TW200603446A - Stem for light-emitting element, and optical semiconductor device - Google Patents

Stem for light-emitting element, and optical semiconductor device

Info

Publication number
TW200603446A
TW200603446A TW094117422A TW94117422A TW200603446A TW 200603446 A TW200603446 A TW 200603446A TW 094117422 A TW094117422 A TW 094117422A TW 94117422 A TW94117422 A TW 94117422A TW 200603446 A TW200603446 A TW 200603446A
Authority
TW
Taiwan
Prior art keywords
light
stem
emitting element
semiconductor device
optical semiconductor
Prior art date
Application number
TW094117422A
Other languages
Chinese (zh)
Inventor
Kenji Kawamura
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200603446A publication Critical patent/TW200603446A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

The present invention provides a stem for a light-emitting element in which stem suppresses substantially a decrease in the reflectance of light in a range of UV-rays having a wavelength of 400 nm or less. According to the disclosed stem for the light-emitting element, a reflective surface for reflecting light from a light-emitting diode 20 is formed on a mounting surface of the metal stem 10 on which the light-emitting diode 20 is mounted. The bare surface of the stem 10, where the reflective surface is formed, is coated with a bright nickel plated layer, which is then further coated with a bright silver plated layer, where UV-rays incident thereon with wavelength of 400 nm show a reflectance of 80% or higher.
TW094117422A 2004-06-01 2005-05-27 Stem for light-emitting element, and optical semiconductor device TW200603446A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004162930A JP2005347375A (en) 2004-06-01 2004-06-01 Stem for light-emitting element, and optical semiconductor device

Publications (1)

Publication Number Publication Date
TW200603446A true TW200603446A (en) 2006-01-16

Family

ID=35499489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117422A TW200603446A (en) 2004-06-01 2005-05-27 Stem for light-emitting element, and optical semiconductor device

Country Status (3)

Country Link
JP (1) JP2005347375A (en)
KR (1) KR20060046091A (en)
TW (1) TW200603446A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4452216B2 (en) * 2005-06-29 2010-04-21 日本特殊陶業株式会社 Ceramic package for light emitting device and method for manufacturing the same
JP2008016593A (en) * 2006-07-05 2008-01-24 Ngk Spark Plug Co Ltd Wiring board for mounting light emitting element
JP4367457B2 (en) 2006-07-06 2009-11-18 パナソニック電工株式会社 Silver film, silver film manufacturing method, LED mounting substrate, and LED mounting substrate manufacturing method
KR100757803B1 (en) * 2006-09-29 2007-09-11 서울옵토디바이스주식회사 Ultraviloet light emitting diode assembly
US8067778B2 (en) 2006-09-28 2011-11-29 Seoul Opto Device Co., Ltd. Ultraviolet light emitting diode package
JP2009267274A (en) * 2008-04-30 2009-11-12 Ngk Spark Plug Co Ltd Wiring board for mounting light emitting device
JP5503388B2 (en) * 2009-05-25 2014-05-28 株式会社神戸製鋼所 LED lead frame
JP5525315B2 (en) * 2009-06-16 2014-06-18 株式会社神戸製鋼所 LED lead frame
JP5695841B2 (en) * 2009-08-24 2015-04-08 株式会社神戸製鋼所 LED lead frame
JP2012151289A (en) * 2011-01-19 2012-08-09 Furukawa Electric Co Ltd:The Optical semiconductor mounting board, manufacturing method of the same and optical semiconductor device
JP5998621B2 (en) * 2012-05-10 2016-09-28 大日本印刷株式会社 LED lead frame and semiconductor device using the LED lead frame
JP6279868B2 (en) * 2013-10-01 2018-02-14 アピックヤマダ株式会社 Lead frame substrate manufacturing method and light emitting device manufacturing method
JP6318613B2 (en) * 2013-12-27 2018-05-09 日亜化学工業株式会社 Plating solution used for lead frame or substrate for light emitting device, lead frame or substrate manufactured using the same, method for manufacturing the same, and light emitting device including the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574184A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element
JPS6118185A (en) * 1984-07-04 1986-01-27 Toshiba Corp Lead frame for photo-semiconductor device
JPS61202484A (en) * 1985-03-05 1986-09-08 Sumitomo Electric Ind Ltd Light emitting diode
JP2556486Y2 (en) * 1991-02-20 1997-12-03 京セラ株式会社 Light emitting element storage package
JPH09293904A (en) * 1996-04-26 1997-11-11 Nichia Chem Ind Ltd Led package
JPH11163412A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led illuminator
JP4055373B2 (en) * 2001-05-31 2008-03-05 日亜化学工業株式会社 Method for manufacturing light emitting device
JP2005159045A (en) * 2003-11-26 2005-06-16 Sumitomo Electric Ind Ltd Semiconductor light emitting element mounting member and light emitting diode using the same
JP2005210056A (en) * 2003-12-25 2005-08-04 Ngk Spark Plug Co Ltd Led ceramic package

Also Published As

Publication number Publication date
JP2005347375A (en) 2005-12-15
KR20060046091A (en) 2006-05-17

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