JP2005530886A5 - - Google Patents
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- JP2005530886A5 JP2005530886A5 JP2004515393A JP2004515393A JP2005530886A5 JP 2005530886 A5 JP2005530886 A5 JP 2005530886A5 JP 2004515393 A JP2004515393 A JP 2004515393A JP 2004515393 A JP2004515393 A JP 2004515393A JP 2005530886 A5 JP2005530886 A5 JP 2005530886A5
- Authority
- JP
- Japan
- Prior art keywords
- present
- hydrogen
- carbon atoms
- carboxyl
- hydroxyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- -1 if any is present Chemical group 0.000 claims description 4
- 239000003211 photoinitiator Substances 0.000 claims description 4
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atoms Chemical class [H]* 0.000 claims 3
- 150000002500 ions Chemical class 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical group [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BIUNYMXQLNNMJR-UHFFFAOYSA-N tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1[B-](C=1C(=C(F)C(F)=C(F)C=1F)F)(C=1C(=C(F)C(F)=C(F)C=1F)F)C1=C(F)C(F)=C(F)C(F)=C1F BIUNYMXQLNNMJR-UHFFFAOYSA-N 0.000 description 1
Description
［構造式中、構造Ｖについては、Ｒ６、Ｒ７、Ｒ８、Ｒ９及びＲ１０は、存在していても、存在していなくてもよいが、存在しない場合、水素であり、いずれかが存在する場合、アルキル（例えば炭素原子１〜５個の）、ハロゲン、ヒドロキシル及びカルボキシルから個別に選択することができ、構造ＩＶについては、Ｒ６、Ｒ７、Ｒ８、Ｒ９、Ｒ１０、Ｒ６’、Ｒ７’、Ｒ８’、Ｒ９’及びＲ１０’は、存在していても、存在していなくてもよいが、存在しない場合、水素であり、いずれかが存在する場合、水素、アルキル（例えば炭素原子１〜５個の）、ハロゲン、ヒドロキシル及びカルボキシルから個別に選択することができ、構造ＶＩについては、Ｒ１１、Ｒ１２、Ｒ１３、Ｒ１４、Ｒ１５、Ｒ１６、Ｒ１７、Ｒ１８、Ｒ１９、Ｒ２０及びＲ２１は、存在していても、存在していなくてもよいが、存在しない場合、水素であり、いずれかが存在する場合、水素、アルキル（例えば炭素原子１〜５個の）、ハロゲン、ヒドロキシル及びカルボキシルから個別に選択することができる］
構造ＩＶ、Ｖ及びＶＩの範囲内のコアカチオンを有するカチオン光開始剤のより具体的な例は、それぞれ構造ＶＩＩ（ａ）及びＶＩＩ（ｂ）、ＶＩＩＩ及びＩＸによって表されるものを含む。
構造ＩＶ、Ｖ及びＶＩの範囲内のコアカチオンを有するカチオン光開始剤のより具体的な例は、それぞれ構造ＶＩＩ（ａ）及びＶＩＩ（ｂ）、ＶＩＩＩ及びＩＸによって表されるものを含む。
表１ｃにおいて、試料番号５については光開始剤は、フェロセニウムテトラキス（ペンタフルオロフェニル）ボレートであり、試料番号６については光開始剤は、Ｖａｎｔｉｃｏ，Ｉｎｃ．によりＩＲＧＡＣＵＲＥ ２６１として市販されているフェロセニウムヘキサフルオロホスフィンである。
Claims (1)
- カチオン光開始剤が、以下からなる群から選択される対イオンを含む請求項１に記載の組成物。
［構造式中、構造Ｖについては、Ｒ６、Ｒ７、Ｒ８、Ｒ９及びＲ１０は、存在していても、存在していなくてもよいが、存在しない場合、水素であり、いずれかが存在する場合、炭素原子１〜５個のアルキル、ハロゲン、ヒドロキシル及びカルボキシルから個別に選択することができ、構造ＩＶについては、Ｒ６、Ｒ７、Ｒ８、Ｒ９、Ｒ１０、Ｒ６’、Ｒ７’、Ｒ８’、Ｒ９’及びＲ１０’は、存在していても、存在していなくてもよいが、存在しない場合、水素であり、いずれかが存在する場合、炭素原子１〜５個のアルキル、ハロゲン、ヒドロキシル及びカルボキシルから個別に選択することができ、構造ＶＩについては、Ｒ１１、Ｒ１２、Ｒ１３、Ｒ１４、Ｒ１５、Ｒ１６、Ｒ１７、Ｒ１８、Ｒ１９、Ｒ２０及びＲ２１は、存在していても、存在していなくてもよいが、存在しない場合、水素であり、いずれかが存在する場合、炭素原子１〜５個のアルキル、ハロゲン、ヒドロキシル及びカルボキシルから個別に選択することができる］
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/176,648 US6918984B2 (en) | 2002-06-24 | 2002-06-24 | Photocurable adhesive compositions, reaction products of which have low halide ion content |
| PCT/IE2003/000096 WO2004000965A1 (en) | 2002-06-24 | 2003-06-24 | Photocurable adhesive compositions, reaction products of which have low halide ion content |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005530886A JP2005530886A (ja) | 2005-10-13 |
| JP2005530886A5 true JP2005530886A5 (ja) | 2006-01-05 |
Family
ID=29999068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004515393A Pending JP2005530886A (ja) | 2002-06-24 | 2003-06-24 | 光硬化性接着剤組成物、低いハロゲン化物イオン含量を有するその反応生成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6918984B2 (ja) |
