JP2005532902A5 - - Google Patents

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Publication number
JP2005532902A5
JP2005532902A5 JP2004521884A JP2004521884A JP2005532902A5 JP 2005532902 A5 JP2005532902 A5 JP 2005532902A5 JP 2004521884 A JP2004521884 A JP 2004521884A JP 2004521884 A JP2004521884 A JP 2004521884A JP 2005532902 A5 JP2005532902 A5 JP 2005532902A5
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JP
Japan
Prior art keywords
container
outlet port
disposed
inlet
primary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2004521884A
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English (en)
Japanese (ja)
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JP2005532902A (ja
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Publication date
Priority claimed from US10/295,302 external-priority patent/US7252714B2/en
Application filed filed Critical
Publication of JP2005532902A publication Critical patent/JP2005532902A/ja
Publication of JP2005532902A5 publication Critical patent/JP2005532902A5/ja
Pending legal-status Critical Current

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JP2004521884A 2002-07-16 2003-07-15 超小型電子品加工片を熱的に制御して処理する装置及び方法 Pending JP2005532902A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39647802P 2002-07-16 2002-07-16
US10/295,302 US7252714B2 (en) 2002-07-16 2002-11-15 Apparatus and method for thermally controlled processing of microelectronic workpieces
PCT/US2003/022174 WO2004007090A1 (en) 2002-07-16 2003-07-15 Apparatus and method for thermally controlled processing of microelectronic workpieces

Publications (2)

Publication Number Publication Date
JP2005532902A JP2005532902A (ja) 2005-11-04
JP2005532902A5 true JP2005532902A5 (enExample) 2006-08-31

Family

ID=30117976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521884A Pending JP2005532902A (ja) 2002-07-16 2003-07-15 超小型電子品加工片を熱的に制御して処理する装置及び方法

Country Status (6)

Country Link
US (2) US7252714B2 (enExample)
EP (1) EP1539371A4 (enExample)
JP (1) JP2005532902A (enExample)
AU (1) AU2003249286A1 (enExample)
TW (1) TWI307943B (enExample)
WO (1) WO2004007090A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
US7531060B2 (en) * 2004-07-09 2009-05-12 Semitool, Inc. Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces
US20060045666A1 (en) * 2004-07-09 2006-03-02 Harris Randy A Modular tool unit for processing of microfeature workpieces
US20060281310A1 (en) * 2005-06-08 2006-12-14 Applied Materials, Inc. Rotating substrate support and methods of use
JP2010034283A (ja) * 2008-07-29 2010-02-12 Hitachi Kokusai Electric Inc 基板処理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658839A (en) * 1951-04-21 1953-11-10 Gen Am Transport Process of chemical nickel plating
US2791516A (en) * 1953-09-17 1957-05-07 Gen Motors Corp Electroless plating
GB1052647A (enExample) * 1964-03-23
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
US4448684A (en) * 1983-01-28 1984-05-15 The Perkin-Elmer Corporation Solvent pressurization system
JPH0669019B2 (ja) * 1984-03-12 1994-08-31 株式会社ニコン 半導体製造装置
US4594273A (en) * 1984-11-19 1986-06-10 International Business Machines Corporation High-rate electroless deposition process
US4616596A (en) * 1985-10-21 1986-10-14 Hughes Aircraft Company Electroless plating apparatus
JPH0622201B2 (ja) * 1986-05-19 1994-03-23 黒谷 巌 半導体材料の現像処理装置
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
EP0703604B1 (en) * 1994-09-20 2001-12-05 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Apparatus for the controlled cooling of chemical tanks
JP2655098B2 (ja) * 1994-10-18 1997-09-17 日本電気株式会社 薬液を用いたウエハ表面処理装置
US6042712A (en) * 1995-05-26 2000-03-28 Formfactor, Inc. Apparatus for controlling plating over a face of a substrate
US5938845A (en) * 1995-10-20 1999-08-17 Aiwa Co., Ltd. Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps
US5830805A (en) * 1996-11-18 1998-11-03 Cornell Research Foundation Electroless deposition equipment or apparatus and method of performing electroless deposition
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6555298B1 (en) * 2000-08-22 2003-04-29 Micron Technology, Inc. Method and apparatus for uniformly baking substrates such as photomasks
WO2002034962A1 (fr) * 2000-10-26 2002-05-02 Ebara Corporation Dispositif et procede pour depot autocatalytique
US6551412B1 (en) * 2001-07-16 2003-04-22 Taiwan Semiconductor Manufacturing Company Non-tubular type recycle system of wet bench tank

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