JP2003258388A - Arranging structure of flexible printed circuit board - Google Patents
Arranging structure of flexible printed circuit boardInfo
- Publication number
- JP2003258388A JP2003258388A JP2002061154A JP2002061154A JP2003258388A JP 2003258388 A JP2003258388 A JP 2003258388A JP 2002061154 A JP2002061154 A JP 2002061154A JP 2002061154 A JP2002061154 A JP 2002061154A JP 2003258388 A JP2003258388 A JP 2003258388A
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- flexible printed
- wiring board
- printed wiring
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板(FPC)の配置構造に関するものである。特
に、繰り返し曲げが加わっても導体の断線確率を低減で
きるFPCの配置構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board (FPC) layout structure. In particular, the present invention relates to an FPC layout structure that can reduce the probability of conductor breakage even if repeated bending is applied.
【0002】[0002]
【従来の技術】近年、携帯電話の発展が目覚ましい。特
に、最近では表示部の大画面化、コンパクト化、ファッ
ション性、操作ボタンなどの保護性を考慮して、二つ折
り型(シェル型)の携帯電話が主流になっており、今後
もその傾向が継続すると予想される。2. Description of the Related Art In recent years, the development of mobile phones has been remarkable. In particular, recently, in consideration of the large screen of the display unit, compactness, fashionability, and protection of operation buttons, the folding (shell-type) mobile phone has become the mainstream, and this trend will continue in the future. Expected to continue.
【0003】図5(A)は、シェル型の携帯電話を開いた
状態の模式図、同(C)は閉じた状態の模式図、同(B)は同
携帯電話を開いた状態におけるFPCの模式図、同(D)は閉
じた状態におけるFPCの模式図である。シェル型の携帯
電話60は、操作ボタン(図示せず)の配列されたキースイ
ッチ部61に液晶画面などの表示部62をヒンジ63で折り畳
み自在に連結した構造である。キースイッチ部61と表示
部62とはFPC64を介して電気的接続がとられている。FIG. 5 (A) is a schematic view of the shell type mobile phone in an open state, FIG. 5 (C) is a schematic view of the closed state, and FIG. 5 (B) is an FPC in the open state of the mobile phone. Schematic diagram, (D) is a schematic diagram of the FPC in a closed state. The shell-type mobile phone 60 has a structure in which a display unit 62 such as a liquid crystal screen is foldably connected by a hinge 63 to a key switch unit 61 in which operation buttons (not shown) are arranged. The key switch unit 61 and the display unit 62 are electrically connected via the FPC 64.
【0004】ここで用いられるFPCは、例えば図4に示
すように、両端の直線部50をS型屈曲部51でつないだオ
フセット型の形状をしており、S型屈曲部51を前記ヒン
ジ内で1巻きして、キースイッチ部と表示部を繰り返し
折り曲げした際の耐折性を得ている。As shown in FIG. 4, for example, the FPC used here has an offset type shape in which straight portions 50 at both ends are connected by S-shaped bent portions 51. It has a fold resistance when the key switch part and the display part are repeatedly bent.
【0005】その際、ヒンジの円筒部材内にFPCの屈曲
部が配置されるが、従来は1巻きされたFPCの巻き形状
を保持する格別の構成が設けられていなかった。At this time, the bent portion of the FPC is arranged in the cylindrical member of the hinge, but conventionally, no special structure for holding the winding shape of the FPC wound once was provided.
【0006】[0006]
【発明が解決しようとする課題】しかし、上記のような
FPCの配置構造では、表示部とキースイッチ部の開閉に
伴い、FPCの巻き径が過小となる問題があった。従来のF
PCの配置構造は、1巻きされたFPCの巻き形状を保持す
る何らの手段も設けられていない。そのため、携帯電話
の開閉を繰り返すと、図5(D)に示すように、この巻き径
が小さくなったり巻き形状がつぶれたりすることが起こ
る。その結果、導通の不良、導体の断線が起こり、場合
によってはFPCの破断に至る。However, as described above,
In the FPC layout structure, there is a problem that the winding diameter of the FPC becomes too small due to the opening and closing of the display section and the key switch section. Conventional F
The arrangement structure of the PC is not provided with any means for maintaining the winding shape of the FPC having one winding. Therefore, when the mobile phone is repeatedly opened and closed, the winding diameter may be reduced or the winding shape may be collapsed, as illustrated in FIG. 5D. As a result, poor continuity and breakage of the conductor occur, and in some cases, the FPC is broken.
