CN102231936B - Double sided flexible printed circuit board for use hinge region - Google Patents
Double sided flexible printed circuit board for use hinge region Download PDFInfo
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- CN102231936B CN102231936B CN2011101532007A CN201110153200A CN102231936B CN 102231936 B CN102231936 B CN 102231936B CN 2011101532007 A CN2011101532007 A CN 2011101532007A CN 201110153200 A CN201110153200 A CN 201110153200A CN 102231936 B CN102231936 B CN 102231936B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Telephone Set Structure (AREA)
- Telephone Function (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a double sided flexible printed circuit board which is able to repeatedly bend, adapt to the transmission of the high-frequency signal, be light and thin, inhibit the conductor breakage and promote the high density of the circuit board. The double-sided flexible circuit board is provided with a conductor circuit 2 and a cover material 1 on both sides of an insulating layer 3. In this case, the insulating layer is formed of a liquid crystal polymer film or a polyimide film of 10-100 [mu]m in thickness, and the cover material is formed of only a liquid crystal polymer film with a thermal deformation temperature different from that of the insulating layer. The double-sided flexible circuit board for bending is also provided with a surrounding section of which the copper foil stress value Y is used in a range of 0.5-3% as shown in a following formula (1) Y(%)=(tCu+1/2 tLI)/(r+tCL.+tCu+1/2 tLI)*100 (where, tLI: thickness of insulating layer ([mu]m); tCL: thickness of cover material ([mu]m); tCu: thickness of copper foil ([mu]m); r: bending radius of surrounding section).
Description
The application is that application number is 200610007679.2, and the applying date is denomination of invention on February 17th, 2006 dividing an application for the Chinese patent application of " but double-side flexible circuit substrate of alternating bending ".
Technical field
But the present invention relates to the alternating bending double-side flexible circuit substrate of a kind of hinge part that is applicable to frequent crooked mobile phone etc.
Background technology
Mobile phone is as the crucial constituent components of electronic equipment and play the part of important role, is accompanied by the miniaturization of electronic component and highly integrated, more requires it to possess high-performance.For these requirements, even in having the circuit substrate of wiring circuit, not only densification, lightening, flexible, in order to process bulk information, the high frequencyization of signal also attracts attention in recent years.
In order to transmit high-frequency signal, must use the material of low-k, low dielectric loss angle tangent (dielectric loss tangent).At this, liquid crystal polymer film is as good materials such as high-fire resistance, moisture absorption dimensional stability, high frequency electrical characteristics and by public domain.For example, in the existing circuit substrate, in order to realize dimensional stability, adopt preimpregnation (pre-preg) layer as insulator, this prepreg layer uses glass fibre and as the resin of solid, and in having the circuit substrate of trickle distribution, in order to ensure the filling of trickle wiring closet, also adopt and be coated with the film of solid as cladding material.Yet above-mentioned material is not suitable for transmitting high-frequency signal.At this, make insulating barrier and cladding material by same material, or only use liquid crystal polymer film as cladding material, then need not consider the material behavior of insulating barrier and cladding material, can consist of the flexible circuit board that can not damage the liquid crystal polymer film characteristic.
Flexible circuit board is known as having the material of good flexible and flexible use.Wherein, the single face flexible circuit board at the one-sided formation conductor layer of insulating barrier, is applicable to the situation of alternating bending.Double-side flexible circuit substrate is formed with the circuit that consists of with conductor in the insulating barrier both sides, only be applicable in the situation that bending is once during actual installation.
In the time that but the electronic circuit board of alternating bending must being used, use the single face flexible circuit board.Yet in the single face flexible circuit board, the packing density that has circuit substrate only is the problems such as cost costliness such as half of double-side flexible circuit substrate.For example, patent documentation 1 discloses, and in the single flexible circuit board that comprises double-side flexible circuit substrate and single face flexible circuit board, makes single face flexible circuit board section crooked, consist of bend by the part that coincides with another single face flexible circuit board, promote its bendability.Patent documentation 2 discloses, and at the arrangement that the inboard configuration of the crooked position of flexible circuit board has the support material of barrel surface, can prevent thus the bend crushing and fractures, and suppress conductor broken string or disrumpent feelings, also can be applicable in addition Collapsible mobile telephone.
[patent documentation 1] Japanese kokai publication hei 11-195850 communique
[patent documentation 2] Japanese kokai publication hei 15-258388 communique
Yet, combination single face flexible circuit board and consisting of in the situation of bend, the thickness of the layer of the flexible circuit board of formation itself can increase, therefore frivolous property and flexible will be poorer than single single face flexible circuit board.And, in the situation that flexible circuit board has reinforcing structure, because having reinforcing structure, can hinder the densification in circuit substrate of electronic circuit or electronic component.
Summary of the invention
The object of the invention is to, a kind of high-frequency signal that is suitable for transmitting is provided, lightening, and can suppress conductor broken string or disrumpent feelings and realize the double-side flexible circuit substrate of the densification of circuit substrate.
The present invention is in order to solve aforementioned problems, but research finds only to use liquid crystal polymer film as the cladding material of the double-side flexible circuit substrate of the alternating bending that is used for mobile phone etc., can obtain thus and equal flexible of single face flexible circuit board.
The present invention relates to a kind of flexible double-side flexible circuit substrate with the section of unrolling, it is a kind of double-side flexible circuit substrate that conductor circuit and cladding material and this conductor circuit are made by Copper Foil that arranges in the insulating barrier both sides, it is characterized in that: insulating barrier is to be made of the liquid crystal polymer film of thickness at 10 μ m to 100 μ m, cladding material is only to be made of the heat distortion temperature liquid crystal polymer film different from insulating barrier, use Copper Foil deformation values Y that following calculating formula (1) calculates in 0.5% to 3% scope, this double-side flexible circuit substrate has bend and non-bend, and bend is unrolled and uses.
Y(％)＝(tCu+1/2tLI)/(r+tCL.+tCu+1/2tLI)×100(1)
Wherein, tLI represents insulating layer of thin-film thickness (μ m), and tCL. represents the liquid crystal polymer film thickness (μ m) of cladding material, and tCu represents copper thickness (μ m), r represents the bending radius (μ m, bending radius r are 2.0mm to 5.0mm) of the section of unrolling.
Satisfy following any one above condition, above-mentioned double-side flexible circuit substrate will possess better performance.(1) insulating barrier is to be made of liquid crystal polymer film, and its heat distortion temperature is in 270 ℃ to 330 ℃ scope, and is lower than said temperature as the liquid crystal polymer film heat distortion temperature of cladding material; (2) thickness of conductor circuit is in the scope of 5 μ m to 30 μ m; (3) thickness of cladding material is in the scope of 10 μ m to 100 μ m; (4) unroll the bending radius r of section in the scope of 2.0mm to 5.0mm.
Above-mentioned double-side flexible circuit substrate uses the folding part at Collapsible mobile telephone effectively.And the feature of Collapsible mobile telephone involved in the present invention is with the folding part of above-mentioned double-side flexible circuit substrate use at Collapsible mobile telephone.Collapsible mobile telephone involved in the present invention is that its closure state is made as 0 °, and the angle of open mode is in 10 ° to 180 ° scope.
Below, further specify the double-side flexible circuit substrate that the present invention relates to.
The double-side flexible circuit substrate that the present invention relates to is applicable to the crooked positions such as hinge part of mobile phone, and when for example using as the hinge part of mobile phone, its Reversebend life can reach more than 300,000 times.
The double-side flexible circuit substrate that the present invention relates to is to utilize the known method such as circuit fabrication to obtain, at the two-sided conductor circuit that arranges of the insulating barrier that is consisted of by liquid crystal polymer film or polyimide film, and the cladding material that is only consisted of by liquid crystal polymer film in its arranged outside.
Liquid crystal polymer film as insulating barrier or cladding material use can be any liquid crystal polymer film that can form optically anisotropic melting phase, also is referred to as thermic (Thermotropic) liquid crystal polymer.Can form known to the macromolecule such as various equivalent modifications of optically anisotropic melting phase, when possessing the test portion of observing molten condition under the petrographic microscope crossed nicols of heater (crossed Nicol), the macromolecule with the character that penetrates polarisation.
By the viewpoint of thermal endurance, processability, liquid crystal polymer film preferably its inversion temperature that is transferred to optically anisotropic melting phase at 200 ℃ to 400 ℃, particularly in 250 ℃ to 350 ℃ scope.Moreover, in the scope that does not undermine film characteristics, also can be used in conjunction with lubrication prescription, antioxidant, filler etc.Liquid crystal polymer film used in the present invention can be film-form or coating solution, and film-form can be conducive to engage Copper Foil.
Liquid crystal polymer film obtains by known methods such as extrusion moldings.When extrusion molding, can use any extruding formation method, but known T die methods, laminated body extension method, plavini etc. are comparatively favourable from industrial production.Especially, plavini, laminated body extension method, not only in the mechanical axis direction (hereinafter referred to as the MD direction) of film, and with the direction (hereinafter referred to as the TD direction) of this MD direction quadrature also stress application, therefore can obtain the film of the engineering properties equilibrium of MD direction and TD direction.
The film that uses as insulating barrier also can be liquid crystal polymer film, also can be polyimide film.Polyimide film can be used as FPC (flexible circuit board) and is widely used, and polyimide film layer is made of also passable the polyimide film layer more than 2 layers.
Cladding material adopts as the liquid crystal polymer film of insulating barrier use or the different liquid crystal polymer film of heat distortion temperature of polyimide film.Heat distortion temperature preferably differs 10 ℃ to 100 ℃.When using liquid crystal polymer film as insulating barrier, its heat distortion temperature is preferably 270 ℃ to 330 ℃ scope, and is preferably low than said temperature as the liquid crystal polymer film of cladding material, preferably low 10 ℃ to 100 ℃.
The method of the double-side flexible circuit substrate that manufacturing the present invention relates to comprises: in the step of the two-sided lamination conductor layer of insulating barrier; With the step of conductor layer as circuit; In the step that is positioned at lamination cladding material on each two-sided conductor circuit layer.The material of formation conductor layer is Copper Foil (containing copper alloy foil) preferably.Below, the explanation conductor layer take Copper Foil as representative, but be not limited to use Copper Foil.
For example, when insulating barrier is liquid crystal polymer film, Copper Foil two-sided carried out roughening treatment, the lamination liquid crystal polymer film is in heating, add to depress and carry out lamination.Then, utilize known method to carry out the circuit fabrication of Copper Foil.Then, at the liquid crystal polymer film of two-sided configuration as cladding material, heating, adding to depress and carry out lamination.Liquid crystal polymer film as cladding material, when being configured on the conductor circuit, is had as mentioned above: the method that (1) only configures liquid crystal polymer film and heats, pressurizes; Or (2) heat, pressurize at the liquid crystal polymer film face of conductor circuit configuration liquid crystal polymer film with the laminate of Copper Foil, then utilizes the method for etching removal Copper Foil.The present invention can use wherein any one method.
When insulating barrier is polyimide film, might not need to carry out the roughening treatment of the copper-clad surface that engages with polyimide film, polyimide film can form by coating, dry, cured polyimide solution or its precursor solution.
Roughening of copper foil is processed can adopt the method for roughening of the dry types such as sandblast (blast) processing, grinding or the wet type method of roughening that carries out with liquid, but preferably utilizes Darkening process.
The thickness of insulating layer scope preferably below 200 μ m, is preferably in 10 μ m to 100 μ m.Film thickness easily breaks during less than 10 μ m, processes comparatively difficulty; When surpassing 100 μ m, film becomes stiff and is difficult to be wound as tubular, is difficult to process.
The liquid crystal polymer film that superimposed heat distortion temperature is different, during with the manufacturing double-side flexible circuit substrate, preferably, insulating barrier and cladding material heat distortion temperature differ more than 10 ℃.The difference of this heat distortion temperature is during less than 10 ℃, in the situation of using the insulating barrier that consisted of by liquid crystal polymer film and cladding material to make double-side flexible circuit substrate, because the pressurization during lamination, there is simultaneously thermal deformation of liquid crystal polymer film, it is easily mobile that all conductor circuits become, and is difficult to carry out the hidden danger of the positioning control of conductor circuit.At this, when insulating barrier was liquid crystal polymer film, its heat distortion temperature was more than 260 ℃, preferably in 270 ℃ to 330 ℃ scope.Heat distortion temperature is during less than 270 ℃, existence can't distinguish the liquid crystal polymer film that uses as insulating barrier with as the thermal deformation of the liquid crystal polymer film of cladding material.On the other hand, heat distortion temperature surpasses the melting point of liquid crystal polymer film more than 330 ℃ the time, is difficult to the shape of holding circuit substrate.Even in the situation that insulating barrier is polyimides, insulating barrier is necessary different from the heat distortion temperature of cladding material, and preferably the heat distortion temperature of cladding material is lower more than 10 ℃ than the heat distortion temperature of insulating barrier.
The Copper Foil deformation values Y that double-side flexible circuit substrate through type (1) involved in the present invention calculates is in 0.5% to 3% scope.Copper Foil deformation values Y is less than 0.5% the time, and thickness of insulating layer, the copper thickness that engages with insulating barrier and cover material thickness can attenuation, therefore has the hidden danger of conductor circuit broken string.On the other hand, when Copper Foil deformation values Y surpassed 3%, each layer thickness that forms double-side flexible circuit substrate can increase, bending radius becomes large, therefore was difficult to actually satisfy take the requirement of lightening, flexible mobile phone alternating bending as feature.
The preferred thickness of conductor layer is below 100 μ m.When conductor layer was Copper Foil, its thickness was preferably at 5 μ m to 30 μ m.From forming the viewpoint of fine pattern, preferably make the copper thickness attenuation, yet when its thickness became thin, existing in process of production, Copper Foil can produce wrinkle, this is external when forming circuit as wiring substrate, distribution fracture and reduce the problem of the reliability of circuit substrate.On the other hand, when copper thickness increases, can produce in the circuit side during etching Copper Foil, be unfavorable for forming fine pattern.
Copper Foil used in the present invention can be by any one production in roll process or the electric decomposition method.In order to ensure with purposes such as adhesion as the liquid crystal polymer film of insulating barrier, also can in the scope of not damaging effect of the present invention, apply the chemistry surface treatments such as the physical property surface treatments such as roughening treatment or pickling to Copper Foil.
The preferred thickness of the cladding material that only is made of liquid crystal polymer film is preferably in 10 μ m to 100 μ m below 300 μ m.Cover material thickness is during less than 10 μ m, and the Copper Foil deformation values can obviously become large, exists cladding material to be difficult to play the hidden danger of the effect of protection conductor circuit.On the other hand, when cover material thickness surpassed 100 μ m, gross thickness can thickening, therefore was difficult to actually satisfy take the requirement of lightening, flexible mobile phone alternating bending as feature.
The double-side flexible circuit substrate that the present invention relates to is useful in the purposes of the alternating bending of mobile phone etc., therefore helps the transmission of high-frequency signal, lightening, the densification that suppresses conductor broken string or fracture and circuit substrate.
Description of drawings
Fig. 1 is the cutaway view that the embodiment 1 of double-side flexible circuit substrate is described.
Fig. 2 is the cutaway view that the embodiment 3 of double-side flexible circuit substrate is described.
Fig. 3 is the cutaway view that the comparative example 1 of double-side flexible circuit substrate is described.
Fig. 4 is the cutaway view that the comparative example 3 of double-side flexible circuit substrate is described.
Fig. 5 is the cutaway view that the comparative example 5 of double-side flexible circuit substrate is described.
Fig. 6 (A) and 6 (B) are the ideographs that the example of double-side flexible circuit substrate is described.
Fig. 7 is the ideograph that an example of Collapsible mobile telephone is described.
Symbol description
1 liquid crystal polymer film cladding material, 2 conductor circuit layers
3 liquid crystal polymer film insulating barriers, 4 polyimide film insulating barriers
5 polyimide film cladding materials, 6 knitting layers
7 test films, 8 bends
The axle that unrolls of 9 non-bend 10 bends
11 hinge parts, 12 bodies
13 caps.
Embodiment
Below, for the double-side flexible circuit substrate that the present invention relates to and example thereof, describe with reference to accompanying drawing.Fig. 1 is the cutaway view that a layer example of constructing of double-side flexible circuit substrate is described, at the two-sided conductor circuit layer 2 that is provided with of the insulating barrier 3 that is consisted of by liquid crystal polymer film, and the cladding material that is made of liquid crystal polymer film 1 is set at conductor circuit layer 2.Fig. 2 is another routine cutaway view that the layer structure of double-side flexible circuit substrate is described, at the two-sided conductor circuit layer 2 that is provided with of the insulating barrier 4 that is made of polyimide film, and arranges at conductor circuit layer 2 and to consist of cladding material by liquid crystal polymer film 1.
Fig. 3 is another routine cutaway view that the layer structure of double-side flexible circuit substrate is described, at the two-sided conductor circuit layer 2 that is provided with of the insulating barrier 3 that is consisted of by liquid crystal polymer film, and the cladding material that is made of the polyimide film 5 that with epoxy is following layer 6 is set at conductor circuit layer 2.Fig. 4 is the cutaway view that the insulating barrier 3 among Fig. 3 is become the example of the insulating barrier 4 that is made of polyimide film.Fig. 5 consists of insulating barrier 4 by polyimide film, with liquid crystal polymer film 1 and polyimides system then the laminated film that consists of of film 6 as the cutaway view of an example of cladding material.And Fig. 3 to Fig. 5 represents the double-side flexible circuit substrate that the scope of the invention is outer.
Fig. 6 is the ideograph that uses the example when the hinge part in order to the double-side flexible circuit substrate that explanation will the present invention relates to, the double-side flexible circuit substrate 7 that will have the bend 8 that bends to the S font shown in Fig. 6 (A), as Fig. 6 (B) near the bend that is shown in the mode take section as toroidal reel, unroll.And by unrolling, when seeing from the top down, the surface of the non-bend 9 of the section both sides of unrolling becomes same.When unrolling, also can use the cylindrical shape material in the part of the axle 10 that unrolls as it.
Fig. 6 (B) is the example under the use form of mobile phone alternating bending, and the double-side flexible circuit substrate of bend rotates a circle in the section of unrolling, in the scope of bending radius at 2.0mm to 5.0mm at section place of unrolling.When using this double-side flexible circuit substrate at Collapsible mobile telephone, open and close angle in 10 ° to 180 ° scope.Fig. 6 (B) shows bend 8 rotations and the state in the week of unrolling of the double-side flexible circuit substrate with bend and non-bend, and this part is called the α volume.
The bending radius of the section of unrolling (with the radius of the axle 10 that unrolls about equally), its preferable range is between 2.0mm to 5.0mm.Bending radius is difficult to keep curved shape during less than 2.0mm.On the other hand, when bending radius surpasses 5.0mm, be difficult to actually satisfy take the requirement of lightening, flexible mobile phone alternating bending as feature.
Fig. 7 is the ideograph that Collapsible mobile telephone is described, double-side flexible circuit substrate 7 unrolls at hinge part 11 places, connects body (button section) 12 and cap (display part) 13.The preferable range of body 12 and cap 13 formed switching angles is between 10 ° to 180 °.When opening and closing angle less than 10 °, produce the practicality resistance that is referred to as to open and close and hinder.On the other hand, when opening and closing angle above 180 °, then its purposes is not as the mobile phone alternating bending, but uses as bending.
Embodiment
Below, specify the present invention by embodiment, but the present invention is not limited to these embodiment.
The processing copper foil circuit
The two-sided copper-surfaced laminated plates superimposed layer dry film that consists of at liquid crystal polymer film, and use the patterned films of photoresistance width 100 μ m, circuit width 100 μ m, utilize UV (ultraviolet ray) exposure to form circuit pattern.Then, utilize the copper chloride etching solution to carry out the Copper Foil etching.Utilize light microscope confirm whether the circuit of the two-sided conductor circuit substrate of gained is peeled off or circuit between whether residual copper is arranged.
Measure thickness
According to JISC5016, use thickness tester (three rich company systems, dial gauge 215-153), measure the thickness of insulating barrier, cladding material and Copper Foil.
Measure initial resistivity value
According to JISC5016, (CUSTOM company system CX-180N), is tested the resistance value of the front two-sided conductor circuit substrate of punching press cladding material to use resistance tester.
Calculate the Copper Foil deformation values
Utilize formula (1), by copper thickness, thickness of insulating layer, cover material thickness and the bending radius used on double-side flexible circuit substrate, calculate the Copper Foil deformation values.
The mobile phone alternating bending test
(PROS company system PIS-FPJ310) is configured the alternating bending test of the mobile phone of double-side flexible circuit substrate to use the Apparatus for Bending at low-temp of anti-the hinge.The condition of breaking of double-side flexible circuit substrate is that resistance value rises 5% from initial resistivity value.
The 1st embodiment
Be that the liquid crystal polymer film 280 (280 ° of the Beckstar processed of KURARAY company (transliteration), heat distortion temperatures) of 25 μ m is as insulating barrier with thickness, in its two-sided two-sided copper-surfaced laminated plates that is provided with the rolling Copper Foil that thickness is 18 μ m (day ore deposit BHY-22B-T processed of MATERIALS company), the lamination dry film, and the patterned films of use photoresistance width 100 μ m, circuit width 100 μ m, utilize UV (ultraviolet ray) exposure to form circuit pattern.Then, utilize the copper chloride etching solution to carry out the Copper Foil etching, make two-sided conductor circuit substrate W.Then, with thickness be the liquid crystal polymer film 260 (260 ° of the Beckstar processed of KURARAY company, heat distortion temperatures) of 25 μ m as the cladding material of two-sided conductor circuit substrate W, prepare to have the single face copper-surfaced laminated plates S that thickness is the above-mentioned rolling Copper Foil of 18 μ m at its single face.
At this, utilize alkaline aqueous solution that the liquid crystal polymer film face of two-sided conductor circuit substrate W and single face copper-surfaced laminated plates S is carried out the liquid processing, after cleaning with pure water, carry out drying with 90 ℃ hot-blast ovens.And, engage with liquid crystal polymer film as cladding material in order to make Copper Foil, Darkening process is carried out on the copper surface of two-sided conductor circuit substrate.Then, under the form of the two-sided conductor circuit substrate W of double team, the single face copper-surfaced laminated plates S of lamination take the different liquid crystal polymer film of flow temperature as resin bed, and utilize precision stamping under 260 ℃, the condition of 9MPa, to carry out punching press, make circuit substrate.After the punching press, the outermost layer Copper Foil of the circuit substrate of gained is removed in etching, obtains being made of liquid crystal polymer film the double-side flexible circuit substrate (Fig. 1) of insulating barrier and cladding material work.
To cut into by the double-side flexible circuit substrate of said method gained the shape shown in Fig. 6 (A), make test film.Unroll test film bend and become α volume, the circuit face of line/space=100/100 (μ m) as the inboard, is carried out anti-hinge bend test (with reference to Fig. 6 (B)).Then, after anti-hinge bend test finishes, calculate the Copper Foil deformation values of each test film.
The 2nd embodiment
Except the liquid crystal polymer film 260 that uses 50 μ m thickness as the cladding material, adopt same method to make double-side flexible circuit substrate with the 1st embodiment, carry out identical experiment.
The 3rd embodiment (reference example)
Be two-sided two-sided copper-surfaced laminated plates M (chemical company of the Nippon Steel system with rolling Copper Foil of thickness 18 μ m of polyimide film of 25 μ m at thickness, expanex (transliteration) M level) superimposed layer dry film, and the patterned films of use photoresistance width 100 μ m, circuit width 100 μ m, utilize UV (ultraviolet ray) exposure to form circuit pattern.Then, utilize the copper chloride etching solution to carry out the Copper Foil etching, make two-sided conductor circuit substrate.Then, for the liquid crystal polymer film 260 of the thickness 25 μ m cladding material as above-mentioned two-sided conductor circuit substrate, prepare to have the single face copper-surfaced laminated plates that thickness is the rolling Copper Foil of 18 μ m at its single face.Under the form of the two-sided conductor circuit substrate of double team, the single face copper-surfaced laminated plates of lamination take liquid crystal polymer film as resin bed, and utilize precision stamping under 260 ℃, the condition of 9MPa, to carry out punching press, make circuit substrate.After the punching press, the outermost layer Copper Foil of the circuit substrate of gained is removed in etching, and insulating barrier uses polyimide film and cladding material only to use liquid crystal polymer film, makes the double-side flexible circuit substrate (Fig. 2) of lamination variety classes resin bed.
The 1st comparative example
The insulating barrier used thickness is the liquid crystal polymer film 280 of 25 μ m, two-sidedly has a two-sided copper-surfaced laminated plates superimposed layer dry film that thickness is the rolling Copper Foil of 18 μ m at it, and the patterned films of use photoresistance width 100 μ m, circuit width 100 μ m, utilize UV (ultraviolet ray) exposure to form circuit pattern.Then, utilize the copper chloride etching solution to carry out the Copper Foil etching, make two-sided conductor circuit substrate.Then, will be at polyimide film K (CAPTON, registered trade mark) being provided with epoxy is that the polyimide film of following layer uses as cladding material, under the form of the two-sided conductor circuit substrate of double team, utilize precision stamping under 160 ℃ to 170 ℃, 2 to 7MPa condition, to carry out punching press, make double-side flexible circuit substrate (Fig. 3).
The 2nd comparative example
Except use polyimide film cladding material (3 kinds) that polyimide film K is provided with thickness shown in the table 1 that epoxy is following layer as cladding material, adopt to use the same method with the 1st comparative example and process, and carry out identical experiment.
The 3rd comparative example
Being that the polyimide film of 25 μ m is two-sided at thickness is provided with the two-sided copper-surfaced laminated plates M superimposed layer dry film that thickness is the rolling Copper Foil of 18 μ m, and the patterned films of use photoresistance width 100 μ m, circuit width 100 μ m, utilize UV (ultraviolet ray) exposure to form circuit pattern.Then, utilize the copper chloride etching solution to carry out the Copper Foil etching, make two-sided conductor circuit substrate.Then, use is provided with the polyimide film cladding material that epoxy is following layer at polyimide film K, under the form of the above-mentioned two-sided conductor circuit substrate of double team, utilize precision stamping under 160 ℃ to 170 ℃, 2 to 7MPa condition, to carry out punching press, make double-side flexible circuit substrate (Fig. 4).
The 4th comparative example
Except use polyimide film cladding material (3 kinds) that polyimide film K is provided with thickness shown in the table 1 that epoxy is following layer as cladding material, adopt to use the same method with the 1st comparative example and process, and carry out identical experiment.
The 5th comparative example
Being that the polyimide film of 25 μ m is two-sided at thickness is provided with the two-sided copper-surfaced laminated plates M superimposed layer dry film that thickness is the rolling Copper Foil of 18 μ m, and the patterned films of use photoresistance width 100 μ m, circuit width 100 μ m, utilize UV (ultraviolet ray) exposure to form circuit pattern.Then, utilize the copper chloride etching solution to carry out the Copper Foil etching, make two-sided conductor circuit substrate.Then, be the single face of the liquid crystal polymer film 260 of 25 μ m at thickness, prepare to have the single face copper-surfaced laminated plates that thickness is the rolling Copper Foil of 18 μ m.Then, two-sided conductor circuit substrate is bonding film (chemical company of Nippon Steel system by polyimides, joint fastener SPB), the single face copper-surfaced laminated plates of lamination take liquid crystal polymer film as resin bed, and utilize precision stamping under 260 ℃, the condition of 9MPa, to carry out punching press, make circuit substrate.After the punching press, the outermost layer Copper Foil of the circuit substrate of gained is removed in etching, makes double-side flexible circuit substrate (Fig. 5).
The arrangement experimental data is made table 1.Value representation in () on the cover material thickness hurdle in the comparative example: PF: polyimide film, LCPF: liquid crystal polymer film, Ad: epoxy system or polyimides are the thickness (μ m) of knitting layer.
Table 1
Claims (7)
1. double-side flexible circuit substrate, it has the section of unrolling, conductor circuit and cladding material and this conductor circuit are set in the both sides of insulating barrier to be made by Copper Foil, this double-side flexible circuit substrate is characterised in that: insulating barrier is that the liquid crystal polymer film of 10 μ m to 100 μ m consists of by thickness, cladding material only is made of the heat distortion temperature liquid crystal polymer film different from insulating barrier, and the Copper Foil deformation values Y that calculates by following calculating formula (1) is in 0.5% to 3% scope, this double-side flexible circuit substrate has bend and non-bend, bend is unrolled and is used
Y(％)＝(tCu+1/2tLI)/(r+tCL.+tCu+1/2tLI)×100 (1)
Wherein, tLI represents insulating layer of thin-film thickness, and tCL. represents the liquid crystal polymer film thickness of cladding material, tCu represents copper thickness, r represents the bending radius of the section of unrolling, and the unit of above tLI, tCL., tCu and r is μ m, and bending radius r is between 2.0mm to 5.0mm.
2. double-side flexible circuit substrate according to claim 1, it is characterized in that, insulating barrier is made of liquid crystal polymer film, and its heat distortion temperature is in 270 ℃ to 330 ℃ scope, and is lower than said temperature as the heat distortion temperature of the liquid crystal polymer film of cladding material.
3. double-side flexible circuit substrate according to claim 1 and 2 is characterized in that, the thickness of conductor circuit is in the scope of 5 μ m to 30 μ m.
4. double-side flexible circuit substrate according to claim 1 and 2 is characterized in that, the thickness of cladding material is in the scope of 10 μ m to 100 μ m.
5. double-side flexible circuit substrate according to claim 1 and 2 is characterized in that, double-side flexible circuit substrate is used in the folding part of Collapsible mobile telephone.
6. a Collapsible mobile telephone is characterized in that, with according to claim 1 in 5 the described double-side flexible circuit substrate of any one use folding part at Collapsible mobile telephone.
7. Collapsible mobile telephone according to claim 6 is characterized in that, when the closure state with Collapsible mobile telephone was made as 0 °, the angle of open mode was in 10 ° to 180 ° scope.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005040194A JP4722507B2 (en) | 2005-02-17 | 2005-02-17 | Double-sided flexible circuit board for repeated bending applications |
| JP2005-040194 | 2005-02-17 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100076792A Division CN1829412B (en) | 2005-02-17 | 2006-02-17 | Double-side flexible circuit substrate capable of repeatedly bending |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102231936A CN102231936A (en) | 2011-11-02 |
| CN102231936B true CN102231936B (en) | 2013-02-27 |
Family
ID=36947463
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100076792A Expired - Fee Related CN1829412B (en) | 2005-02-17 | 2006-02-17 | Double-side flexible circuit substrate capable of repeatedly bending |
| CN2011101532007A Expired - Fee Related CN102231936B (en) | 2005-02-17 | 2006-02-17 | Double sided flexible printed circuit board for use hinge region |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100076792A Expired - Fee Related CN1829412B (en) | 2005-02-17 | 2006-02-17 | Double-side flexible circuit substrate capable of repeatedly bending |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4722507B2 (en) |
| KR (2) | KR101195087B1 (en) |
| CN (2) | CN1829412B (en) |
| TW (1) | TWI397351B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4969993B2 (en) * | 2006-11-01 | 2012-07-04 | 日本メクトロン株式会社 | Multilayer flexible printed wiring board and manufacturing method thereof |
| JP5151265B2 (en) | 2007-06-14 | 2013-02-27 | 日立電線株式会社 | Multilayer wiring board and method for manufacturing multilayer wiring board |
| KR100956238B1 (en) * | 2007-12-18 | 2010-05-04 | 삼성전기주식회사 | Flexible printed circuit board and manufacturing method for the same |
| TWI393512B (en) * | 2008-08-20 | 2013-04-11 | Unimicron Technology Corp | Rigid wiring board |
| JP5354018B2 (en) * | 2009-08-11 | 2013-11-27 | 株式会社村田製作所 | Multilayer board |
| JP5717961B2 (en) * | 2009-12-24 | 2015-05-13 | 日本メクトロン株式会社 | Method for manufacturing flexible circuit board |
| JP5284308B2 (en) | 2010-04-19 | 2013-09-11 | 日本メクトロン株式会社 | Flexible circuit board and manufacturing method thereof |
| CN103069933B (en) * | 2010-08-12 | 2014-06-04 | 新日铁住金化学株式会社 | Metal-clad laminated plate |
| JP5540436B2 (en) * | 2011-08-09 | 2014-07-02 | 住友電工プリントサーキット株式会社 | Printed wiring assembly sheet, printed wiring board formed using the printed wiring assembly sheet, and method for producing the printed wiring assembly sheet |
| CN102843448B (en) * | 2012-08-14 | 2016-06-15 | 惠州Tcl移动通信有限公司 | A kind of SIM card holder stacked structure and mobile phone thereof |
| CN104349571B (en) * | 2013-07-29 | 2017-06-06 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN104320908A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Heat dissipating type multilayer soft and hardness combined printing plate |
| KR20160108761A (en) * | 2015-03-06 | 2016-09-20 | 삼성전자주식회사 | Connecting substrate |
| US20160380326A1 (en) * | 2015-06-26 | 2016-12-29 | Stephen H. Hall | Flexible circuit structures for high-bandwidth communication |
| US9786790B2 (en) | 2015-12-10 | 2017-10-10 | Industrial Technology Research Institute | Flexible device |
| US11452198B2 (en) | 2019-07-25 | 2022-09-20 | Borgwarner, Inc. | Thermally insulated printed circuit board |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195849A (en) | 1997-12-26 | 1999-07-21 | Fujikura Ltd | Flexible printed wiring board and method for manufacturing it |
| JP3490309B2 (en) * | 1998-10-29 | 2004-01-26 | 山一電機株式会社 | Wiring board and method of manufacturing the same |
| JP4138995B2 (en) * | 1999-03-31 | 2008-08-27 | 株式会社クラレ | Circuit board and manufacturing method thereof |
| JP2001102700A (en) * | 1999-07-27 | 2001-04-13 | Sanyo Electric Co Ltd | Flexible printed board and portable telephone terminal having the flexible printed board |
| JP2003046275A (en) * | 2001-07-31 | 2003-02-14 | Fujitsu Ltd | Mobile device |
| JP2003258389A (en) * | 2002-03-06 | 2003-09-12 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board |
| JP3859527B2 (en) * | 2002-03-06 | 2006-12-20 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board layout structure |
| JP2004311740A (en) * | 2003-04-08 | 2004-11-04 | Arisawa Mfg Co Ltd | Flexible printed wiring board |
-
2005
- 2005-02-17 JP JP2005040194A patent/JP4722507B2/en not_active Expired - Fee Related
-
2006
- 2006-01-27 TW TW095103415A patent/TWI397351B/en not_active IP Right Cessation
- 2006-02-14 KR KR1020060014028A patent/KR101195087B1/en not_active IP Right Cessation
- 2006-02-17 CN CN2006100076792A patent/CN1829412B/en not_active Expired - Fee Related
- 2006-02-17 CN CN2011101532007A patent/CN102231936B/en not_active Expired - Fee Related
-
2012
- 2012-03-20 KR KR1020120028096A patent/KR101259474B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060092087A (en) | 2006-08-22 |
| TW200642535A (en) | 2006-12-01 |
| KR101195087B1 (en) | 2012-10-29 |
| CN1829412A (en) | 2006-09-06 |
| TWI397351B (en) | 2013-05-21 |
| JP4722507B2 (en) | 2011-07-13 |
| JP2006228922A (en) | 2006-08-31 |
| KR101259474B1 (en) | 2013-05-06 |
| CN102231936A (en) | 2011-11-02 |
| CN1829412B (en) | 2012-06-20 |
| KR20120032506A (en) | 2012-04-05 |
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