JP2005538571A - 平坦化するための窓を有する研磨パッド - Google Patents
平坦化するための窓を有する研磨パッド Download PDFInfo
- Publication number
- JP2005538571A JP2005538571A JP2004539871A JP2004539871A JP2005538571A JP 2005538571 A JP2005538571 A JP 2005538571A JP 2004539871 A JP2004539871 A JP 2004539871A JP 2004539871 A JP2004539871 A JP 2004539871A JP 2005538571 A JP2005538571 A JP 2005538571A
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- JP
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- Prior art keywords
- layer
- polishing pad
- partially
- opening
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011573 trace mineral Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41336702P | 2002-09-25 | 2002-09-25 | |
| PCT/US2003/030139 WO2004028744A1 (en) | 2002-09-25 | 2003-09-18 | Polishing pad with window for planarization |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008099836A Division JP2008229843A (ja) | 2002-09-25 | 2008-04-07 | 平坦化するための窓を有する研磨パッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005538571A true JP2005538571A (ja) | 2005-12-15 |
| JP2005538571A5 JP2005538571A5 (enExample) | 2008-05-29 |
Family
ID=32043244
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004539871A Pending JP2005538571A (ja) | 2002-09-25 | 2003-09-18 | 平坦化するための窓を有する研磨パッド |
| JP2008099836A Withdrawn JP2008229843A (ja) | 2002-09-25 | 2008-04-07 | 平坦化するための窓を有する研磨パッド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008099836A Withdrawn JP2008229843A (ja) | 2002-09-25 | 2008-04-07 | 平坦化するための窓を有する研磨パッド |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040102141A1 (enExample) |
| EP (1) | EP1542832A1 (enExample) |
| JP (2) | JP2005538571A (enExample) |
| KR (1) | KR20050052513A (enExample) |
| CN (1) | CN100417493C (enExample) |
| AU (1) | AU2003275237A1 (enExample) |
| TW (1) | TWI287836B (enExample) |
| WO (1) | WO2004028744A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004241775A (ja) * | 2003-02-03 | 2004-08-26 | Rodel Holdings Inc | 研磨パッド窓のための散乱防止層 |
| WO2012144388A1 (ja) * | 2011-04-21 | 2012-10-26 | 東洋ゴム工業株式会社 | 積層研磨パッド |
| WO2012144458A1 (ja) * | 2011-04-21 | 2012-10-26 | 東洋ゴム工業株式会社 | 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層 |
| JP2013515379A (ja) * | 2009-12-22 | 2013-05-02 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨パッド及びこれの製造方法 |
| WO2014073344A1 (ja) * | 2012-11-08 | 2014-05-15 | 東洋ゴム工業株式会社 | 積層研磨パッド |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070010169A1 (en) * | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
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| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| US8758659B2 (en) | 2010-09-29 | 2014-06-24 | Fns Tech Co., Ltd. | Method of grooving a chemical-mechanical planarization pad |
| CN111069994B (zh) * | 2019-12-11 | 2021-11-16 | 江苏月生达机械制造有限公司 | 一种桥梁加固钢板精确加工设备 |
| JP7105334B2 (ja) * | 2020-03-17 | 2022-07-22 | エスケーシー ソルミックス カンパニー，リミテッド | 研磨パッドおよびこれを用いた半導体素子の製造方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3572232A (en) * | 1968-04-01 | 1971-03-23 | Itek Corp | Photographic film processing material |
| US5257478A (en) * | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
| US6120860A (en) * | 1990-08-23 | 2000-09-19 | American National Can Company | Multilayer film structure and packages therefrom for organics |
| US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| US6017265A (en) * | 1995-06-07 | 2000-01-25 | Rodel, Inc. | Methods for using polishing pads |
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| DE69624923T2 (de) * | 1995-08-11 | 2003-08-21 | Daikin Industries, Ltd. | Silizium enthaltende organische fluorpolymere und ihre verwendung |
| JPH10156705A (ja) * | 1996-11-29 | 1998-06-16 | Sumitomo Metal Ind Ltd | 研磨装置および研磨方法 |
| US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
