JP2005538571A5 - - Google Patents
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- JP2005538571A5 JP2005538571A5 JP2004539871A JP2004539871A JP2005538571A5 JP 2005538571 A5 JP2005538571 A5 JP 2005538571A5 JP 2004539871 A JP2004539871 A JP 2004539871A JP 2004539871 A JP2004539871 A JP 2004539871A JP 2005538571 A5 JP2005538571 A5 JP 2005538571A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polishing pad
- polishing
- pad
- partially
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 126
- 239000000853 adhesive Substances 0.000 claims description 72
- 230000001070 adhesive Effects 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 50
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 238000011068 load Methods 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 9
- 239000006260 foam Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 239000004821 Contact adhesive Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920000098 polyolefin Polymers 0.000 claims description 5
- -1 polypropylene Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000002491 polymer binding agent Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 240000008528 Hevea brasiliensis Species 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920002725 Thermoplastic elastomer Polymers 0.000 claims description 3
- 229920001194 natural rubber Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920003051 synthetic elastomer Polymers 0.000 claims description 3
- 239000005061 synthetic rubber Substances 0.000 claims description 3
- ZNAMMSOYKPMPGC-HTOAHKCRSA-N (2R,3R,4S,5R,6S)-2-(hydroxymethyl)-6-(2-phenylethylsulfanyl)oxane-3,4,5-triol Chemical compound O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@H]1SCCC1=CC=CC=C1 ZNAMMSOYKPMPGC-HTOAHKCRSA-N 0.000 claims description 2
- LCJRHAPPMIUHLH-UHFFFAOYSA-N 1-$l^{1}-azanylhexan-1-one Chemical compound [CH]CCCCC([N])=O LCJRHAPPMIUHLH-UHFFFAOYSA-N 0.000 claims description 2
- 229920002301 Cellulose acetate Polymers 0.000 claims description 2
- 229920001634 Copolyester Polymers 0.000 claims description 2
- 229920002292 Nylon 6 Polymers 0.000 claims description 2
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 229920001225 Polyester resin Polymers 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001721 Polyimide Polymers 0.000 claims description 2
- 239000004699 Ultra-high molecular weight polyethylene (UHMWPE) Substances 0.000 claims description 2
- 229920001727 cellulose butyrate Polymers 0.000 claims description 2
- 229920003174 cellulose-based polymer Polymers 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- 229920001903 high density polyethylene Polymers 0.000 claims description 2
- 239000004700 high-density polyethylene Substances 0.000 claims description 2
- 229920001684 low density polyethylene Polymers 0.000 claims description 2
- 239000004702 low-density polyethylene Substances 0.000 claims description 2
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920002530 poly[4-(4-benzoylphenoxy)phenol] polymer Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 2
- 229920005596 polymer binder Polymers 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 229920003288 polysulfone Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims description 2
- 239000011800 void material Substances 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims 2
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 239000002002 slurry Substances 0.000 description 28
- 238000000034 method Methods 0.000 description 17
- 238000005259 measurement Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- 239000011148 porous material Substances 0.000 description 12
- 229920002635 polyurethane Polymers 0.000 description 11
- 239000004814 polyurethane Substances 0.000 description 11
- 238000005296 abrasive Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 238000007796 conventional method Methods 0.000 description 9
- 238000004377 microelectronic Methods 0.000 description 8
- 239000000835 fiber Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000011065 in-situ storage Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229920000126 Latex Polymers 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- OFJATJUUUCAKMK-UHFFFAOYSA-N Cerium(IV) oxide Chemical compound [O-2]=[Ce+4]=[O-2] OFJATJUUUCAKMK-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000010438 granite Substances 0.000 description 3
- 239000011528 polyamide (building material) Substances 0.000 description 3
- 239000011496 polyurethane foam Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N 1,4-Butanediol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- VHOQXEIFYTTXJU-UHFFFAOYSA-N 2-methylbuta-1,3-diene;2-methylprop-1-ene Chemical compound CC(C)=C.CC(=C)C=C VHOQXEIFYTTXJU-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- YACLQRRMGMJLJV-UHFFFAOYSA-N Chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920001228 Polyisocyanate Polymers 0.000 description 2
- 229920001451 Polypropylene glycol Polymers 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- VOLSCWDWGMWXGO-UHFFFAOYSA-N cyclobuten-1-yl acetate Chemical compound CC(=O)OC1=CCC1 VOLSCWDWGMWXGO-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002225 poly(styrene-co-butadiene) Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-HTRCEHHLSA-N 5-[(2S,3R)-3-hydroxybutan-2-yl]-4-methylbenzene-1,3-diol Chemical compound C[C@@H](O)[C@@H](C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-HTRCEHHLSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229920000180 Alkyd Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 240000000218 Cannabis sativa Species 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N Hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- LMNZTLDVJIUSHT-UHFFFAOYSA-N Phosmet Chemical compound C1=CC=C2C(=O)N(CSP(=S)(OC)OC)C(=O)C2=C1 LMNZTLDVJIUSHT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene (PE) Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N Polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N Toluene diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N [N-]=C=O Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000004059 degradation Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000003628 erosive Effects 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000008079 hexane Substances 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002459 porosimetry Methods 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- 230000003252 repetitive Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41336702P | 2002-09-25 | 2002-09-25 | |
| PCT/US2003/030139 WO2004028744A1 (en) | 2002-09-25 | 2003-09-18 | Polishing pad with window for planarization |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008099836A Division JP2008229843A (ja) | 2002-09-25 | 2008-04-07 | 平坦化するための窓を有する研磨パッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005538571A JP2005538571A (ja) | 2005-12-15 |
| JP2005538571A5 true JP2005538571A5 (zh) | 2008-05-29 |
Family
ID=32043244
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004539871A Pending JP2005538571A (ja) | 2002-09-25 | 2003-09-18 | 平坦化するための窓を有する研磨パッド |
| JP2008099836A Withdrawn JP2008229843A (ja) | 2002-09-25 | 2008-04-07 | 平坦化するための窓を有する研磨パッド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008099836A Withdrawn JP2008229843A (ja) | 2002-09-25 | 2008-04-07 | 平坦化するための窓を有する研磨パッド |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040102141A1 (zh) |
| EP (1) | EP1542832A1 (zh) |
| JP (2) | JP2005538571A (zh) |
| KR (1) | KR20050052513A (zh) |
| CN (1) | CN100417493C (zh) |
| AU (1) | AU2003275237A1 (zh) |
| TW (1) | TWI287836B (zh) |
| WO (1) | WO2004028744A1 (zh) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070010169A1 (en) * | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
| US6676483B1 (en) * | 2003-02-03 | 2004-01-13 | Rodel Holdings, Inc. | Anti-scattering layer for polishing pad windows |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| US6984163B2 (en) * | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
| US20060019417A1 (en) * | 2004-07-26 | 2006-01-26 | Atsushi Shigeta | Substrate processing method and substrate processing apparatus |
| US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| CN101966697B (zh) | 2006-04-19 | 2015-04-22 | 东洋橡胶工业株式会社 | 抛光垫的制造方法 |
| JP4943233B2 (ja) * | 2007-05-31 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| US7635290B2 (en) * | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
| TWI411495B (zh) * | 2007-08-16 | 2013-10-11 | Cabot Microelectronics Corp | 拋光墊 |
| WO2009070352A1 (en) * | 2007-11-30 | 2009-06-04 | Innopad, Inc. | Chemical-mechanical planarization pad having end point detection window |
| JP5233621B2 (ja) * | 2008-12-02 | 2013-07-10 | 旭硝子株式会社 | 磁気ディスク用ガラス基板及びその製造方法。 |
| SG181890A1 (en) * | 2009-12-22 | 2012-07-30 | 3M Innovative Properties Co | Polishing pad and method of making the same |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| US8758659B2 (en) | 2010-09-29 | 2014-06-24 | Fns Tech Co., Ltd. | Method of grooving a chemical-mechanical planarization pad |
| JP5858576B2 (ja) * | 2011-04-21 | 2016-02-10 | 東洋ゴム工業株式会社 | 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層 |
| JP5893479B2 (ja) * | 2011-04-21 | 2016-03-23 | 東洋ゴム工業株式会社 | 積層研磨パッド |
| JP2014094424A (ja) * | 2012-11-08 | 2014-05-22 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
| CN111069994B (zh) * | 2019-12-11 | 2021-11-16 | 江苏月生达机械制造有限公司 | 一种桥梁加固钢板精确加工设备 |
| JP7105334B2 (ja) * | 2020-03-17 | 2022-07-22 | エスケーシー ソルミックス カンパニー，リミテッド | 研磨パッドおよびこれを用いた半導体素子の製造方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3572232A (en) * | 1968-04-01 | 1971-03-23 | Itek Corp | Photographic film processing material |
| US5257478A (en) * | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
| US6120860A (en) * | 1990-08-23 | 2000-09-19 | American National Can Company | Multilayer film structure and packages therefrom for organics |
| US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| US6017265A (en) * | 1995-06-07 | 2000-01-25 | Rodel, Inc. | Methods for using polishing pads |
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US6183872B1 (en) * | 1995-08-11 | 2001-02-06 | Daikin Industries, Ltd. | Silicon-containing organic fluoropolymers and use of the same |
| JPH10156705A (ja) * | 1996-11-29 | 1998-06-16 | Sumitomo Metal Ind Ltd | 研磨装置および研磨方法 |
| US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
| TW377467B (en) * | 1997-04-22 | 1999-12-21 | Sony Corp | Polishing system, polishing method, polishing pad, and method of forming polishing pad |
| JPH11277408A (ja) * | 1998-01-29 | 1999-10-12 | Shin Etsu Handotai Co Ltd | 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置 |
| US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
| US6585574B1 (en) * | 1998-06-02 | 2003-07-01 | Brian Lombardo | Polishing pad with reduced moisture absorption |
| US6159073A (en) * | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| US6261168B1 (en) * | 1999-05-21 | 2001-07-17 | Lam Research Corporation | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| US6439968B1 (en) * | 1999-06-30 | 2002-08-27 | Agere Systems Guardian Corp. | Polishing pad having a water-repellant film theron and a method of manufacture therefor |
| ATE339154T1 (de) * | 1999-09-21 | 2006-10-15 | Honeywell Hommed Llc | System zur häuslichen patientenüberwachung |
| US6402591B1 (en) * | 2000-03-31 | 2002-06-11 | Lam Research Corporation | Planarization system for chemical-mechanical polishing |
| US6561891B2 (en) * | 2000-05-23 | 2003-05-13 | Rodel Holdings, Inc. | Eliminating air pockets under a polished pad |
| US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US20030094593A1 (en) * | 2001-06-14 | 2003-05-22 | Hellring Stuart D. | Silica and a silica-based slurry |
| JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
| US6722249B2 (en) * | 2001-11-06 | 2004-04-20 | Rodel Holdings, Inc | Method of fabricating a polishing pad having an optical window |
| US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
| CN1684799A (zh) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | 平面化用的抛光垫片 |
-
2003
- 2003-09-18 CN CNB038229560A patent/CN100417493C/zh not_active Expired - Fee Related
- 2003-09-18 AU AU2003275237A patent/AU2003275237A1/en not_active Abandoned
- 2003-09-18 JP JP2004539871A patent/JP2005538571A/ja active Pending
- 2003-09-18 EP EP03759509A patent/EP1542832A1/en not_active Withdrawn
- 2003-09-18 KR KR1020057005045A patent/KR20050052513A/ko active IP Right Grant
- 2003-09-18 WO PCT/US2003/030139 patent/WO2004028744A1/en active Application Filing
- 2003-09-22 US US10/664,951 patent/US20040102141A1/en not_active Abandoned
- 2003-12-26 TW TW092137095A patent/TWI287836B/zh active
-
2008
- 2008-04-07 JP JP2008099836A patent/JP2008229843A/ja not_active Withdrawn
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