JP2006228922A - Double-sided flexible circuit board for repeated bending - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-sided flexible circuit board suitable for a mobile phone that is suited to the transmission of high-frequency signals and is provided with a folding part to make the unit thinner, to prevent the disconnection or breakage of a conductor, and to make a circuit board dense. <P>SOLUTION: The double-sided flexible circuit board is provided with a conductor circuit 2 and a cover material 1 on both sides of an insulating layer 3. In this case, the insulating layer is formed of a liquid crystal polymer film or a polyimide film of 10-100 μm in thickness, and the cover material is formed of only a liquid crystal polymer film with a thermal deformation temperature different from that of the insulating layer. The double-sided flexible circuit board for bending is also provided with a surrounding section of which the copper foil stress value Y is used in a range of 0.5-3% as shown in a following formula (1) Y(%)=(t<SB>Cu</SB>+1/2 t<SB>LI</SB>)/(r+t<SB>CL.</SB>+t<SB>Cu</SB>+1/2 t<SB>LI</SB>)×100 (where, t<SB>LI</SB>: thickness of insulating layer (μm); t<SB>CL.</SB>: thickness of cover material (μm); t<SB>Cu</SB>: thickness of copper foil (μm); r: bending radius of surrounding section). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a double-sided flexible circuit board suitable for applications in which bending of a mobile phone hinge part or the like is frequently performed.

  A mobile phone plays an important role as a key component of an electronic device, but higher performance is required as electronic components become smaller and highly integrated. In response to these demands, not only high density, light weight, and flexibility of a circuit board having a wiring circuit, in recent years, attention has been focused on increasing the frequency of signals in order to process a large amount of information.

  In order to transmit a high-frequency signal, it is necessary to use a material having a low dielectric constant and a low dielectric loss tangent. Here, the liquid crystal polymer film is known as a material excellent in high heat resistance, hygroscopic dimensional stability, high-frequency electrical characteristics, and the like. For example, in a conventional circuit board, a prepreg layer using glass fiber and a resin as an adhesive is used as an insulator to aim at dimensional stability, and even in a circuit board having fine wiring, In order to ensure the filling property, a cover material is used using a film coated with an adhesive. However, the above materials are not suitable for transmitting high frequency signals. Here, the insulating layer and the cover material are made of the same material, or by using only the liquid crystal polymer film for the cover material, the material characteristics of the insulating layer and the cover material are not considered, and the characteristics of the liquid crystal polymer film are not impaired. A circuit board can be constructed.

  The flexible circuit board is excellent in flexibility and is known as a material that can be bent and used. Among them, the single-sided flexible circuit board has a conductor layer formed on one side of an insulating layer, and is repeatedly used for bending. Further, in a double-sided flexible circuit board, a circuit made of a conductor is formed on both sides of an insulating layer, and is used for bending only once during mounting.

  An electronic circuit board that requires repeated bending uses a single-sided flexible circuit board. However, the single-sided flexible circuit board has a problem that the mounting density of the circuit board is half that of the double-sided flexible circuit board and the cost is high. For example, Patent Document 1 discloses that a single flexible circuit board including a double-sided flexible circuit board and a single-sided flexible circuit board is bent at a portion where a single-sided flexible circuit board is folded and overlapped with another single-sided flexible circuit board. It is shown that it improves the flexibility. In Patent Document 2, the arrangement structure in which a support material having a cylindrical surface is arranged inside the bent portion of the flexible circuit board prevents the bent portion from being crushed and broken, and suppresses the disconnection and breakage of the conductor. In addition, application to a foldable mobile phone is also shown.

Japanese Patent Laid-Open No. 11-195850 Japanese Patent Laid-Open No. 15-258388

  However, when a single-sided flexible circuit board is combined and applied to a bent part, the thickness of the layer of the flexible circuit board to be formed increases, resulting in inferiority and flexibility as compared with a single-sided flexible circuit board. . In addition, when a flexible circuit board is provided with a reinforcing structure, the presence of the reinforcing structure hinders an increase in the density of circuit boards in electronic circuits and electronic components.

