JP2006070279A - 高光学性能の樹脂組成物 - Google Patents
高光学性能の樹脂組成物 Download PDFInfo
- Publication number
- JP2006070279A JP2006070279A JP2005350777A JP2005350777A JP2006070279A JP 2006070279 A JP2006070279 A JP 2006070279A JP 2005350777 A JP2005350777 A JP 2005350777A JP 2005350777 A JP2005350777 A JP 2005350777A JP 2006070279 A JP2006070279 A JP 2006070279A
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- JP
- Japan
- Prior art keywords
- resin composition
- optical performance
- high optical
- resin
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
Abstract
【解決手段】平均分子量が45〜25000である樹脂材料と硬化剤が含有され、樹脂材料や硬化剤の主鎖に、硫黄原子やベンゼン環或いは多ベンゼン環からなる群からの少なくその一つの官能基がある。
Description
A、メチルヘキサヒドロフタル酸無水物(Methylhexahydrophtalic anhydride、MHHPA)或いは置換基を有するメチルヘキサヒドロフタル酸無水物
B、多(バイ)メルカプタン、例えば、バイメルカプタン(分子量=278)
Claims (13)
- 重量平均分子量が45〜25000で、100重量部が計算基準とされる樹脂材料と、
1〜120重量部である硬化剤と、が含有され、
当該樹脂材料や硬化剤の主鎖に、硫黄原子やベンゼン環或いは多ベンゼン環からなる群からの少なくその一つの官能基を有する。
ことを特徴とする高光学性能の樹脂組成物。 - 光学性能を向上するために、発光素子に設置されることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 被覆や印刷によって設置されることを特徴とする請求項2に記載の高光学性能の樹脂組成物。
- 当該発光素子は、発光ダイオードであることを特徴とする請求項2に記載の高光学性能の樹脂組成物。
- 当該硬化剤は、メチルヘキサヒドロフタル酸無水物(Methylhexahydrophtalic anhydride、MHHPA)や置換基を有するメチルヘキサヒドロフタル酸無水物或いは多(バイ)メルカプタンから選ばれたその一つであることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 当該樹脂材料は、多(バイ)-チオエーテルエポキシ樹脂単量体やそのプレポリマー或いはその派生物であることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 当該樹脂材料と当該硬化剤との反応温度は、50℃〜250℃であることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 更に、当該樹脂材料の劣化を防止するための熱安定剤が含有されることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 当該熱安定剤は、亜リン酸塩類である熱安定剤であることを特徴とする請求項8に記載の高光学性能の樹脂組成物。
- 更に、当該樹脂材料と当該硬化剤との反応を促進するための促進剤が含有されることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 当該促進剤は、アンモニウム塩促進剤であることを特徴とする請求項10に記載の高光学性能の樹脂組成物。
- 当該樹脂材料は、透過性質を有することを特徴とする請求項1に記載の高光学性能の樹脂組成物。
- 当該樹脂材料は、熱硬化樹脂であることを特徴とする請求項1に記載の高光学性能の樹脂組成物。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138232A TWI274062B (en) | 2005-11-01 | 2005-11-01 | Resin composition having high optical properties |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006070279A true JP2006070279A (ja) | 2006-03-16 |
Family
ID=36151213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005350777A Pending JP2006070279A (ja) | 2005-11-01 | 2005-12-05 | 高光学性能の樹脂組成物 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070100092A1 (ja) |
JP (1) | JP2006070279A (ja) |
TW (1) | TWI274062B (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10114764A (ja) * | 1996-10-15 | 1998-05-06 | Mitsui Chem Inc | 含硫エポキシ化合物及び含硫エポキシ樹脂 |
JPH10130250A (ja) * | 1996-10-25 | 1998-05-19 | Mitsui Chem Inc | 含硫エポキシ化合物及び含硫エポキシ樹脂 |
JP2002226456A (ja) * | 2001-01-30 | 2002-08-14 | Mitsui Chemicals Inc | 新規なポリチオール |
WO2003064530A1 (fr) * | 2002-01-25 | 2003-08-07 | Sumitomo Bakelite Co., Ltd. | Composition de composite transparent |
JP2004168945A (ja) * | 2002-11-21 | 2004-06-17 | Sumitomo Bakelite Co Ltd | 透明複合体組成物 |
JP2005298736A (ja) * | 2004-04-14 | 2005-10-27 | Idemitsu Kosan Co Ltd | 硫黄含有化合物、その製造方法および含硫黄重合体並びに光学材料 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW561162B (en) * | 2003-06-11 | 2003-11-11 | Chang Chun Plastics Co Ltd | Epoxy resin composition for encapsulation of optical semiconductor device |
-
2005
- 2005-11-01 TW TW094138232A patent/TWI274062B/zh not_active IP Right Cessation
- 2005-12-05 JP JP2005350777A patent/JP2006070279A/ja active Pending
-
2006
- 2006-01-06 US US11/326,406 patent/US20070100092A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10114764A (ja) * | 1996-10-15 | 1998-05-06 | Mitsui Chem Inc | 含硫エポキシ化合物及び含硫エポキシ樹脂 |
JPH10130250A (ja) * | 1996-10-25 | 1998-05-19 | Mitsui Chem Inc | 含硫エポキシ化合物及び含硫エポキシ樹脂 |
JP2002226456A (ja) * | 2001-01-30 | 2002-08-14 | Mitsui Chemicals Inc | 新規なポリチオール |
WO2003064530A1 (fr) * | 2002-01-25 | 2003-08-07 | Sumitomo Bakelite Co., Ltd. | Composition de composite transparent |
JP2004168945A (ja) * | 2002-11-21 | 2004-06-17 | Sumitomo Bakelite Co Ltd | 透明複合体組成物 |
JP2005298736A (ja) * | 2004-04-14 | 2005-10-27 | Idemitsu Kosan Co Ltd | 硫黄含有化合物、その製造方法および含硫黄重合体並びに光学材料 |
Also Published As
Publication number | Publication date |
---|---|
TW200718724A (en) | 2007-05-16 |
TWI274062B (en) | 2007-02-21 |
US20070100092A1 (en) | 2007-05-03 |
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