JP2006080383A - 発光装置及びその温度検出方法 - Google Patents

発光装置及びその温度検出方法 Download PDF

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Publication number
JP2006080383A
JP2006080383A JP2004264339A JP2004264339A JP2006080383A JP 2006080383 A JP2006080383 A JP 2006080383A JP 2004264339 A JP2004264339 A JP 2004264339A JP 2004264339 A JP2004264339 A JP 2004264339A JP 2006080383 A JP2006080383 A JP 2006080383A
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JP
Japan
Prior art keywords
temperature
light emitting
emitting device
light
temperature measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004264339A
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English (en)
Japanese (ja)
Other versions
JP2006080383A5 (enExample
Inventor
Hideo Nagai
秀男 永井
Noriyasu Tanimoto
憲保 谷本
Nobuyuki Matsui
伸幸 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2004264339A priority Critical patent/JP2006080383A/ja
Publication of JP2006080383A publication Critical patent/JP2006080383A/ja
Publication of JP2006080383A5 publication Critical patent/JP2006080383A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Devices (AREA)
JP2004264339A 2004-09-10 2004-09-10 発光装置及びその温度検出方法 Pending JP2006080383A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004264339A JP2006080383A (ja) 2004-09-10 2004-09-10 発光装置及びその温度検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264339A JP2006080383A (ja) 2004-09-10 2004-09-10 発光装置及びその温度検出方法

Publications (2)

Publication Number Publication Date
JP2006080383A true JP2006080383A (ja) 2006-03-23
JP2006080383A5 JP2006080383A5 (enExample) 2007-09-27

Family

ID=36159578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004264339A Pending JP2006080383A (ja) 2004-09-10 2004-09-10 発光装置及びその温度検出方法

Country Status (1)

Country Link
JP (1) JP2006080383A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294838A (ja) * 2006-04-26 2007-11-08 Yiguang Electronic Ind Co Ltd 発光ダイオードのパッケージ構造
JP2007300010A (ja) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd 発光装置及び照明装置
JP2008166412A (ja) * 2006-12-27 2008-07-17 Koito Mfg Co Ltd 発光素子駆動回路及び車両用灯具
KR20130063421A (ko) * 2011-12-06 2013-06-14 엘지이노텍 주식회사 발광 소자 패키지
JP2016092183A (ja) * 2014-11-04 2016-05-23 豊田合成株式会社 発光装置及びその製造方法
CN105810795A (zh) * 2016-04-14 2016-07-27 宏齐光电子(深圳)有限公司 一种芯片级封装 led 的封装结构
US9607970B2 (en) 2009-11-13 2017-03-28 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US9679942B2 (en) 2010-01-22 2017-06-13 Sharp Kabushiki Kaisha Light emitting device
JP2017167222A (ja) * 2016-03-14 2017-09-21 マイクロネット株式会社 顕微鏡用照明装置、顕微鏡用照明装置を備える顕微鏡、顕微鏡用照明装置を備える顕微鏡システム
WO2022040632A1 (en) * 2020-08-21 2022-02-24 Lumileds Llc Multi-color lighting device, system and method of manufacture

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154192A (ja) * 1984-12-27 1986-07-12 Nec Corp 半導体レ−ザの温度特性測定装置
JPH06237013A (ja) * 1991-05-27 1994-08-23 Mitsubishi Kasei Corp 発光スペクトル制御システム
JPH06331151A (ja) * 1993-05-21 1994-11-29 Toshiba Corp 卓上こんろ
JPH0982379A (ja) * 1995-09-18 1997-03-28 Kitagawa Ind Co Ltd ケーブル接続具
JP2001043728A (ja) * 1999-07-30 2001-02-16 Fujitsu Takamisawa Component Ltd 発光ダイオード照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154192A (ja) * 1984-12-27 1986-07-12 Nec Corp 半導体レ−ザの温度特性測定装置
JPH06237013A (ja) * 1991-05-27 1994-08-23 Mitsubishi Kasei Corp 発光スペクトル制御システム
JPH06331151A (ja) * 1993-05-21 1994-11-29 Toshiba Corp 卓上こんろ
JPH0982379A (ja) * 1995-09-18 1997-03-28 Kitagawa Ind Co Ltd ケーブル接続具
JP2001043728A (ja) * 1999-07-30 2001-02-16 Fujitsu Takamisawa Component Ltd 発光ダイオード照明装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294838A (ja) * 2006-04-26 2007-11-08 Yiguang Electronic Ind Co Ltd 発光ダイオードのパッケージ構造
JP2007300010A (ja) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd 発光装置及び照明装置
JP2008166412A (ja) * 2006-12-27 2008-07-17 Koito Mfg Co Ltd 発光素子駆動回路及び車両用灯具
US9607970B2 (en) 2009-11-13 2017-03-28 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US9966367B2 (en) 2010-01-22 2018-05-08 Sharp Kabushiki Kaisha Light emitting device
US9679942B2 (en) 2010-01-22 2017-06-13 Sharp Kabushiki Kaisha Light emitting device
KR20130063421A (ko) * 2011-12-06 2013-06-14 엘지이노텍 주식회사 발광 소자 패키지
KR101949150B1 (ko) * 2011-12-06 2019-02-18 엘지이노텍 주식회사 발광 소자 패키지
JP2016092183A (ja) * 2014-11-04 2016-05-23 豊田合成株式会社 発光装置及びその製造方法
JP2017167222A (ja) * 2016-03-14 2017-09-21 マイクロネット株式会社 顕微鏡用照明装置、顕微鏡用照明装置を備える顕微鏡、顕微鏡用照明装置を備える顕微鏡システム
CN105810795A (zh) * 2016-04-14 2016-07-27 宏齐光电子(深圳)有限公司 一种芯片级封装 led 的封装结构
WO2022040632A1 (en) * 2020-08-21 2022-02-24 Lumileds Llc Multi-color lighting device, system and method of manufacture
JP2023538102A (ja) * 2020-08-21 2023-09-06 ルミレッズ リミテッド ライアビリティ カンパニー 多色照明装置、システム及び製造方法

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