  An object of the present invention is to provide a double-sided flexible circuit board that is suitable for transmission of a high-frequency signal and that can be lightened, suppressed conductor breakage and breakage, and can have a high density circuit board.

  As a result of intensive studies in order to solve the above-mentioned problems, the present inventor uses only a liquid crystal polymer film as a cover material of a double-sided flexible circuit board for repeated bending applications such as a mobile phone. The present inventors have found that the same flexibility as that of the substrate can be obtained and completed the present invention.

That is, the present invention provides a double-sided flexible circuit board in which a conductor circuit and a cover material are provided on both sides of an insulating layer, the insulating layer is made of a liquid crystal polymer film or polyimide film having a thickness of 10 to 100 μm, and the cover material is an insulating layer Is composed of only liquid crystal polymer films having different thermal deformation temperatures, and the copper foil strain value Y calculated by the following formula (1) is used in the range of 0.5 to 3%. It is a double-sided flexible circuit board for bending applications having a portion.
Y (%) = (t _Cu + 1/2 t _LI ) / (r + t _CL. + T _Cu + 1/2 t _LI ) x 100 (1)
Where t _LI is the thickness of the insulating layer film (μm), t _CL. Is the thickness of the liquid crystal polymer film of the cover material (μm), t _Cu is the thickness of the copper foil (μm), and r is the bending radius of the circular part (however, the bending radius r represents 2.0 to 5.0 mm).

Here, satisfying any one or more of the following requirements for the double-sided flexible circuit board provides a double-sided flexible circuit board having better performance.
1) The insulating layer is made of a liquid crystal polymer film, and its thermal deformation temperature is in the range of 270 to 330 ° C, and the thermal deformation temperature of the liquid crystal polymer film as the cover material is lower than that, 2) the conductor circuit is copper foil 3) that the thickness is in the range of 5 to 30 μm, 3) the cover material thickness is in the range of 10 to 100 μm, and 4) a double-sided flexible circuit board having a bent portion and a non-bent portion. 5) The bend radius r of the turn portion is in the range of 2.0 to 5.0 mm.

  The double-sided flexible circuit board is advantageously used in a folding part of a folding mobile phone. The present invention is also a foldable mobile phone characterized in that the double-sided flexible circuit board is used in a foldable portion of a foldable mobile phone. Furthermore, the present invention is the above foldable mobile phone in which the angle of the open state is in the range of 10 to 180 ° when the closed state of the foldable mobile phone is 0 °.

Hereinafter, the double-sided flexible circuit board of the present invention will be further described.
The double-sided flexible circuit board of the present invention is suitable for use in a bent portion such as a hinge portion of a mobile phone. For example, when used in a hinge portion of a mobile phone, the repeated bending life is 300,000 times or more. It is possible.

  The double-sided flexible circuit board of the present invention can be obtained by a known method such as circuit processing, but a conductor circuit is provided on both sides of an insulating layer made of a liquid crystal polymer film or a polyimide film, and a cover made only of a liquid crystal polymer film on the outside thereof. It has a structure with materials.

  The liquid crystal polymer film used in the insulating layer or the cover material is an arbitrary liquid crystal polymer film capable of forming an optically anisotropic melt phase, and is also called a thermotropic liquid crystal polymer. As is well known to those skilled in the art, a polymer capable of forming an optically anisotropic molten phase is a material that is polarized when a sample in a molten state is observed under a direct microscope with a polarizing microscope equipped with a heating device. It is a polymer having the property of passing through.

  The liquid crystal polymer film preferably has a transition temperature to an optically anisotropic melt phase in the range of 200 to 400 ° C., particularly 250 to 350 ° C. in terms of heat resistance and workability. Further, a lubricant, an antioxidant, a filler, and the like may be blended within a range that does not impair the characteristics of the film. The liquid crystal polymer film used in the present invention can be used in the form of a film or a solution, but it is advantageous to adhere to a copper foil as a film.

