JP2006024654A5 - - Google Patents

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Publication number
JP2006024654A5
JP2006024654A5 JP2004199872A JP2004199872A JP2006024654A5 JP 2006024654 A5 JP2006024654 A5 JP 2006024654A5 JP 2004199872 A JP2004199872 A JP 2004199872A JP 2004199872 A JP2004199872 A JP 2004199872A JP 2006024654 A5 JP2006024654 A5 JP 2006024654A5
Authority
JP
Japan
Prior art keywords
conductive layer
interposer
potential
substrate
holding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004199872A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006024654A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004199872A priority Critical patent/JP2006024654A/ja
Priority claimed from JP2004199872A external-priority patent/JP2006024654A/ja
Priority to KR1020087003018A priority patent/KR100858075B1/ko
Priority to PCT/JP2005/012425 priority patent/WO2006004128A1/ja
Priority to US11/631,638 priority patent/US7866038B2/en
Priority to EP05765497A priority patent/EP1775761A4/en
Priority to TW094122866A priority patent/TW200616503A/zh
Publication of JP2006024654A publication Critical patent/JP2006024654A/ja
Publication of JP2006024654A5 publication Critical patent/JP2006024654A5/ja
Pending legal-status Critical Current

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JP2004199872A 2004-07-06 2004-07-06 インターポーザ Pending JP2006024654A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004199872A JP2006024654A (ja) 2004-07-06 2004-07-06 インターポーザ
KR1020087003018A KR100858075B1 (ko) 2004-07-06 2005-07-05 인터포저
PCT/JP2005/012425 WO2006004128A1 (ja) 2004-07-06 2005-07-05 貫通基板およびインターポーザ、ならびに貫通基板の製造方法
US11/631,638 US7866038B2 (en) 2004-07-06 2005-07-05 Through substrate, interposer and manufacturing method of through substrate
EP05765497A EP1775761A4 (en) 2004-07-06 2005-07-05 SUBSTRATE AND INTERMEDIATE AND METHOD FOR PRODUCING A SUBSTRATE
TW094122866A TW200616503A (en) 2004-07-06 2005-07-06 Through substrate and interposer, and method for manufacturing through substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004199872A JP2006024654A (ja) 2004-07-06 2004-07-06 インターポーザ

Publications (2)

Publication Number Publication Date
JP2006024654A JP2006024654A (ja) 2006-01-26
JP2006024654A5 true JP2006024654A5 (enExample) 2007-04-05

Family

ID=35797732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004199872A Pending JP2006024654A (ja) 2004-07-06 2004-07-06 インターポーザ

Country Status (1)

Country Link
JP (1) JP2006024654A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014011169A (ja) 2012-06-27 2014-01-20 Ps4 Luxco S A R L シリコンインターポーザ及びこれを備える半導体装置
JP6344072B2 (ja) 2014-06-10 2018-06-20 富士通株式会社 半導体部品用ソケット、プリント基板ユニット、及び情報処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163192A (ja) * 1997-11-25 1999-06-18 Hitachi Ltd セラミック多層同軸信号配線基板及びセラミック多層同軸信号配線基板の製造方法及び電子回路装置
JP2000151114A (ja) * 1998-11-11 2000-05-30 Sony Corp 多層基板及びその製造方法
JP2001332652A (ja) * 2000-05-24 2001-11-30 Nec Corp 半導体パッケージ及びその製造方法
JP4628520B2 (ja) * 2000-06-06 2011-02-09 富士通株式会社 電子装置実装基板の製造方法
US6498381B2 (en) * 2001-02-22 2002-12-24 Tru-Si Technologies, Inc. Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same

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