JP2005181645A - Optical waveguide, manufacturing method therefor, and optical information processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide capable of effectively coupling outgoing light from a light source, a method for manufacturing this optical waveguide easily at a low cost with high productivity, and to provide an optical information processor using this optical waveguide. <P>SOLUTION: The optical waveguide 1 consists of a cemented body of a clad layer 2 and a core layer 4, and is constituted so that the light is made incident to the core layer 4 through the clad layer 2, and a light condensing means 7 is formed integrally with the clad layer 2 at a position corresponding to a light incident part 5 to the core layer 4. The method for manufacturing the optical waveguide 1 includes a process for molding the light condensing means 7 integrally with the clad layer 2 at the position corresponding to the light incident part 5 to the core layer 5, and a process for cementing the clad layer 2 to the core layer 4 on the surface opposite to the light condensing means 7. The optical information processor has: the optical waveguide 1 of this invention; a light incident means 81 for making the light incident to the core layer 4 of the optical waveguide 1; and a light receiving means 91 for receiving the outgoing light from the core layer 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical waveguide suitable for a light source module, optical interconnection, optical communication, and the like, a manufacturing method thereof, and an optical information processing apparatus.

  Currently, signal propagation between semiconductor chips such as LSIs (Large Scale Integrated Circuits) is all made by electrical signals via substrate wiring. However, with the recent increase in MPU functionality, the amount of data exchanged between chips has increased remarkably, and as a result, various high frequency problems have emerged. Typical examples thereof include RC signal delay, impedance mismatch, EMC / EMI, crosstalk, and the like.

  In order to solve the above problems, the mounting industry and others have so far taken the lead in solving various problems such as optimization of wiring layout and development of new materials.

  However, in recent years, the effects of optimization of the wiring layout and development of new materials have been hampered by physical limitations, and it is assumed that simple semiconductor chips will be mounted in order to realize further advanced system functionality in the future. It has become necessary to review the structure of the printed wiring board itself. In recent years, various drastic measures have been proposed to solve these problems, but the following are representative examples.

-Fine wiring bonding by multi-chip module (MCM) High-performance chip is mounted on a precision mounting substrate such as ceramic and silicon, and fine wiring bonding that cannot be formed on a motherboard (multilayer printed circuit board) is realized. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Sealing and integration of various semiconductor chips and electrical wiring bonding by integration Various semiconductor chips are two-dimensionally sealed and integrated using polyimide resin or the like, and fine wiring bonding is performed on the integrated substrate. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Three-dimensional bonding of semiconductor chips A through electrode is provided in various semiconductor chips, and each is bonded to form a laminated structure. Thereby, the connection between the different types of semiconductor chips is physically short-circuited, and as a result, problems such as signal delay are avoided. On the other hand, however, problems such as an increase in the amount of heat generated due to lamination and thermal stress between semiconductor chips occur.

  Furthermore, in order to realize high speed and large capacity of signal transmission / reception as described above, an optical transmission coupling technique using optical wiring has been developed (for example, see Non-Patent Document 1 and Non-Patent Document 2 described later). . The optical wiring can be applied to various places such as between electronic devices, between boards in an electronic device, or between chips in a board. For example, as shown in FIG. 24, for transmission of signals over a short distance such as between chips, an optical waveguide 51 is formed on a printed wiring board 57 on which the chips are mounted, and the optical waveguide 51 is subjected to signal modulation. In addition, it is possible to construct an optical transmission / communication system using a transmission path of laser light or the like. Further, as shown in FIG. 25, the optical waveguide 51 includes clad layers 54 and 55 and a core layer 56 sandwiched between the clad layers 54 and 55, and an end face on the light incident side of the core layer 56 is It is formed on a 45 ° mirror surface.

  In the optical transmission coupling technique using the optical wiring as described above, laser light or LED (light-emitting diode) light is used as a light source, and these light sources have a wide beam shape. In order to condense the signal light 53 emitted from the light source and efficiently enter the light into the optical waveguide 51, the optical waveguide 51 according to the conventional example is provided between the light emitting element 50 and the optical waveguide 51 as shown in FIG. An optical component 52 such as a lens is separately or retrofitted. Such an optical waveguide 51 is formed, for example, by forming a joined body including a clad layer 54, a core layer 56, and a clad layer 55, and processing the incident end face into a 45 ° mirror surface by machining using a dicing saw or the like. It can be manufactured by dropping and solidifying a lens material as the optical component 52 on the clad layer 54.

Nikkei Electronics, “Encounter with Optical Wiring”, December 3, 2001, pages 122, 123, 124, 125, FIG. 4, FIG. 5, FIG. 6, FIG. NTT R & D, vol.48, no.3, pp.271-280 (1999)

  However, when the optical component 52 such as a lens is installed separately or retrofitted as in the conventional example described above, it is necessary to adjust the optical axis between the optical waveguide 51 and the optical component 52, and the positioning accuracy of the optical component 52 is difficult. It is. In addition, the manufacturing process becomes complicated, resulting in an increase in cost, and the number of parts is increased, thereby deteriorating productivity.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide an optical waveguide capable of effectively optically coupling light emitted from a light source, and to facilitate the optical waveguide. Another object of the present invention is to provide a method that can be manufactured at low cost and high productivity, and an optical information processing apparatus having this optical waveguide.

  That is, the present invention comprises a joined body of a clad layer and a core layer, and is configured such that light is incident on the core layer through the clad layer, and at a position corresponding to a light incident portion with respect to the core layer, a light focusing means Are related to the optical waveguide formed integrally with the cladding layer.

  A method of manufacturing an optical waveguide comprising a joined body of a clad layer and a core layer and configured to allow light to enter the core layer through the clad layer, the position corresponding to a light incident portion with respect to the core layer The method of manufacturing an optical waveguide, comprising: a step of integrally forming a light focusing means with the cladding layer; and a step of bonding the cladding layer to the core layer on a surface opposite to the light focusing means. It is.

  Furthermore, the present invention relates to an optical information processing apparatus comprising the above-described optical waveguide of the present invention, light incident means for making light incident on the core layer of the optical waveguide, and light receiving means for receiving light emitted from the core layer. is there.

  According to the present invention, since the light focusing means is integrally formed with the cladding layer at a position corresponding to the light incident portion with respect to the core layer, an optical component such as a lens is separately provided as in the conventional example described above. Or compared with the case where it installs by retrofitting, the positioning accuracy of the said light focusing means is easy, and manufacture is also easy, and it can reduce cost. Further, since the light focusing means is integrally formed with the cladding layer, the number of parts does not increase and the productivity is high. Furthermore, the light converging means integrally formed with the clad layer allows the light emitted from the light source to be effectively incident on the core layer, thereby improving the optical coupling efficiency.

  Since the optical waveguide of the present invention has the excellent effects as described above, it can be suitably used as an optical information processing apparatus such as an optical wiring.

  In the optical waveguide of the present invention, the core layer plays a role of guiding incident signal light, and the cladding layer plays a role of confining the signal light in the core layer. The core layer is made of a material having a high refractive index, and the cladding layer is made of a material having a refractive index lower than that of the core layer.

  In the light emitting portion of the core layer, it is preferable that collimation or focusing means for light emitted from the core layer through the cladding layer is integrally formed with the cladding layer. Thereby, the emitted light emitted from the optical waveguide based on this invention can be collimated or focused effectively, and the said light-receiving means can receive the said emitted light efficiently.

  Preferably, the light focusing or collimating means is made of the same material as the cladding layer. Specifically, the cladding layer and the light focusing means may be made of an injection molding resin for optical elements (for example, Japan). Zeon's product name ZEONEEX).

  The light focusing or collimating means is preferably a convex lens, and the convex lens can be formed by stamping, for example.

  Further, it is desirable that at least the light incident portion of the core layer is formed on an inclined mirror surface, for example, a 45 ° mirror surface. The core layer with the inclined mirror surface can be formed by injection molding. By the injection molding, the inclined mirror surface can be formed without directly processing the core layer, so there is no damage during production, the surface state can be smoothed, and good quality easily and accurately. A simple optical waveguide can be produced. In addition, by forming the light incident portion of the core layer on the inclined mirror surface, signal light emitted from a light source such as a laser or LED can be more efficiently incident on the core layer. As the material for the core layer, conventionally known materials can be used, and examples include UV (ultraviolet) curable resins such as fluorine-based polyimide.

  Further, it is preferable that the core layer is sandwiched between the clad layer and another clad layer, and the former clad layer is formed longer than the latter clad layer in the light propagation direction. Here, examples of the material of the latter cladding layer include polycarbonate.

  In the optical waveguide manufacturing method of the present invention, specifically, the light focusing means is integrally formed with the cladding layer, and a core material is filled between the cladding layer and a mold corresponding to the core layer. It is preferable that the core layer bonded to the clad layer is peeled off from the mold.

  Then, the present invention efficiently collects and emits a predetermined light flux by the optical waveguide, or emits the signal light after efficiently entering the optical waveguide to the light receiving element (optical wiring, photodetector, etc.) of the next stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured to be incident.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

First Embodiment FIG. 1 is a schematic sectional view of an optical waveguide according to the present invention. As shown in FIG. 1, the optical waveguide 1 has a core layer 4 sandwiched between a clad layer 2 and another clad layer 3. The core layer 4 serves to guide the incident signal light, and the cladding layers 2 and 3 serve to confine the signal light in the core layer 4. The core layer 4 is made of a material having a high refractive index, and the cladding layers 2 and 3 are made of a material having a refractive index lower than that of the core layer 4.

  A convex lens 7 as the light focusing means is integrally formed with the cladding layer 2 at a position corresponding to the light incident portion 5 with respect to the core layer 4.

  As shown in FIGS. 1 and 2, an optical component 12 may be installed in a light emitting element 81 such as a laser, and signal light (for example, laser light) 30 emitted from the light emitting element 81 by the optical component 12 is parallel. Collimated into light. Then, the parallel light is focused by the convex lens 7 as the light focusing means and is effectively incident on the core layer 4. In this case, as shown in FIG. 2, since the optical waveguide 1 according to the present invention has the convex lens 7 as the light focusing means, even when the positions of the light emitting element 81 and the optical component 12 are slightly shifted, the light emitting element The signal light 30 from 81 can be effectively focused and incident on the core layer 4 so that optical coupling can be performed efficiently.

  Further, in the light emitting portion 6 of the core layer 4, it is preferable that a convex lens 7 as a collimating or focusing means for light emitted from the core layer 4 through the cladding layer 2 is integrally formed with the cladding layer 2. Thereby, the light emitted from the optical waveguide 1 according to the present invention can be collimated or focused effectively, and the light receiving element (optical wiring, photo detector, etc.) 91 as the light receiving means can efficiently receive the signal light. be able to.

  Here, for example, the thickness of the convex lens 7 can be 50 μm, and the lens diameter can be about Φ100 μm. The thickness of the cladding layer 2 (excluding the thickness of the convex lens 7) can be 500 μm, and the thickness of the core layer 4 can be 15 μm and the width can be 5 μm. Furthermore, the thickness of the clad layer 3 can be 100 μm.

  Further, it is desirable that the convex lens 7 is made of the same material as that of the clad layer 2. Specifically, as the material of the clad layer 2 and the convex lens 7, an injection molding resin for optical elements (for example, a product name manufactured by Nippon Zeon Co., Ltd.) ZEONEX) and the like. On the other hand, examples of the material of the clad layer 3 include polycarbonate.