| EP (1) | EP1516030A1 (ja) |
| JP (1) | JP2005530886A (ja) |
| CN (1) | CN100408647C (ja) |
| AU (1) | AU2003253228A1 (ja) |
| WO (1) | WO2004000965A1 (ja) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6674158B2 (en) * | 1998-09-03 | 2004-01-06 | Micron Technology, Inc. | Semiconductor die package having a UV cured polymeric die coating |
| SE528250C2 (sv) * | 2004-02-27 | 2006-10-03 | Calignum Technologies Ab | Komposition innefattande en initiator och ett förfarande för att behandla trä med kompositionen |
| JP2005281611A (ja) * | 2004-03-30 | 2005-10-13 | Toho Tenax Co Ltd | エポキシ樹脂組成物を用いたプリプレグ |
| JP2005281606A (ja) * | 2004-03-30 | 2005-10-13 | Toho Tenax Co Ltd | 放射線硬化用エポキシ樹脂組成物 |
| EP1619726A1 (fr) * | 2004-07-22 | 2006-01-25 | St Microelectronics S.A. | Boîtier optique pour capteur semiconducteur |
| WO2007017341A1 (de) * | 2005-08-11 | 2007-02-15 | Siemens Aktiengesellschaft | Fluxing encapsulants - giessharze für dca-anwendungen auf basis kationisch härtbarer epoxidharze |
| US8166645B2 (en) | 2006-08-23 | 2012-05-01 | Rockwell Collins, Inc. | Method for providing near-hermetically coated, thermally protected integrated circuit assemblies |
| US8076185B1 (en) | 2006-08-23 | 2011-12-13 | Rockwell Collins, Inc. | Integrated circuit protection and ruggedization coatings and methods |
| US8637980B1 (en) | 2007-12-18 | 2014-01-28 | Rockwell Collins, Inc. | Adhesive applications using alkali silicate glass for electronics |
| US8174830B2 (en) * | 2008-05-06 | 2012-05-08 | Rockwell Collins, Inc. | System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling |
| US7915527B1 (en) | 2006-08-23 | 2011-03-29 | Rockwell Collins, Inc. | Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings |
| US8581108B1 (en) | 2006-08-23 | 2013-11-12 | Rockwell Collins, Inc. | Method for providing near-hermetically coated integrated circuit assemblies |
| US8617913B2 (en) | 2006-08-23 | 2013-12-31 | Rockwell Collins, Inc. | Alkali silicate glass based coating and method for applying |
| US8084855B2 (en) | 2006-08-23 | 2011-12-27 | Rockwell Collins, Inc. | Integrated circuit tampering protection and reverse engineering prevention coatings and methods |
| US8363189B2 (en) * | 2007-12-18 | 2013-01-29 | Rockwell Collins, Inc. | Alkali silicate glass for displays |
| US8084553B2 (en) * | 2008-01-10 | 2011-12-27 | Trillion Science, Inc. | Curable adhesive compositions, process, and applications |
| US8017872B2 (en) * | 2008-05-06 | 2011-09-13 | Rockwell Collins, Inc. | System and method for proportional cooling with liquid metal |
| US8650886B2 (en) * | 2008-09-12 | 2014-02-18 | Rockwell Collins, Inc. | Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections |
| US8616266B2 (en) * | 2008-09-12 | 2013-12-31 | Rockwell Collins, Inc. | Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid |
| US8221089B2 (en) * | 2008-09-12 | 2012-07-17 | Rockwell Collins, Inc. | Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader |
| US8205337B2 (en) * | 2008-09-12 | 2012-06-26 | Rockwell Collins, Inc. | Fabrication process for a flexible, thin thermal spreader |
