JP2006228856A5 - - Google Patents
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- Publication number
- JP2006228856A5 JP2006228856A5 JP2005038775A JP2005038775A JP2006228856A5 JP 2006228856 A5 JP2006228856 A5 JP 2006228856A5 JP 2005038775 A JP2005038775 A JP 2005038775A JP 2005038775 A JP2005038775 A JP 2005038775A JP 2006228856 A5 JP2006228856 A5 JP 2006228856A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light
- emitting element
- cavity
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (3)
上記基板本体の表面に開口し且つ底面に発光素子を実装するキャビティと、
上記キャビティの側面に形成される光反射層と、を含み、
上記光反射層に含まれるＡｇ層の厚みは、３μｍ超〜１０μｍの範囲にあり、且つ該Ａｇ層の光沢度は、０．２以上である、
ことを特徴とする発光素子実装用配線基板。 A substrate body having a front surface and a back surface and made of an insulating material;
A cavity opening on the surface of the substrate body and mounting a light emitting element on the bottom surface;
A light reflecting layer formed on a side surface of the cavity,
The thickness of the Ag layer included in the light-reflecting layer is 3 [mu] m Ri range near ultra 10 .mu.m, and the glossiness of the Ag layer is Ru der 0.2 or higher,
A wiring board for mounting a light-emitting element.
上記基板本体の表面に開口し且つ底面に発光素子を実装するキャビティと、
上記キャビティの側面に形成される光反射層と、を含み、
上記光反射層に含まれるＡｇ層の厚みは、３μｍ超〜１０μｍの範囲にあり、且つ該Ａｇ層の表面粗さは、Ｒａで３μｍ以下である、
ことを特徴とする請求項１に記載の発光素子実装用配線基板。 A substrate body having a front surface and a back surface and made of an insulating material;
A cavity that opens on the surface of the substrate body and mounts the light emitting element on the bottom surface;
A light reflecting layer formed on a side surface of the cavity,
The thickness of the Ag layer contained in the light reflection layer is in the range of more than 3 μm to 10 μm, and the surface roughness of the Ag layer is 3 μm or less in Ra.
The wiring board for mounting a light emitting element according to claim 1.
ことを特徴とする請求項１または２に記載の発光素子実装用配線基板。 The light reflection layer is composed of a metal layer formed on a side surface of the cavity, and a Ni plating layer, an Au plating layer, and an Ag plating layer sequentially formed thereon .
The wiring board for mounting a light-emitting element according to claim 1 or 2.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005038775A JP4436265B2 (en) | 2005-02-16 | 2005-02-16 | Light-emitting element mounting wiring board |
| KR1020050116162A KR101154801B1 (en) | 2004-12-03 | 2005-12-01 | Ceramic package for receiving ceramic substrate and light emitting device |
| US11/291,965 US7648775B2 (en) | 2004-12-03 | 2005-12-02 | Ceramic substrate, ceramic package for housing light emitting element |
| EP05026495A EP1670295B1 (en) | 2004-12-03 | 2005-12-05 | Ceramic substrate, ceramic package for housing light emitting element |
| EP11007897.9A EP2405723B1 (en) | 2004-12-03 | 2005-12-05 | Ceramic package for housing light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005038775A JP4436265B2 (en) | 2005-02-16 | 2005-02-16 | Light-emitting element mounting wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006228856A JP2006228856A (en) | 2006-08-31 |
| JP2006228856A5 true JP2006228856A5 (en) | 2009-01-29 |
| JP4436265B2 JP4436265B2 (en) | 2010-03-24 |
Family
ID=36989974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005038775A Expired - Fee Related JP4436265B2 (en) | 2004-12-03 | 2005-02-16 | Light-emitting element mounting wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4436265B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010007781A1 (en) * | 2008-07-17 | 2010-01-21 | 株式会社 東芝 | Light emitting device, backlight using the device, liquid crystal display device, and illumination device |
| JP5220527B2 (en) * | 2008-09-11 | 2013-06-26 | 昭和電工株式会社 | Light emitting device, light emitting module |
| JP5220522B2 (en) * | 2008-09-09 | 2013-06-26 | 昭和電工株式会社 | Light emitting device, light emitting module |
| US8378369B2 (en) | 2008-09-09 | 2013-02-19 | Showa Denko K.K. | Light emitting unit, light emitting module, and display device |
| JP5220526B2 (en) * | 2008-09-11 | 2013-06-26 | 昭和電工株式会社 | Light emitting device, light emitting module, display device |
| JP2011040668A (en) * | 2009-08-18 | 2011-02-24 | Shin-Etsu Chemical Co Ltd | Optical semiconductor device |
| JP2011216588A (en) * | 2010-03-31 | 2011-10-27 | Toshiba Corp | Light emitting element module-substrate, light emitting element module, and lighting device |
| JP5159985B2 (en) * | 2010-11-25 | 2013-03-13 | 京セラ株式会社 | Light emitting element mounting substrate and light emitting device |
| JP5198638B2 (en) * | 2011-09-21 | 2013-05-15 | 株式会社東芝 | Method for manufacturing light-emitting element module substrate |
| US11322667B2 (en) | 2017-09-22 | 2022-05-03 | Suzhou Lekin Semiconductor Co., Ltd. | Light-emitting device package |
-
2005
- 2005-02-16 JP JP2005038775A patent/JP4436265B2/en not_active Expired - Fee Related
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