JP2006001895A - 有機金属化合物の精製方法及びこれにより得られた有機金属化合物 - Google Patents
有機金属化合物の精製方法及びこれにより得られた有機金属化合物 Download PDFInfo
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- JP2006001895A JP2006001895A JP2004180971A JP2004180971A JP2006001895A JP 2006001895 A JP2006001895 A JP 2006001895A JP 2004180971 A JP2004180971 A JP 2004180971A JP 2004180971 A JP2004180971 A JP 2004180971A JP 2006001895 A JP2006001895 A JP 2006001895A
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- Prior art keywords
- organometallic compound
- purifying
- impurities
- compound
- organometallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000002902 organometallic compounds Chemical class 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000012535 impurity Substances 0.000 claims abstract description 24
- 238000000746 purification Methods 0.000 claims abstract description 18
- 238000004821 distillation Methods 0.000 claims abstract description 16
- 239000011261 inert gas Substances 0.000 claims abstract description 11
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 19
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 239000000654 additive Substances 0.000 abstract description 4
- 230000000996 additive effect Effects 0.000 abstract description 3
- 239000012264 purified product Substances 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000001307 helium Substances 0.000 description 7
- 229910052734 helium Inorganic materials 0.000 description 7
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000002736 metal compounds Chemical class 0.000 description 4
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- BYLOHCRAPOSXLY-UHFFFAOYSA-N dichloro(diethyl)silane Chemical compound CC[Si](Cl)(Cl)CC BYLOHCRAPOSXLY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- -1 pentadienyl Chemical group 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- SONNOUIBKXBPIL-UHFFFAOYSA-N [O-2].[Al+3].[Al+3].[Al+3] Chemical class [O-2].[Al+3].[Al+3].[Al+3] SONNOUIBKXBPIL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PDNUHAXBKKDGAM-UHFFFAOYSA-N chloro-diethyl-methylsilane Chemical compound CC[Si](C)(Cl)CC PDNUHAXBKKDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- FJWRGPWPIXAPBJ-UHFFFAOYSA-N diethyl(dimethyl)silane Chemical compound CC[Si](C)(C)CC FJWRGPWPIXAPBJ-UHFFFAOYSA-N 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- PPWWEWQTQCZLMW-UHFFFAOYSA-N magnesium 5-methylcyclopenta-1,3-diene Chemical compound [Mg+2].C[C-]1C=CC=C1.C[C-]1C=CC=C1 PPWWEWQTQCZLMW-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- VCZQFJFZMMALHB-UHFFFAOYSA-N tetraethylsilane Chemical compound CC[Si](CC)(CC)CC VCZQFJFZMMALHB-UHFFFAOYSA-N 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- JCSVHJQZTMYYFL-UHFFFAOYSA-N triethyl(methyl)silane Chemical compound CC[Si](C)(CC)CC JCSVHJQZTMYYFL-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/061—Aluminium compounds with C-aluminium linkage
- C07F5/062—Al linked exclusively to C
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
Abstract
【効果】 本発明方法によれば、有機金属化合物中の蒸気圧の高い不純物を高効率及び容易に除去できるという工業的利益が発揮される。また、高純度化された精製物をエピタキシャル成長させると、高性能な半導体を製造することができる。
【選択図】 なし
Description
(1)有機金属化合物から有機金属化合物よりも蒸気圧の高い不純物を蒸留精製で除去する場合において、有機金属化合物の蒸気中に不活性ガスを流通させることを特徴とする有機金属化合物の精製方法。
(2)有機金属化合物が、トリメチルアルミニウムであることを特徴とする(1)記載の有機金属化合物の精製方法。
(3)有機金属化合物よりも蒸気圧の高い不純物が、有機珪素化合物であることを特徴とする(1)又は(2)記載の有機金属化合物の精製方法。
(4)(1)〜(3)のいずれか1項記載の有機金属化合物の精製方法により得られた有機珪素成分が1ppm以下であることを特徴とする有機金属化合物。
蒸留精製は、通常一回で十分であるが、必要に応じて数回繰り返されてもよい。
還流冷却器、40段の蒸留塔を備えた1,000mlのSUS容器を十分ヘリウム置換後、該容器にトリメチルアルミニウムを497g仕込んだ。次いで、高純度ヘリウムを100ml/分で導入しながら常圧下、127℃で蒸留精製して、主留を347g得た。これらの有機珪素成分濃度を測定した結果、精製前173ppm、精製後0.7ppmであった。
精製前の有機珪素成分濃度が24.5ppmであることと高純度ヘリウムの吹き込み量が50ml/分であることを除いて、実施例1と同様の方法で精製したトリメチルアルミニウム中の有機珪素成分濃度を測定した結果、0.2ppmであった。
精製前の有機珪素成分濃度が25.3ppmであることを除いて、実施例2と同様の方法で精製したトリメチルアルミニウム中の有機珪素成分濃度を測定した結果、0.08ppmであった。
高純度ヘリウムを吹き込まないことを除いて、実施例1と同様の方法で精製したトリメチルアルミニウム中の有機珪素成分濃度を測定した結果、9.4ppmであった。
高純度ヘリウムを吹き込まないことを除いて、実施例2と同様の方法で精製したトリメチルアルミニウム中の有機珪素成分濃度を測定した結果、0.7ppmであった。
高純度ヘリウムを吹き込まないことを除いて、実施例3と同様の方法で精製したトリメチルアルミニウム中の有機珪素成分濃度を測定した結果、0.4ppmであった。
Claims (4)
- 有機金属化合物から有機金属化合物よりも蒸気圧の高い不純物を蒸留精製で除去する場合において、有機金属化合物の蒸気中に不活性ガスを流通させることを特徴とする有機金属化合物の精製方法。
- 有機金属化合物が、トリメチルアルミニウムであることを特徴とする請求項1記載の有機金属化合物の精製方法。
- 有機金属化合物よりも蒸気圧の高い不純物が、有機珪素化合物であることを特徴とする請求項1又は2記載の有機金属化合物の精製方法。
- 請求項1〜3のいずれか1項記載の有機金属化合物の精製方法により得られた有機珪素成分が1ppm以下であることを特徴とする有機金属化合物。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004180971A JP4488186B2 (ja) | 2004-06-18 | 2004-06-18 | トリメチルアルミニウムの精製方法 |
CN2005101132865A CN1769289B (zh) | 2004-06-18 | 2005-06-17 | 有机金属化合物精制方法及由此制得的有机金属化合物 |
KR1020050052182A KR100861207B1 (ko) | 2004-06-18 | 2005-06-17 | 유기 금속 화합물의 정제 방법 및 그에 의해 얻어진 유기금속 화합물 |
TW094120282A TW200602349A (en) | 2004-06-18 | 2005-06-17 | Purification method for organometallic compounds and organometallic compounds obtained therefrom |
US11/154,534 US7112691B2 (en) | 2004-06-18 | 2005-06-17 | Purification method for organometallic compounds and organometallic compounds obtained therefrom |
DE602005021726T DE602005021726D1 (de) | 2004-06-18 | 2005-06-20 | Verfahren zur Reinigiung organometallischer Verbindungen |
EP05253799A EP1616872B1 (en) | 2004-06-18 | 2005-06-20 | Purification method for organometallic compounds |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004180971A JP4488186B2 (ja) | 2004-06-18 | 2004-06-18 | トリメチルアルミニウムの精製方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006001895A true JP2006001895A (ja) | 2006-01-05 |
JP4488186B2 JP4488186B2 (ja) | 2010-06-23 |
Family
ID=35241161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004180971A Expired - Lifetime JP4488186B2 (ja) | 2004-06-18 | 2004-06-18 | トリメチルアルミニウムの精製方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7112691B2 (ja) |
EP (1) | EP1616872B1 (ja) |
JP (1) | JP4488186B2 (ja) |
KR (1) | KR100861207B1 (ja) |
CN (1) | CN1769289B (ja) |
DE (1) | DE602005021726D1 (ja) |
TW (1) | TW200602349A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4470682B2 (ja) * | 2004-10-13 | 2010-06-02 | 住友化学株式会社 | トリメチルガリウムの製造方法 |
US7659414B2 (en) * | 2007-07-20 | 2010-02-09 | Rohm And Haas Company | Method of preparing organometallic compounds |
EP2545972A1 (en) | 2011-07-13 | 2013-01-16 | Dow Global Technologies LLC | Organometallic compound purification by two steps distillation |
EP2545973B1 (en) | 2011-07-13 | 2020-03-04 | Dow Global Technologies LLC | Organometallic compound purification by stripping step |
EP2559682B1 (en) | 2011-08-15 | 2016-08-03 | Rohm and Haas Electronic Materials LLC | Organometallic compound preparation |
EP2559681B1 (en) | 2011-08-15 | 2016-06-22 | Dow Global Technologies LLC | Organometallic compound preparation |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3477668D1 (en) | 1983-02-09 | 1989-05-18 | Sumitomo Chemical Co | Process for producing high purity metallic compound |
DE3567871D1 (en) | 1984-03-26 | 1989-03-02 | Secr Defence Brit | The preparation of metal alkyls |
JPS62132888A (ja) | 1985-12-03 | 1987-06-16 | Sumitomo Chem Co Ltd | 有機金属化合物の精製方法 |
JPS62185090A (ja) | 1986-02-10 | 1987-08-13 | Sumitomo Chem Co Ltd | アルキルガリウムの精製方法 |
US4847399A (en) * | 1987-01-23 | 1989-07-11 | Morton Thiokol, Inc. | Process for preparing or purifying Group III-A organometallic compounds |
JPH0535154A (ja) | 1991-07-29 | 1993-02-12 | Ricoh Co Ltd | 画像形成装置 |
JP3215195B2 (ja) * | 1992-11-09 | 2001-10-02 | 東ソー・ファインケム株式会社 | 有機金属化合物の精製法 |
JP3221237B2 (ja) | 1994-06-30 | 2001-10-22 | 住友化学工業株式会社 | 有機金属化合物の精製方法 |
ATE250616T1 (de) | 1999-05-21 | 2003-10-15 | Akzo Nobel Nv | Reinigung einer metallorganischen verbindung durch umkristallisieren |
GB0017968D0 (en) * | 2000-07-22 | 2000-09-13 | Epichem Ltd | An improved process and apparatus for the isolation of pure,or substantially pure,organometallic compounds |
CN1345726A (zh) * | 2000-09-30 | 2002-04-24 | 阿克佐诺贝尔公司 | 有机金属化合物的纯化 |
JP4150917B2 (ja) * | 2003-06-19 | 2008-09-17 | 信越化学工業株式会社 | トリメチルガリウムの精製方法 |
JP4054997B2 (ja) * | 2003-06-19 | 2008-03-05 | 信越化学工業株式会社 | 高純度アルキルガリウムの製造方法 |
-
2004
- 2004-06-18 JP JP2004180971A patent/JP4488186B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-17 US US11/154,534 patent/US7112691B2/en active Active
- 2005-06-17 TW TW094120282A patent/TW200602349A/zh not_active IP Right Cessation
- 2005-06-17 CN CN2005101132865A patent/CN1769289B/zh not_active Expired - Fee Related
- 2005-06-17 KR KR1020050052182A patent/KR100861207B1/ko not_active IP Right Cessation
- 2005-06-20 DE DE602005021726T patent/DE602005021726D1/de active Active
- 2005-06-20 EP EP05253799A patent/EP1616872B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP1616872A3 (en) | 2006-01-25 |
JP4488186B2 (ja) | 2010-06-23 |
TW200602349A (en) | 2006-01-16 |
KR100861207B1 (ko) | 2008-09-30 |
US7112691B2 (en) | 2006-09-26 |
CN1769289B (zh) | 2010-12-15 |
EP1616872A2 (en) | 2006-01-18 |
TWI333954B (ja) | 2010-12-01 |
US20050283015A1 (en) | 2005-12-22 |
EP1616872B1 (en) | 2010-06-09 |
DE602005021726D1 (de) | 2010-07-22 |
KR20060048414A (ko) | 2006-05-18 |
CN1769289A (zh) | 2006-05-10 |
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