| US8309633B2 (en) * | 2008-07-17 | 2012-11-13 | Henkel Ireland Ltd. | Low temperature, cationically curable compositions with improved cure speed and toughness |
| US8119040B2 (en) | 2008-09-29 | 2012-02-21 | Rockwell Collins, Inc. | Glass thick film embedded passive material |
| WO2010068488A1 (en) * | 2008-11-25 | 2010-06-17 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
| US9093448B2 (en) | 2008-11-25 | 2015-07-28 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
| JP5444702B2 (ja) * | 2008-12-05 | 2014-03-19 | デクセリアルズ株式会社 | 新規なスルホニウムボレート錯体 |
| CN102842566A (zh) * | 2011-06-21 | 2012-12-26 | 上海长丰智能卡有限公司 | 一种带线圈的智能卡载带 |
| CN102842565A (zh) * | 2011-06-21 | 2012-12-26 | 上海长丰智能卡有限公司 | 一种带线圈的智能卡模块及其实现方式 |
| CN102311681A (zh) * | 2011-08-25 | 2012-01-11 | 浙江科创新材料科技有限公司 | Uv固化型银纳米线墨水及其制备方法和使用方法 |
| US9966319B1 (en) | 2011-10-27 | 2018-05-08 | Global Circuit Innovations Incorporated | Environmental hardening integrated circuit method and apparatus |
| US9935028B2 (en) | 2013-03-05 | 2018-04-03 | Global Circuit Innovations Incorporated | Method and apparatus for printing integrated circuit bond connections |
| US10109606B2 (en) | 2011-10-27 | 2018-10-23 | Global Circuit Innovations, Inc. | Remapped packaged extracted die |
| US10128161B2 (en) | 2011-10-27 | 2018-11-13 | Global Circuit Innovations, Inc. | 3D printed hermetic package assembly and method |
| US9870968B2 (en) | 2011-10-27 | 2018-01-16 | Global Circuit Innovations Incorporated | Repackaged integrated circuit and assembly method |
| US10147660B2 (en) | 2011-10-27 | 2018-12-04 | Global Circuits Innovations, Inc. | Remapped packaged extracted die with 3D printed bond connections |
| US10002846B2 (en) | 2011-10-27 | 2018-06-19 | Global Circuit Innovations Incorporated | Method for remapping a packaged extracted die with 3D printed bond connections |
| US10177054B2 (en) | 2011-10-27 | 2019-01-08 | Global Circuit Innovations, Inc. | Method for remapping a packaged extracted die |
| KR101355855B1 (ko) * | 2011-12-19 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
| US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US9435915B1 (en) | 2012-09-28 | 2016-09-06 | Rockwell Collins, Inc. | Antiglare treatment for glass |
| KR102090456B1 (ko) * | 2012-11-30 | 2020-03-18 | 엘지디스플레이 주식회사 | 비 전도성 타입 접착수단과 이를 구비한 표시장치 |
| WO2014149926A1 (en) | 2013-03-15 | 2014-09-25 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
| CN106165074B (zh) * | 2014-03-19 | 2020-05-12 | 三星电子株式会社 | 制造半导体装置的方法 |
| CN104922725A (zh) * | 2015-06-08 | 2015-09-23 | 苏州乔纳森新材料科技有限公司 | 一种光固化粘合剂及其制备方法 |
| CN105489562A (zh) * | 2015-10-18 | 2016-04-13 | 魏赛琦 | 一种智能卡卡芯及其制备方法 |
| US11104802B2 (en) | 2016-09-26 | 2021-08-31 | University Of Washington | PDMS resin for stereolithographic 3D-printing of PDMS |
| WO2018095856A1 (de) | 2016-11-22 | 2018-05-31 | Basf Se | Verfahren zur herstellung von 1,3-butadien aus n-butenen durch oxidative dehydrierung umfassend eine methacrolein-abtrennung bei der aufarbeitung |
| TWI651362B (zh) * | 2017-03-29 | 2019-02-21 | 台虹科技股份有限公司 | 感光性絕緣組成物 |
| CN108018011B (zh) * | 2017-12-05 | 2021-03-30 | 烟台德邦科技股份有限公司 | 一种适用于非透光材质粘接的紫外光固化胶黏剂 |
| US10115645B1 (en) | 2018-01-09 | 2018-10-30 | Global Circuit Innovations, Inc. | Repackaged reconditioned die method and assembly |
| EP3762871B1 (en) | 2018-03-07 | 2024-08-07 | X-Card Holdings, LLC | Metal card |
| CN108913072A (zh) * | 2018-05-10 | 2018-11-30 | 昆山西微美晶电子新材料科技有限公司 | 用于智能卡芯片保护包封胶及其制备方法 |
| EP3747925A1 (en) | 2019-06-07 | 2020-12-09 | Henkel AG & Co. KGaA | Radiation-curable composition by anionic polymerization |
| US11508680B2 (en) | 2020-11-13 | 2022-11-22 | Global Circuit Innovations Inc. | Solder ball application for singular die |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3806738C1 (ja) * | 1988-03-02 | 1989-09-07 | Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De | |
| JPH0491118A (ja) * | 1990-08-06 | 1992-03-24 | Yokohama Rubber Co Ltd:The | 光硬化性樹脂組成物 |
| FR2688783A1 (fr) * | 1992-03-23 | 1993-09-24 | Rhone Poulenc Chimie | Nouveaux borates d'onium ou de complexe organometallique amorceurs cationiques de polymerisation. |
| US6147184A (en) * | 1992-03-23 | 2000-11-14 | Rhone-Poulenc Chimie | Onium borates/borates of organometallic complexes and cationic initiation of polymerization therewith |
| US5721289A (en) * | 1994-11-04 | 1998-02-24 | Minnesota Mining And Manufacturing Company | Stable, low cure-temperature semi-structural pressure sensitive adhesive |
| SG48462A1 (en) * | 1995-10-26 | 1998-04-17 | Ibm | Lead protective coating composition process and structure thereof |
| US5863970A (en) * | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
| US5777903A (en) * | 1996-01-22 | 1998-07-07 | Motorola, Inc. | Solar cell powered smart card with integrated display and interface keypad |
| US5721451A (en) * | 1996-12-02 | 1998-02-24 | Motorola, Inc. | Integrated circuit assembly adhesive and method thereof |
| FR2761368B1 (fr) | 1997-03-25 | 2005-10-21 | Rhodia Chimie Sa | Composition (e. g. encre ou vernis) polymerisable et/ou reticulable sous irradiation par voie cationique et/ou radicalaire, a base d'une matrice organique, d'un diluant silicone et d'un photo-amorceur |
| SG91249A1 (en) * | 1999-01-14 | 2002-09-17 | Lintec Corp | Process for producing non-contact data carrier |
| JP2002062649A (ja) * | 2000-08-21 | 2002-02-28 | Ngk Spark Plug Co Ltd | プリント配線基板用感光性樹脂組成物、プリント配線基板 |
| JP2002097443A (ja) * | 2000-09-21 | 2002-04-02 | Hitachi Chem Co Ltd | 接着剤組成物及びこれを用いた回路接続材料並びに接続体 |
-
2002
- 2002-06-24 US US10/176,648 patent/US6918984B2/en not_active Expired - Fee Related
-
2003
- 2003-06-24 EP EP03760851A patent/EP1516030A1/en not_active Withdrawn
- 2003-06-24 WO PCT/IE2003/000096 patent/WO2004000965A1/en not_active Application Discontinuation
- 2003-06-24 CN CNB038171414A patent/CN100408647C/zh not_active Expired - Fee Related
- 2003-06-24 AU AU2003253228A patent/AU2003253228A1/en not_active Abandoned
- 2003-06-24 JP JP2004515393A patent/JP2005530886A/ja active Pending
-
2004
- 2004-11-08 US US10/982,840 patent/US20050133152A1/en not_active Abandoned
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