  Further, it is desirable that the light incident / exit portions 5 and 6 of the core layer 4 are formed on an inclined mirror surface, for example, a 45 ° mirror surface. The core layer 4 with the inclined mirror surface can be formed by injection molding. By the injection molding, the inclined mirror surface can be formed without directly processing the core layer 4, so that there is no damage during production, the surface state can be smoothed, and good quality easily and accurately. A simple optical waveguide 1 can be produced. Further, by forming the light incident / exit portions 5 and 6 of the core layer 4 on the inclined mirror surface, the signal light 30 emitted from the light emitting element 81 such as a laser can be incident on the core layer 4 more efficiently. Further, the incident signal light 30 can be guided and emitted to the light receiving element 91 effectively. As the material for the core layer 4, conventionally known materials can be used, and examples thereof include UV (ultraviolet) curable resins such as fluorine-based polyimide.

  Such an optical waveguide 1 according to the present invention is efficiently condensed into a predetermined light flux by the optical waveguide 1 and emitted, or the signal light 30 emitted after being efficiently incident on the optical waveguide 1 is output from the next stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured to be incident on a light receiving element (such as an optical wiring or a photodetector) 91.

  Next, an example of the manufacturing method of the optical waveguide 1 based on this invention is demonstrated with reference to FIG.3 and FIG.4.

  First, as shown in FIG. 3A, a clad material 2a that forms the basis of the clad layer 2 is formed. Examples of the clad material 2a include injection molding resins for optical elements (for example, product name ZEONEX manufactured by Nippon Zeon Co., Ltd.). Next, as shown in FIG. 3B, stamping is performed using a Ni mold 10 having a shape corresponding to the convex lens 7. Thereby, the convex lens 7 can be integrally formed with the clad layer 2 as shown in FIG.

  On the other hand, as shown in FIG. 3 (d), a core material 4 a is filled in a quartz mold 11 having a shape corresponding to the light incident portion 5 and the light emitting portion 6 of the core layer 4. A conventionally well-known thing can be used as the core material 4a, and UV (ultraviolet ray) curable resin, for example, a fluorine-type polyimide etc. are mentioned. The quartz mold 11 can be easily manufactured, for example, by binary mask exposure and dry etching.

  Next, as shown in FIG. 4 (e), the clad layer 2 produced above is placed on the quartz mold 11 filled with the core material 4a with the surface having the convex lens 7 facing upward, and ultraviolet rays are irradiated. The core material 4a is solidified by irradiation or the like. Then, as shown in FIG. 4 (f), the core layer 4 bonded to the cladding layer 2 is peeled from the quartz mold 11. In this way, by forming the light incident / exit portions 5 and 6 of the core layer 4 on the inclined mirror surface, for example, a 45 ° mirror surface by injection molding, the inclined mirror surface can be formed without directly processing the core layer 4. Since it can be formed, there is no damage during production, the surface state can be smoothed, and the optical waveguide 1 of good quality can be produced easily and accurately.

  Next, as shown in FIG. 4G, the optical waveguide 1 according to the present invention can be manufactured by further disposing the clad layer 3 on the opposite side of the core layer 2 from the clad layer 2. . The clad layer 3 can be produced by injection molding or the like, and the material is, for example, polycarbonate.

  According to the present embodiment, the convex lens 7 as the light converging means is integrally formed with the cladding layer 2 at the position corresponding to the light incident / exiting portions 5 and 6 with respect to the core layer 4, so that the positioning of the convex lens 7 is easy. In addition, the manufacturing is easy and the cost can be reduced. Moreover, since the convex lens 7 is integrally formed with the cladding layer 2, the number of parts does not increase and the productivity is high.

Second Embodiment FIG. 10A is a diagram showing the arrangement of the light emitting element 81, the light receiving element 91, and the optical waveguide 1 as seen from the cladding layer 3 (not shown) side in FIG. ) Is a side view seen from the X direction in FIG. 10A, and FIG. 10C is a side view seen from the Y direction in FIG. 10A. In addition, in FIG.10 (b) and (c), it has shown upside down.

  In the optical waveguide 1 shown in FIG. 10, a plurality of core layers 4 each having a light incident portion 5 and a light emitting portion 6 which are 45 ° mirror surfaces are arranged in parallel. 6 positions are aligned in the length direction.

  The light emitting element array 8 includes a plurality of light emitting elements 81 arranged at positions corresponding to the light incident portions 5 of the respective core layers 4. In the gaps between the light emitting elements 81, penetrating electrodes (not shown) for electrical connection between the light emitting elements 81 and the semiconductor integrated circuit chip (not shown) are arranged. The light receiving element array 9 is the same as the light emitting element array 8 described above.

  In the optical waveguide 1 shown in FIG. 10, the light emitting elements 81 of the light emitting element array 8 and the light receiving elements 91 of the light receiving element array 9 are arranged at the same pitch as the arrangement pitch of the core layers 4.

  In this case, the convex lens 7 as the light focusing means in the clad layer 2 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 5 and the clad layer 2 may be integrally formed.

  In this operation mechanism, an electrical signal transmitted from one semiconductor integrated circuit chip (not shown) is converted into an optical signal and emitted from each light emitting element 81 of the light emitting element array 8 as an optical signal. The emitted optical signal is focused by a corresponding convex lens 7 of the optical waveguide 1, is incident on the light incident part 5 of the core layer 4, is reflected by the light incident part 5 composed of a 45 ° mirror surface, and the core The light is guided in the waveguide direction in which the layer 4 extends, and is reflected again by the light emitting part 6 composed of the other 45 ° mirror surface and emitted from the light emitting part 6 of the core layer 4. The optical signal emitted from the optical waveguide 1 is received by the corresponding light receiving element 91 of the light receiving element array 9 through the convex lens 7 and converted into an electrical signal, and is sent to the other semiconductor integrated circuit chip (not shown) as an electrical signal. Is transmitted (hereinafter, the same applies to other embodiments).

