CN100417493C - 平面化用的具有窗口的抛光垫片及制备方法 - Google Patents

平面化用的具有窗口的抛光垫片及制备方法 Download PDF

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Publication number
CN100417493C
CN100417493C CNB038229560A CN03822956A CN100417493C CN 100417493 C CN100417493 C CN 100417493C CN B038229560 A CNB038229560 A CN B038229560A CN 03822956 A CN03822956 A CN 03822956A CN 100417493 C CN100417493 C CN 100417493C
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CN
China
Prior art keywords
layer
polishing pad
polishing
inches
partially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038229560A
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English (en)
Chinese (zh)
Other versions
CN1684798A (zh
Inventor
R·斯舍尔
W·C·阿利森
A·E·王
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PPG Industries Inc
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PPG Industries Inc
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Filing date
Publication date
Application filed by PPG Industries Inc filed Critical PPG Industries Inc
Publication of CN1684798A publication Critical patent/CN1684798A/zh
Application granted granted Critical
Publication of CN100417493C publication Critical patent/CN100417493C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laminated Bodies (AREA)
CNB038229560A 2002-09-25 2003-09-18 平面化用的具有窗口的抛光垫片及制备方法 Expired - Fee Related CN100417493C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41336702P 2002-09-25 2002-09-25
US60/413,367 2002-09-25

Publications (2)

Publication Number Publication Date
CN1684798A CN1684798A (zh) 2005-10-19
CN100417493C true CN100417493C (zh) 2008-09-10

Family

ID=32043244

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038229560A Expired - Fee Related CN100417493C (zh) 2002-09-25 2003-09-18 平面化用的具有窗口的抛光垫片及制备方法

Country Status (8)

Country Link
US (1) US20040102141A1 (enExample)
EP (1) EP1542832A1 (enExample)
JP (2) JP2005538571A (enExample)
KR (1) KR20050052513A (enExample)
CN (1) CN100417493C (enExample)
AU (1) AU2003275237A1 (enExample)
TW (1) TWI287836B (enExample)
WO (1) WO2004028744A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US6676483B1 (en) * 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TW200800489A (en) 2006-04-19 2008-01-01 Toyo Tire & Amp Rubber Co Ltd Method for manufacturing polishing pad
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
WO2009070352A1 (en) * 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
JP5233621B2 (ja) * 2008-12-02 2013-07-10 旭硝子株式会社 磁気ディスク用ガラス基板及びその製造方法。
KR101855073B1 (ko) * 2009-12-22 2018-05-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 연마 패드 및 그의 제조 방법
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP2014094424A (ja) * 2012-11-08 2014-05-22 Toyo Tire & Rubber Co Ltd 積層研磨パッド
CN111069994B (zh) * 2019-12-11 2021-11-16 江苏月生达机械制造有限公司 一种桥梁加固钢板精确加工设备
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0845328A2 (en) * 1996-11-29 1998-06-03 Sumitomo Metal Industries, Ltd. Polishing pad and apparatus for polishing a semiconductor wafer
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US20010044261A1 (en) * 1999-04-26 2001-11-22 Elledge Jason B. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3572232A (en) * 1968-04-01 1971-03-23 Itek Corp Photographic film processing material
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US6120860A (en) * 1990-08-23 2000-09-19 American National Can Company Multilayer film structure and packages therefrom for organics
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
WO1997007155A1 (fr) * 1995-08-11 1997-02-27 Daikin Industries, Ltd. Fluoropolymeres organiques au silicium et leur emploi
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
TW377467B (en) * 1997-04-22 1999-12-21 Sony Corp Polishing system, polishing method, polishing pad, and method of forming polishing pad
JPH11277408A (ja) * 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6585574B1 (en) * 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6439968B1 (en) * 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
EP1726257B1 (en) * 1999-09-21 2017-12-06 Honeywell HomMed LLC In-home patient monitoring system
US6561891B2 (en) * 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US20030094593A1 (en) * 2001-06-14 2003-05-22 Hellring Stuart D. Silica and a silica-based slurry
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US6722249B2 (en) * 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
AU2003272674A1 (en) * 2002-09-25 2004-04-19 Ppg Industries Ohio, Inc. Polishing pad for planarization

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
EP0845328A2 (en) * 1996-11-29 1998-06-03 Sumitomo Metal Industries, Ltd. Polishing pad and apparatus for polishing a semiconductor wafer
US20010044261A1 (en) * 1999-04-26 2001-11-22 Elledge Jason B. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing

Also Published As

Publication number Publication date
KR20050052513A (ko) 2005-06-02
TW200522185A (en) 2005-07-01
JP2008229843A (ja) 2008-10-02
TWI287836B (en) 2007-10-01
CN1684798A (zh) 2005-10-19
EP1542832A1 (en) 2005-06-22
JP2005538571A (ja) 2005-12-15
US20040102141A1 (en) 2004-05-27
WO2004028744A1 (en) 2004-04-08
AU2003275237A1 (en) 2004-04-19

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Granted publication date: 20080910

Termination date: 20091019