JP2006147888A - 回路チップパッケージの取り外し方法および回路チップパッケージ用取り外し治具 - Google Patents
回路チップパッケージの取り外し方法および回路チップパッケージ用取り外し治具 Download PDFInfo
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- JP2006147888A JP2006147888A JP2004336703A JP2004336703A JP2006147888A JP 2006147888 A JP2006147888 A JP 2006147888A JP 2004336703 A JP2004336703 A JP 2004336703A JP 2004336703 A JP2004336703 A JP 2004336703A JP 2006147888 A JP2006147888 A JP 2006147888A
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- chip package
- circuit board
- printed circuit
- circuit chip
- removal jig
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49821—Disassembling by altering or destroying work part or connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49822—Disassembling by applying force
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53274—Means to disassemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53274—Means to disassemble electrical device
- Y10T29/53283—Means comprising hand-manipulatable implement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】取り外し治具21はプリント回路基板12上に搭載される。傾斜面35、36の前進は、プリント回路基板12および回路チップパッケージ13の間に配置される固体のはんだバンプ14で受け止められる。プリント回路基板12に熱が加えられる。はんだバンプ14は溶融する。傾斜面35、36の前進の規制は取り払われる。はんだバンプ14の溶融に応じて傾斜面35、36は前進する。プリント回路基板12および回路チップパッケージ13の間に傾斜面35、36は滑り込む。こうした取り外し方法によれば、はんだバンプ14が完全に溶融した後に、回路チップパッケージ13にはプリント回路基板12の表面に垂直方向に持ち上げ力が加えられる。比較的に簡単に回路チップパッケージ13のみが取り外されることができる。
【選択図】図4
Description
Claims (9)
- プリント回路基板上に取り外し治具を搭載し、プリント回路基板および回路チップパッケージの間に配置される固体のはんだバンプで取り外し治具の傾斜面の前進を受け止めさせる工程と、プリント回路基板に熱を加えはんだバンプを溶融させ、傾斜面の前進の規制を取り払う工程と、はんだバンプの溶融に応じてプリント回路基板の表面に沿って取り外し治具の傾斜面を前進させ、プリント回路基板および回路チップパッケージの間に傾斜面を滑り込ませる工程とを備えることを特徴とする回路チップパッケージの取り外し方法。
- プリント回路基板上に取り外し治具を搭載し、取り外し治具の1対の把持部材で、プリント回路基板および回路チップパッケージの間に配置される固体のはんだバンプ列を挟み込み、回路チップパッケージの外縁に各把持部材上の傾斜面を向き合わせつつ回路チップパッケージ上で取り外し治具を固定する工程と、プリント回路基板に熱を加えはんだバンプを溶融させる工程と、はんだバンプの溶融に応じてプリント回路基板の表面に沿って取り外し治具の把持部材同士を接近させ、プリント回路基板および回路チップパッケージの間に把持部材上の傾斜面を滑り込ませる工程とを備えることを特徴とする回路チップパッケージの取り外し方法。
- プリント回路基板上に搭載され、プリント回路基板とともに持ち運ばれる回路チップパッケージ用取り外し治具であって、支持体と、支持体上で1直線に沿って相互に相対移動する第1および第2把持部材と、第1および第2把持部材を相互に接近させる伸縮力を発揮する弾性伸縮部材とを備え、第1および第2把持部材には、プリント回路基板の表面に受け止められ、内端同士で相互に向き合わせられる水平平板部と、水平平板部の外端から所定の傾斜角で立ち上がる傾斜平板部とが区画されることを特徴とする回路チップパッケージ用取り外し治具。
- プリント回路基板上に搭載され、プリント回路基板とともに持ち運ばれる回路チップパッケージ用取り外し治具であって、相互に隔てられた位置でプリント回路基板の表面に受け止められる1対の第1部材片と、第1部材片同士の間に配置される第2部材片と、第2部材片および個々の第1部材片を接続し、常温よりも高い所定の温度に達すると、常温時の原形から変形してプリント回路基板の表面から第2部材片を遠ざける接続部材とを備えることを特徴とする回路チップパッケージ用取り外し治具。
- 請求項4に記載の回路チップパッケージ用取り外し治具において、前記第1および第2部材片並びに接続部材は1枚のバイメタルから構成されることを特徴とする回路チップパッケージ用取り外し治具。
- 請求項4に記載の回路チップパッケージ用取り外し治具において、前記第1および第2部材片並びに接続部材は1枚の形状記憶合金から構成されることを特徴とする回路チップパッケージ用取り外し治具。
- 請求項4に記載の回路チップパッケージ用取り外し治具において、前記第2部材片の表面に取り付けられて回路チップパッケージを挟み込む挟み込み部材をさらに備えることを特徴とする回路チップパッケージ用取り外し治具。
- プリント回路基板上に搭載され、プリント回路基板とともに持ち運ばれる回路チップパッケージ用取り外し治具であって、プリント回路基板の表面に受け止められる平板部材と、平板部材の表面に向き合わせられる部材片と、一端で部材片に連結されるとともに他端で平板部材に連結され、平板部材から所定の距離に位置する部材片に平板部材から遠ざかる弾性力を付与する弾性部材と、常温で平板部材から所定の距離に位置する部材片および平板部材を相互に結合し、常温よりも高い所定の温度で溶融する結合材とを備えることを特徴とする回路チップパッケージ用取り外し治具。
- 請求項8に記載の回路チップパッケージ用取り外し治具において、前記部材片の表面に取り付けられて回路チップパッケージを挟み込む挟み込み部材をさらに備えることを特徴とする回路チップパッケージ用取り外し治具。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004336703A JP4519614B2 (ja) | 2004-11-19 | 2004-11-19 | 回路チップパッケージ用取り外し治具 |
US11/061,471 US7469457B2 (en) | 2004-11-19 | 2005-02-22 | Method of removing integrated circuit chip package and detachment jig therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004336703A JP4519614B2 (ja) | 2004-11-19 | 2004-11-19 | 回路チップパッケージ用取り外し治具 |
Publications (2)
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JP2006147888A true JP2006147888A (ja) | 2006-06-08 |
JP4519614B2 JP4519614B2 (ja) | 2010-08-04 |
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JP2004336703A Expired - Fee Related JP4519614B2 (ja) | 2004-11-19 | 2004-11-19 | 回路チップパッケージ用取り外し治具 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7469457B2 (en) * | 2004-11-19 | 2008-12-30 | Fujitsu Limited | Method of removing integrated circuit chip package and detachment jig therefor |
JP2013149787A (ja) * | 2012-01-19 | 2013-08-01 | Fujitsu Telecom Networks Ltd | 電子部品の複数個同時リワーク工法とリワーク治具 |
Families Citing this family (13)
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JP2013251449A (ja) * | 2012-06-01 | 2013-12-12 | Fujitsu Ltd | 伝熱キャップ、リペア装置及びリペア方法 |
TWI498520B (zh) * | 2012-06-29 | 2015-09-01 | Ibm | 從一安裝表面分離一元件的裝置及方法 |
CN104002542A (zh) * | 2013-02-22 | 2014-08-27 | 深圳富泰宏精密工业有限公司 | 顶料装置 |
WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
US9591795B2 (en) * | 2014-09-18 | 2017-03-07 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Sensor-based removal of a soldered device |
US10553557B2 (en) * | 2014-11-05 | 2020-02-04 | Infineon Technologies Austria Ag | Electronic component, system and method |
US10192846B2 (en) | 2014-11-05 | 2019-01-29 | Infineon Technologies Austria Ag | Method of inserting an electronic component into a slot in a circuit board |
US10064287B2 (en) | 2014-11-05 | 2018-08-28 | Infineon Technologies Austria Ag | System and method of providing a semiconductor carrier and redistribution structure |
JP6455129B2 (ja) * | 2014-12-18 | 2019-01-23 | 富士通株式会社 | 半導体部品分離方法 |
US10269762B2 (en) * | 2015-10-29 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Rework process and tool design for semiconductor package |
US10177519B2 (en) * | 2015-11-23 | 2019-01-08 | Raytheon Company | Connector demating tool and method |
FR3066937B1 (fr) * | 2017-05-30 | 2019-07-12 | Continental Automotive France | Dispositif de chauffe |
SG11202003666VA (en) * | 2017-11-02 | 2020-05-28 | Universal Instruments Corp | Fixture to hold part before and after reflow, and method |
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2004
- 2004-11-19 JP JP2004336703A patent/JP4519614B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-22 US US11/061,471 patent/US7469457B2/en not_active Expired - Fee Related
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Publication number | Priority date | Publication date | Assignee | Title |
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US7469457B2 (en) * | 2004-11-19 | 2008-12-30 | Fujitsu Limited | Method of removing integrated circuit chip package and detachment jig therefor |
JP2013149787A (ja) * | 2012-01-19 | 2013-08-01 | Fujitsu Telecom Networks Ltd | 電子部品の複数個同時リワーク工法とリワーク治具 |
Also Published As
Publication number | Publication date |
---|---|
JP4519614B2 (ja) | 2010-08-04 |
US20060107513A1 (en) | 2006-05-25 |
US7469457B2 (en) | 2008-12-30 |
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