JP2005281611A - エポキシ樹脂組成物を用いたプリプレグ - Google Patents
エポキシ樹脂組成物を用いたプリプレグ Download PDFInfo
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- JP2005281611A JP2005281611A JP2004100961A JP2004100961A JP2005281611A JP 2005281611 A JP2005281611 A JP 2005281611A JP 2004100961 A JP2004100961 A JP 2004100961A JP 2004100961 A JP2004100961 A JP 2004100961A JP 2005281611 A JP2005281611 A JP 2005281611A
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 45
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 44
- 239000000203 mixture Substances 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 15
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 24
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
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- 125000000217 alkyl group Chemical group 0.000 claims description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 3
- 239000013034 phenoxy resin Substances 0.000 claims description 3
- 229920006287 phenoxy resin Polymers 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- LYPJKORWSCCJIB-UHFFFAOYSA-N CC1=CC=CC=C1CC(C)(I)C1=CC=CC=C1 Chemical group CC1=CC=CC=C1CC(C)(I)C1=CC=CC=C1 LYPJKORWSCCJIB-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 13
- -1 diallyl iodonium salt Chemical class 0.000 abstract description 4
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- 229910052796 boron Inorganic materials 0.000 abstract description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
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- 238000002474 experimental method Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
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- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 239000003063 flame retardant Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
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- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 101100404584 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) NET1 gene Proteins 0.000 description 1
- 229920000690 Tyvek Polymers 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 231100000987 absorbed dose Toxicity 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000011074 autoclave method Methods 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003758 nuclear fuel Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
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- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
反応性に優れた、電子線、ガンマー線、X線等の放射線で硬化するエポキシ樹脂組成物を、繊維強化材に含浸せしめたプリプレグを提供することを目的とする。
【解決手段】
エポキシ樹脂を主体とする樹脂成分と、該樹脂成分1kg当たり0.005〜0.5モルの、特定式で表されるホウ素系ジアリルヨードニウム塩である重合開始剤とからなる、放射線硬化用エポキシ樹脂組成物を、繊維強化材に含浸せしめたプリプレグによって達成される。そして、これに放射線を照射して成形された複合材料・部材は、十分な硬化度を有し機械的あるいは熱的性質に優れているので、航空・宇宙分野はもちろん、その他の一般産業分野に広く使用される。
Description
SRM8規格に準拠して測定した。
PHOTOINITIATOR 2074)を0.01 mol/kg添加混合し、樹脂組成物を作成した。これを炭素繊維のシート(東邦テナックス社製IM600-24K、単糸デニール0.83d、2400本を引き揃えたもの)(目付150g/m2)に、樹脂組成物を溶融含浸法により樹脂含量が35%となるように含浸させ、プリプレグを得た。これから20cm四方の試験片を切取り、これを20枚全層0°(同方向)となるように積層し、原子燃料工業株式会社製の電子線照射装置 (加速電圧 10 MeV、制動X線変換装置搭載)を用いて、25〜100kGy(ジュール/kg)の電子線を照射し樹脂を架橋・硬化させた。なお、プリプレグの吸収線量が同じであれば、電子の加速方法(連続波、パルス波)や加速電圧が異なっても機械的特性は同じになる。得られた複合材料の機械的特性(プリプレグ間の層間せん断強度)は表1に示したとおりであった。層間せん断強度は、照射線量によらず60MPaを超えており、十分に実用に耐えるものであった。なお、表の層間せん断強度は、Vf=60%の換算値である(複合材料中の繊維の体積含有率を60%として強度を換算した値)。
Claims (10)
- 重合開始剤の量が、樹脂成分1kg当たり0.01〜0.1モルである、請求項1記載のプリプレグ。
