JP2006066657A - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
- Publication number
- JP2006066657A JP2006066657A JP2004247660A JP2004247660A JP2006066657A JP 2006066657 A JP2006066657 A JP 2006066657A JP 2004247660 A JP2004247660 A JP 2004247660A JP 2004247660 A JP2004247660 A JP 2004247660A JP 2006066657 A JP2006066657 A JP 2006066657A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- reflecting
- reflecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 93
- 238000006243 chemical reaction Methods 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 238000009826 distribution Methods 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 229920002050 silicone resin Polymers 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000000149 argon plasma sintering Methods 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 229910017709 Ni Co Inorganic materials 0.000 description 3
- 229910003267 Ni-Co Inorganic materials 0.000 description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 229910052863 mullite Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 229910017309 Mo—Mn Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
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- 238000000151 deposition Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 229910018509 Al—N Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 241001417501 Lobotidae Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920000995 Spectralon Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 231100000040 eye damage Toxicity 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- UQMZPFKLYHOJDL-UHFFFAOYSA-N zinc;cadmium(2+);disulfide Chemical compound [S-2].[S-2].[Zn+2].[Cd+2] UQMZPFKLYHOJDL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004247660A JP2006066657A (ja) | 2004-08-27 | 2004-08-27 | 発光装置および照明装置 |
DE102005030128A DE102005030128B4 (de) | 2004-06-28 | 2005-06-28 | Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung |
KR1020050056282A KR100752586B1 (ko) | 2004-06-28 | 2005-06-28 | 발광장치 및 조명장치 |
TW094121703A TWI267211B (en) | 2004-06-28 | 2005-06-28 | Light-emitting apparatus and illuminating apparatus |
CNB2005100791757A CN100411207C (zh) | 2004-06-28 | 2005-06-28 | 发光装置及照明装置 |
US11/168,887 US20060034084A1 (en) | 2004-06-28 | 2005-06-28 | Light-emitting apparatus and illuminating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004247660A JP2006066657A (ja) | 2004-08-27 | 2004-08-27 | 発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006066657A true JP2006066657A (ja) | 2006-03-09 |
JP2006066657A5 JP2006066657A5 (enrdf_load_stackoverflow) | 2007-09-06 |
Family
ID=36112856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004247660A Pending JP2006066657A (ja) | 2004-06-28 | 2004-08-27 | 発光装置および照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2006066657A (enrdf_load_stackoverflow) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273603A (ja) * | 2006-03-30 | 2007-10-18 | Kyocera Corp | 発光素子用配線基板および発光装置 |
JP2007273602A (ja) * | 2006-03-30 | 2007-10-18 | Kyocera Corp | 発光素子用配線基板および発光装置 |
JP2009543335A (ja) * | 2006-06-27 | 2009-12-03 | クリー インコーポレイテッド | 効率的な放射ledパッケージ及び光を効率的に放射する方法 |
JP2012009469A (ja) * | 2010-06-22 | 2012-01-12 | Nitto Denko Corp | 複合シートおよびそれを用いた半導体発光装置 |
JP2012009470A (ja) * | 2010-06-22 | 2012-01-12 | Nitto Denko Corp | 半導体発光装置 |
KR101134409B1 (ko) * | 2010-03-29 | 2012-04-09 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 |
WO2012081141A1 (ja) * | 2010-12-15 | 2012-06-21 | パナソニック株式会社 | 半導体発光装置 |
JP4962635B1 (ja) * | 2011-03-15 | 2012-06-27 | オムロン株式会社 | 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法 |
JP2012244085A (ja) * | 2011-05-24 | 2012-12-10 | Panasonic Corp | 照明装置 |
RU2537091C2 (ru) * | 2009-10-29 | 2014-12-27 | Нития Корпорейшн | Светоизлучающее устройство и способ изготовления светоизлучающего устройства |
WO2015016048A1 (ja) * | 2013-07-30 | 2015-02-05 | 堺ディスプレイプロダクト株式会社 | 光源装置、照明装置及び液晶表示装置 |
JP2015535951A (ja) * | 2012-09-19 | 2015-12-17 | ヴェンティス テクノロジーズ エルエルシー | 光を散乱させる装置 |
JP2019165122A (ja) * | 2018-03-20 | 2019-09-26 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
JP2021106184A (ja) * | 2019-12-26 | 2021-07-26 | 日亜化学工業株式会社 | 発光装置 |
JP2021141174A (ja) * | 2020-03-04 | 2021-09-16 | ローム株式会社 | 半導体発光装置および半導体発光装置の製造方法 |
JP2022024282A (ja) * | 2020-07-14 | 2022-02-09 | 日亜化学工業株式会社 | 発光装置及び照明装置 |
CN116449608A (zh) * | 2023-04-28 | 2023-07-18 | 惠科股份有限公司 | 背光模组及显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148512A (ja) * | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | 照明光源 |
JP2003298117A (ja) * | 2002-04-05 | 2003-10-17 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP2004056075A (ja) * | 2002-05-31 | 2004-02-19 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
-
2004
- 2004-08-27 JP JP2004247660A patent/JP2006066657A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148512A (ja) * | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | 照明光源 |
JP2003298117A (ja) * | 2002-04-05 | 2003-10-17 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP2004056075A (ja) * | 2002-05-31 | 2004-02-19 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273603A (ja) * | 2006-03-30 | 2007-10-18 | Kyocera Corp | 発光素子用配線基板および発光装置 |
JP2007273602A (ja) * | 2006-03-30 | 2007-10-18 | Kyocera Corp | 発光素子用配線基板および発光装置 |
JP2009543335A (ja) * | 2006-06-27 | 2009-12-03 | クリー インコーポレイテッド | 効率的な放射ledパッケージ及び光を効率的に放射する方法 |
RU2537091C2 (ru) * | 2009-10-29 | 2014-12-27 | Нития Корпорейшн | Светоизлучающее устройство и способ изготовления светоизлучающего устройства |
KR101134409B1 (ko) * | 2010-03-29 | 2012-04-09 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 |
JP2012009470A (ja) * | 2010-06-22 | 2012-01-12 | Nitto Denko Corp | 半導体発光装置 |
JP2012009469A (ja) * | 2010-06-22 | 2012-01-12 | Nitto Denko Corp | 複合シートおよびそれを用いた半導体発光装置 |
US9608178B2 (en) | 2010-06-22 | 2017-03-28 | Nitto Denko Corporation | Semiconductor light emitting device |
WO2012081141A1 (ja) * | 2010-12-15 | 2012-06-21 | パナソニック株式会社 | 半導体発光装置 |
JP4962635B1 (ja) * | 2011-03-15 | 2012-06-27 | オムロン株式会社 | 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法 |
WO2012124147A1 (ja) * | 2011-03-15 | 2012-09-20 | オムロン株式会社 | 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法 |
US9006750B2 (en) | 2011-03-15 | 2015-04-14 | Omron Corporation | Optical semiconductor package, optical semiconductor module, and manufacturing method of these |
JP2012244085A (ja) * | 2011-05-24 | 2012-12-10 | Panasonic Corp | 照明装置 |
JP2015535951A (ja) * | 2012-09-19 | 2015-12-17 | ヴェンティス テクノロジーズ エルエルシー | 光を散乱させる装置 |
WO2015016048A1 (ja) * | 2013-07-30 | 2015-02-05 | 堺ディスプレイプロダクト株式会社 | 光源装置、照明装置及び液晶表示装置 |
JP2019165122A (ja) * | 2018-03-20 | 2019-09-26 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
JP2021106184A (ja) * | 2019-12-26 | 2021-07-26 | 日亜化学工業株式会社 | 発光装置 |
JP7481610B2 (ja) | 2019-12-26 | 2024-05-13 | 日亜化学工業株式会社 | 発光装置 |
JP2021141174A (ja) * | 2020-03-04 | 2021-09-16 | ローム株式会社 | 半導体発光装置および半導体発光装置の製造方法 |
JP7413086B2 (ja) | 2020-03-04 | 2024-01-15 | ローム株式会社 | 半導体発光装置 |
JP2022024282A (ja) * | 2020-07-14 | 2022-02-09 | 日亜化学工業株式会社 | 発光装置及び照明装置 |
JP7525779B2 (ja) | 2020-07-14 | 2024-07-31 | 日亜化学工業株式会社 | 発光装置及び照明装置 |
CN116449608A (zh) * | 2023-04-28 | 2023-07-18 | 惠科股份有限公司 | 背光模组及显示装置 |
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