TWI307943B - Apparatus and method for thermally controlled processing of microelectronic workpieces - Google Patents
Apparatus and method for thermally controlled processing of microelectronic workpieces Download PDFInfo
- Publication number
- TWI307943B TWI307943B TW92119372A TW92119372A TWI307943B TW I307943 B TWI307943 B TW I307943B TW 92119372 A TW92119372 A TW 92119372A TW 92119372 A TW92119372 A TW 92119372A TW I307943 B TWI307943 B TW I307943B
- Authority
- TW
- Taiwan
- Prior art keywords
- container
- microelectronic workpiece
- process liquid
- workpiece
- heat
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 455
- 238000004377 microelectronic Methods 0.000 title claims description 217
- 238000012545 processing Methods 0.000 title claims description 24
- 230000008569 process Effects 0.000 claims description 405
- 239000007788 liquid Substances 0.000 claims description 173
- 238000012546 transfer Methods 0.000 claims description 135
- 239000012530 fluid Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 28
- 238000007772 electroless plating Methods 0.000 claims description 26
- 238000009826 distribution Methods 0.000 claims description 11
- 239000013529 heat transfer fluid Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000007791 liquid phase Substances 0.000 claims description 5
- 239000012071 phase Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- 230000003993 interaction Effects 0.000 claims description 3
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- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- 229910052797 bismuth Inorganic materials 0.000 description 2
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- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
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- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Chemically Coating (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39647802P | 2002-07-16 | 2002-07-16 | |
| US10/295,302 US7252714B2 (en) | 2002-07-16 | 2002-11-15 | Apparatus and method for thermally controlled processing of microelectronic workpieces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200402130A TW200402130A (en) | 2004-02-01 |
| TWI307943B true TWI307943B (en) | 2009-03-21 |
Family
ID=30117976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92119372A TWI307943B (en) | 2002-07-16 | 2003-07-16 | Apparatus and method for thermally controlled processing of microelectronic workpieces |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7252714B2 (enExample) |
| EP (1) | EP1539371A4 (enExample) |
| JP (1) | JP2005532902A (enExample) |
| AU (1) | AU2003249286A1 (enExample) |
| TW (1) | TWI307943B (enExample) |
| WO (1) | WO2004007090A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060043750A1 (en) * | 2004-07-09 | 2006-03-02 | Paul Wirth | End-effectors for handling microfeature workpieces |
| US20070020080A1 (en) * | 2004-07-09 | 2007-01-25 | Paul Wirth | Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine |
| US7531060B2 (en) * | 2004-07-09 | 2009-05-12 | Semitool, Inc. | Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces |
| US20060045666A1 (en) * | 2004-07-09 | 2006-03-02 | Harris Randy A | Modular tool unit for processing of microfeature workpieces |
| US20060281310A1 (en) * | 2005-06-08 | 2006-12-14 | Applied Materials, Inc. | Rotating substrate support and methods of use |
| JP2010034283A (ja) * | 2008-07-29 | 2010-02-12 | Hitachi Kokusai Electric Inc | 基板処理装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2658839A (en) * | 1951-04-21 | 1953-11-10 | Gen Am Transport | Process of chemical nickel plating |
| US2791516A (en) * | 1953-09-17 | 1957-05-07 | Gen Motors Corp | Electroless plating |
| GB1052647A (enExample) * | 1964-03-23 | |||
| US3876434A (en) * | 1972-12-07 | 1975-04-08 | Shipley Co | Replenishment of electroless nickel solutions |
| US4183799A (en) * | 1978-08-31 | 1980-01-15 | Production Machinery Corporation | Apparatus for plating a layer onto a metal strip |
| US4448684A (en) * | 1983-01-28 | 1984-05-15 | The Perkin-Elmer Corporation | Solvent pressurization system |
| JPH0669019B2 (ja) * | 1984-03-12 | 1994-08-31 | 株式会社ニコン | 半導体製造装置 |
| US4594273A (en) * | 1984-11-19 | 1986-06-10 | International Business Machines Corporation | High-rate electroless deposition process |
| US4616596A (en) * | 1985-10-21 | 1986-10-14 | Hughes Aircraft Company | Electroless plating apparatus |
| JPH0622201B2 (ja) * | 1986-05-19 | 1994-03-23 | 黒谷 巌 | 半導体材料の現像処理装置 |
| US5235995A (en) * | 1989-03-27 | 1993-08-17 | Semitool, Inc. | Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization |
| EP0703604B1 (en) * | 1994-09-20 | 2001-12-05 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Apparatus for the controlled cooling of chemical tanks |
| JP2655098B2 (ja) * | 1994-10-18 | 1997-09-17 | 日本電気株式会社 | 薬液を用いたウエハ表面処理装置 |
| US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
| US5938845A (en) * | 1995-10-20 | 1999-08-17 | Aiwa Co., Ltd. | Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps |
| US5830805A (en) * | 1996-11-18 | 1998-11-03 | Cornell Research Foundation | Electroless deposition equipment or apparatus and method of performing electroless deposition |
| TW405158B (en) * | 1997-09-17 | 2000-09-11 | Ebara Corp | Plating apparatus for semiconductor wafer processing |
| US6555298B1 (en) * | 2000-08-22 | 2003-04-29 | Micron Technology, Inc. | Method and apparatus for uniformly baking substrates such as photomasks |
| WO2002034962A1 (fr) * | 2000-10-26 | 2002-05-02 | Ebara Corporation | Dispositif et procede pour depot autocatalytique |
| US6551412B1 (en) * | 2001-07-16 | 2003-04-22 | Taiwan Semiconductor Manufacturing Company | Non-tubular type recycle system of wet bench tank |
-
2002
- 2002-11-15 US US10/295,302 patent/US7252714B2/en not_active Expired - Fee Related
-
2003
- 2003-07-15 AU AU2003249286A patent/AU2003249286A1/en not_active Abandoned
- 2003-07-15 WO PCT/US2003/022174 patent/WO2004007090A1/en not_active Ceased
- 2003-07-15 EP EP03764715A patent/EP1539371A4/en not_active Withdrawn
- 2003-07-15 JP JP2004521884A patent/JP2005532902A/ja active Pending
- 2003-07-16 TW TW92119372A patent/TWI307943B/zh not_active IP Right Cessation
-
2007
- 2007-07-12 US US11/776,952 patent/US20080011450A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1539371A4 (en) | 2010-11-17 |
| TW200402130A (en) | 2004-02-01 |
| AU2003249286A1 (en) | 2004-02-02 |
| US20040013808A1 (en) | 2004-01-22 |
| US7252714B2 (en) | 2007-08-07 |
| US20080011450A1 (en) | 2008-01-17 |
| EP1539371A1 (en) | 2005-06-15 |
| WO2004007090A1 (en) | 2004-01-22 |
| JP2005532902A (ja) | 2005-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |