JP2005252041A - Photoelectric conversion device and its mounting structure, interposer and optical information processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low cost photoelectric conversion device which can effectively project or receive light and its mounting structure, an interposer and an optical information processor. <P>SOLUTION: In the photoelectric conversion device which is formed by mounting a photoelectric conversion element in the interposer; the interposer is light transmitting and has a lens which exerts optical collimation or optical focusing in the opposing position of the photoelectric converter of the photoelectric conversion element, the photoelectric conversion element has the lead-out electrode of the photoelectric converter, and the lead-out electrode is connected to a wiring electrode of the interposer. The photoelectric conversion device is mounted on a mounting substrate via the interposer. The interposer constitutes the photoelectric conversion device. The optical information processor has the photoelectric conversion device and an optical waveguide. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a photoelectric conversion device, a mounting structure thereof, an interposer, and an optical information processing device.

  Currently, signal propagation between semiconductor chips such as LSI (Large Scale Integrated Circuit) is all done by electrical signals via substrate wiring. However, with the recent increase in MPU functionality, the amount of data exchanged between chips has increased remarkably, and as a result, various high frequency problems have emerged. Typical examples thereof include RC signal delay, impedance mismatch, EMC / EMI, crosstalk, and the like.

  In order to solve the above problems, the mounting industry and others have so far taken the lead in solving various problems such as optimization of wiring layout and development of new materials.

  However, in recent years, the effects of optimization of the wiring layout and development of new materials have been hampered by physical limitations, and it is assumed that simple semiconductor chips will be mounted in order to realize further advanced system functionality in the future. It has become necessary to review the structure of the printed wiring board itself. In recent years, various drastic measures have been proposed to solve these problems, but the following are representative examples.

-Fine wiring bonding by multi-chip module (MCM) High-performance chip is mounted on a precision mounting substrate such as ceramic and silicon, and fine wiring bonding that cannot be formed on a motherboard (multilayer printed circuit board) is realized. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Sealing and integration of various semiconductor chips and electrical wiring bonding by integration Various semiconductor chips are two-dimensionally sealed and integrated using polyimide resin or the like, and fine wiring bonding is performed on the integrated substrate. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Three-dimensional bonding of semiconductor chips A through electrode is provided in various semiconductor chips, and each is bonded to form a laminated structure. Thereby, the connection between the different types of semiconductor chips is physically short-circuited, and as a result, problems such as signal delay are avoided. On the other hand, however, problems such as an increase in the amount of heat generated due to lamination and thermal stress between semiconductor chips occur.

  Furthermore, in order to realize high speed and large capacity of signal transmission / reception as described above, an optical transmission coupling technique using optical wiring has been developed (for example, see Non-Patent Document 1 and Non-Patent Document 2 described later). . The optical wiring can be applied to various places such as between electronic devices, between boards in an electronic device, or between chips in a board. For example, as shown in FIG. 15, for transmission of signals over a short distance such as between chips, an optical waveguide 51 is formed on a printed wiring board 50 on which the chips are mounted, and a light emitting element (for example, a surface emitting laser) is formed. The light (for example, laser light) modulated by 52 is incident on the optical waveguide 51, the incident light is guided through the optical waveguide 51, and the light emitted from the optical waveguide 51 is a light receiving element (for example, a photodiode) 53. Is received by. In this way, it is possible to construct an optical transmission / communication system using the optical waveguide 51 as a transmission path for signal-modulated laser light or the like.

  On the other hand, the light emitting element 52 and the light receiving element 53 as described above are mounted on a substrate 54 such as GaAs as shown in FIG. 16, for example, and the circuit 55 for driving these elements 52 and 53 is the element 52. Alternatively, they are electrically connected through a lead electrode 56 connected to 53 and a through electrode 57 formed in the GaAs substrate 54. For example, the through electrode 57 can be manufactured by forming a through hole in the substrate 54, forming an oxide insulating film on the entire surface of the hole side wall (not shown), and epitaxially growing a metal serving as an electrode.

  Further, since the signal light 58 such as a laser beam has a broadened beam shape, the signal light 58 from the light emitting element 52 is converted into parallel light and effectively incident on the optical waveguide 51 or emitted from the optical waveguide 51. An optical component 59 such as a lens is disposed at a position corresponding to the light emitting element 52 and the light receiving element 53 in order to collect the light 58 and cause the light receiving element 53 to receive light effectively.

Nikkei Electronics, “Encounter with Optical Wiring”, December 3, 2001, pages 122, 123, 124, 125, FIG. 4, FIG. 5, FIG. 6, FIG. NTT R & D, vol.48, no.3, pp.271-280 (1999)

  However, as in the conventional example described above, in order to electrically connect the light emitting element 52 or the light receiving element 53 and the circuit 55 for driving these elements 52 and 53, a through electrode is formed on a substrate 54 such as GaAs. The reason why 57 is formed is that the elements 52 and 53 may be damaged in the process of forming the through hole. Further, a deep via plating process in which a metal is embedded in a high aspect ratio through hole is difficult. Furthermore, it is necessary to form the pad electrode 60 on the surface opposite to the surface on which the elements 52 and 53 of the GaAs substrate 54 are mounted, which increases the cost and is difficult to form.

  Further, when the optical component 59 such as a lens is arranged, it is difficult to align the light emitting element 52 or the light receiving element 53.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to effectively emit or receive light, and a low-cost photoelectric conversion device and its mounting structure. It is to provide an interposer and an optical information processing apparatus.

That is, the present invention provides a photoelectric conversion device in which a photoelectric conversion element is mounted on an interposer.
The interposer is light transmissive, and has a lens part that performs light collimation or light focusing at a position facing the photoelectric conversion part of the photoelectric conversion element;
The photoelectric conversion device according to the present invention is characterized in that the photoelectric conversion element has an extraction electrode of the photoelectric conversion unit, and the extraction electrode is connected to a wiring electrode of the interposer. Moreover, the photoelectric conversion device of the present invention relates to a mounting structure of a photoelectric conversion device that is mounted on a mounting substrate via the interposer.

  In addition, the light-transmitting lens has a lens part that performs light collimation or light focusing at a position facing the photoelectric conversion part of the photoelectric conversion element, and further has a wiring electrode. The wiring electrode and the photoelectric conversion element And the lead electrode of the photoelectric conversion unit is connected to the interposer constituting the photoelectric conversion device.

  Furthermore, the present invention relates to an optical information processing apparatus having the photoelectric conversion device of the present invention and an optical waveguide.

  In the photoelectric conversion device of the present invention, the interposer is light transmissive, and includes the lens unit that performs light collimation or light focusing at a position facing the photoelectric conversion unit of the photoelectric conversion element, and The conversion element has the extraction electrode of the photoelectric conversion unit, and the extraction electrode is connected to the wiring electrode of the interposer. And according to the mounting structure of the photoelectric conversion device of the present invention, since the photoelectric conversion device of the present invention is mounted on the mounting substrate via the interposer, the photoelectric conversion element as in the conventional example described above. It is not necessary to form a through electrode for electrically connecting the circuit for driving this element to the circuit. Therefore, the photoelectric conversion element is easy and low cost without being damaged.

  In addition, since the interposer includes the lens unit that performs light collimation or light focusing, the alignment of the photoelectric conversion element with the photoelectric conversion unit is easy, and light emission or incidence is effectively performed. be able to.

  In this invention, it is preferable that the said photoelectric conversion element is distribute | arranged to the one surface side of the said interposer, and the said lens part is distribute | arranged to the surface side opposite to the said photoelectric conversion element.

  Moreover, it is preferable that the said lens part is integrally molded with the said interposer. Thereby, the number of parts does not increase and the productivity is high.

  The interposer preferably includes an external terminal connected to the wiring electrode, and the external terminal and the electrode of the mounting substrate may be electrically connected.

  Furthermore, in the mounting structure of the photoelectric conversion device according to the present invention, the photoelectric conversion element can be in non-contact with the mounting substrate. Thereby, it is possible to effectively dissipate heat generated during use, and it is possible to prevent the photoelectric conversion element from being damaged by heat.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

First Embodiment FIG. 1 is a schematic sectional view of a photoelectric conversion device according to the present invention. As shown in FIG. 1, in a photoelectric conversion device 1 according to the present invention, a photoelectric conversion element 3 is mounted on an interposer 2.

  The interposer 2 is light transmissive, and as a material, for example, quartz is preferable. And it has the lens part 5 which makes a light collimation or light focusing effect | action in the position facing the photoelectric conversion part 4 of the photoelectric conversion element 3. FIG. Moreover, it has the wiring electrode 6 for connecting with the photoelectric conversion element 3.

  The photoelectric conversion element 3 includes a photoelectric conversion unit 4 on a substrate 7 made of GaAs or the like having a thickness of 50 μm, for example, and further includes a lead electrode 8 of the photoelectric conversion unit 4. The lead electrode 8 and the wiring electrode 6 of the interposer 2 are connected via the solder bump 9a. Examples of the photoelectric conversion unit 4 include a light emitting element (for example, laser light) for causing light to enter an optical waveguide, which will be described later, or a light receiving element (for example, a photodiode) for receiving light emitted from the optical waveguide. The substrate 7 can be variously applied depending on the wavelength and application such as GaAs, InP, Si, or the like. The lead electrode 8 is an anode, and the electrode 40 not connected to the photoelectric conversion unit 4 is a cathode. The photoelectric conversion unit 4 may be retrofitted on the substrate 7. However, when GaAs or the like is used as the substrate 7, the photoelectric conversion unit 4 can be produced by growing GaAs.

  Specifically, the photoelectric conversion element 3 is disposed on one surface side of the interposer 2, and the lens unit 5 is disposed on the surface side opposite to the photoelectric conversion element 3. Further, an under filler such as epoxy may be filled between the photoelectric conversion element 3 and the interposer 2.

  Further, the interposer 2 has an external terminal 11 connected to the wiring electrode 6 by the wiring 10, and is connected to the electrode 13 of the mounting board 12 such as a rewiring board or a printed wiring board through the external terminal 11. Has been. As a connection method, as shown in the figure, for example, electrical connection may be made using solder bumps 9b or the like. Thereby, the photoelectric conversion apparatus 1 based on this invention can be mounted in the mounting board | substrate 12 via the interposer 2. FIG.

  Here, the photoelectric conversion element 3 is preferably not in contact with the mounting substrate 12. Thereby, it is possible to effectively dissipate heat generated during use, and it is possible to prevent the photoelectric conversion element 3 from being damaged by heat. In order to make the photoelectric conversion element 3 and the mounting substrate 12 non-contact, as shown in the figure, for example, the diameter of the solder bump 9a that connects the photoelectric conversion element 3 and the interposer 2 is set to the interposer 2 and the mounting substrate 12. May be made smaller than the diameter of the solder bump 9b connecting the two. Specifically, the diameter of the solder bump 9a that connects the photoelectric conversion element 3 and the interposer 2 is about φ50 μm, and the diameter of the solder bump 9b that connects the interposer 2 and the mounting substrate 12 is about φ100 μm. it can.

  Next, an example of the manufacturing method of the interposer 2 based on this invention is demonstrated with reference to FIGS.

  First, as shown in FIG. 2A, a Cu layer 15 is formed on a light-transmitting substrate 14 such as quartz. Next, as shown in FIG. 2B, a resist 16 is further applied on the Cu layer 15, and exposed and patterned as shown in FIG. Then, as shown in FIG. 2D, the resist 16 is removed. Thereby, the wiring electrode 6, the wiring 10, and the external terminal 11 can be produced on one surface side of the quartz substrate 14.

  Next, as shown in FIG. 3E, a thick film resist 17 is applied to the surface of the quartz substrate 14 opposite to the wiring electrode 6 (for example, a thickness of 30 to 40 μm) and three-dimensional exposure is performed. If the resist 17 is removed by general dry etching, the lens unit 5 can be integrally formed with the substrate 14. In the case of such integral molding, the number of parts does not increase and the productivity is high.

  As described above, as shown in FIG. 3 (f), the present invention has the wiring electrode 6, the wiring 10, and the external terminal 11 on one surface side, and the lens portion 5 on the other surface side. The interposer 2 based on can be produced.

  Here, although the example which forms the lens part 5 in the other surface side after forming the wiring electrode 6, the wiring 10, and the external terminal 11 on the one surface side above was given, FIG. ) Wiring 6, 10, 11 formation process and the lens part 5 formation process of FIGS. 3E to 3F may be reversed.

  Next, an example of a mounting process of the photoelectric conversion device according to the present invention will be described with reference to FIG.

  First, as shown in FIG. 4A, the wiring electrode 6 of the interposer 2 and the extraction electrode 8 of the photoelectric conversion element 3 according to the present invention manufactured as shown in FIGS. Using a high melting point solder (about 250 ° C.), a photoelectric conversion device 1 according to the present invention is manufactured. At this time, since the interposer 2 according to the present invention is light transmissive, the alignment between the lens unit 5 of the interposer 2 and the photoelectric conversion unit 4 of the photoelectric conversion element 3 can be easily performed. Moreover, the alignment between the interposer 2 and the photoelectric conversion element 3 according to the present invention is easy due to the self-alignment effect (mounting position variation ± 1 μm or less). Furthermore, since the interposer 2 according to the present invention with high processing accuracy and the substrate 7 made of GaAs or the like in the photoelectric conversion element 3 are joined, the size and pitch of the solder 9a can be reduced.

  Next, as shown in FIG. 4B, the external terminals 11 connected to the wiring electrodes 6 of the interposer 2 according to the present invention and the electrodes 13 of the mounting substrate 12 are solder bumps (for example, about φ100 μm) 9b. Used and connected by low melting point solder (about 150 ° C.).

  As described above, the photoelectric conversion device 1 according to the present invention can be mounted on the mounting substrate 12 via the interposer 2. As shown in the figure, the diameter of the solder bump 9a connecting the photoelectric conversion element 3 and the interposer 2 is made smaller than the diameter of the solder bump 9b connecting the interposer 2 and the mounting substrate 12, etc. The conversion element 3 is preferably not in contact with the mounting substrate 12. Thereby, it is possible to effectively dissipate heat generated during use, and it is possible to prevent the photoelectric conversion element 3 from being damaged by heat. For example, although not illustrated, a gap can be provided between the photoelectric conversion element 3 and another element such as an amplifier element mounted on the mounting substrate 12, so that the heat of the other element such as the amplifier element is reduced. The characteristics of the light emitting element (for example, a laser) and the light receiving element (for example, a photodiode) as the photoelectric conversion unit 4 that are not directly conducted to the photoelectric conversion element 3 and whose characteristics are likely to deteriorate due to heat are stabilized.

  In the photoelectric conversion device according to the present invention, the interposer 2 is light transmissive and has a lens unit 5 that performs light collimation or light focusing at a position facing the photoelectric conversion unit 4 of the photoelectric conversion element 3. The conversion element 3 has an extraction electrode 8 of the photoelectric conversion unit 4, and the extraction electrode 8 is connected to the wiring electrode 6 of the interposer 2. And according to the mounting structure of the photoelectric conversion apparatus 1 based on this invention, since the photoelectric conversion apparatus 1 based on this invention is mounted in the mounting board | substrate 12 via the interposer 2, it is like the above-mentioned prior art example. It is not necessary to form a through electrode for electrically connecting the photoelectric conversion element 3 and a circuit for driving the element 3. Therefore, the photoelectric conversion element 3 is easy and low-cost without being damaged (hereinafter, the same applies to other embodiments).

  Moreover, since the interposer 2 based on this invention has the lens part 5 which makes a light collimation or a light condensing effect | action, alignment with the photoelectric conversion part 4 of the photoelectric conversion element 3 is easy, and light emission or incidence | injection is carried out. This can be done effectively (the same applies to other embodiments hereinafter).

Second Embodiment FIG. 5 is a schematic sectional view of an optical information processing apparatus according to the present invention. As shown in FIG. 5, the optical information processing apparatus 18 according to the present invention includes a photoelectric conversion apparatus 1 according to the present invention and an optical waveguide 19. The optical waveguide 19 is not particularly limited, and a conventionally known optical waveguide can be used. For example, the optical waveguide 19 includes clads 20a and 20b and a core layer 21 sandwiched between the clads 20a and 20b. And a light emitting portion each having a lens member 22. Further, the light incident portion and the light emitting portion of the core layer 21 of the optical waveguide 19 are formed on a 45 ° mirror surface.

  According to the mechanism of the optical information processing apparatus 18 according to the present invention, the light (for example, laser light) 23 that is signal-modulated by the light emitting element 4 a as the photoelectric conversion unit is collimated by the lens unit 5 of the interposer 2. The signal light 23 is further collected by a lens member 22 formed at the light incident portion of the optical waveguide 19 and is effectively incident on the core layer 21 of the optical waveguide 19. The incident light 23 is guided through the optical waveguide 19, collimated by the lens member 22 formed at the light emitting portion of the optical waveguide 19, and emitted from the optical waveguide 19. The emitted light 23 is collected by the lens unit 5 of the interposer 2 and is effectively received by the light receiving element 4b serving as the photoelectric conversion unit. In this way, it is possible to construct an optical transmission / communication system using the optical waveguide 19 as a transmission path for signal-modulated laser light or the like.

Third Embodiment As described above, the optical information processing apparatus according to the present invention includes the photoelectric conversion apparatus according to the present invention and the optical waveguide, and the structure is appropriately selected as long as it does not depart from the content of the present invention. Although it is possible, for example, it can be suitably used for a structure having a socket and an optical waveguide installed in the socket.

  FIG. 6 is a schematic perspective view of the socket. 6A is a schematic perspective view of the socket as viewed from the surface side where the optical waveguide is installed, and FIG. 6B is a schematic perspective view as viewed from the opposite surface side of FIG. 6A. FIG.

  As shown in FIG. 6, the socket 24 is provided with positioning means having a concavo-convex structure for positioning and fixing the optical waveguide. Specifically, the concavo-convex structure has a recess 25 for fitting the optical waveguide and positioning the width direction thereof, and a protrusion 26 for positioning the length direction of the optical waveguide. . Further, the depth of the recess 25 is larger than the thickness of the optical waveguide.

  Further, on the convex surface 27 of the concavo-convex structure of the socket 24, a conduction means, for example, a terminal pin 28, for conducting the front and back surfaces of the socket 24 is provided. And the rewiring board in which the photoelectric conversion apparatus 1 based on this invention was mounted is fixed on the convex surface 27 of this uneven structure so that it may mention later.

  As the material of the socket 24, a conventionally known material can be used as long as it is an insulating resin. Examples thereof include glass-filled PES (polyethylene sulfide) resin and glass-filled PET (polyethylene terephthalate) resin. Such socket 24 material already has a lot of data on its type, insulation, reliability, etc., and there are a wide variety of manufacturers. Therefore, it is a structure that is easy to accept in all of its functions, costs, reliability, etc., and can be easily integrated with the existing printed wiring board mounting process.

  Although the manufacturing method of the socket 24 is not specifically limited, For example, it can manufacture easily by shaping | molding using the metal mold | die which has the said uneven structure.

  FIG. 7 is a schematic perspective view of an optical information processing apparatus 18 based on the present invention using the socket 24 described above. FIG. 7A is a schematic perspective view of the optical information processing apparatus 18 according to the present invention, and FIG. 7B is a schematic cross-sectional view taken along the line A-A ′ of FIG.

  As shown in FIG. 7, the optical information processing apparatus 18 according to the present invention using the socket 24 includes a pair of sockets 24 and an optical waveguide 19 installed in the socket 24, and between the pair of sockets 24. An optical waveguide 19 is stretched over. Although not shown, the optical waveguide 19 includes a plurality of core layers arranged in parallel therein. At this time, since the optical waveguide 19 is not in contact with a printed wiring board described later, it is possible to effectively prevent the optical waveguide 19 from being broken by heat generated during use.

  A circuit 29 and a semiconductor for mounting the photoelectric conversion device 1 according to the present invention on one surface side on the convex surface 27 of the concave-convex structure of the socket 24 and driving the photoelectric conversion unit on the other surface side A rewiring board 31 on which the chips 30a and 30b are mounted is fixed.

  As shown in FIG. 7B, the rewiring board 31 has semiconductor chips 30a and 30b and a circuit 29 for driving the photoelectric conversion unit mounted on one side, and the other side has a circuit 29. The photoelectric conversion device 1 according to the present invention is mounted. Here, in the photoelectric conversion device 1 according to the present invention, the photoelectric conversion unit includes a light emitting element (for example, laser light) 4 a that makes light incident on the optical waveguide 19, and a light receiving element that receives light emitted from the optical waveguide 19. (For example, a photodiode) 4b is used. Although not shown, a rewiring electrode is provided on the periphery of the rewiring board 31.

  When the pair of sockets 24 in which the optical waveguide 19 is installed in the recess 25 and the rewiring board 31 are fixed, the surface side of the rewiring board 31 on which the photoelectric conversion device 1 according to the present invention is mounted is connected to the socket. The terminal pin 28 of the socket 24 and the rewiring electrode (not shown) of the rewiring board 31 are fixed so as to be electrically connected.

  Further, by forming the depth of the recess 25 of the socket 24 to be larger than the thickness (for example, 1 mm) of the optical waveguide 19 (for example, the depth is 2 mm), as shown in FIG. A space 33 can be formed between the one surface 32 side of 19 and the interposer 2 according to the present invention.

  As described above, the semiconductor chips 30a and 30b are mounted on the socket 24 via the rewiring board 31, and the space between the one surface 32 side of the optical waveguide 19 and the interposer 2 according to the present invention. By forming 33, even if the semiconductor chips 30a and 30b generate heat when the optical information processing apparatus 18 is used, it is possible to effectively prevent the optical waveguide 19 from being broken by this heat.

  The mechanism of this operation is that an electric signal transmitted from one semiconductor chip 30a is converted into an optical signal and emitted from the light emitting element 4a as an optical signal by laser light. The emitted optical signal is incident on the light incident portion of one corresponding core layer 21 of the optical waveguide 19, guided in the waveguide direction in which the optical waveguide 19 extends, and from the light emitting portion of the other core layer 21. Exit. The optical signal emitted from the optical waveguide 19 is received by the corresponding light receiving element 4b, converted into an electrical signal, and transmitted to the other semiconductor chip 30b as an electrical signal. Here, each of the light emitting element 4a and the light receiving element 4b is connected to and controlled by the corresponding driving circuit 29 mounted on the rewiring board 31 via the interposer 2. Further, the optical signal is collimated or condensed by the lens portion 5 of the interposer 2 and the lens member 22 of the optical waveguide 19, and is effectively emitted or incident.

  The optical information processing apparatus 18 of the present embodiment can constitute an optical wiring system in which the optical waveguide 19 is used as an optical wiring. That is, the optical information processing device 18 is fixed in a state of being electrically connected to the printed wiring board.

  In the photoelectric conversion device 1 according to the present invention, the interposer 2 is light transmissive and has a lens portion 5 that performs light collimation or light focusing at a position facing the photoelectric conversion portions 4a and 4b of the photoelectric conversion element 3. The photoelectric conversion element 3 has the extraction electrodes 8 of the photoelectric conversion units 4 a and 4 b, and the extraction electrodes 8 are connected to the wiring electrodes 6 of the interposer 2. And according to the mounting structure of the photoelectric conversion apparatus 1 based on this invention, since the photoelectric conversion apparatus 1 based on this invention is mounted in the rewiring board 31 via the interposer 2, it is like the above-mentioned prior art example. In addition, it is not necessary to form a through electrode on the substrate 7 for electrically connecting the photoelectric conversion element 3 and the circuit 29 for driving the element 3. Therefore, the photoelectric conversion element 3 is easy and low-cost without being damaged.

  Moreover, since the interposer 2 based on this invention has the lens part 5 which makes a light collimation or a light focusing effect | action, alignment with the photoelectric conversion parts 4a and 4b of the photoelectric conversion element 3 is easy, and light emission or Incidence can be performed effectively.

  Further, since the optical waveguide 19 can be electrically connected to the printed wiring board in a state where it is installed in the recess 25 of the socket 24, the existing mounting structure of the printed wiring board can be used as it is. Therefore, if a region where the socket 24 can be installed is provided on the printed wiring board, other general electric wiring can be formed by a conventional process.

  Even if the optical waveguide 19 is vulnerable to a high temperature process, for example, after fixing the socket 24 to the printed wiring board, and after completing all mounting processes including a high temperature process such as solder reflow and underfill resin sealing. Since the optical waveguide 19 can be installed in the concave portion 25 of the socket 24, the optical waveguide 19 can be mounted without suffering damage due to high temperature.

  Further, since the socket 24 can be made of a resin having higher rigidity than the printed wiring board, and the light coupling between the light emitting element 4a or the light receiving element 4b and the optical waveguide 19 can be performed on the socket 24, Mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Furthermore, since the semiconductor chips 30a and 30b and the light emitting element 4a or the light receiving element 4b as the photoelectric conversion part can be disposed close to the upper and lower surfaces via the rewiring substrate 31, the semiconductor chip 30a, The wiring length between 30b and the light emitting element 4a or the light receiving element 4b can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, in the electrical wiring structure according to the conventional example, since the optical waveguide is directly provided on the printed wiring board, the number of pins and wirings drawn from the semiconductor chips 30a and 30b increases as the functions of the semiconductor chips 30a and 30b increase. The design freedom of the printed wiring board is obstructed by the optical waveguide. As a result, it has become difficult to increase the functionality of the printed wiring board, and as a result, it has become a situation that relies on SOC (system on chip) that allows all functions to be contained in one chip. On the other hand, according to the optical information processing apparatus 18 according to the present invention, the optical waveguide 19 can be electrically connected to the printed wiring board in a state where it is installed in the recess 25 of the socket 24. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high-density wiring on the board and the degree of freedom of its design. It can be expected to increase the functionality of the total equipment and shorten the turn around time (TAT) of development.

  Next, an example of the manufacturing method of the optical information processing apparatus 18 based on this invention is demonstrated with reference to FIGS. 8 and 9 are schematic cross-sectional views taken along the line A-A ′ of FIG.

  First, as shown in FIGS. 8A and 8B, a pair of sockets 24 is mounted on the printed wiring board 34. At this time, an electrode (not shown) on the printed wiring board 34 and the terminal pin 28 of the socket 24 are aligned and mounted so that the electrode and the socket 24 are electrically connected.

  Although not shown in the figure, other electronic components and electrical wiring are formed on the printed wiring board 34 in advance.

  Next, as shown in FIG. 8C, the optical waveguide 19 is installed in the recess 25 of the socket 24, and the optical waveguide 19 is bridged between the pair of sockets 24. At this time, the optical waveguide 19 can be easily positioned in the length direction by the protrusion 26 as the uneven structure provided in the socket 24, and the optical waveguide 19 can be easily positioned in the width direction by the recess 25. Can be done. In addition, since the optical waveguide 19 is installed in the concave portion 25 of the socket 24, the optical waveguide 19 and the printed wiring board 34 are in a non-contact state.

  At this time, as shown in a somewhat exaggerated manner in FIG. 11, when the optical waveguide 19 was mounted, the length of the optical waveguide 19 fixed to the socket 24 in the light propagation direction was fixed to the printed wiring board 34. It is desirable that the distance between the pair of sockets 24 be larger. As shown in the figure, by fixing the optical waveguide 19 in a bent state, it is possible to absorb the positioning error of the socket 24 on the printed wiring board 34, and to always perform stable and efficient optical waveguide. it can.

  The means for fixing the optical waveguide 19 to the socket 24 is not particularly limited, and for example, an adhesive resin can be used. Specifically, first, as shown in FIG. 10A, a groove 36 is formed in an arbitrary shape on the bottom surface of the recess 25 of the socket 24. At this time, the groove 36 is formed so that the end of the groove 36 is located up to the periphery of the protrusion 26 of the socket 24. Next, as shown in FIG. 10B, the optical waveguide 19 in which a plurality of core layers 21 are arranged side by side is installed in the recess 25 of the socket 24. As described above, the positioning of the optical waveguide 19 in the length direction and the width direction can be easily performed by the protrusions 26 and the recesses 25 provided in the socket 24. Here, since the groove 36 is formed so as to be located up to the peripheral portion of the protruding portion 26, a part of the groove 36 is not covered with the optical waveguide 19. Next, as shown in FIG. 10C, an adhesive resin is injected from a part of the groove 36 not covered with the optical waveguide 19 using a dispenser 37 or the like and hardened, whereby the concave portion 25 of the socket 24 is obtained. The optical waveguide 19 can be bonded and fixed to the substrate.

  After installing the optical waveguide 19 in the socket 24 as described above, as shown in FIG. 9D, on the convex surface 27 of the socket 24, for example, an MPU (micro processor unit) 30a or a DRAM (DRAM ( dynamic random access memory) 30b, the circuit 29 for driving the photoelectric conversion unit, and the rewiring substrate 31 on which the photoelectric conversion device 1 according to the present invention is mounted are fixed. At this time, the surface side of the rewiring board 31 on which the photoelectric conversion device 1 according to the present invention is mounted is configured to be in contact with the convex surface 27 of the socket 24, and terminal pins exposed on the convex surface 27 of the socket 24 (not shown). And a rewiring electrode (not shown) of the rewiring board 31 are fixed so as to be electrically connected.

  Next, as shown in FIG. 9E, aluminum fins 35 are installed on the MPU 30a and the DRAM 30b, respectively.

  As described above, an optical wiring system in which the optical waveguide 19 is used as an optical wiring can be configured using the optical information processing apparatus 18 according to the present invention.

  Here, FIG. 12 is a schematic diagram showing an example in which the optical information processing apparatus 18 according to the present invention is developed on the printed wiring board 34. For example, by standardizing the optical waveguide module, it can be freely deployed in four directions.

  In the photoelectric conversion device 1 according to the present invention, the interposer 2 is light-transmitting and has a lens unit 5 that performs light collimation or light focusing at a position facing the photoelectric conversion units 4a and 4b of the photoelectric conversion element 3. The photoelectric conversion element 3 has the extraction electrodes 8 of the photoelectric conversion units 4 a and 4 b, and the extraction electrodes 8 are connected to the wiring electrodes 6 of the interposer 2. And according to the mounting structure of the photoelectric conversion apparatus 1 based on this invention, since the photoelectric conversion apparatus 1 based on this invention is mounted in the rewiring board 31 via the interposer 2, it is like the above-mentioned prior art example. In addition, it is not necessary to form a through electrode on the substrate 7 for electrically connecting the photoelectric conversion element 3 and the circuit 29 for driving the element 3. Therefore, the photoelectric conversion element 3 is easy and low-cost without being damaged.

  Moreover, since the interposer 2 based on this invention has the lens part 5 which makes a light collimation or a light focusing effect | action, alignment with the photoelectric conversion parts 4a and 4b of the photoelectric conversion element 3 is easy, and light emission or Incidence can be performed effectively.

  Further, since the optical waveguide 19 can be electrically connected to the printed wiring board 34 in a state where it is installed in the recess 25 of the socket 24, the existing mounting structure of the printed wiring board 34 can be used as it is. Therefore, if a region where the socket 24 can be installed is provided on the printed wiring board 34, other general electric wiring can be formed by a conventional process.

  Even if the optical waveguide 19 is vulnerable to high-temperature processes, as described above, the socket 24 is fixed to the printed wiring board 34, and all mounting processes including high-temperature processes such as solder reflow and underfill resin sealing are performed. After completion, the optical waveguide 19 is installed in the recess 25 of the socket 24, so that the optical waveguide can be mounted without suffering damage due to high temperature.

  Further, since the socket 24 can be made of a resin having higher rigidity than the printed wiring board 34, and the optical coupling between the light emitting element 4a or the light receiving element 4b and the optical waveguide 19 can be performed on the socket 24, Mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  In addition, since the semiconductor chips 30a and 30b and the light emitting element 4a or the light receiving element 4b can be installed close to the upper and lower surfaces via the rewiring substrate 31, the semiconductor chips 30a and 30b and the light emitting element 4a are arranged. Alternatively, the wiring length between the light receiving element 4b can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 19 can be electrically connected to the printed wiring board 34 in a state where the optical waveguide 19 is installed in the recess 25 of the socket 24, the high-density wiring of the printed wiring board 34 and the degree of freedom of design can be secured. An optical wiring system can be developed on the printed wiring board at a low cost and with a high degree of freedom. High-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and short development TAT (turn around time).

  Furthermore, the semiconductor chips 30a and 30b are mounted on the socket 24 via the rewiring board 31, and a space 33 is formed between the one surface 32 side of the optical waveguide 19 and the interposer 2 according to the present invention. By doing so, even if the semiconductor chips 30a and 30b generate heat when the optical information processing apparatus 18 is used, this heat can effectively prevent the optical waveguide 19 from being destroyed.

  As mentioned above, although embodiment of this invention was described, the above-mentioned example can be variously modified based on the technical idea of this invention.

  For example, in the interposer according to the present invention, the example in which the lens portion is formed only on the surface side opposite to the wiring electrode has been described, but the lens portion is also formed on the same surface side as the wiring electrode. It may be. In addition, the shape of the lens portion is not particularly limited, and may be installed later, not integrally with a substrate such as quartz.

Further, in order to make the photoelectric conversion element and the mounting substrate non-contact, the diameter of the solder bump connecting the photoelectric conversion element and the interposer based on the present invention is set to the interposer based on the present invention and the mounting substrate. Although the example which makes it smaller than the diameter of the solder bump which connects and is mentioned, the method described below is mentioned other than this. However, the example using solder bumps having different diameters is the cheapest and easiest.
The thickness of the external terminal of the interposer according to the present invention is formed by thick film plating (for example, a thickness of 100 μm), and the gap between the interposer according to the present invention and the mounting substrate is increased.
An electrode spacer is attached to the external terminal of the interposer according to the present invention to increase the gap between the interposer according to the present invention and the mounting substrate.
A depression is provided only in a region corresponding to the photoelectric conversion element of the mounting substrate.
-Etching is selectively performed using hydrofluoric acid or the like only in the region corresponding to the photoelectric conversion element of the interposer according to the present invention.

  Moreover, although the example which mounts the said photoelectric conversion apparatus on the said mounting board | substrate was demonstrated so that the said photoelectric conversion element might exist between the photoelectric conversion apparatus based on this invention and the said mounting board | substrate, as shown in FIG. The interposer 2 according to the present invention may be provided with a through electrode 39, and the photoelectric conversion device 1 according to the present invention and the mounting substrate 12 may be connected via the through electrode 39.

  In addition, an example in which a terminal pin is provided as a conduction means for conducting the front and back surfaces of the socket has been described, but in addition to this, a through electrode is provided in the socket, and the socket and the printed wiring board are provided. The rewiring board may be electrically connected with solder.

  Further, as shown in FIG. 14, the socket may have a rewiring board positioning mechanism 38 (for example, a fitting boss) on the convex surface 27, and the shape, size, etc. thereof are not particularly limited. .