【0007】従って、本発明の主目的は、屈曲して配さ
れたFPCにおける導体の断線やFPC自体の破断を抑制する
ことができるFPCの配置構造を提供することにある。Therefore, a main object of the present invention is to provide an FPC arranging structure capable of suppressing disconnection of a conductor in a bent FPC and breakage of the FPC itself.
【0008】[0008]
【課題を解決するための手段】本発明は、屈曲して配さ
れたFPCの保形手段を設けることで上記の目的を達成す
る。The present invention achieves the above object by providing a shape-retaining means for an FPC that is arranged in a bent manner.
【0009】すなわち、本発明フレキシブルプリント配
線板の配置構造は、繰り返し屈曲が作用する個所にフレ
キシブルプリント配線板の一部を屈曲して配したフレキ
シブルプリント配線板の配置構造であって、前記フレキ
シブルプリント配線板の屈曲個所の内側に、円筒面をも
つ支持材を配したことを特徴とする。That is, the arrangement structure of the flexible printed wiring board according to the present invention is the arrangement structure of the flexible printed wiring board in which a part of the flexible printed wiring board is bent and arranged at the position where the bending is repeatedly applied. It is characterized in that a supporting member having a cylindrical surface is arranged inside the bent portion of the wiring board.
【0010】FPCにおける屈曲個所の内側に支持材を配
することで、FPCの屈曲部のつぶれや折れを防止して、
導体の断線やFPCの破断を抑制する。By arranging the support material inside the bent portion of the FPC, it is possible to prevent the bent portion of the FPC from being crushed or broken.
Suppresses conductor breaks and FPC breaks.
【0011】支持材の形状は円筒面を有するものであれ
ば良い。一般にはパイプ状のものが好適である。特に、
周面の一部を軸方向に切り欠いた円筒部材は支持材自体
の縮径方向への弾性が得られて好ましい。The support material may have any shape as long as it has a cylindrical surface. Generally, a pipe shape is suitable. In particular,
A cylindrical member in which a part of the peripheral surface is cut out in the axial direction is preferable because elasticity of the support material itself in the diameter reducing direction can be obtained.
【0012】支持材の材質はプラスチックや金属が好ま
しい。例えば、ポリエチレン、ポリプロピレン、ポリエ
チレンテレフタレートやアルミニウム、銅が利用でき
る。もちろん、これら材料単体ではなく、積層・複合化
した材料も利用できる。The support material is preferably plastic or metal. For example, polyethylene, polypropylene, polyethylene terephthalate, aluminum or copper can be used. Of course, not only these materials alone but also a laminated / composite material can be used.
【0013】支持材の厚みは材料にもよるが、一般的に
は0.2〜1.0mm程度が好ましい。Although the thickness of the support material depends on the material, it is generally preferably about 0.2 to 1.0 mm.
【0014】支持材とFPCとの配置は、FPCを支持材に巻
き付けたり、装着することが好ましい。そして、支持材
とFPCを接着剤により固定したり、支持材に係合部を設
け、この係合部にFPCを挟み込むなどして固定すること
が挙げられる。接着剤を用いる場合、支持材とFPCは全
面接着であっても部分接着であっても良い。The arrangement of the support material and the FPC is preferably such that the FPC is wound around or attached to the support material. Then, the support material and the FPC may be fixed by an adhesive, or the support material may be provided with an engaging portion, and the FPC may be sandwiched between the engaging portions so as to be fixed. When an adhesive is used, the support material and the FPC may be wholly bonded or partially bonded.
【0015】[0015]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。
(実施例1)本発明配置構造に用いるFPCは、従来と同
様、図4に示すように、両端の直線部をS型屈曲部でつ
ないだオフセット型の形状をしている。一般に、このよ
うなFPCは両端部に図示しない相手方基板との接続電極
部が形成されている。接続電極部以外の導体はポリイミ
ドなどの樹脂フィルムの間に挟み込まれ、FPCを構成し
ている。本例では、厚さ18μmの銅箔で導体を構成し、
この導体を各々厚さ12.5μmのポリイミド製上面樹脂フ
ィルムと下面樹脂フィルムとの間に挟んでいる。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. (Example 1) The FPC used in the arrangement structure of the present invention has an offset type shape in which linear portions at both ends are connected by S-shaped bent portions, as shown in FIG. In general, such an FPC has connection electrode portions (not shown) for connection with a mating substrate, which are not shown. The conductors other than the connecting electrodes are sandwiched between resin films such as polyimide to form an FPC. In this example, the conductor is composed of 18 μm thick copper foil,
Each of these conductors is sandwiched between a polyimide upper surface resin film and a lower surface resin film having a thickness of 12.5 μm.
【0016】このようなFPCと支持材を図1(A)に示す。
ここでは周面の一部が軸方向に切り欠かれたポリエチレ
ンパイプ20を支持材とした。図1(B)に示すように、この
ポリエチレンパイプ20の外周にFPC10を1回巻きつける。
巻き付け回数は特に限定されない。ここでは単にFPCを
支持材に巻き付けただけであり、接着は行っていない。Such an FPC and supporting material are shown in FIG. 1 (A).
In this case, the polyethylene pipe 20 having a part of the peripheral surface cut out in the axial direction was used as the supporting material. As shown in FIG. 1 (B), the FPC 10 is wound once around the outer circumference of the polyethylene pipe 20.
The number of windings is not particularly limited. Here, the FPC is simply wrapped around the support material, and no bonding is performed.
【0017】このような支持材とFPCは、例えばシェル
型携帯電話のヒンジ部内に配置することで利用される。The support material and the FPC are used by arranging them in the hinge part of a shell type mobile phone, for example.
【0018】このように構成したFPCと支持材を用いて
繰り返し曲げ試験を行った。比較として、支持材がなく
FPCのみを1回巻きした配置構造についても同様の曲げ試
験を行った。試験条件は次のとおりである。シェル型携
帯電話実機に前記FPCを装着し、キースイッチ部と表示
部の開閉動作を繰り返す。ここでは「全開」と「閉」と
の間にて前記開閉動作を2秒サイクルで繰り返した。FPC
の内径は約5mmφである。A repeated bending test was performed using the FPC and the support material thus configured. For comparison, without support
The same bending test was performed for the arrangement structure in which only the FPC was wound once. The test conditions are as follows. The FPC is mounted on the actual shell type mobile phone, and the opening and closing operations of the key switch section and the display section are repeated. Here, the opening / closing operation was repeated in a 2-second cycle between "fully opened" and "closed". FPC
The inner diameter of is about 5 mmφ.
【0019】その結果、支持材を用いたFPCの配置構造
は、10万回の繰り返し屈曲に対して導体の断線やFPCの
破断が見られなかった。これに対して、支持材のないFP
Cの配置構造は、8万回の繰り返し屈曲で導体の断線が見
られた。As a result, in the FPC arrangement structure using the support material, no conductor breakage or FPC breakage was observed after repeated bending of 100,000 times. In contrast, FP without support material
Regarding the arrangement structure of C, the conductor was broken after repeated bending of 80,000 times.
【0020】(実施例2)以上の実施例1では支持材にF
PCを1回巻いたが、図2に示すように、0.5回巻くような
場合であっても良い。このようにパイプ20にFPC10を0.5
回巻いた配置構造でも、実施例1と同様にFPCの屈曲形状
が縮小されることを防止でき、導体断線を抑制すること
ができる。(Example 2) In Example 1 described above, F was used as the support material.
Although the PC is wound once, it may be wound 0.5 times as shown in FIG. In this way, pipe 20 to 0.5 FPC10
Even with the wound arrangement structure, it is possible to prevent the bent shape of the FPC from being reduced as in the first embodiment, and it is possible to suppress conductor breakage.
【0021】(実施例3)さらに、図3に示すように、
円筒状の支持部材30に波型にFPC10を沿わせる配置構造
でも良い。このような配置構造でも、実施例1と同様にF
PCの屈曲形状が縮小されることを防止でき、導体断線を
抑制することができる。(Embodiment 3) Further, as shown in FIG.
The FPC 10 may be arranged in a corrugated manner along the cylindrical support member 30. Even with such an arrangement structure, as in Example 1, F
It is possible to prevent the bent shape of the PC from being reduced, and it is possible to suppress conductor breakage.
【0022】[0022]
【発明の効果】以上説明したように、本発明によれば、
FPCの屈曲部に支持材を配することで、FPCの屈曲部を保
形することができ、繰り返し曲げに対して導体の断線や
FPCの破断確率を低下させることができる。As described above, according to the present invention,
By arranging the support material in the bent part of the FPC, the bent part of the FPC can be kept in shape and the conductor disconnection and
The probability of FPC breakage can be reduced.
【図1】(A)は支持材にFPCを巻きつける前の状態を示す
説明図、(B)は支持材にFPCを巻きつけた後の状態を示す
本発明配置構造の説明図である。FIG. 1A is an explanatory view showing a state before the FPC is wound around a support material, and FIG. 1B is an explanatory view of the arrangement structure of the present invention showing a state after the FPC is wound around the support material.
【図2】支持材にFPCを半周巻き付けた本発明配置構造
の説明図である。FIG. 2 is an explanatory view of an arrangement structure of the present invention in which an FPC is wound around a support member half way.
【図3】支持材にFPCを波型に沿わせた本発明配置構造
の説明図である。FIG. 3 is an explanatory view of an arrangement structure of the present invention in which an FPC is arranged along a corrugated shape on a support material.
【図4】従来より用いられているFPCの模式説明図であ
る。FIG. 4 is a schematic explanatory diagram of a conventionally used FPC.
【図5】携帯電話におけるFPC屈曲部の形状変化を示す
説明図であり、(A)は、シェル型の携帯電話を開いた状
態の模式図、(C)は閉じた状態の模式図、(B)は同携帯電
話を開いた状態におけるFPCの模式図、(D)は閉じた状態
におけるFPCの模式図である。5A and 5B are explanatory diagrams showing changes in the shape of an FPC bent portion in a mobile phone, where FIG. 5A is a schematic view of a shell-type mobile phone in an open state, and FIG. 5C is a schematic view of a closed state. B) is a schematic diagram of the FPC when the mobile phone is opened, and (D) is a schematic diagram of the FPC when the mobile phone is closed.
10 FPC 20 パイプ 30 支持部材 50 直線部 51
屈曲部
60 携帯電話 61 キースイッチ部 62 表示部 63
ヒンジ 64 FPC10 FPC 20 Pipe 30 Support member 50 Straight section 51
Bending part 60 Mobile phone 61 Key switch part 62 Display part 63
Hinge 64 FPC
Claims (5)
ブルプリント配線板の一部を屈曲して配したフレキシブ
ルプリント配線板の配置構造であって、 前記フレキシブルプリント配線板の屈曲個所の内側に、
円筒面をもつ支持材を配したことを特徴とするフレキシ
ブルプリント配線板の配置構造。1. An arrangement structure of a flexible printed wiring board in which a part of the flexible printed wiring board is bent and arranged at a portion where repeated bending acts, wherein the flexible printed wiring board has an inner side of the bent portion of the flexible printed wiring board.
An arrangement structure of a flexible printed wiring board, characterized in that a supporting material having a cylindrical surface is arranged.
個所は、前記支持材に巻き付けられていることを特徴と
する請求項1に記載のフレキシブルプリント配線板の配
置構造。2. The arrangement structure of a flexible printed wiring board according to claim 1, wherein the bent portion of the flexible printed wiring board is wound around the support material.
個所は、前記支持材に装着されていることを特徴とする
請求項1に記載のフレキシブルプリント配線板の配置構
造。3. The arrangement structure of the flexible printed wiring board according to claim 1, wherein the bent portion of the flexible printed wiring board is mounted on the support member.
ことを特徴とする請求項1に記載のフレキシブルプリン
ト配線板の配置構造。4. The arrangement structure of a flexible printed wiring board according to claim 1, wherein the support material is made of plastic.
り欠かれた円筒状であることを特徴とする請求項1に記
載のフレキシブルプリント配線板の配置構造。5. The arrangement structure for a flexible printed wiring board according to claim 1, wherein the support member has a cylindrical shape in which a part of a peripheral surface is axially cut out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002061154A JP3859527B2 (en) | 2002-03-06 | 2002-03-06 | Flexible printed wiring board layout structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002061154A JP3859527B2 (en) | 2002-03-06 | 2002-03-06 | Flexible printed wiring board layout structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003258388A true JP2003258388A (en) | 2003-09-12 |
JP3859527B2 JP3859527B2 (en) | 2006-12-20 |
Family
ID=28670226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002061154A Expired - Fee Related JP3859527B2 (en) | 2002-03-06 | 2002-03-06 | Flexible printed wiring board layout structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3859527B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228922A (en) * | 2005-02-17 | 2006-08-31 | Nippon Steel Chem Co Ltd | Double-sided flexible circuit board for repeated bending |
US7640812B2 (en) | 2007-03-26 | 2010-01-05 | Nagano Keiki Co., Ltd. | Flexible board sensor and manufacturing method of sensor |
JP2011091438A (en) * | 2011-01-24 | 2011-05-06 | Nippon Steel Chem Co Ltd | Double-sided flexible circuit board for repeatedly bending use |
KR101719170B1 (en) * | 2016-04-14 | 2017-03-23 | 주식회사 신도리코 | Apparatus for tensioning flexible flat cable of scanner |
-
2002
- 2002-03-06 JP JP2002061154A patent/JP3859527B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228922A (en) * | 2005-02-17 | 2006-08-31 | Nippon Steel Chem Co Ltd | Double-sided flexible circuit board for repeated bending |
JP4722507B2 (en) * | 2005-02-17 | 2011-07-13 | 新日鐵化学株式会社 | Double-sided flexible circuit board for repeated bending applications |
US7640812B2 (en) | 2007-03-26 | 2010-01-05 | Nagano Keiki Co., Ltd. | Flexible board sensor and manufacturing method of sensor |
JP2011091438A (en) * | 2011-01-24 | 2011-05-06 | Nippon Steel Chem Co Ltd | Double-sided flexible circuit board for repeatedly bending use |
KR101719170B1 (en) * | 2016-04-14 | 2017-03-23 | 주식회사 신도리코 | Apparatus for tensioning flexible flat cable of scanner |
Also Published As
Publication number | Publication date |
---|---|
JP3859527B2 (en) | 2006-12-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8872032B2 (en) | Bundled flexible flat circuit cable | |
JP2008187154A (en) | Connection structure of flexible wiring circuit board, and electronic device | |
JP4919755B2 (en) | Wiring circuit board and electronic equipment | |
CN107809705A (en) | A kind of manufacture method of conductivity type vibrating diaphragm, loudspeaker and conductivity type vibrating diaphragm | |
JP4472408B2 (en) | Mobile terminal device | |
JP2003258390A (en) | Flexible printed circuit board | |
JP3859527B2 (en) | Flexible printed wiring board layout structure | |
CN110049616B (en) | Flexible circuit board | |
JP2010130581A (en) | Portable terminal device | |
JP5298888B2 (en) | Display device | |
JP4953558B2 (en) | Mobile terminal device | |
JP2006093461A (en) | Folding electronic equipment | |
JP4394495B2 (en) | Mobile terminal device | |
EP4030411A1 (en) | Flexible display screen and electronic device | |
CN209854041U (en) | Bonding device, battery pack and terminal equipment | |
JP2001319679A (en) | Battery | |
JP2006147290A (en) | Connection structure | |
JP4510860B2 (en) | Mobile terminal device | |
JP2010109152A (en) | Multilayer wiring board and foldable electronic equipment | |
JP2003258389A (en) | Flexible printed circuit board | |
JP5184227B2 (en) | Key press detection device | |
JP4769493B2 (en) | Multilayer flexible board | |
JP2009260140A (en) | Electronic device | |
JP2003046274A (en) | Electronic device | |
JP4515242B2 (en) | Printed circuit board having cable portion and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20041224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060420 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060619 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060710 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060822 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060911 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060919 |
|
R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090929 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100929 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100929 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110929 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110929 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120929 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130929 Year of fee payment: 7 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |