JP2006119651A - 位相シフトマスクを製作するための方法および位相シフトマスク - Google Patents
位相シフトマスクを製作するための方法および位相シフトマスク Download PDFInfo
- Publication number
- JP2006119651A JP2006119651A JP2005306747A JP2005306747A JP2006119651A JP 2006119651 A JP2006119651 A JP 2006119651A JP 2005306747 A JP2005306747 A JP 2005306747A JP 2005306747 A JP2005306747 A JP 2005306747A JP 2006119651 A JP2006119651 A JP 2006119651A
- Authority
- JP
- Japan
- Prior art keywords
- phase shift
- light
- layer
- shift mask
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010363 phase shift Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 41
- 230000003667 anti-reflective effect Effects 0.000 claims abstract description 19
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 34
- 229910052804 chromium Inorganic materials 0.000 claims description 24
- 239000011651 chromium Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000005019 vapor deposition process Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 6
- 229920002120 photoresistant polymer Polymers 0.000 description 30
- 229920003259 poly(silylenemethylene) Polymers 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/973,526 US7384714B2 (en) | 2004-10-25 | 2004-10-25 | Anti-reflective sidewall coated alternating phase shift mask and fabrication method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006119651A true JP2006119651A (ja) | 2006-05-11 |
| JP2006119651A5 JP2006119651A5 (enExample) | 2008-12-04 |
Family
ID=36206554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005306747A Pending JP2006119651A (ja) | 2004-10-25 | 2005-10-21 | 位相シフトマスクを製作するための方法および位相シフトマスク |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7384714B2 (enExample) |
| JP (1) | JP2006119651A (enExample) |
| SG (1) | SG121937A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7674562B2 (en) * | 2005-12-07 | 2010-03-09 | Chartered Semiconductor Manufacturing, Ltd. | Angled-wedge chrome-face wall for intensity balance of alternating phase shift mask |
| US20080261122A1 (en) * | 2007-04-20 | 2008-10-23 | Jeffrey Peter Gambino | Photolithography mask with protective capping layer |
| US20080261121A1 (en) * | 2007-04-20 | 2008-10-23 | Jeffrey Peter Gambino | Photolithography mask with protective silicide capping layer |
| US20080261120A1 (en) * | 2007-04-20 | 2008-10-23 | Jeffrey Peter Gambino | Photolithography mask with integrally formed protective capping layer |
| JP2008299159A (ja) * | 2007-06-01 | 2008-12-11 | Nec Electronics Corp | レベンソンマスク及びレベンソンマスクの製造方法 |
| US20080311485A1 (en) * | 2007-06-12 | 2008-12-18 | William Stanton | Photomasks Used to Fabricate Integrated Circuitry, Finished-Construction Binary Photomasks Used to Fabricate Integrated Circuitry, Methods of Forming Photomasks, and Methods of Photolithographically Patterning Substrates |
| US20090226823A1 (en) * | 2008-03-06 | 2009-09-10 | Micron Technology, Inc. | Reticles including assistant structures, methods of forming such reticles, and methods of utilizing such reticles |
| EP2391924B1 (en) | 2009-01-29 | 2013-07-24 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
| US8586403B2 (en) * | 2011-02-15 | 2013-11-19 | Sunpower Corporation | Process and structures for fabrication of solar cells with laser ablation steps to form contact holes |
| US8846273B2 (en) | 2012-06-04 | 2014-09-30 | Micron Technology, Inc. | Photomasks, methods of forming a photomask, and methods of photolithographically patterning a substrate |
| CN108650794B (zh) * | 2018-06-04 | 2023-01-17 | 上海量子绘景电子股份有限公司 | 一种线路板的制备方法 |
| CN112099308B (zh) * | 2020-10-22 | 2025-04-11 | 泉芯集成电路制造(济南)有限公司 | 衰减相移掩模版及其制程方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11119411A (ja) * | 1997-10-20 | 1999-04-30 | Sony Corp | 位相シフトマスク及び位相シフトマスクの製造方法 |
| JP2002289592A (ja) * | 2001-03-28 | 2002-10-04 | Sony Corp | 半導体装置の製造方法 |
| JP2003043662A (ja) * | 2001-08-01 | 2003-02-13 | Toppan Printing Co Ltd | ハーフトーン型位相シフトマスク |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5411824A (en) | 1993-01-21 | 1995-05-02 | Sematech, Inc. | Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging |
| US5418095A (en) | 1993-01-21 | 1995-05-23 | Sematech, Inc. | Method of fabricating phase shifters with absorbing/attenuating sidewalls using an additive process |
| WO1994017449A1 (en) | 1993-01-21 | 1994-08-04 | Sematech, Inc. | Phase shifting mask structure with multilayer optical coating for improved transmission |
| US6824932B2 (en) * | 2002-06-05 | 2004-11-30 | International Business Machines Corporation | Self-aligned alternating phase shift mask patterning process |
-
2004
- 2004-10-25 US US10/973,526 patent/US7384714B2/en active Active
-
2005
- 2005-08-26 SG SG200505529A patent/SG121937A1/en unknown
- 2005-10-21 JP JP2005306747A patent/JP2006119651A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11119411A (ja) * | 1997-10-20 | 1999-04-30 | Sony Corp | 位相シフトマスク及び位相シフトマスクの製造方法 |
| JP2002289592A (ja) * | 2001-03-28 | 2002-10-04 | Sony Corp | 半導体装置の製造方法 |
| JP2003043662A (ja) * | 2001-08-01 | 2003-02-13 | Toppan Printing Co Ltd | ハーフトーン型位相シフトマスク |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060088771A1 (en) | 2006-04-27 |
| SG121937A1 (en) | 2006-05-26 |
| US7384714B2 (en) | 2008-06-10 |
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