  The liquid crystal polymer film is obtained by a known method such as extrusion. In the case of extrusion molding, any extrusion molding method can be applied, but the known T-die method, laminate stretching method, inflation method and the like are industrially advantageous. In particular, in the inflation method and laminate stretching method, stress is applied not only in the mechanical axis direction of the film (hereinafter referred to as the MD direction) but also in the direction perpendicular to this (hereinafter referred to as the TD direction). A film with a balanced mechanical property can be obtained.

  The film used for the insulating layer may be a liquid crystal polymer film or a polyimide film. The polyimide film widely used for FPC can be used, and the polyimide film layer may be composed of two or more polyimide film layers.

  As the cover material, a liquid crystal polymer film or a polyimide film used for the insulating layer is a liquid crystal polymer film having a different thermal deformation temperature. The heat distortion temperature is preferably different in the range of 10 to 100 ° C. When a liquid crystal polymer film is used for the insulating layer, the thermal deformation temperature is in the range of 270 to 330 ° C, and the liquid crystal polymer film of the cover material is lower than that, preferably 10 to 100 ° C.

  In the method for producing a double-sided flexible circuit board of the present invention, a step of laminating a conductor layer on both sides of an insulating layer, a step of forming a conductor layer as a circuit, and a step of laminating a cover material on each conductor circuit layer on both sides There is. A copper foil (including a copper alloy foil) is suitable as a material for forming the conductor layer. Hereinafter, the conductor layer may be described as being representative of copper foil, but is not limited to copper foil.

  For example, when the insulating layer is a liquid crystal polymer film, both surfaces of the copper foil are roughened and laminated with the liquid crystal polymer film, and then laminated under heating and pressure. Next, circuit processing of the copper foil is performed by a known method. Next, after arrange | positioning the liquid crystal polymer film used as a cover material on both surfaces, it laminates | stacks under a heating and pressurization. When the liquid crystal polymer film is disposed on the conductor circuit as a cover material, as described above, 1) a method in which only the liquid crystal polymer film is disposed and heated and pressurized, or 2) the liquid crystal polymer film and the copper foil There is a method in which the liquid crystal polymer film surface of the laminate is placed on a conductor circuit, heated and pressurized, and then the copper foil is removed by etching. Any method may be used depending on the present invention.

  When the insulating layer is a polyimide film, the roughening treatment of the copper foil surface in contact with the polyimide film is not necessarily required, and the polyimide film is formed by applying, drying or curing in the form of a polyimide solution or a precursor solution thereof. Can be made.

  The copper foil roughening treatment includes a dry roughening method such as blasting and polishing, and a wet roughening method using a chemical solution. It is particularly preferable to use a blackening treatment.

  A preferable thickness range of the insulating layer is 200 μm or less, and particularly preferably 10 to 100 μm. If the film thickness is less than 10 μm, the film is easily torn and difficult to handle, and if it exceeds 100 μm, the film becomes rigid and difficult to handle in a roll shape.

  When manufacturing a double-sided flexible circuit board by laminating liquid crystal polymer films having different thermal deformation temperatures, it is desirable that the thermal deformation temperature differs by 10 ° C. or more between the insulating layer and the cover material. If the difference in thermal deformation temperature is less than 10 ° C, when a double-sided flexible circuit board is formed using an insulating layer made of a liquid crystal polymer film and a cover material, the liquid crystal polymer film is thermally deformed simultaneously by the pressure applied during lamination. This is because all the conductor circuits are likely to move, and the positioning control of the conductor circuits may be difficult. Here, when the insulating layer is a liquid crystal polymer film, the heat distortion temperature is set to 260 ° C. or higher, particularly preferably 270 to 330 ° C. If the thermal deformation temperature is lower than 270 ° C., there is a possibility that the thermal deformation of only the liquid crystal polymer film used for the insulating layer and the liquid crystal polymer film as the cover material cannot be distinguished. On the other hand, if the heat distortion temperature is 330 ° C. or higher, the melting point of the liquid crystal polymer film is exceeded, and it becomes difficult to maintain the shape of the circuit board. Even in the case where the insulating layer is polyimide, the thermal deformation temperature of the insulating layer and the cover material must be different, and it is desirable that the thermal deformation temperature of the cover material is lower by 10 ° C. or more than the thermal deformation temperature of the insulating layer.

  The copper foil strain value Y calculated from the formula (1) of the double-sided flexible circuit board of the present invention is in the range of 0.5 to 3%. If the copper foil strain value is less than 0.5%, the insulating layer thickness, the thickness of the copper foil in contact therewith, and the thickness of the cover material are reduced, which may cause disconnection of the conductor circuit. On the other hand, if the copper foil strain value exceeds 3%, the thickness of each layer forming the double-sided flexible circuit board will increase, and the bending radius will increase, making it practical for use in cell phone repeated bending applications that are lighter and more flexible. The above application becomes difficult.

  A preferable thickness range of the conductor layer is 100 μm or less. When the conductor layer is a copper foil, the thickness is desirably 5 to 30 μm. Although it is preferable to reduce the thickness of the copper foil from the viewpoint that a fine pattern can be formed, if the thickness is too thin, the copper foil may be wrinkled in the manufacturing process, and a circuit may be formed as a wiring board. In some cases, the wiring may break or the reliability of the circuit board may be reduced. On the other hand, when the thickness of the copper foil is increased, the side surface of the circuit is tapered when the copper foil is etched, which is not preferable for forming a fine pattern.

  As the copper foil used in the present invention, any copper foil produced by a rolling method or an electrolysis method can be used. The copper foil does not lose the effect of the present invention by physical surface treatment such as roughening treatment or chemical surface treatment such as acid cleaning for the purpose of ensuring adhesion with the liquid crystal polymer film as an insulating layer. It may be given within a range.

  A preferable thickness range of the cover material made of only the liquid crystal polymer film is 300 μm or less, and particularly preferably 10 to 100 μm. If the cover material thickness is less than 10 μm, the strain value of the copper foil is remarkably large, and it may be difficult to protect the conductor circuit, which serves as the cover material. On the other hand, if the cover material thickness exceeds 100 μm, the total thickness is too thick, making it difficult to practically apply to repeated bending applications characterized by lightening and flexibility.

  By applying the double-sided flexible circuit board of the present invention to repeated bending applications such as cellular phones, it contributes to high-frequency signal transmission, lightening, suppression of conductor disconnection and breakage, and high density of circuit boards.

  Hereinafter, the double-sided flexible circuit board of the present invention and its use examples will be described with reference to the drawings. FIG. 1 is a cross-sectional view for explaining an example of a layer structure of a double-sided flexible circuit board, which has a conductor circuit layer 2 on both sides of an insulating layer 3 made of a liquid crystal polymer film, and further has a liquid crystal polymer film 1 thereon. The cover material is provided. FIG. 2 is a cross-sectional view for explaining an example of another layer structure of a double-sided flexible circuit board, which has a conductor circuit layer 2 on both sides of an insulating layer 4 made of a polyimide film, and further a liquid crystal polymer film thereon 1 cover material is provided.

  FIG. 3 is a cross-sectional view for explaining another example of the layer structure of the double-sided flexible circuit board, which has a conductor circuit layer 2 on both sides of an insulating layer 3 made of a liquid crystal polymer film, and further, an epoxy-based layer. A polyimide film 5 with an adhesive layer 6 is used as a cover material. FIG. 4 shows an example in which the insulating layer 3 in FIG. 3 is an insulating layer 4 made of a polyimide film. FIG. 5 shows an example in which a composite film composed of a liquid crystal polymer film 1 and a polyimide adhesive film 6 is used as a cover material for the insulating layer 4 composed of a polyimide film. 3 to 5 show a double-sided flexible circuit board outside the scope of the present invention.

  FIG. 6 is a schematic diagram for explaining an example of the case where the double-sided flexible circuit board of the present invention is used for a hinge part. The double-sided flexible circuit having a bent part 8 bent into an S shape as shown in FIG. As shown in (B), the circuit board 7 is wound around the bent portion so as to have a circular cross section. Further, by turning around, the surface of the non-bent part 9 on both sides of the turning part becomes the same surface when viewed from above. When rotating, a cylindrical body may be used for the portion that becomes the rotating shaft 10.

  FIG. 6B is an example of a usage pattern used in a mobile phone repeated bending application, where the double-sided flexible circuit board in the bent portion is rotated once in the rotating portion, and the bending radius in the rotating portion is 2.0 to 5.0. It is in the mm range. When this is used for a folding mobile phone, the opening / closing angle is in the range of 10 ° to 180 °. FIG. 6B shows a double-sided flexible circuit board having a bent portion and a non-bent portion, in which the bent portion 8 is rotated once, and this portion is called α winding.

  A preferred radius range of the bending radius (approximately equal to the radius of the rotating shaft 10) at the rotating portion is in the range of 2.0 to 5.0 mm. If the bending radius is less than 2.0 mm, it may be difficult to maintain the bent shape. On the other hand, if the bending radius exceeds 5.0 mm, it will be difficult to practically apply to repeated bending of a mobile phone characterized by lightening and flexibility.

  FIG. 7 is a schematic diagram of a folded cellular phone, in which a double-sided flexible circuit board 7 is wound around a hinge portion 11 to connect between a main body (button portion) 12 and a lid portion (display portion) 13. A preferable angle range of the opening / closing angle formed by the main body 12 and the lid portion 13 is in the range of 10 to 180 °. If the opening / closing angle is less than 10 °, there is a possibility that practical troubles such as opening and closing cannot occur. On the other hand, when the opening / closing angle exceeds 180 °, the cell phone is not repeatedly bent but is bent.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited at all by these Examples.

* Copper foil circuit processing A dry film was laminated on a double-sided copper clad laminate made of a liquid crystal polymer film, and a circuit pattern was formed by UV exposure using a pattern film with a resist width of 100 μm and a circuit width of 100 μm. Next, copper foil etching was performed using a copper chloride etching solution. The obtained double-sided conductor circuit board was checked for peeling of the circuit and residual copper between the circuits using an optical microscope.
* Thickness measurement
In accordance with JISC5016, the thickness of the insulating layer, the cover material, and the copper foil were measured using a film thickness measuring instrument (Dial Gauge 215-153 manufactured by Mitutoyo Corporation).
* Initial resistance measurement
According to JISC5016, a resistance measuring device (CX-180N made by Custom Co., Ltd.) was used to measure the resistance value of the double-sided conductor circuit board before pressing the cover material.
* Calculation of copper foil strain value The copper foil strain value calculated from the copper foil thickness value, the insulating layer thickness, the cover material thickness, and the bending radius used for the double-sided flexible circuit board was calculated by the formula (1).
* Cellular phone repeated bending test Using a hinge bending resistance tester (PIS-FPJ310 manufactured by Pros), a cell phone repeated bending test was performed on a double-sided flexible circuit board. The breaking condition of the double-sided flexible circuit board was a resistance value increase of 5% from the initial resistance value.

Example 1
Both sides with 25μm thick liquid crystal polymer film 280 (Kuraray Bexter, heat distortion temperature 280 ° C) as insulation layer and 18μm thick rolled copper foil (Nikko Materials BHY-22B-T) on both sides A dry film was laminated on the copper-clad laminate, and a circuit pattern was formed by UV exposure using a pattern film having a resist width of 100 μm and a circuit width of 100 μm. Next, copper foil etching was performed using a copper chloride etchant to prepare a double-sided conductor circuit board W. Next, in order to use a 25 μm-thick liquid crystal polymer film 260 (Kuraray Bexter, heat distortion temperature 260 ° C.) as a cover material for the double-sided conductor circuit board W, one side having the above-mentioned rolled copper foil with a thickness of 18 μm on one side A copper clad laminate S was prepared.
Here, the liquid crystal polymer film surfaces of the double-sided conductor circuit board W and the single-sided copper-clad laminate S were subjected to chemical treatment with an alkaline aqueous solution, washed with pure water, and then dried in a hot air oven at 90 ° C. Moreover, in order to adhere the liquid crystal polymer film as the cover material to the copper foil, the copper surface of the double-sided conductor circuit board was blackened. After that, in the form of sandwiching the double-sided conductor circuit board W, laminating a single-sided copper-clad laminate S with liquid crystal polymer films with different flow temperatures as the resin layer, pressing with a precision press at 260 ° C and a pressure of 9 MPa, A circuit board was obtained. After the pressing, the outermost layer copper foil of the obtained circuit board was removed by etching to obtain a double-sided flexible circuit board (FIG. 1) in which the insulating layer and the cover material were made of a liquid crystal polymer.
The double-sided flexible circuit board obtained as described above was cut into the shape shown in FIG. The bent part of the test piece was turned around to make α winding, and a hinge bending resistance test was performed with the circuit surface of line / space = 100/100 (μm) facing inward (see FIG. 6B). Moreover, the copper foil distortion value of each test piece after completion | finish of a hinge bending-proof test was computed.

Example 2
A double-sided flexible circuit board was produced and evaluated in the same manner as in Example 1 except that the liquid crystal polymer film 260 having a thickness of 50 μm was used as the cover material.

Example 3
A dry film is laminated on double-sided copper-clad laminate M (Espanex M grade, manufactured by Nippon Steel Chemical Co., Ltd.) having a rolled copper foil of 18 μm thickness on both sides of polyimide with a thickness of 25 μm, resist width 100 μm, circuit width 100 μm A circuit pattern was formed by UV exposure using the pattern film. Next, copper foil etching was performed using a copper chloride etchant to prepare a double-sided conductor circuit board. Next, in order to use the liquid crystal polymer film 260 having a thickness of 25 μm as a cover material for the double-sided conductor circuit board, a single-sided copper-clad laminate having a rolled copper foil having a thickness of 18 μm on one side was prepared. A single-sided copper-clad laminate with a liquid crystal polymer film as a resin layer was laminated with a double-sided conductor circuit board sandwiched between them, and the circuit board was pressed with a precision press at 260 ° C. and 9 MPa. After pressing, the outermost copper foil of the obtained circuit board is removed by etching, a polyimide film on the insulating layer, the cover material is only a liquid crystal polymer film, and a double-sided flexible circuit board in which different resin layers are laminated (FIG. 2) It was.

Comparative Example 1
The insulating layer is a liquid crystal polymer film 280 with a thickness of 25 μm, and a dry film is laminated on a double-sided copper-clad laminate that has a rolled copper foil with a thickness of 18 μm on both sides, and a pattern film with a resist width of 100 μm and a circuit width of 100 μm is used. A circuit pattern was formed by UV exposure. Next, copper foil etching was performed using a copper chloride etchant to prepare a double-sided conductor circuit board. Next, using a polyimide film cover material in which an epoxy adhesive layer is provided on a polyimide film K (Kapton: registered trademark), a double-sided conductor circuit board is sandwiched, and a precision press, 160 to 170 ° C., 2 to Pressing was performed at a pressure of 7 MPa to obtain a double-sided flexible circuit board (FIG. 3).

Comparative Example 2
Evaluation was performed in the same manner as in Comparative Example 1 except that a polyimide film cover material (three types) having a thickness structure shown in Table 1 in which an epoxy adhesive layer was provided on a polyimide film K was used as a cover material.
Comparative Example 3

  A dry film is laminated on a double-sided copper-clad laminate M with 18 μm-thick rolled copper foil on both sides of a polyimide with a thickness of 25 μm, and a circuit pattern is formed by UV exposure using a pattern film with a resist width of 100 μm and a circuit width of 100 μm. Formed. Next, copper foil etching was performed using a copper chloride etchant to prepare a double-sided conductor circuit board. Next, using a polyimide film cover material in which an epoxy adhesive layer is provided on polyimide film K, the double-sided conductor circuit board is sandwiched and pressed at a pressure of 160 to 170 ° C and 2 to 7 MPa with a precision press. To obtain a double-sided flexible circuit board (FIG. 4).

Comparative Example 4
Evaluation was performed in the same manner as in Comparative Example 1 except that a polyimide film cover material (three types) having a thickness structure shown in Table 1 in which an epoxy adhesive layer was provided on a polyimide film K was used as a cover material.

Comparative Example 5
A dry film is laminated on a double-sided copper-clad laminate M with 18 μm-thick rolled copper foil on both sides of a polyimide with a thickness of 25 μm, and a circuit pattern is formed by UV exposure using a pattern film with a resist width of 100 μm and a circuit width of 100 μm. Formed. Next, copper foil etching was performed using a copper chloride etchant to prepare a double-sided conductor circuit board. Next, a single-sided copper clad laminate having a rolled copper foil with a thickness of 18 μm on one side of a liquid crystal polymer film 260 with a thickness of 25 μm was prepared. Next, a double-sided conductor circuit board was laminated with a single-sided copper-clad laminate with a liquid crystal polymer film as a resin layer via a polyimide adhesive film (bonding sheet SPB manufactured by Nippon Steel Chemical Co., Ltd.). A circuit board was obtained by pressing at 9 ° C. and a pressure of 9 MPa. After the pressing, the outermost layer copper foil of the obtained circuit board was removed by etching to obtain a double-sided flexible circuit board (FIG. 5).

  The evaluation results are shown in Table 1. In addition, the value in () in the cover material thickness column in the comparative example represents the thickness (μm) of PF: polyimide film, LCPF: liquid crystal polymer film, Ad: epoxy type or polyimide type adhesive layer.

Sectional drawing for demonstrating an example of a double-sided flexible circuit board Sectional drawing for demonstrating an example of a double-sided flexible circuit board other Sectional drawing for demonstrating the comparative example of a double-sided flexible circuit board Sectional drawing for demonstrating the comparative example of a double-sided flexible circuit board Sectional drawing for demonstrating the comparative example of a double-sided flexible circuit board Schematic diagram for explaining an example of using a double-sided flexible circuit board Schematic diagram for explaining an example of a folding mobile phone

Explanation of symbols

1: LCD polymer film cover material
2: Conductor circuit layer
3: Liquid crystal polymer film insulation layer
4: Polyimide film insulation layer
5: Polyimide film cover material
6: Adhesive layer
7: Test piece
8: Bending part
9: Non-bent part
10: Circumference axis of bent part
11: Hinge part
12: Body
13: Lid

Claims (8)

In a double-sided flexible circuit board in which a conductor circuit and a cover material are provided on both sides of the insulation layer, the insulation layer is made of a liquid crystal polymer film or polyimide film with a thickness of 10 to 100 μm, and the cover material has a heat deformation temperature of the insulation layer. For bending applications having a circular portion, which is composed of only different liquid crystal polymer films and has a copper foil strain value Y calculated by the following formula (1) in the range of 0.5 to 3%. Double-sided flexible circuit board.
Y (%) = (t _Cu + 1/2 t _LI ) / (r + t _CL. + T _Cu + 1/2 t _LI ) x 100 (1)
(Where t _LI is the insulation layer film thickness (μm), t _CL. Is the thickness of the liquid crystal polymer film of the cover material (μm), t _Cu is the copper foil thickness (μm), and r is the bending radius (where (Radius r is 2.0 to 5.0 mm)   2. The double-sided flexible circuit board according to claim 1, wherein the insulating layer is made of a liquid crystal polymer film, the heat deformation temperature thereof is in the range of 270 to 330 [deg.] C., and the heat deformation temperature of the liquid crystal polymer film as the cover material is lower.   The double-sided flexible circuit board according to claim 1 or 2, wherein the conductor circuit is formed from a copper foil and has a thickness in the range of 5 to 30 µm.   The double-sided flexible circuit board according to claim 1, wherein the cover material has a thickness in the range of 10 to 100 μm.   The double-sided flexible circuit board according to any one of claims 1 to 4, wherein the double-sided flexible circuit board has a bent part and a non-bent part, and the bent part is wound around.   The double-sided flexible circuit board according to any one of claims 1 to 5, wherein the double-sided flexible circuit board is used in a folding part of a folding cellular phone.   A foldable mobile phone, wherein the double-sided flexible circuit board according to any one of claims 1 to 6 is used in a foldable portion of a foldable mobile phone.   The foldable mobile phone according to claim 7, wherein when the foldable mobile phone is in a closed state of 0 °, an angle of the open state is in a range of 10 to 180 °.

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