JP2006080495A5 - - Google Patents

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Publication number
JP2006080495A5
JP2006080495A5 JP2005225305A JP2005225305A JP2006080495A5 JP 2006080495 A5 JP2006080495 A5 JP 2006080495A5 JP 2005225305 A JP2005225305 A JP 2005225305A JP 2005225305 A JP2005225305 A JP 2005225305A JP 2006080495 A5 JP2006080495 A5 JP 2006080495A5
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JP
Japan
Prior art keywords
semiconductor layer
forming
gate electrode
layer
conductive layer
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JP2005225305A
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English (en)
Japanese (ja)
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JP4906039B2 (ja
JP2006080495A (ja
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Priority to JP2005225305A priority Critical patent/JP4906039B2/ja
Priority claimed from JP2005225305A external-priority patent/JP4906039B2/ja
Publication of JP2006080495A publication Critical patent/JP2006080495A/ja
Publication of JP2006080495A5 publication Critical patent/JP2006080495A5/ja
Application granted granted Critical
Publication of JP4906039B2 publication Critical patent/JP4906039B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005225305A 2004-08-03 2005-08-03 半導体装置の作製方法 Expired - Fee Related JP4906039B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005225305A JP4906039B2 (ja) 2004-08-03 2005-08-03 半導体装置の作製方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004227292 2004-08-03
JP2004227292 2004-08-03
JP2004234677 2004-08-11
JP2004234677 2004-08-11
JP2005225305A JP4906039B2 (ja) 2004-08-03 2005-08-03 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2006080495A JP2006080495A (ja) 2006-03-23
JP2006080495A5 true JP2006080495A5 (enrdf_load_stackoverflow) 2008-08-07
JP4906039B2 JP4906039B2 (ja) 2012-03-28

Family

ID=36159663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005225305A Expired - Fee Related JP4906039B2 (ja) 2004-08-03 2005-08-03 半導体装置の作製方法

Country Status (1)

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JP (1) JP4906039B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4746021B2 (ja) * 2006-10-13 2011-08-10 株式会社神戸製鋼所 薄膜トランジスタ基板の製造方法、および表示デバイス
KR101043508B1 (ko) 2006-10-13 2011-06-23 가부시키가이샤 고베 세이코쇼 박막 트랜지스터 기판 및 표시 디바이스
JP5197058B2 (ja) 2007-04-09 2013-05-15 キヤノン株式会社 発光装置とその作製方法
JP2009004518A (ja) 2007-06-20 2009-01-08 Kobe Steel Ltd 薄膜トランジスタ基板、および表示デバイス
JP2010056541A (ja) * 2008-07-31 2010-03-11 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
CN101714546B (zh) * 2008-10-03 2014-05-14 株式会社半导体能源研究所 显示装置及其制造方法
WO2010038820A1 (en) * 2008-10-03 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Display device
EP2172977A1 (en) * 2008-10-03 2010-04-07 Semiconductor Energy Laboratory Co., Ltd. Display device
TWI831050B (zh) 2008-11-07 2024-02-01 日商半導體能源研究所股份有限公司 半導體裝置和其製造方法
EP2515337B1 (en) * 2008-12-24 2016-02-24 Semiconductor Energy Laboratory Co., Ltd. Driver circuit and semiconductor device
EP2284891B1 (en) * 2009-08-07 2019-07-24 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
WO2011043194A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4236716B2 (ja) * 1997-09-29 2009-03-11 株式会社半導体エネルギー研究所 半導体装置
JP4718700B2 (ja) * 2001-03-16 2011-07-06 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4615197B2 (ja) * 2002-08-30 2011-01-19 シャープ株式会社 Tftアレイ基板の製造方法および液晶表示装置の製造方法

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