JP2005531913A - プラズマパラメータの非侵入性の測定と解析のための方法と装置 - Google Patents
プラズマパラメータの非侵入性の測定と解析のための方法と装置 Download PDFInfo
- Publication number
- JP2005531913A JP2005531913A JP2004519601A JP2004519601A JP2005531913A JP 2005531913 A JP2005531913 A JP 2005531913A JP 2004519601 A JP2004519601 A JP 2004519601A JP 2004519601 A JP2004519601 A JP 2004519601A JP 2005531913 A JP2005531913 A JP 2005531913A
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- sensor
- plasma process
- coupled
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000004458 analytical method Methods 0.000 title claims abstract description 14
- 238000005259 measurement Methods 0.000 title abstract description 5
- 230000008569 process Effects 0.000 claims abstract description 42
- 238000012545 processing Methods 0.000 claims abstract description 26
- 230000005404 monopole Effects 0.000 claims description 4
- 238000010183 spectrum analysis Methods 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 7
- 238000000513 principal component analysis Methods 0.000 description 6
- 238000005070 sampling Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005206 flow analysis Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32963—End-point detection
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39310302P | 2002-07-03 | 2002-07-03 | |
PCT/US2003/019040 WO2004006285A1 (en) | 2002-07-03 | 2003-06-18 | Method and apparatus for non-invasive measurement and analysis of plasma parameters |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005531913A true JP2005531913A (ja) | 2005-10-20 |
Family
ID=30115545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004519601A Withdrawn JP2005531913A (ja) | 2002-07-03 | 2003-06-18 | プラズマパラメータの非侵入性の測定と解析のための方法と装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050145334A1 (zh) |
JP (1) | JP2005531913A (zh) |
CN (1) | CN1666315A (zh) |
AU (1) | AU2003281421A1 (zh) |
TW (1) | TWI230996B (zh) |
WO (1) | WO2004006285A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007036139A (ja) * | 2005-07-29 | 2007-02-08 | Sharp Corp | プラズマ処理装置およびプラズマクリーニング終点検出方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7115210B2 (en) * | 2004-02-02 | 2006-10-03 | International Business Machines Corporation | Measurement to determine plasma leakage |
WO2006135515A1 (en) * | 2005-06-10 | 2006-12-21 | Bird Technologies Group Inc. | System and method for analyzing power flow in semiconductor plasma generation systems |
US11670488B2 (en) * | 2020-01-10 | 2023-06-06 | COMET Technologies USA, Inc. | Fast arc detecting match network |
US12027351B2 (en) * | 2020-01-10 | 2024-07-02 | COMET Technologies USA, Inc. | Plasma non-uniformity detection |
GB202005828D0 (en) * | 2020-04-21 | 2020-06-03 | Univ Dublin City | Electromagnetic field signal acquisition system for high signal-t-noise ratios, and electrical noise immunity |
GB202016105D0 (en) | 2020-10-09 | 2020-11-25 | Univ Dublin City | Non-invasive measurement of plasma systems |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0224930B1 (en) * | 1985-12-06 | 1993-01-27 | Fujisawa Pharmaceutical Co., Ltd. | Tablet printing machine |
US5705940A (en) * | 1990-07-16 | 1998-01-06 | Raytheon Company | Logic family for digitally controlled analog monolithic microwave integrated circuits |
US6057805A (en) * | 1996-08-19 | 2000-05-02 | Emc Test Systems, L.P. | Broad band shaped element antenna |
GB9620151D0 (en) * | 1996-09-27 | 1996-11-13 | Surface Tech Sys Ltd | Plasma processing apparatus |
US5895531A (en) * | 1996-12-13 | 1999-04-20 | Compuvac Systems, Inc. | Apparatus and polymerization gun for coating objects by vacuum deposit |
EP1025276A1 (en) * | 1997-09-17 | 2000-08-09 | Tokyo Electron Limited | Device and method for detecting and preventing arcing in rf plasma systems |
US6450116B1 (en) * | 1999-04-22 | 2002-09-17 | Applied Materials, Inc. | Apparatus for exposing a substrate to plasma radicals |
WO2002015649A2 (en) * | 2000-08-17 | 2002-02-21 | Tokyo Electron Limited | Close coupled match structure for rf drive electrode |
US6631693B2 (en) * | 2001-01-30 | 2003-10-14 | Novellus Systems, Inc. | Absorptive filter for semiconductor processing systems |
AU2003239392A1 (en) * | 2002-05-29 | 2003-12-19 | Tokyo Electron Limited | Method and system for data handling, storage and manipulation |
-
2003
- 2003-06-18 JP JP2004519601A patent/JP2005531913A/ja not_active Withdrawn
- 2003-06-18 AU AU2003281421A patent/AU2003281421A1/en not_active Abandoned
- 2003-06-18 CN CN03815550.8A patent/CN1666315A/zh active Pending
- 2003-06-18 WO PCT/US2003/019040 patent/WO2004006285A1/en active Application Filing
- 2003-07-02 TW TW092118067A patent/TWI230996B/zh not_active IP Right Cessation
-
2004
- 2004-12-27 US US11/020,127 patent/US20050145334A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007036139A (ja) * | 2005-07-29 | 2007-02-08 | Sharp Corp | プラズマ処理装置およびプラズマクリーニング終点検出方法 |
Also Published As
Publication number | Publication date |
---|---|
AU2003281421A1 (en) | 2004-01-23 |
TW200409262A (en) | 2004-06-01 |
CN1666315A (zh) | 2005-09-07 |
WO2004006285A1 (en) | 2004-01-15 |
US20050145334A1 (en) | 2005-07-07 |
TWI230996B (en) | 2005-04-11 |
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Legal Events
Date | Code | Title | Description |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060331 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20080822 |