JP4769493B2 - Multilayer flexible board - Google Patents

Description

    The present invention comprises one housing and the other housing that are relatively pivotably connected and open and close to each other, one circuit board housed and installed in one housing and the other circuit housed and installed in the other housing The present invention relates to an electronic device connected with a multilayer flexible wiring cable wound around the rotating shaft of one housing and the other housing, and also relates to a substrate connection method for the electronic device, Furthermore, the present invention relates to a multilayer flexible substrate intended for the electronic device.

    A foldable mobile phone A which is an embodiment of the electronic device shown in FIG. 11 includes a lower case B having an operation unit Ba and the like, and an upper case C having a liquid crystal display unit Ca and the like. The case B and the upper case C are connected to each other through a hinge portion D so as to be relatively rotatable.

  The circuit board Eb accommodated and installed in the lower case B and the circuit board Ec accommodated and installed in the upper case C are electrically connected to each other via a flexible wiring cable F (for example, Patent Document 1). reference).

The flexible wiring cable F is connected to the circuit board Eb and the circuit board Ec via connectors Fc provided at both ends thereof, and excessive bending or the like occurs when the lower case B and the upper case C are opened and closed. As shown in FIGS. 11 and 12, the hinge portion D is wound so as to surround the rotating shafts of the lower case B and the upper case C as shown in FIGS.
Japanese Patent Laid-Open No. 11-303852

    By the way, in recent mobile phones, it is necessary to connect circuit boards with a large number of signal lines due to improvement in performance, increase in functions, etc., so that the same flexible wiring cable for connecting circuit boards is used. A multilayer flexible wiring cable in which two or more flexible substrates (cable layers) in the form are stacked is employed.

  However, as shown in FIG. 12B, in the multilayer flexible wiring cable F in which the first cable layer Fa and the second cable layer Fb are overlapped, one turn is performed on the outer peripheral side and the inner peripheral side of the wound portion. A slight difference occurs in the path length required for the cable, so that the second cable layer Fb passing through the outer peripheral side of the wound portion is loosened to the first cable layer Fa passing through the inner peripheral side having a shorter path length. And it is inevitable that wrinkles occur.

  For this reason, in the conventional mobile phone A, excessive bending is applied to the multilayer flexible wiring cable F due to the generation of wrinkles, or the wrinkles of the multilayer flexible wiring cable F are in contact with the lower case B and the upper case C that open and close As a result, in the worst case, the multilayer flexible wiring cable F may be disconnected.

  In view of the above situation, the object of the present invention is to prevent the multilayer flexible wiring cable from being loosened and wrinkled, and to prevent the multilayer flexible wiring cable from being disconnected due to the opening and closing of one housing and the other housing. Accordingly, it is an object of the present invention to provide an electronic device, a substrate connecting method, and a multilayer flexible substrate that can eliminate adverse effects on performance.

    In order to achieve the above object, an electronic apparatus according to the present invention includes a first casing and a second casing that are relatively pivotably connected to open and close each other, and one circuit board accommodated and installed in the first casing. And an electronic device in which the other circuit board accommodated and installed in the other casing is connected by a multilayer flexible wiring cable wound around the rotation shaft of the one casing and the other casing. The connected multilayer flexible wiring cable is folded and inverted so as to extend toward the other circuit board, and the cable layer located outside in the folded portion is wound in such a manner as to be positioned on the inner peripheral side. It is characterized by.

  Further, in order to achieve the above object, a board connecting method according to the present invention includes one housing and the other housing that are relatively pivotably coupled to open and close each other, and are housed and installed in the one housing. Substrate connection in electronic equipment in which one circuit board and the other circuit board accommodated and installed in the other casing are connected by a multilayer flexible wiring cable wound around the rotation axis of the one casing and the other casing A multi-layer flexible wiring cable connected to one circuit board is folded and inverted to extend toward the other circuit board, and the cable layer located outside in the folded portion is on the inner peripheral side. It is characterized by being wound in a manner of being positioned.

  Furthermore, in order to achieve the above object, a multilayer flexible substrate according to the present invention includes one housing and the other housing that are connected to each other so as to be relatively rotatable and are opened and closed. Multilayer flexible in an electronic device in which one circuit board and the other circuit board accommodated and installed in the other housing are connected by a multilayer flexible wiring cable wound around the rotation shaft of the one housing and the other housing A circuit board having one circuit board part accommodated and installed in one casing and a multilayer flexible wiring cable part integrally formed with one circuit board part in a mode extending away from the other circuit board. The multi-layer flexible wiring cable portion formed integrally with the one circuit board portion is folded and inverted so as to extend toward the other circuit board and be folded. Wound in a manner to be positioned on the inner peripheral side cable layer positioned outside the portion of the tooth, it is characterized in that is connected to the other circuit board.

Pathway in electronic equipment, the cable layer positioned outside the portion of the wrapping, while passing through a longer path than the cable layer located inside the portion of the folded, than the cable layer located on the outer peripheral side in the winding portions By passing through the short inner circumference side, the difference between the cable layer path length located on the outer circumference side and the cable layer path length located on the inner circumference side in the winding portion is canceled out. It is possible to prevent the wiring cable from being slackened or wrinkled, thereby eliminating the adverse effects on the performance due to the disconnection of the multilayer flexible wiring cable.

Further, the board connecting method, cable layer positioned outside the portion of the wrapping, while passing through a longer path than the cable layer located inside the portion of the wrapping, the cable layer located on the outer peripheral side in the winding portions The difference between the path length of the cable layer located on the outer circumference side and the path length of the cable layer located on the inner circumference side is canceled by passing the inner circumference side having a shorter path length than In addition, it is possible to prevent slack and wrinkles from occurring in the multilayer flexible wiring cable, and it is possible to eliminate adverse effects on performance due to disconnection of the multilayer flexible wiring cable.

Further, in the multi-layer flexible board, cable layer positioned outside the portion of the wrapping, while passing through a longer path than the cable layer located inside the portion of the wrapping, the cable layer located on the outer peripheral side in the winding portions The difference between the path length of the cable layer located on the outer circumference side and the path length of the cable layer located on the inner circumference side is canceled by passing the inner circumference side having a shorter path length than In addition, it is possible to prevent the multilayer flexible wiring cable portion from being slackened or wrinkled, thereby eliminating the adverse effects on the performance due to the disconnection of the multilayer flexible wiring cable portion.

Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments.
1 to 8 show an embodiment in which the present invention is applied to a foldable mobile phone which is an aspect of an electronic device. The mobile phone 1 includes a lower casing as shown in FIGS. (The other housing) 2 and the upper housing (one housing) 3 are provided, and the lower housing 2 and the upper housing 3 are rotatable so as to be opened and closed with each other via the hinge portion 4. It is connected.

  The lower casing 2 is provided with a transmitter 2a and an operation section 2b on the front thereof, while the upper casing 3 has a receiver 3a and a main liquid crystal display 3b on the front thereof. In addition, a sub liquid crystal display unit 3c and a camera unit 3d are provided on the rear surface.

  In addition, a rigid circuit board (the other circuit board) 20 on which components such as a transmitter and an operation unit are mounted is installed inside the lower casing 2, while the upper casing 3 has an inside thereof. A circuit board part (one circuit board part) 11 of a multilayer flexible board 10 to be described later is installed.

  Further, inside the hinge portion 4, a multilayer flexible wiring cable portion (multilayer flexible wiring cable) 12 of the multilayer flexible substrate 10 is wound so as to surround the rotating shafts of the lower housing 2 and the upper housing 3. The circuit board 20 in the lower casing 2 and the circuit board section 11 in the upper casing 3 are electrically connected to each other via the multilayer flexible wiring cable section 12.

  As shown in FIGS. 3 to 5, the circuit board portion (one circuit board portion) 11 in the multilayer flexible substrate 10 is configured to be rigid by interposing an adhesive layer (base material) between the substrates, In order to avoid the LCD (not shown) of the sub liquid crystal display unit 3c in the state where it is installed in the upper housing 3, a concave shape having a rectangular notch 11a in the central region, specifically, an edge facing the hinge unit 4 Various circuit components (not shown) are mounted on the surface (surface hidden in the circuit board portion 11 in FIGS. 3 to 5).

  Further, a wiring cable portion 13 is extended at the tip end portion of the circuit board portion 11, and the end portion of the wiring cable portion 13 folded back to the center side of the circuit board portion 11 is attached to the upper housing 3. A connector 13C to be connected to the mechanical parts of the installed receiver 3a is mounted.

  Further, a notch 11b for avoiding the mechanical parts of the camera part 3d installed in the upper housing 3 is formed at the base end part of the circuit board part 11, and wiring is provided on the side edge of the notch 11b. A cable portion 14 is extended, and is connected to a mechanical part of the camera portion 3d installed in the upper housing 3 at an end portion of the wiring cable portion 14 that is folded back to the outside of the circuit board portion 11. A connector 14C is mounted.

Further, a multilayer flexible wiring cable portion 12 is extended from the bottom edge of the notch 11a having a concave shape at the base end portion of the circuit board portion 11, and the multilayer flexible wiring cable portion 12 is folded back. extends toward the circuit board 20 in the lower housing 2 by reversing the connector 12 C to be connected to the circuit board 20 is mounted at its ends.

  Here, the multilayer flexible wiring cable portion 12 is formed by connecting the circuit board portion 11 integrally with the circuit board portion 11 except for the adhesive layer (base material) as shown in FIG. Thus, it has the 1st cable layer 12A and the 2nd cable layer 12B of the same form piled up mutually.

  In addition, as shown in FIGS. 3, 5, and 6, the multilayer flexible wiring cable portion 12 extends toward the circuit board 20 by being inverted at the folded portion 12a, and is wound around the end portion. The portion 12b is wound so as to surround the rotation shafts of the lower housing 2 and the upper housing 3.

  Furthermore, the multilayer flexible wiring cable portion 12 is bent in a convex shape so as to avoid mechanical parts of the camera portion 3d installed in the upper housing 3 by intermediate crank portions 12c and 12d.

  Here, as is apparent from FIGS. 7 and 8 conceptually showing the handling of the multilayer flexible wiring cable portion 12, the winding portion 12b of the multilayer flexible wiring cable portion 12 is located outside the folded portion 12a. The second cable layer 12B is wound in such a manner as to be positioned on the inner peripheral side.

  That is, in the folded portion 12a of the multilayer flexible wiring cable portion 12, the first cable layer 12A passes through the inner peripheral side, the second cable layer 12B passes through the outer peripheral side, and the first cable layer 12A passes through the outer periphery at the winding portion 12b. Side, the second cable layer 12B passes through the inner peripheral side.

  In other words, the first cable layer 12A located on the inner side in the folded portion 12a passes through a shorter path than the second cable layer 12B located on the outer side, while the second cable layer located on the inner peripheral side in the winding portion 12b. It passes the outer peripheral side whose path length is longer than 12B. In addition, the second cable layer 12B located on the outer side of the folded portion 12a passes through a longer path than the first cable layer 12A located on the inner side, while the winding portion 12b is more than the first cable layer 12A located on the outer peripheral side. Also passes through the inner circumference with a short path length.

  Thus, the difference between the path length of the first cable layer 12A and the path length of the second cable layer 12B in the multilayer flexible wiring cable portion 12 is canceled out, and the multilayer flexible wiring cable portion 12 is slackened or wrinkled. This can be prevented in advance, so that it is possible to eliminate adverse effects on performance due to disconnection or the like of the multilayer flexible wiring cable portion 12 in advance.

  3, 5, and 6, in the crank portion 12 c and the crank portion 12 d of the multilayer flexible wiring cable portion 12, the difference in path length between the first cable layer 12 </ b> A and the second cable layer 12 </ b> B is Needless to say, it is canceled out due to its crank shape.

  Further, when the multilayer flexible substrate 10 is formed, the multilayer flexible wiring cable portion 12 is positioned in the recess 11a of the circuit board portion 11 and the wiring cable portion 14 is positioned in the recess 11b of the circuit substrate portion 11 as shown in FIG. Thus, by effectively utilizing the space that is used during use, the material yield associated with the production of the multilayer flexible substrate 10 is greatly improved.

  In addition, the multilayer flexible wiring cable portion 12 extending downward in the figure from the circuit board portion 11 in use is positioned in the concave portion 11a of the circuit board portion 11 at the time of formation, so that the length of the entire length at the time of formation is made possible. Therefore, the material yield accompanying the manufacture of the multilayer flexible substrate 10 is improved.

  Further, the connectors 12C, 13C, and 14C that are provided at the ends of the multilayer flexible wiring cable portion 12, the wiring cable portion 13, and the wiring cable portion 14 and that face the front side in the drawings in FIGS. 4 is mounted on the same surface as the surface on which various circuit components are mounted on the circuit board portion 11 (the surface hidden by the circuit board portion 11 in FIGS. 3 to 5). Since the multilayer flexible substrate 10 can be manufactured by so-called single-sided mounting, it is possible to reduce the production cost by simplifying the manufacturing process.

  9 and 10 show another embodiment in which the present invention is applied to a foldable mobile phone which is an aspect of an electronic device. The mobile phone 100 includes a lower casing (the other casing) 102 and An upper housing (one housing) 103 is provided, and the lower housing 102 and the upper housing 103 are rotatably connected to each other via a hinge portion 104 so as to be opened and closed.

  A rigid circuit board (one circuit board) 111 is installed inside the upper casing 103, while a rigid circuit board (other circuit board) 112 is installed inside the lower casing 102. The circuit board 111 and the circuit board 112 are electrically connected to each other via the multilayer flexible wiring cable 120.

  The multilayer flexible wiring cable 120 is formed by overlapping the first cable layer 120A and the second cable layer 120B having the same form, and the circuit board 111 and the circuit via the connector 120Ca and the connector 120Cb provided at both ends thereof. Connected to the substrate 112.

  Further, the multilayer flexible wiring cable 120 extends toward the circuit board 112 in the lower housing 102 by folding the end portion on the connector 120Ca side and inverting it, The multilayer flexible wiring cable 120 is wound and accommodated so as to surround the rotation shafts of the lower housing 102 and the upper housing 103.

  That is, the multilayer flexible wiring cable 120 extends toward the circuit board 112 by being inverted at the folded portion 120a, and the lower casing 102 and the upper casing 103 at the winding portion 120b near the end. It is wound so as to surround the rotating shaft.

  Here, as is apparent from FIGS. 7 and 9, the winding portion 120b of the multilayer flexible wiring cable 120 is wound in such a manner that the second cable layer 120B positioned on the outer side in the folded portion 120a is positioned on the inner peripheral side. It is turning.

  That is, in the folded portion 120a of the multilayer flexible wiring cable 120, the first cable layer 120A passes through the inner peripheral side, the second cable layer 120B passes through the outer peripheral side, and in the winding portion 120b, the first cable layer 120A passes through the outer peripheral side. The second cable layer 120B passes through the inner peripheral side.

  In other words, the first cable layer 120A located on the inner side in the folded portion 120a passes through a shorter path than the second cable layer 120B located on the outer side, while the second cable layer located on the inner peripheral side in the winding portion 120b. It passes the outer peripheral side having a longer path length than 120B.

  In addition, the second cable layer 120B located on the outer side of the folded portion 120a passes through a longer path than the first cable layer 120A located on the inner side, while the winding portion 120b is more than the first cable layer 120A located on the outer peripheral side. Also passes through the inner circumference where the path length is short.

  Thus, the difference between the path length of the first cable layer 120A and the path length of the second cable layer 120B in the multilayer flexible wiring cable 120 is offset, and the multilayer flexible wiring cable 120 is slackened or wrinkled. Therefore, it is possible to prevent an adverse effect on performance due to disconnection of the multilayer flexible wiring cable 120 or the like.

  In each of the above-described embodiments, an example in which the present invention is applied to a foldable mobile phone has been described. However, any electronic device in which one housing and the other housing are rotatably connected may be used in the embodiments. Of course, the present invention can be effectively applied to various electronic devices without being limited to a foldable mobile phone.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external perspective view showing a foldable mobile phone showing an embodiment of an electronic apparatus according to the present invention. The conceptual diagram which shows the internal structure in the mobile telephone shown in FIG. FIG. 2 is an external perspective view showing a multilayer flexible substrate mounted on the mobile phone shown in FIG. 1. The whole top view at the time of preparation of the multilayer flexible substrate shown in FIG. The whole top view at the time of use of the multilayer flexible substrate shown in FIG. FIG. 6 is a sectional view taken along line VI-VI in FIG. The conceptual diagram which shows the connection aspect of the board | substrate in the mobile telephone shown in FIG. (a) And (b) is a conceptual diagram which expands and shows the principal part in FIG. The conceptual diagram which shows the connection aspect of the board | substrate in the foldable mobile telephone which is another Example of the electronic device concerning this invention. (a) And (b) is a conceptual diagram which expands and shows the principal part in FIG. (a) And (b) is an external appearance perspective view and internal structure figure of the folding-type mobile phone which is an example of the conventional electronic device. (a) And (b) is a conceptual diagram which shows the connection aspect of one circuit board and the other circuit board in the foldable mobile telephone shown in FIG.

Explanation of symbols

1 ... Mobile phone (electronic equipment)
2 ... Lower housing (the other housing),
3 ... Upper housing (one housing),
4 ... Hinge part,
10 ... multilayer flexible substrate,
11 ... circuit board part (one circuit board),
12 ... Multilayer flexible wiring cable (multilayer flexible wiring cable),
12A ... 1st cable layer,
12B ... the second cable layer,
20 ... Circuit board (the other circuit board),
100: mobile phone (electronic device),
102 ... lower housing (other housing),
103 ... Upper housing (one housing),
104 ... hinge part,
111 ... circuit board (one circuit board),
112 ... Circuit board (the other circuit board),
120 ... multilayer flexible wiring cable,
120A ... first cable layer,
120B ... Second cable layer.

Claims (1)

A first circuit board housed and installed in the one housing; and a second circuit board housed and installed in the other housing; A multilayer flexible board in an electronic device connected by a multilayer flexible wiring cable wound around the rotation axis of the one casing and the other casing,
Having one circuit board part accommodated and installed in the one case, and having a multilayer flexible wiring cable part integrally formed with the one circuit board part in a mode extending in a direction away from the other circuit board; The multilayer flexible wiring cable part formed integrally with the one circuit board part is folded and inverted to extend toward the other circuit board, and the cable layer positioned outside in the folded part is provided inside. A multilayer flexible substrate, wherein the multilayer flexible substrate is wound in such a manner as to be positioned on the peripheral side and connected to the other circuit substrate.

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