with the distance from the waveguide core 3a and the depth of the groove. Thereby, when the optical waveguide 3 is inserted into the coupling hole 74, the protrusions 75 of the connector 72 are fitted into the V-groove 79, whereby the connector 72 and the optical waveguide 3 can be easily aligned. The optical waveguide 3 can be fixed with high precision in the housing 78 of the connector 72 by resin-sealing the optical waveguide 3 to the connector 72. By inserting the pin 77 into the pin hole 76 of the connector 72, the quartz fibers (not shown) arranged with high accuracy and the optical waveguide 3 can be accurately aligned.

  Next, the operation of the fourth embodiment of the optical module of the present invention is the same as that of the second embodiment except that a multi-channel optical signal is transmitted.

  Next, since the fourth embodiment of the optical element manufacturing method of the present invention is the same as the second embodiment, the description thereof is omitted.

  Next, an embodiment of a method for manufacturing the optical waveguide 3 of the present invention will be described. 23 to 24 are cross-sectional views showing the steps of the embodiment of the optical waveguide manufacturing method of the present invention. Here, a process of manufacturing a film waveguide as an optical waveguide will be described.

  Referring to FIG. 23, first, a base material 81 having flatness and capable of transmitting UV light is prepared (FIG. 23 (a)). Next, an adhesive layer 82 whose adhesion strength with the base material 81 is reduced by UV light irradiation is formed on the base material 81 (FIG. 23B). Subsequently, a protective layer 83 that does not transmit UV light is formed on the adhesive layer 82 (FIG. 23C). Three layers of a clad layer 84b, a core layer 84a, and a clad layer 84b of a polymer waveguide are formed on the protective layer 83 by repeating coating, exposure, and curing to form an optical waveguide 84 (FIG. 23D). . About the obtained optical waveguide 84, a V-groove is formed at a predetermined position. The V groove can be formed, for example, by processing with a dicing saw using a blade having a V groove shape.

  The role of the protective layer 83 is to prevent the adhesion strength of the adhesive layer 82 from being lowered and peeled off by the UV light irradiated at the time of exposure for producing the optical waveguide 84. The adhesive layer 82 may have a mechanism in which the foaming agent contained in the adhesive layer 82 is foamed by UV light and has a mechanism for reducing adhesion by generating gas. By using the adhesive layer 82 having such a mechanism, the base material 81 can be locally peeled by UV light irradiation, and the optical waveguide 3 can be peeled from the base material 81 with low stress. Become. By adopting the method as described above, the support for the polymer waveguide can be removed without any trouble during the production of the film waveguide. In addition, a method of forming an optical waveguide on a substrate that does not transmit UV light and peeling the polymer waveguide with heat or a solvent to form a film is also conceivable. It is unsuitable.

  Referring to FIG. 24, after forming the V-groove, both ends of the waveguide pattern are left from the substrate 81 side, and a kerf 85 is formed (FIG. 24A). Subsequently, UV light is irradiated from the substrate 81 side through the mask 86 (FIG. 24B). Thereby, only the part which wants to film-form is irradiated with UV light. When nitrogen is generated from the foaming agent contained in the adhesive layer 82, an air layer is formed at the interface between the base material 81 and the adhesive layer 82, and the base material 87 that is a part of the base material 81 can be easily peeled off. (FIG. 24 (c)). Thereby, the bottom portion 88 of the optical waveguide is exposed. Using the V-groove processing formed at the end of the obtained film waveguide, it can be aligned with the protrusion on the connector and can be optically coupled to the quartz fiber.

  The material of the transparent substrate 81 which is the support substrate shown above is not particularly limited to an inorganic material such as glass as long as it is flat and can transmit UV light. . An organic film material such as polyimide, polyethylene terephthalate, or polyethylene naphthalate can be processed in the same manner. It can be used properly according to required heat resistance conditions, weight, light transmittance, application and the like.

  By performing the same film formation process as described above on both sides of the polymer waveguide, it is possible to leave a supporting base material with a structure sandwiching the waveguide. When bonding with the quartz fiber, it is possible to reduce the optical axis shift at the time of thermal cycle application by sandwiching a support base material having a low linear expansion coefficient. In the case of forming a multi-layered optical waveguide, etc., the influence of the optical axis shift appears more severely, so it is effective to adopt the above method.

  One end of the film waveguide formed as described above was subjected to wedge processing (mirror processing) at 45 ° using a dicing saw. The dicing process may be performed before or after removing the base material of the waveguide. However, in order to improve processing accuracy, it is desirable to perform the processing with the base material.

  Next, regarding the fourth embodiment of the method for manufacturing an optical element module of the present invention, the optical waveguide 3 is the same as the optical waveguide 3 except that a plurality of columns × multiple rows of light emitting elements and the corresponding optical waveguide 3 are used. Since this is the same as the second embodiment, the description thereof is omitted.

  Also in the present invention, the same effect as in the second embodiment can be obtained. In addition, since the optical waveguide formed on the optical element or the optical element surface has a columnar or V-groove processing, it can be easily coupled with other optical lines using pins or the like. Become.

  Each embodiment in the present invention may be implemented together as long as no contradiction occurs.

FIG. 1 is a schematic side view showing the configuration of the first embodiment of the optical module of the present invention. FIG. 2 is a schematic plan view showing the configuration of the first embodiment of the optical module of the present invention. FIG. 3 is a schematic side view showing the configuration of the first embodiment of the optical module of the present invention. FIG. 4 is a schematic plan view showing the configuration of the first embodiment of the optical module of the present invention. FIG. 5 is a schematic sectional view showing the vicinity of the light emitting element in FIG. FIG. 6 is a schematic cross-sectional view showing an example of the shape of the coupled waveguide in FIG. FIG. 7 is a schematic cross-sectional view showing the vicinity of the light receiving element in FIG. FIG. 8 is a schematic cross-sectional view showing an example of the shape of the coupled waveguide in FIG. FIG. 9 is a schematic view showing one step of the first embodiment of the method for producing a light-emitting device of the present invention. FIG. 10 is a schematic view showing one step of the first embodiment of the method for producing a light-emitting device of the present invention. FIG. 11 is a schematic view showing one step of the first embodiment of the method for producing a light-emitting device of the present invention. FIG. 12 is a schematic view showing one step of the first embodiment of the method for producing a light-emitting device of the present invention. FIG. 13: is a schematic side view which shows the structure of 2nd Embodiment of the optical module of this invention. FIG. 14 is a schematic side view showing the configuration of the second embodiment of the optical module of the present invention. FIG. 15 is a perspective view showing one process of the second embodiment of the method for manufacturing the light-emitting element of the present invention. FIG. 16 is a perspective view showing a step of the second embodiment of the method for manufacturing a light-emitting device of the present invention. FIG. 17 is a perspective view showing one process of the second embodiment of the method for manufacturing the light-emitting element of the present invention. FIG. 18 is a schematic side view showing the configuration of the optical element module according to the third embodiment of the optical module of the present invention. FIG. 19 is a schematic diagram showing the configuration of the optical element in the third embodiment of the optical module of the present invention. FIG. 20 is a schematic side view showing the configuration of the fourth embodiment of the optical module of the present invention. FIG. 21 is a schematic plan view showing the configuration of the optical module according to the fourth embodiment of the present invention. FIG. 22 is a front view showing a state of connection between the optical waveguide and the connector. FIG. 23 is a cross-sectional view showing the steps of the embodiment of the method for manufacturing an optical waveguide of the present invention. FIG. 24 is a cross-sectional view showing the steps of the embodiment of the method for manufacturing an optical waveguide of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting element body 2, 2 ', 12, 12' Coupling waveguide 2a, 12a, 2a ', 12a' Waveguide core 2b, 12b, 2b ', 12b' Waveguide clad 3, 3 'Optical waveguide 3a, 3a Waveguide core 3b, 3b Waveguide clad 4, 14 Optical path conversion mirror 5, 5 'Interposer substrate 6 Driver IC
7 Motherboard 8, 18 LSI
10, 10a Light emitting element 11 Light receiving element body 16 Receiver IC
20, 20a Light receiving element 21, 22, 23, 24, 25, 26 Wiring 28, 28a, 28b Optical element module 31, 32, 33, 34 Wiring 38, 38a, 38b Optical module 42 Light emitting part 44 Light receiving part 45 Light emitting Element wafer 46 Light-emitting portion 47 Light-emitting element body 48 Polymer base material layer 48 ′ Waveguide clad 49 Glass mask 50 Waveguide core 51 Solder ball 52 Electrode pad 55 First mold 56 Hole 57 Waveguide core 58 Second mold 59 Hole 60 Waveguide Cladding 61 Light-Emitting Element Body 62 Coupling Waveguide 62a Waveguide Core 62b Waveguide Cladding 63 Light-Emitting Portion 64, 65 Light-Emitting Element 66 Molded Seal 67 67 Hole 68 Pin 69 Connector 69
69a hole 72 connector 73 substrate 74 coupling hole 75 protrusion 76 pin hole 77 pin 78 housing 79 V groove 81 base material 82 adhesive layer 83 protective layer 84 optical waveguide 84a core layer 84b cladding layer 86 mask

Claims (25)

An optical element body having a light emitting portion for emitting light;
A first core portion having a first refractive index, provided in contact with the light emitting portion, and guiding the light;
An optical element comprising: a first clad portion having a second refractive index different from the first refractive index and provided so as to surround the first core portion. The optical element according to claim 1,
The area of the first region where the first core portion is in contact with the light emitting portion is equal to or greater than the area of the second region where the light emitting portion emits the light, and the first region is the second region. An optical element that encompasses a region. The optical element according to claim 1 or 2,
The optical element body has a plurality of the light emitting portions,
An optical element provided with a plurality of the first cores corresponding to the plurality of light emitting units. An optical element body having a light receiving portion for receiving light;
A first core portion having a first refractive index, provided in contact with the light receiving portion, and guiding the light;
An optical element comprising: a first clad portion having a second refractive index different from the first refractive index and provided so as to surround the first core portion. The optical element according to claim 4,
The area of the fourth region where the light receiving portion receives the light is equal to or greater than the area of the third region where the first core portion is in contact with the light receiving portion, and the fourth region is the third region. An optical element that encompasses a region. The optical element according to claim 4 or 5,
The optical element body has a plurality of the light receiving parts,
An optical element provided with a plurality of the first cores corresponding to the plurality of light receiving portions. The optical element according to any one of claims 1 to 6,
The first core portion extends in a direction perpendicular to the surface of the optical element body. The optical element according to any one of claims 1 to 7,
The first core part is a columnar optical element. The optical element according to claim 8, wherein
The first cladding portion is a columnar optical device. The optical element according to any one of claims 1 to 9,
An optical element in which a cross-sectional area perpendicular to an axis along which the light is guided in the first core portion monotonously decreases along a direction in which the light is guided. The optical device according to any one of claims 1 to 10,
The first core portion and the first cladding portion are optical elements formed of synthetic resin. The optical element according to claim 11,
The synthetic resin is a photosensitive synthetic resin. The optical element according to claim 11 or 12,
The synthetic resin of the first core portion is an optical element having a transmittance of 90% or more with respect to the wavelength of the light. The optical element according to any one of claims 1 to 13,
The optical element in which the first refractive index is 1.0% or more larger than the second refractive index. The optical element according to any one of claims 1 to 14,
The optical element whose wavelength of the said light is 1000 nm or less. A substrate,
An optical element module comprising: the optical element according to claim 1 provided on one surface of the substrate. The optical element module according to claim 16, wherein
The optical element module, wherein a direction in which the light travels in the optical element is perpendicular to the substrate. The optical element module according to claim 17, wherein
Further comprising an optical waveguide provided on the other surface of the substrate;
The optical waveguide is
A second core portion having a third refractive index and guiding the light;
A second clad part having a fourth refractive index different from the third refractive index and provided so as to surround the second core part,
An end of the optical waveguide having an optical path conversion mirror is provided at a position opposite to the optical element across the substrate,
A direction in which the light travels in the optical element is a direction toward the substrate;
The optical element module in which the tips of the first core part and the first cladding part are in contact with the substrate. The optical element module according to claim 17, wherein
Further comprising an optical waveguide provided on the other surface of the substrate;
The optical waveguide is
A second core portion having a third refractive index and guiding the light;
A second clad part having a fourth refractive index different from the third refractive index and provided so as to surround the second core part,
An end of the optical waveguide having an optical path conversion mirror is provided at a position opposite to the optical element across the substrate,
A direction in which the light travels in the optical element is a direction toward the substrate;
An optical element module, wherein tips of the first core part and the first cladding part are in contact with the end part of the optical waveguide. The optical element module according to claim 18 or 19,
The second cladding portion includes a recess,
An optical element module that aligns the optical waveguide with the other transmission line by fitting the concave part with a convex part of a component related to the other transmission line. With the motherboard,
21. An optical module comprising the optical element module according to any one of claims 16 to 20 mounted on the mother board. (A) a step of forming an optical element body having a light conversion portion that performs either one of light reception and light emission;
(B) forming a first core part on the light conversion part, and forming a first cladding part in a predetermined region excluding the light conversion part of the optical element body,
The first core portion has a first refractive index, is provided in contact with the light conversion portion, and guides the light.
The method of manufacturing an optical element, wherein the first cladding part has a second refractive index different from the first refractive index and is formed so as to surround the first core part. In the manufacturing method of the optical element of Claim 22,
The step (b)
(B1) applying a photosensitive synthetic resin on the optical element body;
(B2) exposing the synthetic resin on the light conversion unit;
(B3) A step of heat-treating the synthetic resin. In the manufacturing method of the optical element of Claim 22,
The step (b)
(B4) installing a first frame on the optical element body;
Here, the first frame has a cylindrical first hole, and the first hole surrounds a space on the light conversion unit,
(B5) inserting a first synthetic resin into the first hole;
(B6) heat-treating the optical element body and the first frame containing the first synthetic resin to form the first core portion;
(B7) replacing the first frame on the optical element body with a second frame;
Here, the second frame has a cylindrical second hole, the second hole surrounds a space on the light conversion unit, and is larger than the first hole,
(B8) inserting a second synthetic resin into the second hole;
(B9) A step of heat-treating the optical element body and the second frame containing the second synthetic resin to form the first cladding part. In the manufacturing method of the optical element according to any one of claims 22 to 24,
The said (b) process is a manufacturing method of the optical element whose temperature to apply is 100 degreeC or more and 350 degrees C or less.

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