JP2005532902A - 超小型電子品加工片を熱的に制御して処理する装置及び方法 - Google Patents

超小型電子品加工片を熱的に制御して処理する装置及び方法 Download PDF

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Publication number
JP2005532902A
JP2005532902A JP2004521884A JP2004521884A JP2005532902A JP 2005532902 A JP2005532902 A JP 2005532902A JP 2004521884 A JP2004521884 A JP 2004521884A JP 2004521884 A JP2004521884 A JP 2004521884A JP 2005532902 A JP2005532902 A JP 2005532902A
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Japan
Prior art keywords
container
processing
processing liquid
disposed
heat transfer
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JP2004521884A
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English (en)
Japanese (ja)
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JP2005532902A5 (enExample
Inventor
カイル エム ハンソン
ロバート ジュニア ダブリュー バッツ
ラジェシュ バスカラン
ノーラン ジマーマン
ツォンミン フー
グレゴリー ジェイ ウィルソン
ポール アール ミチュグ
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セミトゥール インコーポレイテッド
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Publication of JP2005532902A publication Critical patent/JP2005532902A/ja
Publication of JP2005532902A5 publication Critical patent/JP2005532902A5/ja
Pending legal-status Critical Current

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    • H10P72/0476—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H10P72/0434—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemically Coating (AREA)
  • Coating Apparatus (AREA)
JP2004521884A 2002-07-16 2003-07-15 超小型電子品加工片を熱的に制御して処理する装置及び方法 Pending JP2005532902A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39647802P 2002-07-16 2002-07-16
US10/295,302 US7252714B2 (en) 2002-07-16 2002-11-15 Apparatus and method for thermally controlled processing of microelectronic workpieces
PCT/US2003/022174 WO2004007090A1 (en) 2002-07-16 2003-07-15 Apparatus and method for thermally controlled processing of microelectronic workpieces

Publications (2)

Publication Number Publication Date
JP2005532902A true JP2005532902A (ja) 2005-11-04
JP2005532902A5 JP2005532902A5 (enExample) 2006-08-31

Family

ID=30117976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521884A Pending JP2005532902A (ja) 2002-07-16 2003-07-15 超小型電子品加工片を熱的に制御して処理する装置及び方法

Country Status (6)

Country Link
US (2) US7252714B2 (enExample)
EP (1) EP1539371A4 (enExample)
JP (1) JP2005532902A (enExample)
AU (1) AU2003249286A1 (enExample)
TW (1) TWI307943B (enExample)
WO (1) WO2004007090A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US20060045666A1 (en) * 2004-07-09 2006-03-02 Harris Randy A Modular tool unit for processing of microfeature workpieces
US7531060B2 (en) * 2004-07-09 2009-05-12 Semitool, Inc. Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
US20060281310A1 (en) * 2005-06-08 2006-12-14 Applied Materials, Inc. Rotating substrate support and methods of use
JP2010034283A (ja) * 2008-07-29 2010-02-12 Hitachi Kokusai Electric Inc 基板処理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658839A (en) * 1951-04-21 1953-11-10 Gen Am Transport Process of chemical nickel plating
US2791516A (en) * 1953-09-17 1957-05-07 Gen Motors Corp Electroless plating
GB1052647A (enExample) * 1964-03-23
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
US4448684A (en) * 1983-01-28 1984-05-15 The Perkin-Elmer Corporation Solvent pressurization system
JPH0669019B2 (ja) * 1984-03-12 1994-08-31 株式会社ニコン 半導体製造装置
US4594273A (en) * 1984-11-19 1986-06-10 International Business Machines Corporation High-rate electroless deposition process
US4616596A (en) * 1985-10-21 1986-10-14 Hughes Aircraft Company Electroless plating apparatus
JPH0622201B2 (ja) * 1986-05-19 1994-03-23 黒谷 巌 半導体材料の現像処理装置
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
DE69429347T2 (de) * 1994-09-20 2002-08-14 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Anlage zum kontrollierten Abkühlen von chemischen Behältern
JP2655098B2 (ja) * 1994-10-18 1997-09-17 日本電気株式会社 薬液を用いたウエハ表面処理装置
US6042712A (en) * 1995-05-26 2000-03-28 Formfactor, Inc. Apparatus for controlling plating over a face of a substrate
US5938845A (en) * 1995-10-20 1999-08-17 Aiwa Co., Ltd. Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps
US5830805A (en) * 1996-11-18 1998-11-03 Cornell Research Foundation Electroless deposition equipment or apparatus and method of performing electroless deposition
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6555298B1 (en) * 2000-08-22 2003-04-29 Micron Technology, Inc. Method and apparatus for uniformly baking substrates such as photomasks
KR20020074175A (ko) * 2000-10-26 2002-09-28 가부시키 가이샤 에바라 세이사꾸쇼 무전해도금장치 및 방법
US6551412B1 (en) * 2001-07-16 2003-04-22 Taiwan Semiconductor Manufacturing Company Non-tubular type recycle system of wet bench tank

Also Published As

Publication number Publication date
EP1539371A1 (en) 2005-06-15
EP1539371A4 (en) 2010-11-17
US20080011450A1 (en) 2008-01-17
US20040013808A1 (en) 2004-01-22
TWI307943B (en) 2009-03-21
TW200402130A (en) 2004-02-01
US7252714B2 (en) 2007-08-07
WO2004007090A1 (en) 2004-01-22
AU2003249286A1 (en) 2004-02-02

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