JP2006228856A5 - - Google Patents

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Publication number
JP2006228856A5
JP2006228856A5 JP2005038775A JP2005038775A JP2006228856A5 JP 2006228856 A5 JP2006228856 A5 JP 2006228856A5 JP 2005038775 A JP2005038775 A JP 2005038775A JP 2005038775 A JP2005038775 A JP 2005038775A JP 2006228856 A5 JP2006228856 A5 JP 2006228856A5
Authority
JP
Japan
Prior art keywords
layer
light
emitting element
cavity
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005038775A
Other languages
English (en)
Japanese (ja)
Other versions
JP4436265B2 (ja
JP2006228856A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005038775A external-priority patent/JP4436265B2/ja
Priority to JP2005038775A priority Critical patent/JP4436265B2/ja
Priority to KR1020050116162A priority patent/KR101154801B1/ko
Priority to US11/291,965 priority patent/US7648775B2/en
Priority to EP05026495A priority patent/EP1670295B1/en
Priority to EP11007897.9A priority patent/EP2405723B1/en
Publication of JP2006228856A publication Critical patent/JP2006228856A/ja
Publication of JP2006228856A5 publication Critical patent/JP2006228856A5/ja
Publication of JP4436265B2 publication Critical patent/JP4436265B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005038775A 2004-12-03 2005-02-16 発光素子実装用配線基板 Expired - Fee Related JP4436265B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005038775A JP4436265B2 (ja) 2005-02-16 2005-02-16 発光素子実装用配線基板
KR1020050116162A KR101154801B1 (ko) 2004-12-03 2005-12-01 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
US11/291,965 US7648775B2 (en) 2004-12-03 2005-12-02 Ceramic substrate, ceramic package for housing light emitting element
EP11007897.9A EP2405723B1 (en) 2004-12-03 2005-12-05 Ceramic package for housing light emitting element
EP05026495A EP1670295B1 (en) 2004-12-03 2005-12-05 Ceramic substrate, ceramic package for housing light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005038775A JP4436265B2 (ja) 2005-02-16 2005-02-16 発光素子実装用配線基板

Publications (3)

Publication Number Publication Date
JP2006228856A JP2006228856A (ja) 2006-08-31
JP2006228856A5 true JP2006228856A5 (enExample) 2009-01-29
JP4436265B2 JP4436265B2 (ja) 2010-03-24

Family

ID=36989974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005038775A Expired - Fee Related JP4436265B2 (ja) 2004-12-03 2005-02-16 発光素子実装用配線基板

Country Status (1)

Country Link
JP (1) JP4436265B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5773649B2 (ja) * 2008-07-17 2015-09-02 株式会社東芝 発光装置とそれを用いたバックライト、液晶表示装置および照明装置
JP5220526B2 (ja) * 2008-09-11 2013-06-26 昭和電工株式会社 発光装置、発光モジュール、表示装置
JP5220527B2 (ja) * 2008-09-11 2013-06-26 昭和電工株式会社 発光装置、発光モジュール
WO2010029872A1 (ja) * 2008-09-09 2010-03-18 昭和電工株式会社 発光装置、発光モジュール、表示装置
JP5220522B2 (ja) * 2008-09-09 2013-06-26 昭和電工株式会社 発光装置、発光モジュール
JP2011040668A (ja) * 2009-08-18 2011-02-24 Shin-Etsu Chemical Co Ltd 光半導体装置
JP2011216588A (ja) * 2010-03-31 2011-10-27 Toshiba Corp 発光素子モジュール基板、発光素子モジュール及び照明装置
TWI495170B (zh) * 2010-11-25 2015-08-01 京瓷股份有限公司 A light-emitting element mounting substrate, and a light-emitting device
JP5198638B2 (ja) * 2011-09-21 2013-05-15 株式会社東芝 発光素子モジュール基板の製造方法
US11322667B2 (en) 2017-09-22 2022-05-03 Suzhou Lekin Semiconductor Co., Ltd. Light-emitting device package

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