JP5257527B2 - Photoelectric composite transmission module - Google Patents

Description

  The present invention relates to a photoelectric composite transmission module that performs electrical-optical conversion or optical-electrical conversion.

  In recent years, with an increase in display resolution and an increase in the amount of data handled by information transmission devices and storage devices, a high-speed transmission line capable of transmitting data at high speed is required. As a high-speed transmission line, a coaxial cable having a shielding function and a differential transmission line having a pair of differential lines in the shield are used, but there is a limit in transmission distance due to noise and skew problems.

  As a solution to this problem, there is a method of performing optical transmission by providing an optical transmission path in a part for exchanging information signals such as a computer main body and a monitor or a server and a server.

  Devices used for these optical transmissions are LD (Laser Diode) and PD (Photo Diode) at both ends of the optical / electrical composite cable through an optical fiber or an optical / electrical composite cable in which an optical fiber and an electric cable are combined. There is a photoelectric composite cable in which a module composed of an optical element such as an IC (Integrated Circuit) for driving them and a module having an electrical connector for connecting to an information transmission device or a storage device are connected. .

  In order to drive the IC built in this module, it is disclosed to use the power supplied from the device through the same connector to which the signal line is connected (in particular, FIG. (See FIG. 19).

  As conventional prior art, there are the following patent documents.

JP 2000-214972 A JP 2002-366340 A

  When driving a module disposed in a photoelectric composite cable using a power source supplied from an external device such as an information transmission device or a storage device, the supplied power voltage is not necessarily the same as the driving voltage of the IC in the module. Not. For this reason, ICs that can be used are limited.

  Further, in a high-speed IF (Interface) that does not take into account standardized optical transmission, power supply to an IC that drives an optical element is not assumed, and power is separately required for driving the IC. In order to separately supply power for driving the IC, a dedicated cable and connector are separately required, the configuration becomes complicated, and there are problems in terms of handling and cost.

  Also, when mounting an optical element, high mounting accuracy of 10 μm or less is usually required, whereas mounting of a power cable allows a mounting error of 10 times or more compared to mounting of an optical element, The mounting accuracy is between the mounting accuracy of the optical element and the mounting accuracy of the power cable. When mounting those with different mounting accuracy on the same substrate, it is necessary to conform to the specifications with the strictest mounting accuracy, making it difficult to manufacture the substrate and making the substrate expensive.

  Furthermore, the connector of the high-speed electrical IF specification does not assume optical connection, and the connection strength is weaker than the connection strength of a normal optical IF connector. Therefore, when the connector is pulled, there is a problem that the connector is easily disconnected from the connector of the external device. When the connector is disconnected, a rapid voltage change is applied to the optical element, which may lead to destruction of the optical element.

  In order to achieve the above object, the present invention is configured as follows.

The present invention relates to an electro-optical converter comprising a laser that converts an electric signal into an optical signal and a drive IC that drives the laser, and / or a photodiode that converts an optical signal into an electric signal, and an electric power from the photodiode. have a photoelectric conversion unit made of an amplification IC for amplifying a signal, in the optical-electrical composite transmission module connected to an end of the optical-electrical composite cable as a transmission cable, inside the optical-electrical composite transmission module films A flexible print in which the electro-optic conversion section and / or the opto-electric conversion section is disposed in the film-type optical waveguide, and the film-type optical waveguide is provided with an electric wiring on a resin substrate. A substrate, a core and a clad formed on the flexible printed circuit board, and a rigid substrate in the photoelectric composite transmission module. The film-type optical waveguide is mounted on the rigid substrate, the optical fiber of the photoelectric composite cable is mounted on the film-type optical waveguide, and at least one of a signal line, a power cable, and a GND line of the photoelectric composite cable Is an optical / electrical composite transmission module , wherein an electrical connector or an electric cable for connecting to an external device is connected to the rigid board .

The upper SL film type optical waveguide is formed with an optical fiber fixing groove, to insert the optical fiber to the optical fiber fixing groove, the optical fiber mounting Then good to the film type optical waveguide.

The film type optical waveguide may be connected to the rigid substrate by a card edge connector.

The film type optical waveguide may be electrically connected to the rigid substrate by an anisotropic conductive resin or a non-conductive resin.

The electro-optical conversion unit and / or the photoelectric conversion unit may be disposed between the film-type optical waveguide and the rigid substrate.

The rigid substrate has an electrical ground layer therein, and the electro-optical conversion unit and / or the photoelectric conversion unit disposed in the film-type optical waveguide is disposed on one surface side of the rigid substrate. The voltage converter may be disposed on the other surface of the rigid substrate.

The clad is preferably composed of an over clad and an under clad.

The rigid substrate may have electrical wiring on the front surface and the back surface.

  As described above, according to the present invention, the manufacturing accuracy of the rigid substrate is about several tens of μm by arranging the electro-optical conversion unit and the photoelectric conversion unit that require very high position accuracy on the wiring of the film type optical waveguide. Therefore, an inexpensive rigid substrate can be used, and cost reduction is facilitated.

The whole optoelectric composite transmission assembly block diagram. a) An electric cable is connected to the photoelectric composite transmission module. b) Connecting an electric cable and a power cable to the photoelectric composite transmission module. c) An electric cable is connected to the optical / electrical composite transmission module, and the electric power / electrical power composite cable is branched. a) Sectional view of an electrical cable. b) A cross-sectional view of a photoelectric composite cable. c) Cross section of the power cable. d) A cross-sectional view of an optoelectric power composite cable. The whole block diagram of a photoelectric composite assembly. a) An electrical connector is mounted on the photoelectric composite transmission module instead of the electrical cable of FIG. b) An electrical connector is mounted on the photoelectric composite transmission module instead of the electrical cable of FIG. c) An electrical connector is mounted on the photoelectric composite transmission module in place of the electrical cable of FIG. 1c). 1 is an overall configuration diagram of a photoelectric composite transmission assembly. FIG. a) Transmission (LD) side sectional structure. b) Reception (PD) side sectional structure. c) Modification of a) and b). Structure of film type optical waveguide. a) Side sectional view. b) Bird's eye view. FIG. 5 is a cross-sectional view of the photoelectric composite transmission module unit of FIG. 4. FIG. 1C is a cross-sectional view of the photoelectric composite transmission module portion of FIG. a) Transmission (LD) side sectional view. b) Reception (PD) side sectional view. Mounting structure of film type optical waveguide.

  An outline of the present invention is an invention of an optical / electrical composite transmission module that transmits light and electricity in a composite manner, and particularly an invention related to an optical / electrical composite transmission module with low cost and high reliability.

  First, FIG. 1 shows a structural diagram of the entire photoelectric composite transmission assembly.

  The photoelectric composite transmission module 12 is connected to an electric cable 13 with an electric connector 14 connected to an external device (not shown). An example of a cross-sectional structure of the electric cable 13 is shown in FIG. Used as a transmission line with a signal transmission speed of 10 Mbps or more, and used as a transmission line with a signal transmission speed of less than 10 Mbps, where the signal line 21a is covered with a shield 21b braided with a metal tube or metal wire. A low-speed signal line 22, a power cable 23, a GND line 24, and the like.

  The optical / electrical power composite cable 11 is an optical signal obtained by converting an electric signal transmitted from an external device in the optical / electrical composite transmission module 12, and an electric signal transmitted from the external device without being converted in the optical / electrical composite transmission module 12. And transmit power.

  A photoelectric composite transmission module 12 is connected to both ends of the photoelectric composite cable 11, and an electrical cable 13 is connected to each photoelectric composite transmission module 12 to constitute a composite photoelectric transmission assembly 10.

  An example of a cross-sectional structure of the photoelectric composite cable 28 is shown in FIG. The optoelectric composite cable 28 includes an optical fiber 25 (4-core tape type), a low-speed signal line 22, a power cable 23, a GND line 24, and the like, which are covered and integrated with a coating 27 made of an insulating material. In this embodiment, electric power for driving the combined optical and electrical transmission module 12 is supplied through a power cable 23 provided in an electric cable 13 with an electric connector 14 connected to an external device.

  For example, as shown in FIG. 2 d), the photoelectric power composite cable 11 has a structure in which a power cable 29 is integrated with a photoelectric composite cable 28. In general, a photoelectric composite transmission module 12 is connected to both ends of the photoelectric power composite cable 11. At this time, an electro-optical conversion unit described later is arranged inside one of the photoelectric composite transmission modules 12, and a photoelectric conversion unit described later is arranged on the other photoelectric composite transmission module 12, thereby Communication can be performed. In addition, it is possible to perform bidirectional communication by disposing both the electro-optic converter and the opto-electric converter in each of the photoelectric composite transmission modules 12 at both ends.

  On the other hand, in the configuration shown in FIG. 1 a), the photoelectric composite cable 28 may be used instead of the photoelectric composite cable 11, and the photoelectric composite transmission module 12 may be connected to both ends of the photoelectric composite cable 28.

  Next, another form is shown in FIG. In the structure of FIG. 1 a), a power cable 15 is further connected to the combined optical and electrical transmission module 12 to supply electric power for driving the combined optical and electrical transmission module 12. For example, as shown in FIG. 2c), the power cable 15 has a structure in which two power cables 29 are paired. An electrical connector (or plug) 16 is attached to the other end of the power cable 15.

  In this embodiment, power for driving the composite optical and electrical transmission module 12 is supplied through a power cable 15 with an electrical connector 16 connected to an external device. This is because the power supply is limited only by the power cable 23 (see FIG. 2A) provided in the electric cable 13. Of course, the power cable 23 provided in the electric cable 13 can also be used to drive the IC in the combined optical and electrical transmission module 12.

  In general, the electrical connector (or plug) 16 of the power cable 15 has a stronger connection strength than the electrical connector 14 of the electrical cable 13.

  Therefore, in this embodiment, the length of the power cable 15 is shorter than that of the electric cable 13. As a result, before an inadvertent force is applied to the electrical connector 14 in a direction in which the electrical connector 14 is pulled out from the connector of the external device, a pulling force is applied to the power cable 15 having a strong connection strength of the electrical connector (or plug) 16. It becomes like this. Therefore, it becomes difficult for an unintentional pulling force to be applied to the electrical connector 14 attached to the electrical cable 13, and the electrical connector 14 attached to the electrical cable 13 can be difficult to be disconnected from the connector of the external device.

  Yet another embodiment is shown in FIG. Electric power is supplied from an electrical cable 13 with an electrical connector 14 connected to an external device to drive the combined optical and electrical transmission module 12. One or more power cables 15 that do not drive the photoelectric composite transmission module 12 are in the photoelectric composite cable 11, and the power cable 15 is provided with an electrical connector (or plug) 16 other than the electrical connector 14. Yes. Before the optical / electrical power composite cable 11 is connected to the optical / electrical composite transmission module 12, the power cable 15 is branched 17 from the optical / electrical power composite cable 11 and separated into the electric power cable 15 and the optical / electrical composite cable 28. The power cable 15 is not connected to the photoelectric composite transmission module 12, and the photoelectric composite cable 28 is connected to the photoelectric composite transmission module 12.

  Therefore, according to this embodiment, the size of the photoelectric composite transmission module 12 can be reduced. In addition, as shown in FIG. 2d), for example, as shown in FIG. 2d), the branching power cable 29 is arranged at the end of the photoelectric composite cable 28 so that the power cable 29 can be easily branched. A structure is good. In this embodiment, the length of the power cable 29 is preferably shorter than that of the photoelectric composite cable 28 for the reason described in the embodiment of FIG.

  Further, the electrical cable 13 may be removed from the configuration of FIG. 1 and the electrical connector 33 may be directly connected to the combined optical and electrical transmission module 32 as shown in FIG.

  In this case, since the photoelectric composite transmission module 32 is directly connected to an external device via the electrical connector 33, the configuration is simplified and the cost can be reduced.

  Next, the internal structure of the photoelectric composite transmission module 12 will be described with reference to FIG.

  An optical / electrical power composite cable 411, an electric cable 402 having an electric connector 401 connected to an external device, a laser 406b for converting an electric signal from the electric cable 402 into an optical signal, and a laser driving IC 406a. Photoelectricity composed of an electro-optic converter 406 or a photodiode 416b for converting an optical signal from an optical signal line such as an optical fiber or an optical waveguide into an electrical signal and an amplification IC 416a for amplifying the electrical signal from the photodiode 416b. The signal transmission is performed between the electrical cable 402 and the optical / electrical power composite cable 411 by disposing the film type optical waveguide 407 between the conversion unit 416 and the optical / electrical power composite cable 411 and the electrical cable 402. Can do.

  An enlarged view of the film type optical waveguide 407 is shown in FIG. The film-type optical waveguide 517 has a core 503, an over clad 504, and an under clad 519 on a flexible printed circuit (520) (FPC: Flexible Printed Circuit) in which an electrical wiring 501 is formed on a resin substrate 502 such as polyimide.

  As a material for the film-type optical waveguide 517, a resin such as acrylic, epoxy, or polyimide is used. In the film type optical waveguide 517, the optical fiber 508 can be easily mounted only by forming the optical fiber insertion groove 509 as shown in FIG. 5B) and inserting the optical fiber 508 into the optical fiber insertion groove 509. . By mounting the optical fiber 508 on the film-type optical waveguide 517, even when the optical fiber 508 is multi-core, the film-type optical waveguide 517 and the optical element 505 can be aligned at the same time, thereby improving productivity. .

  Therefore, the optical composite transmission module 516 in which the optical fiber 508, the optical element 505 such as a laser or a photodiode, and the IC 506 for driving the optical element 505 are mounted on the film-type optical waveguide 517 can be easily reduced in cost.

  On the other hand, when the optical element 505 and the IC 506 are provided on the rigid substrate 409 shown in FIG. 4, it is not necessary to provide the electric wiring 501 in the film type optical waveguide 517, so that the manufacturing process of the film type optical waveguide 517 is simplified. The film type optical waveguide 517 can be manufactured at a low cost. Further, by disposing the optical element 505 on the rigid substrate 409, the heat dissipation effect of the optical element 505 is enhanced, and the operation characteristics of the optical element 505 are stabilized.

  Further, as shown in the detailed cross-sectional view of the portion of FIG. 4 a), an electric cable 402 is connected to a rigid board 409, and a flexible printed circuit board (405) is mounted using a card edge connector 405 that is also mounted on the rigid board 409. The film type optical waveguide 407 formed thereon is mounted on the rigid substrate 409 (see FIG. 5a). When the card edge connector 405 is used at the time of mounting, there is no process of applying heat to the film type optical waveguide. Further, by simply inserting the film-type optical waveguide 407 into the card edge connector 405, alignment or the like is not necessary, and mounting can be performed easily.

  Furthermore, as another method of mounting the film type optical waveguide 407 on the rigid substrate 409, there is a method of mounting the film type optical waveguide 407 on the rigid substrate 409 using anisotropic conductive resin or non-conductive resin. . An anisotropic conductive resin is a mixture of fine conductive particles in an adhesive resin, and is electrically conductive only to a portion where force is applied. For example, there is an ACF (Anisotropic Conductive Film) or the like, which is sandwiched between substrates to be connected, and the wiring can be electrically connected by applying heat while applying pressure.

  In addition, a mounting method using a non-conductive resin is, for example, a non-conductive between wirings on which bumps 510 are formed on either the chip component side such as the IC 506 and the optical element 505 shown in FIG. 5 or the electric wiring 501 side. By pouring resin and applying heat together with pressure, the wires are connected and fixed together. The mounting method using these anisotropic conductive resin or non-conductive resin is a mounting method having a temperature process, but since it is a low temperature process of about 150 ° C., it adversely affects the optical characteristics of the film type optical waveguide. Can be prevented. Since it can be mounted in a short time of about several tens of seconds, it is advantageous for cost reduction.

  On the wiring surface of the film type optical waveguide 517, as shown in FIG. 5a), an optical element 505 such as a laser or a photodiode and an IC 506 for driving the laser or amplifying an electric signal from the photodiode are disposed via bumps 510. The electric wiring 501 and the Philip chip mounting method are used. In order to optically couple the core 503 of the film-type optical waveguide 517 and the optical element 505, it is necessary to convert the optical path by 90 °. Therefore, as an example, an optical path conversion mirror 507 is formed on the film type optical waveguide 517 by dicing or the like to perform optical path conversion. The inclined surface 521 of the optical path conversion mirror 507 is formed to be inclined by 45 ° with respect to the optical axis of the core 503.

  On the wiring of the film-type optical waveguides 407 and 517 formed on the flexible printed circuit board 520, extremely high positional accuracy (for example, if the core 503 is about 50 μm for multimode, several μm or less, or the core 503 is a single mode) If the electro-optic conversion unit 406 and the opto-electric conversion unit 416 that are required to be sub-μm or less are required for manufacturing, the manufacturing accuracy of the rigid substrate 409 may be about several tens of μm. An inexpensive one can be used.

  Next, the mounting structure of the film type optical waveguide 407 will be described with reference to FIGS. 4, 5, and 8.

  The electro-optical conversion unit 406 and the photoelectric conversion unit 416 are mounted on the surface of the film-type optical waveguide 407, and the electro-optical conversion unit 406 and the photoelectric conversion unit 416 are opposed to one surface of the rigid substrate 409. Has been implemented. A voltage converter 413 is mounted on the other surface of the rigid board 409.

  One end of the film type optical waveguide 407 is held by the card edge connector 405, and the other end side of the film type optical waveguide 407 and the optical fiber covering portion 801 are attached to a protective member 800 such as a glass plate for protecting the optical fiber. It is held and fixed using an adhesive or the like. The protective member 800 is mechanically connected to and held by the rigid substrate 409 using an adhesive or the like.

  With this structure, the electro-optical conversion unit 406 or the photoelectric conversion unit 416 can be protected from the force applied when the resin is molded as the housing 403 of the combined optical and electrical transmission module.

  On the other hand, electrical wiring is required on the surface of the film-type optical waveguide 407 on which the electro-optic conversion unit 406 and the opto-electric conversion unit 416 of FIG. 4 are mounted. Therefore, for example, as shown in FIG. 4 c), the optical elements (416 b, 406 b) and ICs (416 a, 406 a) constituting the electro-optic conversion unit 406 and the opto-electric conversion unit 416 are composed of a film type optical waveguide 407 and a rigid substrate 409. In the case of a structure that is not disposed between them and is disposed on the surface of the film-type optical waveguide 407 far from the rigid substrate 409, the electric wiring 418a of the rigid substrate 409 is formed using anisotropic conductive resin or non-conductive resin. In order to electrically connect the IC and the like disposed in the film type optical waveguide 407, electric wirings 418b and 418c are provided on both surfaces of the film type optical waveguide 420, and the electric wirings 418b and 418c are electrically connected. It is necessary to provide a through hole 419 to be used.

  Here, the driving power of the laser driving IC 406 a and the amplification IC 416 a is supplied from the electric cable 402. At this time, a voltage converter 413 such as a DC-DC (direct current-direct current) converter or an AC-DC (alternating current-direct current) converter is used between the electrical cable 402 and the card edge connector 405 to connect the electrical cable 402. Can be matched to the driving voltage range of the laser driving IC 406a and the amplification IC 416a. As a result, the IC 406a and the amplification IC 416a can be used without being constrained by the drive voltages of the IC 406a and the amplification IC 416a, and the options of the IC 406a and the amplification IC 416a that can be used are expanded.

  Further, as shown in FIGS. 4 and 8, the electro-optic conversion unit 406 or the opto-electric conversion unit 416 is mounted on the film-type optical waveguide 407 so as to be opposed to one surface side of the rigid substrate 409. A voltage converter 413 is disposed on the other surface of the rigid substrate 409. A ground layer 410 is formed inside the rigid substrate 409, and the voltage converter 413 and the electro-optic converter 406 or the opto-electric converter 416 have a structure in which electromagnetic noise is blocked by the ground layer 410.

  Therefore, the electromagnetic noise generated in the voltage converter 413 is less likely to electrically affect the signal line of the electro-optical conversion unit 406 or the photoelectric conversion unit 416. As a result, it is not necessary to provide a metal case or the like for partially covering the ICs 406a, 416a and the like to shield electrical noise, and space can be saved.

  The electrical cable 402 described above may be removed, and an electrical connector 601 for connecting to an external device may be directly connected to the rigid board 608 as shown in FIG.

  Next, the configuration of the photoelectric composite transmission module will be described with reference to FIG.

  An electrical cable 402 having an electrical connector 401 connected to an external device includes a high-speed differential signal line (2 to 4) 404, a composite cable 414 including four low-speed signal lines and one GND line, and a 5V power cable. (One) 415. The optical / electrical power composite cable 411 includes an optical fiber (4-fiber GI 50 μm tape type) 408, a composite cable 414 including five low-speed signal lines and a GND line, and a 5V power cable 412. The high-speed differential signal lines (2 to 4) 404 and the 5V power cable (1) 415 are connected to the rigid board 409.

  The rigid substrate 409 has a three-layer structure having electric wirings on the front and back surfaces and a ground layer 410 inside. The 5V power cable 415 of the electric cable 402 is connected to a voltage converter 413 (DC-DC converter) with an input 5V output of 3.3V, and the power output from the voltage converter 413 passes through the through hole 450 and the back surface (voltage) of the rigid board 409. And transmitted to the surface opposite to the surface on which the converter 413 is mounted.

  Further, power is supplied to the IC 406a for driving the laser (for example, VCSEL (surface emitting laser)) 406b mounted on the film type optical waveguide (with FPC) 407 connected by the card edge connector 405, and the laser 406b is driven. Yes. The power cable 415 on the rigid board 409 is branched into two before the voltage converter 413, and the power cable 412 not connected to the voltage converter 413 becomes the power cable 412 of the photoelectric power composite cable 411.

  As shown in FIG. 4, the optical fiber 408 of the optical / electrical power composite cable 411 is mounted on the film type optical waveguide 407 using the optical fiber insertion groove 509 (see FIG. 5) formed on the film type optical waveguide 407. And fixed using an adhesive such as resin. The film type optical waveguide 407 is connected and fixed to the rigid substrate 409 by a card edge connector 405. The high-speed differential signal line 404 of the electric cable 402 is connected to the surface on which the laser 406b is mounted, and transmits signals to and from the IC 406a for driving the laser 406b through the card edge connector 405.

  A composite cable 414 composed of a low-speed signal line and a GND line is arranged on the surface side of the rigid board 409 on which the voltage converter 413 is mounted. The other end of the optoelectric power composite cable 411 has a similar structure in which a photodiode 416b is mounted in place of the laser 406b, and a module in which an amplification IC 416a is mounted instead of the laser driving IC 406a. The module casing 403 is manufactured by sheet-processing SUS and then covering the top with a resin by molding.

  The other embodiments will be described in detail below with reference to FIG. 7 on the details of the photoelectric composite transmission modules 718 and 719.

  An electric cable 702 having an electric connector 701 connected to an external device includes a high-speed differential signal line (operation 2 to 4) 704, four low-speed signal lines, a 5V power cable (one), and a GND line (one). ) And a composite cable 714. The optical / electrical power composite cable 711 includes an optical fiber (4-fiber GI 50 μm tape type) 708, a composite cable 714 composed of four low-speed signal lines, one 5V power cable and one GND line, and one 12V power cable 712. It consists of and. A 12 V power cable 715 and high-speed differential signal lines (operation 2 to 4) 704 are connected to the rigid board 709.

  Further, the rigid substrate 709 has a three-layer structure in which electric wiring is provided on the front and back surfaces, and a ground layer 710 is provided in the rigid substrate 709. The 12V power cable 715 is connected to an input 12V output 3.3V voltage converter 713 (DC-DC converter), and the power output from the voltage converter 713 is transmitted through the through hole 750 to the back side of the rigid board 709 (voltage Is transmitted to a surface facing the surface on which the converter 713 is mounted. The card edge connector 705 supplies power to the IC 706a for driving the laser 706b mounted on the film type optical waveguide 707, and the laser 706b is driven. The 12V power cable 715 is branched into two before the voltage converter 713, and the cable 712 not connected to the voltage converter 713 becomes a part of the photoelectric power composite cable 711.

  The optical fiber insertion groove 509 shown in FIG. 5 is formed on the film-type optical waveguide 707, and the optical fiber 508 of the photoelectric power composite cable 711 is mounted on the film-type optical waveguide 707 and fixed using an adhesive. ing.

  Further, the film type optical waveguide 707 is connected to the rigid substrate 709 by a card edge connector 705. The high-speed differential signal line 704 of the electric cable 702 is connected to the surface of the rigid board 709 on which the laser 706b is mounted, and transmits signals to the laser driving IC 706a through the card edge connector 705.

  A composite cable 714 including a low-speed signal line, a 5V power cable, and a GND line is connected to the surface of the rigid board 709 on which the voltage converter 713 is mounted. A photoelectric composite transmission module having a photodiode 717b mounted on the other end of the optical / electrical power composite cable 711 instead of the laser 706b and an amplifier IC 717a for amplifying a signal from the photodiode 717b instead of the laser driving IC 706a. 718 is provided.

  The module housing 703 is manufactured by sheet-metal-working SUS and then covering it with a resin by molding.

  An electrical connector 716 is attached to the tip of the 12V power cable 715. In addition, the length of the power cable 715 is about 10 cm shorter than the length of the electric cable 702, and an unintentional pulling force is hardly applied to the electric cable 702. Further, in FIG. 1b), the length of the power cable 15 is shorter than the length of the electric cable 13 by about 10 cm.

  Although the present invention has been specifically described with reference to the examples, the present invention is not limited to these examples.

10; opto-electric composite transmission assembly 11, 31, 411, 610, 711; opto-electric power composite cable 12, 32, 516, 718, 719; opto-electric composite transmission module 13, 402, 702; electrical cable 14, 33, 401 601, 701, 716; electrical connectors 15, 29, 34, 412, 415, 611, 614; power cables 16, 35; electrical connectors (or plugs)
17; branch parts 21, 404, 603, 704; high-speed differential signal line 21a; signal line 21b; shield 22; low-speed signal line 23; power cable 24; GND line 25; 4-core tape type optical fiber 25a; Wire 25b; four-fiber tape type optical fiber coating 27; coating 28; opto-electric composite cables 403, 602, 703; housings 405, 604, 705; card edge connector 406; electro-optical converter 406a;
406b; Laser (VCSEL)
407, 517, 606, 707; film type optical waveguides 408, 508, 607, 708; optical fibers 409, 608, 709; rigid substrates 410, 609, 710; ground layers 413, 612, 713; voltage converter 414; Cable (low speed signal line, GND line)
416, 615, 717; photoelectric conversion units 416a, 615a, 717a; amplification IC
416b, 615b, 717b; photodiode 418, 501; electrical wiring 419, 450, 750; through hole 422, 510; bump 502; resin substrate 503; core 504; over clad 505;
507; optical path conversion mirror 509; optical fiber insertion groove 519; underclad 520; flexible printed circuit board 613; composite cable (low speed signal line, power cable, GND line)
712, 715; 12V power cable 714; composite cable (low speed signal line, 5V power cable, GND line)
800; Protection member (glass plate)
801: Optical fiber coating

Claims (8)

An electrical / optical conversion unit including a laser that converts an electrical signal into an optical signal and a driving IC that drives the laser, and / or a photodiode that converts an optical signal into an electrical signal, and an electrical signal from the photodiode is amplified. have a photoelectric conversion unit made of an amplification IC, the combined optical and electrical transmission module connected to an end of the photoelectric composite cable is a transmission cable,
A film type optical waveguide is disposed inside the photoelectric composite transmission module, and the electro-optical conversion unit and / or the photoelectric conversion unit is disposed in the film type optical waveguide .
The film-type optical waveguide has a flexible printed board in which electrical wiring is formed on a resin board, and a core and a clad formed on the flexible printed board,
A rigid substrate inside the optoelectric composite transmission module;
The film type optical waveguide is mounted on the rigid substrate,
The optical fiber of the photoelectric composite cable is mounted on the film-type optical waveguide,
At least one of the signal line, the power cable, and the GND line of the photoelectric composite cable is connected to the rigid board,
An electrical / electrical composite transmission module, wherein an electrical connector or an electrical cable for connecting to an external device is connected to the rigid board . An optical fiber insertion groove is formed in the film type optical waveguide,
2. The composite optical and electrical transmission module according to claim 1, wherein an optical fiber is inserted into the optical fiber insertion groove, and the optical fiber is mounted on the film-type optical waveguide. 3. The composite photoelectric transmission module according to claim 1, wherein the film type optical waveguide is connected to the rigid substrate by a card edge connector. 3. The photoelectric composite transmission module according to claim 1, wherein the film type optical waveguide is electrically connected to the rigid substrate by an anisotropic conductive resin or a non-conductive resin.
The electrical-optical converter unit and / or the opto-electric conversion unit, the optical-electrical composite transmission of claims 1 to 4, wherein any one, characterized in that it is disposed between the film-type optical waveguide and the rigid substrate module. The rigid substrate has an electrical ground layer therein, and the electro-optical conversion unit and / or the photoelectric conversion unit disposed in the film-type optical waveguide is disposed on one surface side of the rigid substrate. , photoelectric composite transmission module according to any one of claims 1 to 5, characterized in that the voltage converter to the other surface of the rigid substrate is arranged. The photoelectric composite transmission module according to claim 1, wherein the clad includes an over clad and an under clad. The photoelectric composite transmission module according to claim 1, wherein the rigid substrate has electrical wiring on a front surface and a back surface.

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