  Further, the shape, size, and the like of the protrusion 26 formed in the recess 25 of the socket 24 are not particularly limited.

  Furthermore, in the present invention, the optical waveguide is not particularly limited, and any conventionally known optical waveguide can be used.

  The present invention is suitable for the above-described optical wiring system in which a signal is placed on a laser beam. However, the present invention can also be applied to a display or the like by selecting a light source or the like.

  The present invention efficiently collects and emits a predetermined light flux by an optical waveguide, or causes the signal light emitted after being efficiently incident on the optical waveguide to enter a light receiving element (such as an optical wiring or a photodetector) in the next stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured as described above.

It is a schematic sectional drawing of the photoelectric conversion apparatus based on this invention by embodiment of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the interposer based on this invention in order of a process. It is a schematic sectional drawing which shows an example of the manufacturing method of the interposer based on this invention in order of a process. It is a schematic sectional drawing which shows an example of the mounting process of the photoelectric conversion apparatus based on this invention in process order. It is a schematic sectional drawing of the optical information processing apparatus based on this invention. It is a schematic perspective view of the socket suitably used for the optical information processing apparatus based on this invention. 1 is a schematic perspective view of an example of an optical information processing apparatus according to the present invention. FIG. 2 is a schematic cross-sectional view showing an example of a method for manufacturing an optical information processing apparatus according to the present invention in the order of steps. FIG. 2 is a schematic cross-sectional view showing an example of a method for manufacturing an optical information processing apparatus according to the present invention in the order of steps. It is a schematic sectional drawing which shows the partial process of the manufacturing method of the optical information processing apparatus based on this invention. 1 is a partial schematic cross-sectional view of an optical information processing apparatus according to the present invention. It is a schematic diagram which shows the example which expand | deployed the optical information processing apparatus based on this invention on the printed wiring board. It is a schematic sectional drawing which shows the other example of the optical information processing apparatus based on this invention. It is a schematic perspective view of the other example of the socket used suitably for the optical information processing apparatus based on this invention. It is a schematic sectional drawing which shows the mounting structure of the optical waveguide by a prior art example. It is a schematic sectional drawing which shows the example of mounting of a light emitting element or a light receiving element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Photoelectric conversion apparatus, 2 ... Interposer, 3 ... Photoelectric conversion element, 4 ... Photoelectric conversion part,
5 ... Lens portion, 6 ... Wiring electrode, 7 ... Substrate (GaAs, etc.), 8 ... Lead electrode,
9a, 9b ... solder bump, 10 ... wiring, 11 ... external terminal, 12 ... mounting board,
13 ... Electrode, 14 ... Quartz substrate, 15 ... Cu layer, 16 ... Resist, 17 ... Thick film resist,
DESCRIPTION OF SYMBOLS 18 ... Optical information processing apparatus, 19 ... Optical waveguide, 20a, 20b ... Cladding, 21 ... Core layer,
22 ... Lens member, 23 ... Signal light, 24 ... Socket, 25 ... Recess, 26 ... Projection,
27 ... Convex surface, 28 ... Terminal pin, 29 ... Element drive circuit,
30a, 30b ... Semiconductor chip, 31 ... Rewiring board, 33 ... Space, 34 ... Printed wiring board

Claims (11)

In a photoelectric conversion device in which a photoelectric conversion element is mounted on an interposer,
The interposer is light transmissive, and has a lens part that performs light collimation or light focusing at a position facing the photoelectric conversion part of the photoelectric conversion element;
The photoelectric conversion device, wherein the photoelectric conversion element has an extraction electrode of the photoelectric conversion unit, and the extraction electrode is connected to a wiring electrode of the interposer.   The photoelectric conversion device according to claim 1, wherein the photoelectric conversion element is disposed on one surface side of the interposer, and the lens unit is disposed on a surface side opposite to the photoelectric conversion element.   The photoelectric conversion device according to claim 1, wherein the lens unit is integrally formed with the interposer.   The photoelectric conversion device according to claim 1, wherein the interposer has an external terminal connected to the wiring electrode.   The mounting structure of the photoelectric conversion apparatus with which the photoelectric conversion apparatus described in any one of Claims 1-4 is mounted in the mounting board | substrate via the said interposer.   The mounting structure of the photoelectric conversion device according to claim 5, wherein the photoelectric conversion element is not in contact with the mounting substrate.   It is light transmissive, has a lens part that performs light collimation or light focusing at a position facing the photoelectric conversion part of the photoelectric conversion element, further has a wiring electrode, and the wiring electrode and the photoelectric conversion element in the photoelectric conversion element An interposer that is connected to the extraction electrode of the photoelectric conversion unit to constitute a photoelectric conversion device.   The interposer according to claim 7, wherein the photoelectric conversion element is disposed on one surface side, and the lens portion is disposed on a surface side opposite to the photoelectric conversion element.   The interposer according to claim 7, wherein the lens portion is integrally molded.   The interposer according to claim 7, further comprising an external terminal connected to the wiring electrode.   An optical information processing apparatus comprising the photoelectric conversion apparatus according to claim 1 and an optical waveguide.

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