- 重合開始剤が、式1においてR1、R2共に低級アルキル基である、請求項1又は2記載のプリプレグ。
- 重合開始剤が、式1においてR1がイソプロピル基、R2がメチル基、XがC6F5基である(トリルクミル)イオドニウム テトラキス(ペンタフルオロフェニル)ボレエートである、請求項1又は2記載のプリプレグ。
- エポキシ樹脂がビスフェノール型、脂環型、ノボラック型、ナフタレン型、ジシクロペンタジエン型の中から選ばれるいずれか一つ、または二つ以上の混合物である、請求項1〜4記載のプリプレグ。
- 樹脂成分が、ビスフェノールA型エポキシ樹脂60〜99重量部と熱可塑性樹脂40〜1重量部とからなる、請求項1〜4記載のプリプレグ。
- 樹脂成分が、ビスフェノールA型エポキシ樹脂60〜99重量部とフェノキシ樹脂40〜1重量部とからなる、請求項1〜4記載のプリプレグ。
- 樹脂成分の粘度が、25℃において100 Pa・s以上もしくは固体である請求項1〜7記載のプリプレグ。
- 樹脂成分の粘度が、70℃において10〜1000 Pa・sである請求項1〜8記載のプリプレグ。
- プリプレグ中に、樹脂成分を10〜70重量%含有する請求項1〜9記載のプリプレグ。
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JP2004100961A JP2005281611A (ja) | 2004-03-30 | 2004-03-30 | エポキシ樹脂組成物を用いたプリプレグ |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007034679A1 (ja) * | 2005-09-22 | 2007-03-29 | Toho Tenax Co., Ltd. | 放射線硬化用樹脂組成物及びプリプレグ |
US8668983B2 (en) * | 2006-12-13 | 2014-03-11 | The Yokohama Rubber Co., Ltd. | Epoxy resin composition for fiber reinforced composite material |
KR20160000920A (ko) | 2014-06-25 | 2016-01-06 | 한국원자력연구원 | 방사선 경화용 에폭시 프리프레그 제조방법 및 이를 이용한 프리프레그 |
JP6490850B1 (ja) * | 2018-03-02 | 2019-03-27 | 株式会社有沢製作所 | プリプレグ及びプリプレグ成形品の製造方法 |
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JP2000186106A (ja) * | 1998-12-22 | 2000-07-04 | Sekisui Chem Co Ltd | 光カチオン重合性組成物の重合方法 |
JP2002062649A (ja) * | 2000-08-21 | 2002-02-28 | Ngk Spark Plug Co Ltd | プリント配線基板用感光性樹脂組成物、プリント配線基板 |
JP2002062650A (ja) * | 2000-08-21 | 2002-02-28 | Ngk Spark Plug Co Ltd | 感光性樹脂ワニス、感光性接着フィルム、プリント配線基板 |
WO2004000965A1 (en) * | 2002-06-24 | 2003-12-31 | Loctite (R & D) Limited | Photocurable adhesive compositions, reaction products of which have low halide ion content |
-
2004
- 2004-03-30 JP JP2004100961A patent/JP2005281611A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000186106A (ja) * | 1998-12-22 | 2000-07-04 | Sekisui Chem Co Ltd | 光カチオン重合性組成物の重合方法 |
JP2002062649A (ja) * | 2000-08-21 | 2002-02-28 | Ngk Spark Plug Co Ltd | プリント配線基板用感光性樹脂組成物、プリント配線基板 |
JP2002062650A (ja) * | 2000-08-21 | 2002-02-28 | Ngk Spark Plug Co Ltd | 感光性樹脂ワニス、感光性接着フィルム、プリント配線基板 |
WO2004000965A1 (en) * | 2002-06-24 | 2003-12-31 | Loctite (R & D) Limited | Photocurable adhesive compositions, reaction products of which have low halide ion content |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007034679A1 (ja) * | 2005-09-22 | 2007-03-29 | Toho Tenax Co., Ltd. | 放射線硬化用樹脂組成物及びプリプレグ |
US8668983B2 (en) * | 2006-12-13 | 2014-03-11 | The Yokohama Rubber Co., Ltd. | Epoxy resin composition for fiber reinforced composite material |
KR20160000920A (ko) | 2014-06-25 | 2016-01-06 | 한국원자력연구원 | 방사선 경화용 에폭시 프리프레그 제조방법 및 이를 이용한 프리프레그 |
JP6490850B1 (ja) * | 2018-03-02 | 2019-03-27 | 株式会社有沢製作所 | プリプレグ及びプリプレグ成形品の製造方法 |
WO2019167288A1 (ja) * | 2018-03-02 | 2019-09-06 | 株式会社有沢製作所 | プリプレグ及びプリプレグ成形品の製造方法 |
JP2019151730A (ja) * | 2018-03-02 | 2019-09-12 | 株式会社有沢製作所 | プリプレグ及びプリプレグ成形品の製造方法 |
CN111770954A (zh) * | 2018-03-02 | 2020-10-13 | 株式会社有泽制作所 | 预浸料和预浸料成型品的制造方法 |
KR20200123235A (ko) * | 2018-03-02 | 2020-10-28 | 가부시키가이샤 아리사와 세이사쿠쇼 | 프리프레그 및 프리프레그 성형품의 제조 방법 |
KR102305744B1 (ko) | 2018-03-02 | 2021-09-28 | 가부시키가이샤 아리사와 세이사쿠쇼 | 프리프레그 및 프리프레그 성형품의 제조 방법 |
CN111770954B (zh) * | 2018-03-02 | 2023-01-06 | 株式会社有泽制作所 | 预浸料和预浸料成型品的制造方法 |
US11865794B2 (en) | 2018-03-02 | 2024-01-09 | Arisawa Mfg. Co., Ltd. | Prepreg and method for manufacturing molded prepreg article |
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