  According to the present embodiment, since the convex lenses 7 in the cladding layer 2 are integrally formed with the cladding layer 2 so as to be arranged as shown in FIG. 5, an optical signal from the light emitting element 81 is effectively received. The light can be focused and incident on the core layer 4 for efficient optical coupling. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

Third Embodiment FIG. 11A is a diagram showing a schematic configuration of a light emitting element 81, a light receiving element 91, and an optical waveguide 1 viewed from the cladding layer 3 (not shown) side in FIG. 11B is a side view seen from the X direction in FIG. 11A, and FIG. 11C is a side view seen from the Y direction in FIG. In addition, in FIG.11 (b) and (c), it has shown upside down.

  As shown in FIG. 11A, the optical waveguide 1 has a plurality of core layers 4 arranged in parallel. The end portions of each core layer 4 are a light incident portion 5 and a light emitting portion 6 each having a 45 ° mirror surface. In the optical waveguide 1 according to the present embodiment, the light incident / exit portions 5 and 6 of each core layer 4 are shifted in the length direction with respect to the light incident / exit portions 5 and 6 of other adjacent core layers 4. Has been.

  The light emitting element array 8 includes a plurality of light emitting elements 81 arranged at positions corresponding to the light incident / exit portions 5 and 6 of each core layer 4. In the gaps between the light emitting elements 81, penetrating electrodes (not shown) for electrical connection between the light emitting elements 81 and the semiconductor integrated circuit chip (not shown) are disposed (this corresponds to the light receiving element array 9). The same applies to the light receiving element 91.)

  In this case, the convex lens 7 as the light focusing means in the clad layer 2 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 6 and the clad layer 2 may be integrally formed.

  According to the present embodiment, since the convex lenses 7 in the cladding layer 2 are integrally formed with the cladding layer 2 so as to be arranged as shown in FIG. 6, the optical signal from the light emitting element 81 is effectively transmitted. The light can be focused and incident on the core layer 4 for efficient optical coupling. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

  In addition, the light incident / exit portions 5 and 6 of each core layer 4 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 5 and 6 of the other adjacent core layers 4. The pitch between the light emitting elements 81 arranged in the length direction is as large as the amount of deviation in the length direction. For example, when the light incident / exit portions 5 and 6 of the adjacent core layer 4 are shifted by 100 μm in the extending direction, the pitch between the light emitting elements 81 arranged in the length direction of the core layer 4 is 100 μm. The same applies to the light receiving element 91.

  Further, the pitch of the light emitting elements 81 arranged in the arrangement direction of the core layers 4 is a size corresponding to the total arrangement pitch of the five core layers 4. For example, when the core layers 4 are arranged at an arrangement pitch of 20 μm, the pitch of the light emitting elements 81 arranged in the arrangement direction of the core layers 4 is 100 μm.

  As described above, the light incident / exit portions 5 and 6 of each core layer 4 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 5 and 6 of the other adjacent core layers 4. Optical elements (a light emitting element and a light receiving element are collectively referred to) 81 and 91 arranged corresponding to the layer 4 can be secondarily arranged, and the optical elements 81 and 91 are arranged at a pitch of about 100 μm. The core layer 4 can be integrated up to a pitch of 20 μm.

  That is, it is possible to improve the degree of integration of the core layer 4 while arranging the distance between the optical elements 81 and 91 at a pitch to avoid the influence of optical interference and crosstalk due to element heat generation.

  Further, by arranging the optical elements 81 and 91 two-dimensionally while highly integrating the core layer 4, useless space is eliminated, and the area occupied by the substrate per element can be reduced. For this reason, further cost reduction can be achieved.

Fourth Embodiment FIG. 12A shows a light emitting element array, a light receiving element array, and a core layer that are viewed from the opposite side of the surface to which the clad layer integrally formed with the light focusing means is joined. It is a figure which shows schematic structure of an optical waveguide, FIG.12 (b) is the side view seen from X direction in Fig.12 (a), FIG.12 (c) was seen from Y direction in Fig.12 (a) It is a side view. In FIGS. 12B and 12C, the upper and lower sides are reversed.

  As shown in FIG. 12, the optical waveguide 1 includes light incident / exit portions 5 and 6 of the core layers 4-1 and 4-2, and light incident / exit portions of the other core layers 4-2 and 4-1. 5 and 6 are shifted in the length direction. In the present embodiment, the two first core layers 4-1 and the second core layer 4-2 whose positions of the light incident / exit sections 5 and 6 are shifted are repeatedly arranged as a unit.

  A light emitting element array 8-1 having a plurality of light emitting elements 81 arranged corresponding to the light incident portions 5 of the first core layer 4-1, on one side in the length direction of each core layer 4, and a second A light receiving element array 9-2 having a plurality of light receiving elements 91 arranged corresponding to the light emitting portions 6 of the core layer 4-2 is arranged.

  A light receiving element array 9-1 having a plurality of light receiving elements 91 arranged corresponding to the light emitting portions 6 of the first core layer 4-1, on the other side in the length direction of each core layer 4; A light emitting element array 8-2 having a plurality of light emitting elements 81 arranged corresponding to the light incident portions 5 of the core layer 4-2 is arranged.

  That is, in the optical waveguide 1, the light emitting elements 81 and the light receiving elements 91 are alternately arranged for the core layers 4-1 and 4-2 arranged in parallel. Therefore, each of the core layers 4-1 and 4-2 guides light in the opposite direction to the other adjacent core layers 4-2 and 4-1.

  In this case, the convex lens 7 as the light focusing means in the clad layer 2 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, it may be configured so as to have an arrangement as shown in FIG. Thereby, the optical signal from the light emitting element 81 can be effectively focused and incident on the core layer 4, and the optical coupling can be performed efficiently. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

  Further, since the light emitting elements 81 and the light receiving elements 91 are alternately arranged with respect to the core layers 4-1 and 4-2 arranged in parallel, for example, they are connected to a specific circuit of a semiconductor integrated circuit chip. Since the positions of the light emitting element 81 and the light receiving element 91 corresponding to the input / output pads are close to each other as shown in part B of FIG. 12, the length of the electrical wiring can be shortened, and high frequency countermeasures are easy. There is an effect of becoming. In addition, it has the same effect as the third embodiment.