| TW377467B (en) * | 1997-04-22 | 1999-12-21 | Sony Corp | Polishing system, polishing method, polishing pad, and method of forming polishing pad |
| JPH11277408A (ja) * | 1998-01-29 | 1999-10-12 | Shin Etsu Handotai Co Ltd | 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置 |
| US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
| US6585574B1 (en) * | 1998-06-02 | 2003-07-01 | Brian Lombardo | Polishing pad with reduced moisture absorption |
| US6159073A (en) * | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| US6261168B1 (en) * | 1999-05-21 | 2001-07-17 | Lam Research Corporation | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| US6439968B1 (en) * | 1999-06-30 | 2002-08-27 | Agere Systems Guardian Corp. | Polishing pad having a water-repellant film theron and a method of manufacture therefor |
| WO2001021065A1 (en) * | 1999-09-21 | 2001-03-29 | Hommed, Llc | In-home patient monitoring system |
| US6402591B1 (en) * | 2000-03-31 | 2002-06-11 | Lam Research Corporation | Planarization system for chemical-mechanical polishing |
| US6561891B2 (en) * | 2000-05-23 | 2003-05-13 | Rodel Holdings, Inc. | Eliminating air pockets under a polished pad |
| US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US20030094593A1 (en) * | 2001-06-14 | 2003-05-22 | Hellring Stuart D. | Silica and a silica-based slurry |
| JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
| US6722249B2 (en) * | 2001-11-06 | 2004-04-20 | Rodel Holdings, Inc | Method of fabricating a polishing pad having an optical window |
| US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
| CN1684799A (zh) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | 平面化用的抛光垫片 |
-
2003
- 2003-09-18 JP JP2004539871A patent/JP2005538571A/ja active Pending
- 2003-09-18 CN CNB038229560A patent/CN100417493C/zh not_active Expired - Fee Related
- 2003-09-18 KR KR1020057005045A patent/KR20050052513A/ko not_active Abandoned
- 2003-09-18 AU AU2003275237A patent/AU2003275237A1/en not_active Abandoned
- 2003-09-18 WO PCT/US2003/030139 patent/WO2004028744A1/en not_active Ceased
- 2003-09-18 EP EP03759509A patent/EP1542832A1/en not_active Withdrawn
- 2003-09-22 US US10/664,951 patent/US20040102141A1/en not_active Abandoned
- 2003-12-26 TW TW092137095A patent/TWI287836B/zh active
-
2008
- 2008-04-07 JP JP2008099836A patent/JP2008229843A/ja not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004241775A (ja) * | 2003-02-03 | 2004-08-26 | Rodel Holdings Inc | 研磨パッド窓のための散乱防止層 |
| JP2013515379A (ja) * | 2009-12-22 | 2013-05-02 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨パッド及びこれの製造方法 |
| WO2012144388A1 (ja) * | 2011-04-21 | 2012-10-26 | 東洋ゴム工業株式会社 | 積層研磨パッド |
| WO2012144458A1 (ja) * | 2011-04-21 | 2012-10-26 | 東洋ゴム工業株式会社 | 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層 |
| JP2012232404A (ja) * | 2011-04-21 | 2012-11-29 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層 |
| JP2013066993A (ja) * | 2011-04-21 | 2013-04-18 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
| CN103492124A (zh) * | 2011-04-21 | 2014-01-01 | 东洋橡胶工业株式会社 | 层叠研磨垫用热熔粘接剂片、及带有层叠研磨垫用粘接剂层的支持层 |
| CN103492124B (zh) * | 2011-04-21 | 2016-05-18 | 东洋橡胶工业株式会社 | 层叠研磨垫用热熔粘接剂片、及带有层叠研磨垫用粘接剂层的支持层 |
| WO2014073344A1 (ja) * | 2012-11-08 | 2014-05-15 | 東洋ゴム工業株式会社 | 積層研磨パッド |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI287836B (en) | 2007-10-01 |
| WO2004028744A1 (en) | 2004-04-08 |
| US20040102141A1 (en) | 2004-05-27 |
| AU2003275237A1 (en) | 2004-04-19 |
| TW200522185A (en) | 2005-07-01 |
| KR20050052513A (ko) | 2005-06-02 |
| EP1542832A1 (en) | 2005-06-22 |
| CN100417493C (zh) | 2008-09-10 |
| JP2008229843A (ja) | 2008-10-02 |
| CN1684798A (zh) | 2005-10-19 |
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