JP2006156720A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006156720A5 JP2006156720A5 JP2004345364A JP2004345364A JP2006156720A5 JP 2006156720 A5 JP2006156720 A5 JP 2006156720A5 JP 2004345364 A JP2004345364 A JP 2004345364A JP 2004345364 A JP2004345364 A JP 2004345364A JP 2006156720 A5 JP2006156720 A5 JP 2006156720A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- insulator
- component unit
- electronic component
- kneaded material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 83
- 229920005989 resin Polymers 0.000 claims description 77
- 239000011347 resin Substances 0.000 claims description 77
- 239000012212 insulator Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 32
- 239000011256 inorganic filler Substances 0.000 claims description 25
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 description 14
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004345364A JP4013945B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004345364A JP4013945B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006156720A JP2006156720A (ja) | 2006-06-15 |
| JP2006156720A5 true JP2006156720A5 (enrdf_load_stackoverflow) | 2007-07-05 |
| JP4013945B2 JP4013945B2 (ja) | 2007-11-28 |
Family
ID=36634617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004345364A Expired - Fee Related JP4013945B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4013945B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153430A (ja) * | 2006-12-18 | 2008-07-03 | Mitsubishi Electric Corp | 放熱基板並びに熱伝導性シートおよびこれらを用いたパワーモジュール |
| JP2009081253A (ja) * | 2007-09-26 | 2009-04-16 | Nitto Shinko Kk | 絶縁シート |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000191998A (ja) * | 1998-12-28 | 2000-07-11 | Polymatech Co Ltd | 熱伝導性接着剤および接着方法ならびに半導体装置 |
| JP2001284859A (ja) * | 2000-03-31 | 2001-10-12 | Jsr Corp | 熱伝導性シートおよびその用途 |
| JP2001261722A (ja) * | 2000-03-22 | 2001-09-26 | Jsr Corp | 熱伝導性シート用硬化性組成物、半硬化熱伝導性シートおよびその製造方法 |
| JP2002138205A (ja) * | 2000-11-02 | 2002-05-14 | Polymatech Co Ltd | 熱伝導性成形体 |
| JP2002146672A (ja) * | 2000-11-06 | 2002-05-22 | Polymatech Co Ltd | 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置 |
| JP4268778B2 (ja) * | 2001-12-27 | 2009-05-27 | ポリマテック株式会社 | 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート |
| JP2004104115A (ja) * | 2002-08-21 | 2004-04-02 | Matsushita Electric Ind Co Ltd | パワーモジュール及びその製造方法 |
| JP4075549B2 (ja) * | 2002-09-24 | 2008-04-16 | 松下電器産業株式会社 | 放熱用基板及びその製造方法 |
-
2004
- 2004-11-30 JP JP2004345364A patent/JP4013945B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7057896B2 (en) | Power module and production method thereof | |
| CN100490132C (zh) | 绝缘片以及使用了上述绝缘片的功率模块 | |
| WO2013099545A1 (ja) | 電力用半導体装置及びその製造方法 | |
| KR101682761B1 (ko) | 열전도성 유전성 인터페이스 | |
| JP2002033558A (ja) | 回路基板とその製造方法 | |
| JP4261713B2 (ja) | 熱伝導基板とその製造方法 | |
| JP2014187233A (ja) | 放熱シートおよびこれを用いた放熱構造 | |
| JP2010245563A (ja) | 部品ユニット | |
| JP2015165545A (ja) | パワーモジュールとその製造方法 | |
| WO2015132969A1 (ja) | 絶縁基板及び半導体装置 | |
| JP2004104115A (ja) | パワーモジュール及びその製造方法 | |
| JP4111187B2 (ja) | 部品ユニットの製造方法 | |
| JP4013945B2 (ja) | 部品ユニットの製造方法 | |
| JP2006156721A5 (enrdf_load_stackoverflow) | ||
| JP4581655B2 (ja) | 放熱板 | |
| JP2006156720A5 (enrdf_load_stackoverflow) | ||
| JP4636092B2 (ja) | 部品ユニット | |
| JP2006156725A (ja) | 放熱板の製造方法 | |
| JP2006156726A (ja) | 放熱板の製造方法 | |
| JP2008181922A (ja) | 熱伝導基板、その製造方法および熱伝導基板を用いた半導体装置 | |
| JP4325329B2 (ja) | 放熱実装体 | |
| JP4581656B2 (ja) | 放熱板の製造方法 | |
| JP4075549B2 (ja) | 放熱用基板及びその製造方法 | |
| JP2003152143A (ja) | 熱伝導性基板の製造方法 | |
| JP3985558B2 (ja) | 熱伝導性基板の製造方法 |