Fifth Embodiment FIG. 13A shows a light emitting element array, a light receiving element array, and a light receiving element array as viewed from the opposite side of the surface of the core layer to which the clad layer integrally formed with the light focusing means is joined. FIG. 13B is a diagram illustrating a schematic configuration of the optical waveguide, FIG. 13B is a side view seen from the X direction in FIG. 13A, and FIG. 13C is seen from the Y direction in FIG. FIG. 13D is a side view showing the arrangement of the light receiving elements in the light receiving element array and the arrangement of the light emitting elements in the light emitting element array. In FIGS. 13B and 13C, the top and bottom are reversed.

  In the present embodiment, the configuration of the third embodiment and the fourth embodiment is combined. That is, similarly to the fourth embodiment, in the optical waveguide 1, the light emitting elements 81 and the light receiving elements 91 are alternately arranged for the core layers 4 arranged in parallel. Therefore, each core layer 4 guides light in the opposite direction with respect to the other adjacent core layers.

  Further, as in the third embodiment, the optical elements 81 and 91 in each of the optical element arrays 8-1, 8-2, 9-1 and 9-2 are adjacent to each other as shown in FIG. The other optical elements 81 and 91 are arranged so as to be shifted in the length direction of the core layer 4.

  In this case, the convex lens 7 as the light focusing means in the clad layer 2 is formed corresponding to the positions of the light incident / exit portions 5 and 6 of the core layer 4. Specifically, the arrangement shown in FIG. 8 may be formed and the clad layer 2 may be integrally formed. Thereby, the optical signal from the light emitting element 81 can be effectively focused and incident on the core layer 4, and the optical coupling can be performed efficiently. Further, the light receiving element 91 can effectively receive the light emitted from the optical waveguide 1.

  Further, as shown in FIG. 10, the pitch between the optical elements can be increased as compared with the case where the optical elements are linearly arranged in each optical element array. Since the distance between the optical elements can be arranged at a pitch to avoid the influence of crosstalk due to optical interference or element heat generation while maintaining the effect, the integration degree of the core layer 4 can be improved. In addition, the effects of the third embodiment can be achieved.

Sixth Embodiment An optical waveguide according to the present invention can be directly mounted on a printed wiring board.
A socket and an optical waveguide installed in the socket, and at least one of a light emitting element for making light incident on the optical waveguide and a light receiving element for receiving light emitted from the optical waveguide, The present invention can be suitably used for a photoelectric composite device disposed so as to face the optical waveguide.

  FIG. 14 is a schematic perspective view of the socket. FIG. 14A is a schematic perspective view seen from the surface side where the optical waveguide of the socket is installed, and FIG. 14B is a schematic perspective view seen from the opposite surface side of FIG. It is.

  As shown in FIG. 14, the socket 13 is provided with positioning means having a concavo-convex structure for positioning and fixing the optical waveguide according to the present invention. Specifically, the concavo-convex structure has a recess 14 for fitting the optical waveguide and positioning the width direction thereof, and a protrusion 15 for positioning the length direction of the optical waveguide. . Further, the depth of the recess 14 is larger than the thickness of the optical waveguide.

  The convex surface 16 of the concave-convex structure of the socket 13 is provided with conducting means, for example, a terminal pin 17 for conducting the front and back surfaces of the socket 13. Then, an interposer on which the light emitting element and / or the light receiving element are mounted is fixed on the convex surface 16 of the concavo-convex structure, as will be described later.

  As the material of the socket 13, a conventionally known material can be used as long as it is an insulating resin. Examples thereof include glass-filled PES (polyethylene sulfide) resin, glass-filled PET (polyethylene terephthalate) resin, and the like. Such a material for the socket 13 already has a lot of data on its type, insulation, reliability, etc., and there are a wide variety of manufacturers. Therefore, it is a structure that is easy to accept in all of its functions, costs, reliability, etc., and can be easily integrated with the existing printed wiring board mounting process.

  Although the manufacturing method of the socket 13 is not specifically limited, For example, it can manufacture easily by shaping | molding using the metal mold | die which has the said uneven structure.

  FIG. 15 is a schematic perspective view of a photoelectric composite device using the socket 13. 15A is a schematic perspective view of the photoelectric composite device, and FIG. 15B is an exploded view of FIG. 15A.

  As shown in FIG. 15, the photoelectric composite device 18 includes a pair of sockets 13 and the optical waveguide 1 according to the present invention installed in the socket 13, and the optical waveguide 1 is bridged between the pair of sockets 13. Has been passed. The optical waveguide 1 may have any structure of the above-described embodiments, and the cladding layer 2 is longer than the cladding layer 3 in the light propagation direction as shown in FIG. It is preferable. At this time, since the optical waveguide 1 is not in contact with a printed wiring board to be described later, it is possible to effectively prevent the optical waveguide 1 from being broken by heat dissipation of the semiconductor integrated circuit chip.

  Further, on the convex surface 16 of the concavo-convex structure of the socket 13, semiconductor integrated circuit chips 21 a and 21 b, the light emitting element (not shown) (for example, laser) and / or the light receiving element (not shown) are mounted. The poser 20 is fixed.

  For example, as shown in FIG. 16, the interposer 20 has a semiconductor integrated circuit chip 21 mounted on one surface side (FIG. 16A), and the light incident on the optical waveguide 1 on the other surface side. A light emitting element array 8 for performing and a light receiving element array 9 for receiving light emitted from the optical waveguide 1 are mounted, and a rewiring electrode 22 is provided in the peripheral portion (FIG. 16B). The light-emitting element array 8 and the light-receiving element array 9 include a plurality of light-emitting elements and light-receiving elements arranged at positions corresponding to the light incident / exit portions of the optical waveguides described above (not shown). A through electrode for electrical connection between the light emitting element and the light receiving element and the semiconductor integrated circuit chip is disposed in the gap between each light emitting element and the light receiving element (not shown).

  When the pair of sockets 13 in which the optical waveguide 1 is installed in the recess 14 and the interposer 20 are fixed, the surface side of the interposer 20 on which the light emitting element array 8 and / or the light receiving element array 9 is mounted is arranged. The socket 13 is configured to be in contact with the convex surface 16, and the terminal pin 17 of the socket 13 and the rewiring electrode 22 of the interposer 20 are fixed so as to be electrically connected.

  Further, as described above, the depth of the recess 14 of the socket 13 is formed to be larger than the thickness (for example, 1 mm) of the optical waveguide 1 (for example, the depth is set to 2 mm). ), A space (for example, 500 μm) 25 is formed between one surface 23 side of the optical waveguide 1 and the surface side of the interposer 20 on which the light emitting element array 8 and / or the light receiving element array 9 is mounted. (This is when the thickness of the light emitting element array 8 and / or the light receiving element array 9 is 500 μm).

  As described above, the semiconductor integrated circuit chip 21 is mounted on the socket 13 via the interposer 20, the one surface 23 side of the optical waveguide 1, the light emitting element array 8 and / or the light receiving element of the interposer 20. By forming a space 25 between the surface on which the array 9 is mounted, even if the semiconductor integrated circuit chip 21 generates heat when the photoelectric composite device 18 is used, the optical waveguide 1 is broken by this heat. Can be effectively prevented.

  In this operation mechanism, an electrical signal transmitted from one semiconductor chip 21a is converted into an optical signal and emitted from each light emitting element (not shown) of the light emitting element array 8 as an optical signal by laser light. The emitted optical signal is focused by one of the corresponding light focusing means of the optical waveguide 1, enters the light incident portion of the core layer, is guided in the waveguide direction in which the core layer extends, and the other The light is emitted from the light emitting part of the core layer. Then, the optical signal emitted from the optical waveguide 1 is received by a corresponding light receiving element (not shown) of the light receiving element array 9, converted into an electric signal, and transmitted to the other semiconductor chip 21b as an electric signal.

  This photoelectric composite device 18 can constitute an optical wiring system in which the optical waveguide 1 according to the present invention is used as an optical wiring. That is, the photoelectric composite device 18 is fixed in a state of being electrically connected to the printed wiring board.

  According to the photoelectric composite device 18, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board in a state where it is installed in the recess 14 of the socket 13, the existing printed wiring board is mounted. The structure can be used as it is. Therefore, if a region where the socket 13 can be installed is provided on the printed wiring board, other general electric wiring can be formed by a conventional process.

  Even if the optical waveguide is vulnerable to a high-temperature process, for example, after fixing the socket 13 to the printed wiring board, and after completing all mounting processes including a high-temperature process such as solder reflow and underfill resin sealing Since the optical waveguide 1 according to the present invention can be installed in the concave portion 14 of the socket 13, the optical waveguide can be mounted without suffering damage due to high temperature.

  Further, since the socket 13 can be made of a resin having higher rigidity than the printed wiring board, and the light coupling between the light emitting element and / or the light receiving element and the optical waveguide can be performed on the socket 13. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Furthermore, since the semiconductor integrated circuit chip 21 and the light emitting element array 8 and / or the light receiving element array 9 can be installed close to the upper and lower surfaces thereof via the interposer 20, the semiconductor integrated circuit chip 21, The wiring length between the light emitting element and / or the light receiving element can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board in a state where the optical waveguide 1 is installed in the recess 14 of the socket 13, the high-density wiring of the printed wiring board and the degree of freedom of design thereof. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high speed, high-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and development Short TAT (turn around time) can be expected.

  Next, an example of a method for manufacturing the photoelectric composite device 18 will be described with reference to FIGS. 17 and 18 are cross-sectional views taken along the line A-A ′ of the photoelectric composite device 18 in FIG.

  First, as shown in FIGS. 17A and 17B, a pair of sockets 13 is mounted on a printed wiring board 19. At this time, an electrode (not shown) on the printed wiring board 19 and the terminal pin 17 of the socket 13 are aligned and mounted so that the electrode and the socket 13 are electrically connected.

  Although not shown in the figure, other electronic components and electrical wiring are formed on the printed wiring board 19 in advance.

  Next, as shown in FIG. 17C, the optical waveguide 1 according to the present invention is installed in the recess 14 of the socket 13, and the optical waveguide 1 is bridged between the pair of sockets 13. At this time, the projections 15 as the concavo-convex structure provided on the socket 13 can easily position the optical waveguide 1 in the length direction, and the concave portions 14 can easily position the optical waveguide 1 in the width direction. It can be carried out. In addition, since the optical waveguide 1 is installed in the recess 14 of the socket 13, the optical waveguide 1 and the printed wiring board 19 are in a non-contact state.

  At this time, as shown somewhat exaggerated in FIG. 20, when the optical waveguide 1 according to the present invention is mounted, the length of the optical waveguide 1 fixed to the socket 13 in the light propagation direction is the printed wiring board 19. It is desirable that the distance between the pair of sockets 13 fixed to be larger than the distance. As shown in the figure, by fixing the optical waveguide 1 according to the present invention in a bent state, positioning errors on the printed wiring board 19 of the socket 13 can be absorbed, and a stable and efficient light can be always obtained. Can do waves.

