AU2003249286A1 - Apparatus and method for thermally controlled processing of microelectronic workpieces - Google Patents

Apparatus and method for thermally controlled processing of microelectronic workpieces

Info

Publication number
AU2003249286A1
AU2003249286A1 AU2003249286A AU2003249286A AU2003249286A1 AU 2003249286 A1 AU2003249286 A1 AU 2003249286A1 AU 2003249286 A AU2003249286 A AU 2003249286A AU 2003249286 A AU2003249286 A AU 2003249286A AU 2003249286 A1 AU2003249286 A1 AU 2003249286A1
Authority
AU
Australia
Prior art keywords
controlled processing
thermally controlled
microelectronic workpieces
microelectronic
workpieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003249286A
Other languages
English (en)
Inventor
Rajesh Baskaran
Robert Jr. W. Batz
Kyle M. Hanson
Zhongmin Hu
Paul R. Mchugh
Gregory J. Wilson
Nolan Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of AU2003249286A1 publication Critical patent/AU2003249286A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemically Coating (AREA)
  • Coating Apparatus (AREA)
AU2003249286A 2002-07-16 2003-07-15 Apparatus and method for thermally controlled processing of microelectronic workpieces Abandoned AU2003249286A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US39647802P 2002-07-16 2002-07-16
US60/396,478 2002-07-16
US10/295,302 US7252714B2 (en) 2002-07-16 2002-11-15 Apparatus and method for thermally controlled processing of microelectronic workpieces
US10/295,302 2002-11-15
PCT/US2003/022174 WO2004007090A1 (en) 2002-07-16 2003-07-15 Apparatus and method for thermally controlled processing of microelectronic workpieces

Publications (1)

Publication Number Publication Date
AU2003249286A1 true AU2003249286A1 (en) 2004-02-02

Family

ID=30117976

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003249286A Abandoned AU2003249286A1 (en) 2002-07-16 2003-07-15 Apparatus and method for thermally controlled processing of microelectronic workpieces

Country Status (6)

Country Link
US (2) US7252714B2 (enExample)
EP (1) EP1539371A4 (enExample)
JP (1) JP2005532902A (enExample)
AU (1) AU2003249286A1 (enExample)
TW (1) TWI307943B (enExample)
WO (1) WO2004007090A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
US7531060B2 (en) * 2004-07-09 2009-05-12 Semitool, Inc. Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces
US20060045666A1 (en) * 2004-07-09 2006-03-02 Harris Randy A Modular tool unit for processing of microfeature workpieces
US20060281310A1 (en) * 2005-06-08 2006-12-14 Applied Materials, Inc. Rotating substrate support and methods of use
JP2010034283A (ja) * 2008-07-29 2010-02-12 Hitachi Kokusai Electric Inc 基板処理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658839A (en) * 1951-04-21 1953-11-10 Gen Am Transport Process of chemical nickel plating
US2791516A (en) * 1953-09-17 1957-05-07 Gen Motors Corp Electroless plating
GB1052647A (enExample) * 1964-03-23
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
US4448684A (en) * 1983-01-28 1984-05-15 The Perkin-Elmer Corporation Solvent pressurization system
JPH0669019B2 (ja) * 1984-03-12 1994-08-31 株式会社ニコン 半導体製造装置
US4594273A (en) * 1984-11-19 1986-06-10 International Business Machines Corporation High-rate electroless deposition process
US4616596A (en) * 1985-10-21 1986-10-14 Hughes Aircraft Company Electroless plating apparatus
JPH0622201B2 (ja) * 1986-05-19 1994-03-23 黒谷 巌 半導体材料の現像処理装置
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
EP0703604B1 (en) * 1994-09-20 2001-12-05 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Apparatus for the controlled cooling of chemical tanks
JP2655098B2 (ja) * 1994-10-18 1997-09-17 日本電気株式会社 薬液を用いたウエハ表面処理装置
US6042712A (en) * 1995-05-26 2000-03-28 Formfactor, Inc. Apparatus for controlling plating over a face of a substrate
US5938845A (en) * 1995-10-20 1999-08-17 Aiwa Co., Ltd. Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps
US5830805A (en) * 1996-11-18 1998-11-03 Cornell Research Foundation Electroless deposition equipment or apparatus and method of performing electroless deposition
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6555298B1 (en) * 2000-08-22 2003-04-29 Micron Technology, Inc. Method and apparatus for uniformly baking substrates such as photomasks
WO2002034962A1 (fr) * 2000-10-26 2002-05-02 Ebara Corporation Dispositif et procede pour depot autocatalytique
US6551412B1 (en) * 2001-07-16 2003-04-22 Taiwan Semiconductor Manufacturing Company Non-tubular type recycle system of wet bench tank

Also Published As

Publication number Publication date
EP1539371A4 (en) 2010-11-17
TW200402130A (en) 2004-02-01
US20040013808A1 (en) 2004-01-22
US7252714B2 (en) 2007-08-07
US20080011450A1 (en) 2008-01-17
EP1539371A1 (en) 2005-06-15
WO2004007090A1 (en) 2004-01-22
JP2005532902A (ja) 2005-11-04
TWI307943B (en) 2009-03-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase