JP2006344692A5 - - Google Patents

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Publication number
JP2006344692A5
JP2006344692A5 JP2005167494A JP2005167494A JP2006344692A5 JP 2006344692 A5 JP2006344692 A5 JP 2006344692A5 JP 2005167494 A JP2005167494 A JP 2005167494A JP 2005167494 A JP2005167494 A JP 2005167494A JP 2006344692 A5 JP2006344692 A5 JP 2006344692A5
Authority
JP
Japan
Prior art keywords
emitting element
substrate
light emitting
light
element mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005167494A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006344692A (ja
JP4064412B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005167494A external-priority patent/JP4064412B2/ja
Priority to JP2005167494A priority Critical patent/JP4064412B2/ja
Priority to EP06757029.1A priority patent/EP1890343A4/en
Priority to TW95119995A priority patent/TWI311820B/zh
Priority to PCT/JP2006/311289 priority patent/WO2006132222A1/ja
Priority to KR20077028211A priority patent/KR101017917B1/ko
Publication of JP2006344692A publication Critical patent/JP2006344692A/ja
Publication of JP2006344692A5 publication Critical patent/JP2006344692A5/ja
Priority to US11/950,884 priority patent/US7699500B2/en
Publication of JP4064412B2 publication Critical patent/JP4064412B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005167494A 2005-06-07 2005-06-07 発光素子実装用基板および発光素子モジュール Expired - Fee Related JP4064412B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005167494A JP4064412B2 (ja) 2005-06-07 2005-06-07 発光素子実装用基板および発光素子モジュール
KR20077028211A KR101017917B1 (ko) 2005-06-07 2006-06-06 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기
TW95119995A TWI311820B (en) 2005-06-07 2006-06-06 Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device
PCT/JP2006/311289 WO2006132222A1 (ja) 2005-06-07 2006-06-06 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機
EP06757029.1A EP1890343A4 (en) 2005-06-07 2006-06-06 SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
US11/950,884 US7699500B2 (en) 2005-06-07 2007-12-05 Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005167494A JP4064412B2 (ja) 2005-06-07 2005-06-07 発光素子実装用基板および発光素子モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007220232A Division JP4173527B2 (ja) 2007-08-27 2007-08-27 発光素子実装用基板および発光素子モジュール

Publications (3)

Publication Number Publication Date
JP2006344692A JP2006344692A (ja) 2006-12-21
JP2006344692A5 true JP2006344692A5 (enExample) 2007-07-12
JP4064412B2 JP4064412B2 (ja) 2008-03-19

Family

ID=37641448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005167494A Expired - Fee Related JP4064412B2 (ja) 2005-06-07 2005-06-07 発光素子実装用基板および発光素子モジュール

Country Status (1)

Country Link
JP (1) JP4064412B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

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