  The means for fixing the optical waveguide 1 to the socket 13 is not particularly limited, and for example, an adhesive resin can be used. Specifically, first, as shown in FIG. 19A, the groove 27 is formed in an arbitrary shape on the bottom surface of the recess 14 of the socket 13. At this time, the end of the groove 27 is formed so as to be located up to the periphery of the protrusion 15 of the socket 13. Next, as shown in FIG. 19 (b), the optical waveguide 1 according to the present invention is installed in the recess 14 of the socket 13. As described above, the positioning in the length direction and the width direction of the optical waveguide 1 can be easily performed by the protrusions 15 and the recesses 14 provided in the socket 13. Here, since the groove 27 is formed so as to be located up to the peripheral portion of the protrusion 15, a part of the groove 27 is not covered with the optical waveguide 1. Next, as shown in FIG. 19C, the adhesive resin is injected from a part of the groove 27 not covered with the optical waveguide 1 using a dispenser 28 or the like and hardened, whereby the concave portion 14 of the socket 13 is obtained. The optical waveguide 1 can be bonded and fixed to.

  After the optical waveguide 1 according to the present invention is installed in the socket 13 as described above, for example, an MPU (micro processor) as the semiconductor integrated circuit chip is formed on the convex surface 16 of the socket 13 as shown in FIG. unit) 21a or DRAM (dynamic random access memory) 21b and interposer 20 mounted with light emitting element array 8 and / or light receiving element array 9 are fixed. At this time, the surface of the interposer 20 on which the light emitting element array 8 and / or the light receiving element array 9 is mounted is configured to be in contact with the convex surface 16 of the socket 13, and terminal pins (not shown) exposed on the convex surface 16 of the socket 13 are illustrated. And the rewiring electrode 22 of the interposer 20 are fixed so as to be electrically connected.

  Next, as shown in FIG. 18E, aluminum fins 26 are installed on the MPU 21a and the DRAM 21b, respectively.

  As described above, an optical wiring system in which the optical waveguide 1 according to the present invention is used as an optical wiring can be configured using the photoelectric composite device 18.

  Here, FIG. 21 is a schematic diagram showing an example in which the photoelectric composite device 18 is developed on the printed wiring board 19. For example, by standardizing the optical waveguide module, it can be freely deployed in four directions.

  According to the present embodiment, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board 19 in a state where it is installed in the recess 14 of the socket 13, the existing printed wiring board 19 is mounted. The structure can be used as it is. Therefore, if a region where the socket 13 can be installed is provided on the printed wiring board 19, other general electric wiring can be formed by a conventional process.

  Moreover, even if the optical waveguide 1 according to the present invention is vulnerable to a high temperature process, as described above, the socket 13 is fixed to the printed wiring board 19 and further includes a high temperature process such as solder reflow and underfill resin sealing. After the mounting process is completed, the optical waveguide 1 according to the present invention is installed in the recess 14 of the socket 13, so that the optical waveguide 1 can be mounted without suffering damage due to high temperature.

  Further, the socket 13 can be made of a resin having higher rigidity than the printed wiring board 19, and the light coupling between the light emitting element and / or the light receiving element and the optical waveguide 1 can be performed on the socket 13. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Further, since the semiconductor integrated circuit chips 21a and 21b and the light emitting element array 8 and / or the light receiving element array 9 can be installed close to the upper and lower surfaces via the interposer 20, the semiconductor integrated circuit chip 21a. , 21b and the wiring length between the light emitting element and / or the light receiving element can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board 19 in a state where the optical waveguide 1 is installed in the recess 14 of the socket 13, the high-density wiring of the printed wiring board 19 and the degree of freedom of design thereof. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high speed, high-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and development Short TAT (turn around time) can be expected.

  Further, the semiconductor integrated circuit chips 21a and 21b are mounted on the socket 13 via the interposer 20, and the one surface 23 side of the optical waveguide 1 according to the present invention, the light emitting element array 8 of the interposer 20, and / or Alternatively, by forming a space 25 between the surface on which the light receiving element array 9 is mounted, even if the semiconductor integrated circuit chip 21 generates heat when the photoelectric composite device 18 is used, this heat causes light based on the present invention. It is possible to effectively prevent the waveguide 1 from being broken.

  As mentioned above, although embodiment of this invention was described, the above-mentioned example can be variously modified based on the technical idea of this invention.

  For example, the shape of the convex lens 7 as the light converging means is not particularly limited, and for example, besides a spherical lens, a cylindrical lens or the like can be applied.

  Moreover, although the example of stamping was demonstrated as a method of integrally molding the convex lens 7 with the clad layer 2, you may shape | mold by casting etc., for example.

  3 and 4, the example in which the clad layer 2 is disposed on the quartz mold 11 filled with the core material 4a to solidify the core material 4a has been described. In addition to this, a quartz mold having a gate is used. A core material may be introduced into the cavity from the gate by disposing the clad layer 2.

  Further, the example in which the terminal pin 17 is provided as the conducting means for conducting the front and back surfaces of the socket 13 has been described. However, in addition to this, the through-electrode is provided in the socket 13, and the socket 13 and the printed wiring The plate and the interposer may be electrically connected by solder.

  As shown in FIG. 22, the socket 13 may have the interposer positioning mechanism 24 (for example, a fitting boss) on the convex surface 16, and the shape, size, and the like are not particularly limited.

  Furthermore, the shape, size, etc. of the protrusion 15 formed in the recess 14 of the socket 13 are not particularly limited.

  The present invention is suitable for the above-described optical wiring system in which a signal is placed on a laser beam. However, the present invention can also be applied to a display or the like by selecting a light source or the like. Further, as shown in FIG. 23, the optical waveguide according to the present invention may be composed of a joined body of a clad layer 2 and a core layer 4 integrally formed with a convex lens 7, and the clad layer 3 shown in FIG. There is no need to provide it. Further, the shape of the light emitting portion 6 of the core layer 4 may not be an inclined mirror surface, and the presence or absence of the convex lens 7 is not limited in the light emitting portion 6.

  The present invention efficiently collects and emits a predetermined light flux by an optical waveguide, or causes the signal light emitted after being efficiently incident on the optical waveguide to enter a light receiving element (such as an optical wiring or a photodetector) in the next stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured as described above.

It is a schematic sectional drawing of the optical waveguide by 1st Embodiment. It is a schematic sectional drawing of an optical waveguide same as the above. It is a schematic sectional drawing which shows an example of the manufacturing process of the optical waveguide based on this invention in order of a process. It is a schematic sectional drawing which shows an example of the manufacturing process of the optical waveguide based on this invention in order of a process. It is a top view of the clad layer by a 2nd embodiment. It is a top view of the clad layer by a 3rd embodiment. It is a top view of the clad layer by a 4th embodiment. It is a top view of the clad layer by a 5th embodiment. It is a schematic sectional drawing of the optical waveguide based on this invention by 6th Embodiment. FIG. 5 is a schematic configuration diagram of a light emitting element array, a light receiving element array, and an optical waveguide according to a second embodiment. It is a schematic block diagram of the light emitting element array by the 3rd Embodiment, a light receiving element array, and an optical waveguide. It is a schematic block diagram of the light emitting element array by 4th Embodiment, a light receiving element array, and an optical waveguide. It is a schematic block diagram of the light emitting element array by 5th Embodiment, a light receiving element array, and an optical waveguide. It is a schematic perspective view of the socket by 6th Embodiment. 2 is a schematic perspective view of the photoelectric composite device. FIG. It is a schematic perspective view of an interposer. It is a schematic sectional drawing which shows an example of the manufacturing method of a photoelectric composite apparatus in order of a process. It is a schematic sectional drawing which shows an example of the manufacturing method of a photoelectric composite apparatus in order of a process. It is a schematic plan view of a partial process of the manufacturing method of the photoelectric composite device. It is a schematic sectional drawing at the time of mounting of a photoelectric composite apparatus equally. It is a schematic plan view of an example of the mounting structure of the photoelectric composite device. It is a schematic perspective view of the other example of a socket same as the above. It is a schematic sectional drawing of the other example of the optical waveguide based on this invention. It is the schematic which shows the mounting structure of the optical waveguide by a prior art example. It is a schematic sectional drawing of an optical waveguide same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical waveguide, 2, 3 ... Cladding layer, 2a ... Cladding material,
4, 4-1, 4-2 ... core layer, 4a ... core material, 5 ... light incident part, 6 ... light emitting part,
7 ... convex lens, 8, 8-1 and 8-2 ... light emitting element array,
9, 9-1, 9-2 ... light receiving element array, 10 ... mold, 11 ... quartz type, 12 ... optical component,
13 ... Socket, 14 ... Recess, 15 ... Protrusion, 16 ... Convex surface, 17 ... Terminal pin,
18 ... Photoelectric composite device, 19 ... Printed wiring board, 20 ... Interposer,
21, 21 a, 21 b... Semiconductor integrated circuit chip, 22... Redistribution electrode,
24 ... Interposer positioning mechanism, 25 ... Space, 30 ... Signal light, 81 ... Light emitting element, 82 ... Through electrode, 91 ... Light receiving element

Claims (16)

  It is composed of a joined body of a clad layer and a core layer, and is configured so that light is incident on the core layer through the clad layer, and light focusing means is integrated with the clad layer at a position corresponding to a light incident portion with respect to the core layer. An optical waveguide that is molded.   The optical waveguide according to claim 1, wherein collimation or focusing means for light emitted from the core layer through the clad layer is integrally formed with the clad layer in the light emitting portion of the core layer.   The optical waveguide according to claim 1 or 2, wherein the light focusing or collimating means is made of the same material as the cladding layer.   The optical waveguide according to claim 1, wherein the light focusing or collimation means is a convex lens.   The optical waveguide according to claim 1, wherein at least the light incident portion of the core layer is formed on an inclined mirror surface.   The core layer is sandwiched between the clad layer and another clad layer, and the former clad layer is formed longer than the latter clad layer in the light propagation direction. Optical waveguide.   A method of manufacturing an optical waveguide comprising a joined body of a clad layer and a core layer and configured to allow light to enter the core layer through the clad layer, at a position corresponding to a light incident portion with respect to the core layer, A method of manufacturing an optical waveguide, comprising: forming a light focusing unit integrally with the cladding layer; and joining the cladding layer to the core layer on a surface opposite to the light focusing unit.   The method for manufacturing an optical waveguide according to claim 7, wherein collimation or focusing means for light emitted from the core layer through the cladding layer is integrally formed with the cladding layer in the light emitting portion of the core layer.   9. The method of manufacturing an optical waveguide according to claim 7, wherein the light focusing or collimating means is formed of the same material as that of the cladding layer.   The method for manufacturing an optical waveguide according to claim 7, wherein a convex lens is formed as the light focusing or collimation means.   The method for manufacturing an optical waveguide according to claim 10, wherein the convex lens is molded by stamping.   The method for manufacturing an optical waveguide according to claim 7, wherein at least the light incident portion of the core layer is formed on an inclined mirror surface.   The method for manufacturing an optical waveguide according to claim 12, wherein the core layer with the inclined mirror surface is formed by injection molding.   8. The optical waveguide according to claim 7, wherein the core layer is sandwiched between the clad layer and another clad layer, and the former clad layer is formed longer than the latter clad layer in the light propagation direction. Method.   The core that is integrally formed with the light focusing or collimation means in the clad layer, filled with a core material between the clad layer and a mold having a shape corresponding to the core layer, and solidified, and joined to the clad layer The method for producing an optical waveguide according to claim 7, wherein the layer is peeled from the mold.   An optical information comprising: the optical waveguide according to any one of claims 1 to 6; a light incident unit that causes light to enter the core layer of the optical waveguide; and a light receiving unit that receives light emitted from the core layer. Processing equipment.

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