JPS61202484A - Light emitting diode - Google Patents

Light emitting diode

Info

Publication number
JPS61202484A
JPS61202484A JP4537585A JP4537585A JPS61202484A JP S61202484 A JPS61202484 A JP S61202484A JP 4537585 A JP4537585 A JP 4537585A JP 4537585 A JP4537585 A JP 4537585A JP S61202484 A JPS61202484 A JP S61202484A
Authority
JP
Japan
Prior art keywords
lead
alloy
light emitting
cu
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4537585A
Other versions
JPH0424879B2 (en
Inventor
Nobuo Ogasa
Akira Otsuka
Original Assignee
Sumitomo Electric Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Ind Ltd filed Critical Sumitomo Electric Ind Ltd
Priority to JP4537585A priority Critical patent/JPH0424879B2/ja
Publication of JPS61202484A publication Critical patent/JPS61202484A/en
Publication of JPH0424879B2 publication Critical patent/JPH0424879B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Abstract

PURPOSE:To efficiently dissipate through an element supporting lead and a Cu-coated lead connected with a bottom by mounting a light emitting diode element on a copper alloy element supporting lead sealed with glass via a through hole of a kovar stem. CONSTITUTION:At least one through hole 18 is formed at a stem 11 made of an Fe-Ni-Co alloy of a package. An element supporting lead 15 made of CuW alloy containing 5-30wt% of Cu, CuMo alloy of CuWMo alloy is passed in noncontacting state with the inner surface of one of the holes, and a light emitting element 14 is mounted directly or through a submount at the top of the lead 16. A Cu-coated iron lead 17 of 50-90% in the sectional area ratio is connected with the bottom of the lead, and a gap between the outer surface of the lead 16 and the inner surface of the hole 18 for passing the lead is hermetically sealed with glass 13.
JP4537585A 1985-03-05 1985-03-05 Expired - Lifetime JPH0424879B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4537585A JPH0424879B2 (en) 1985-03-05 1985-03-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4537585A JPH0424879B2 (en) 1985-03-05 1985-03-05

Publications (2)

Publication Number Publication Date
JPS61202484A true JPS61202484A (en) 1986-09-08
JPH0424879B2 JPH0424879B2 (en) 1992-04-28

Family

ID=12717518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4537585A Expired - Lifetime JPH0424879B2 (en) 1985-03-05 1985-03-05

Country Status (1)

Country Link
JP (1) JPH0424879B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
US7408203B2 (en) 2004-04-17 2008-08-05 Lg Electronics Inc. Light emitting device and fabrication method thereof and light emitting system using the same
WO2009081470A1 (en) * 2007-12-21 2009-07-02 Mitsubishi Electric Corporation Laser light source module
JP2009272656A (en) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd Semiconductor light-emitting element, and manufacturing method thereof
US20110147785A1 (en) * 2008-02-22 2011-06-23 Illinois Tool Works Inc Surface mount led and holder

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7408203B2 (en) 2004-04-17 2008-08-05 Lg Electronics Inc. Light emitting device and fabrication method thereof and light emitting system using the same
US8008677B2 (en) 2004-04-17 2011-08-30 Lg Electronics Inc. Light emitting device and fabrication method thereof and light emitting system using the same
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
WO2009081470A1 (en) * 2007-12-21 2009-07-02 Mitsubishi Electric Corporation Laser light source module
US8233512B2 (en) 2007-12-21 2012-07-31 Mitsubishi Electric Corporation Laser light source module
JP5430406B2 (en) * 2007-12-21 2014-02-26 三菱電機株式会社 Laser light source module
US20110147785A1 (en) * 2008-02-22 2011-06-23 Illinois Tool Works Inc Surface mount led and holder
US8362513B2 (en) * 2008-02-22 2013-01-29 Illinois Tool Works Inc. Surface mount LED and holder
JP2009272656A (en) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd Semiconductor light-emitting element, and manufacturing method thereof

Also Published As

Publication number Publication date
JPH0424879B2 (en) 1992-04-28

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