JP4013945B2 - 部品ユニットの製造方法 - Google Patents

部品ユニットの製造方法 Download PDF

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Publication number
JP4013945B2
JP4013945B2 JP2004345364A JP2004345364A JP4013945B2 JP 4013945 B2 JP4013945 B2 JP 4013945B2 JP 2004345364 A JP2004345364 A JP 2004345364A JP 2004345364 A JP2004345364 A JP 2004345364A JP 4013945 B2 JP4013945 B2 JP 4013945B2
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JP
Japan
Prior art keywords
insulating resin
kneaded material
electronic component
semi
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004345364A
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English (en)
Japanese (ja)
Other versions
JP2006156720A5 (enrdf_load_stackoverflow
JP2006156720A (ja
Inventor
美智博 宮内
哲也 津村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004345364A priority Critical patent/JP4013945B2/ja
Publication of JP2006156720A publication Critical patent/JP2006156720A/ja
Publication of JP2006156720A5 publication Critical patent/JP2006156720A5/ja
Application granted granted Critical
Publication of JP4013945B2 publication Critical patent/JP4013945B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004345364A 2004-11-30 2004-11-30 部品ユニットの製造方法 Expired - Fee Related JP4013945B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004345364A JP4013945B2 (ja) 2004-11-30 2004-11-30 部品ユニットの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004345364A JP4013945B2 (ja) 2004-11-30 2004-11-30 部品ユニットの製造方法

Publications (3)

Publication Number Publication Date
JP2006156720A JP2006156720A (ja) 2006-06-15
JP2006156720A5 JP2006156720A5 (enrdf_load_stackoverflow) 2007-07-05
JP4013945B2 true JP4013945B2 (ja) 2007-11-28

Family

ID=36634617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004345364A Expired - Fee Related JP4013945B2 (ja) 2004-11-30 2004-11-30 部品ユニットの製造方法

Country Status (1)

Country Link
JP (1) JP4013945B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153430A (ja) * 2006-12-18 2008-07-03 Mitsubishi Electric Corp 放熱基板並びに熱伝導性シートおよびこれらを用いたパワーモジュール
JP2009081253A (ja) * 2007-09-26 2009-04-16 Nitto Shinko Kk 絶縁シート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191998A (ja) * 1998-12-28 2000-07-11 Polymatech Co Ltd 熱伝導性接着剤および接着方法ならびに半導体装置
JP2001284859A (ja) * 2000-03-31 2001-10-12 Jsr Corp 熱伝導性シートおよびその用途
JP2001261722A (ja) * 2000-03-22 2001-09-26 Jsr Corp 熱伝導性シート用硬化性組成物、半硬化熱伝導性シートおよびその製造方法
JP2002138205A (ja) * 2000-11-02 2002-05-14 Polymatech Co Ltd 熱伝導性成形体
JP2002146672A (ja) * 2000-11-06 2002-05-22 Polymatech Co Ltd 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置
JP4268778B2 (ja) * 2001-12-27 2009-05-27 ポリマテック株式会社 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート
JP2004104115A (ja) * 2002-08-21 2004-04-02 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
JP4075549B2 (ja) * 2002-09-24 2008-04-16 松下電器産業株式会社 放熱用基板及びその製造方法

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Publication number Publication date
JP2006156720A (ja) 2006-06-15

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