JP2006100716A - 電子部品の取付方向を表示した電子機器 - Google Patents

電子部品の取付方向を表示した電子機器 Download PDF

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Publication number
JP2006100716A
JP2006100716A JP2004287521A JP2004287521A JP2006100716A JP 2006100716 A JP2006100716 A JP 2006100716A JP 2004287521 A JP2004287521 A JP 2004287521A JP 2004287521 A JP2004287521 A JP 2004287521A JP 2006100716 A JP2006100716 A JP 2006100716A
Authority
JP
Japan
Prior art keywords
electronic component
symbol
wiring board
component
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004287521A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006100716A5 (enExample
Inventor
Tsutomu Shimada
力 嶋田
Kazuyuki Nagata
和幸 永田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orion Electric Co Ltd
Original Assignee
Orion Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Electric Co Ltd filed Critical Orion Electric Co Ltd
Priority to JP2004287521A priority Critical patent/JP2006100716A/ja
Priority to US11/236,492 priority patent/US20060068631A1/en
Publication of JP2006100716A publication Critical patent/JP2006100716A/ja
Publication of JP2006100716A5 publication Critical patent/JP2006100716A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/64Means for preventing incorrect coupling
    • H01R13/641Means for preventing incorrect coupling by indicating incorrect coupling; by indicating correct or full engagement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/168Wrong mounting prevention
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2004287521A 2004-09-30 2004-09-30 電子部品の取付方向を表示した電子機器 Withdrawn JP2006100716A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004287521A JP2006100716A (ja) 2004-09-30 2004-09-30 電子部品の取付方向を表示した電子機器
US11/236,492 US20060068631A1 (en) 2004-09-30 2005-09-28 Electronic apparatus indicating electronic part mounting direction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004287521A JP2006100716A (ja) 2004-09-30 2004-09-30 電子部品の取付方向を表示した電子機器

Publications (2)

Publication Number Publication Date
JP2006100716A true JP2006100716A (ja) 2006-04-13
JP2006100716A5 JP2006100716A5 (enExample) 2007-05-10

Family

ID=36099813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004287521A Withdrawn JP2006100716A (ja) 2004-09-30 2004-09-30 電子部品の取付方向を表示した電子機器

Country Status (2)

Country Link
US (1) US20060068631A1 (enExample)
JP (1) JP2006100716A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239127A (ja) * 2008-03-27 2009-10-15 Hitachi High-Tech Instruments Co Ltd 基板組立実装ラインの管理方法
JP2019180767A (ja) * 2018-04-09 2019-10-24 株式会社三共 遊技機
JP2019180766A (ja) * 2018-04-09 2019-10-24 株式会社三共 遊技機
JP2019180760A (ja) * 2018-04-09 2019-10-24 株式会社三共 遊技機
JP2021087855A (ja) * 2021-03-05 2021-06-10 株式会社三共 遊技機
JP2022027962A (ja) * 2018-11-29 2022-02-14 株式会社三共 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
JP2776860B2 (ja) * 1989-01-11 1998-07-16 株式会社日立製作所 電子部品装着装置及び装着方法
US5252784A (en) * 1990-11-27 1993-10-12 Ibiden Co., Ltd. Electronic-parts mounting board and electronic-parts mounting board frame
JPH04213867A (ja) * 1990-11-27 1992-08-04 Ibiden Co Ltd 電子部品搭載用基板フレーム
JPH0823160A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp プリント配線板と電子部品の接続方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239127A (ja) * 2008-03-27 2009-10-15 Hitachi High-Tech Instruments Co Ltd 基板組立実装ラインの管理方法
JP2019180767A (ja) * 2018-04-09 2019-10-24 株式会社三共 遊技機
JP2019180766A (ja) * 2018-04-09 2019-10-24 株式会社三共 遊技機
JP2019180760A (ja) * 2018-04-09 2019-10-24 株式会社三共 遊技機
JP7019495B2 (ja) 2018-04-09 2022-02-15 株式会社三共 遊技機
JP7068900B2 (ja) 2018-04-09 2022-05-17 株式会社三共 遊技機
JP7068901B2 (ja) 2018-04-09 2022-05-17 株式会社三共 遊技機
JP2022027962A (ja) * 2018-11-29 2022-02-14 株式会社三共 遊技機
JP7209077B2 (ja) 2018-11-29 2023-01-19 株式会社三共 遊技機
JP2021087855A (ja) * 2021-03-05 2021-06-10 株式会社三共 遊技機
JP7150919B2 (ja) 2021-03-05 2022-10-11 株式会社三共 遊技機

Also Published As

Publication number Publication date
US20060068631A1 (en) 2006-03-30

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