JP2005520321A - ツールのフロントエンド加工物処理のための統合システム - Google Patents

ツールのフロントエンド加工物処理のための統合システム Download PDF

Info

Publication number
JP2005520321A
JP2005520321A JP2003514594A JP2003514594A JP2005520321A JP 2005520321 A JP2005520321 A JP 2005520321A JP 2003514594 A JP2003514594 A JP 2003514594A JP 2003514594 A JP2003514594 A JP 2003514594A JP 2005520321 A JP2005520321 A JP 2005520321A
Authority
JP
Japan
Prior art keywords
workpiece
tool
plate
aligner
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003514594A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005520321A5 (https=
Inventor
ロジャー ハイン
マーク ダーナ
リチャード エイ フリッピュージ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Technologies Inc
Original Assignee
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of JP2005520321A publication Critical patent/JP2005520321A/ja
Publication of JP2005520321A5 publication Critical patent/JP2005520321A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
JP2003514594A 2001-07-16 2002-07-11 ツールのフロントエンド加工物処理のための統合システム Pending JP2005520321A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30598001P 2001-07-16 2001-07-16
PCT/US2002/022097 WO2003009347A2 (en) 2001-07-16 2002-07-11 Integrated system for tool front-end workpiece handling

Publications (2)

Publication Number Publication Date
JP2005520321A true JP2005520321A (ja) 2005-07-07
JP2005520321A5 JP2005520321A5 (https=) 2006-01-05

Family

ID=23183213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003514594A Pending JP2005520321A (ja) 2001-07-16 2002-07-11 ツールのフロントエンド加工物処理のための統合システム

Country Status (4)

Country Link
US (1) US7419346B2 (https=)
JP (1) JP2005520321A (https=)
TW (1) TW591736B (https=)
WO (1) WO2003009347A2 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245508A (ja) * 2005-03-07 2006-09-14 Kawasaki Heavy Ind Ltd 基板移載装置の組立て方法および基板移載装置の搬送系ユニット
JP2007335475A (ja) * 2006-06-12 2007-12-27 Kawasaki Heavy Ind Ltd 基板移載装置の搬送系ユニット
JP2009509316A (ja) * 2005-07-11 2009-03-05 ブルックス オートメーション インコーポレイテッド ロードポートモジュール
JP2013051443A (ja) * 2007-11-21 2013-03-14 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
KR20200004756A (ko) * 2018-07-04 2020-01-14 신포니아 테크놀로지 가부시끼가이샤 로드 포트 및 efem
JP2021101472A (ja) * 2016-11-10 2021-07-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 電子デバイス製造用のロードポートの機器、システム、及び方法
KR20230148250A (ko) * 2021-03-04 2023-10-24 어플라이드 머티어리얼스, 인코포레이티드 팩토리 인터페이스를 위한 단축된 로드 포트
JP2024526523A (ja) * 2021-10-12 2024-07-19 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6678583B2 (en) * 2001-08-06 2004-01-13 Seminet, Inc. Robotic storage buffer system for substrate carrier pods
JP4323129B2 (ja) * 2002-02-15 2009-09-02 株式会社ディスコ 板状物の搬送機構
JP4648190B2 (ja) * 2003-03-28 2011-03-09 平田機工株式会社 基板搬送システム
US8639365B2 (en) * 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US8639489B2 (en) * 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US7607879B2 (en) 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
JP4532499B2 (ja) * 2004-09-24 2010-08-25 平田機工株式会社 容器搬送装置
WO2006046580A1 (ja) * 2004-10-25 2006-05-04 Tokyo Electron Limited 搬送システム、基板処理装置、及び搬送方法
DE102004057057A1 (de) * 2004-11-25 2006-06-01 Leica Microsystems Cms Gmbh Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US7762755B2 (en) * 2005-07-11 2010-07-27 Brooks Automation, Inc. Equipment storage for substrate processing apparatus
TWM304619U (en) * 2006-04-28 2007-01-11 Fortrend Taiwan Scient Corp Nitrogen cabinet with distinguishing and inflating apparatuses
US7887280B2 (en) * 2006-05-11 2011-02-15 Tokyo Electron Limited Processing apparatus
TWI452643B (zh) * 2006-05-11 2014-09-11 東京威力科創股份有限公司 Inspection device and inspection method
DE102006029003A1 (de) * 2006-06-24 2008-01-03 Vistec Semiconductor Systems Gmbh Waferhandhabungsvorrichtung
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
WO2008067437A2 (en) * 2006-11-29 2008-06-05 Pouch Pac Innovations, Llc System, method and machine for continuous loading of a product
US9834378B2 (en) * 2006-12-22 2017-12-05 Brooks Automation, Inc. Loader and buffer for reduced lot size
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
US8859103B2 (en) 2010-11-05 2014-10-14 Joseph Eugene Canale Glass wafers for semiconductor fabrication processes and methods of making same
CN102222605B (zh) * 2011-06-08 2013-05-15 致茂电子(苏州)有限公司 一种具有破片检测的晶圆输送设备
TW201344808A (zh) * 2012-04-25 2013-11-01 鴻海精密工業股份有限公司 組裝裝置
US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
TW201502733A (zh) * 2013-07-04 2015-01-16 鴻海精密工業股份有限公司 視覺對位元裝置、視覺對位元系統及方法
US10054482B2 (en) * 2014-09-22 2018-08-21 Antonio Maccari Tool for positioning a scanning device
US9698036B2 (en) * 2015-11-05 2017-07-04 Lam Research Corporation Stacked wafer cassette loading system
US9987747B2 (en) * 2016-05-24 2018-06-05 Semes Co., Ltd. Stocker for receiving cassettes and method of teaching a stocker robot disposed therein
US10541165B2 (en) 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
US10533852B1 (en) * 2018-09-27 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Leveling sensor, load port including the same, and method of leveling a load port
JP7362308B2 (ja) * 2019-06-17 2023-10-17 株式会社ディスコ 加工装置
KR102256132B1 (ko) * 2020-02-18 2021-05-25 (주)캔탑스 캐리어 내부의 오염 관리 기능을 갖는 자동 반송시스템
US11581203B2 (en) 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
CN112566413B (zh) * 2020-12-11 2022-03-29 江苏星网软件有限公司 一种计算机数据采集装置及其使用方法
JP1728449S (ja) * 2022-03-30 2022-10-27 基板処理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682927A (en) * 1982-09-17 1987-07-28 Nacom Industries, Incorporated Conveyor system
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
US5344365A (en) * 1993-09-14 1994-09-06 Sematech, Inc. Integrated building and conveying structure for manufacturing under ultraclean conditions
TW297910B (https=) * 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
DE59611078D1 (de) * 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
US6009890A (en) * 1997-01-21 2000-01-04 Tokyo Electron Limited Substrate transporting and processing system
US6053688A (en) * 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6002840A (en) * 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
US6157450A (en) * 1998-03-09 2000-12-05 Chapman Instruments Automated optical surface profile measurement system
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
US6042324A (en) * 1999-03-26 2000-03-28 Asm America, Inc. Multi-stage single-drive FOUP door system
JP4255091B2 (ja) * 1999-04-07 2009-04-15 株式会社日立国際電気 半導体製造方法
US6520727B1 (en) * 2000-04-12 2003-02-18 Asyt Technologies, Inc. Modular sorter
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
US6585470B2 (en) * 2001-06-19 2003-07-01 Brooks Automation, Inc. System for transporting substrates

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245508A (ja) * 2005-03-07 2006-09-14 Kawasaki Heavy Ind Ltd 基板移載装置の組立て方法および基板移載装置の搬送系ユニット
US11121017B2 (en) 2005-07-11 2021-09-14 Brooks Automation, Inc. Load port module
JP2009509316A (ja) * 2005-07-11 2009-03-05 ブルックス オートメーション インコーポレイテッド ロードポートモジュール
KR101313231B1 (ko) * 2005-07-11 2013-09-30 브룩스 오토메이션 인코퍼레이티드 기판 로드용 기기
JP2007335475A (ja) * 2006-06-12 2007-12-27 Kawasaki Heavy Ind Ltd 基板移載装置の搬送系ユニット
US7942619B2 (en) 2006-06-12 2011-05-17 Kawasaki Jukogyo Kabushiki Kaisha Carrier unit of substrate transfer apparatus
JP2013062534A (ja) * 2007-11-21 2013-04-04 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
JP2013049133A (ja) * 2007-11-21 2013-03-14 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
JP2014060464A (ja) * 2007-11-21 2014-04-03 Yaskawa Electric Corp 筐体、半導体製造装置およびソータ装置
JP2014111310A (ja) * 2007-11-21 2014-06-19 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
JP2013051443A (ja) * 2007-11-21 2013-03-14 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
KR102530954B1 (ko) * 2016-11-10 2023-05-09 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 로드 포트 장치, 시스템들, 및 방법들
JP2021101472A (ja) * 2016-11-10 2021-07-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 電子デバイス製造用のロードポートの機器、システム、及び方法
KR20210092342A (ko) * 2016-11-10 2021-07-23 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 로드 포트 장치, 시스템들, 및 방법들
KR20200004756A (ko) * 2018-07-04 2020-01-14 신포니아 테크놀로지 가부시끼가이샤 로드 포트 및 efem
JP7177333B2 (ja) 2018-07-04 2022-11-24 シンフォニアテクノロジー株式会社 ロードポート、および、ｅｆｅｍ
JP2020009825A (ja) * 2018-07-04 2020-01-16 シンフォニアテクノロジー株式会社 ロードポート、および、ｅｆｅｍ
KR102778943B1 (ko) * 2018-07-04 2025-03-11 신포니아 테크놀로지 가부시끼가이샤 로드 포트 및 efem
KR20230148250A (ko) * 2021-03-04 2023-10-24 어플라이드 머티어리얼스, 인코포레이티드 팩토리 인터페이스를 위한 단축된 로드 포트
JP2024508306A (ja) * 2021-03-04 2024-02-26 アプライド マテリアルズ インコーポレイテッド ファクトリインターフェースのための短縮されたロードポート
KR102871368B1 (ko) 2021-03-04 2025-10-14 어플라이드 머티어리얼스, 인코포레이티드 팩토리 인터페이스를 위한 단축된 로드 포트
JP2024526523A (ja) * 2021-10-12 2024-07-19 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット
JP7704895B2 (ja) 2021-10-12 2025-07-08 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット

Also Published As

Publication number Publication date
WO2003009347A3 (en) 2003-11-20
US7419346B2 (en) 2008-09-02
US20030091409A1 (en) 2003-05-15
WO2003009347A2 (en) 2003-01-30
TW591736B (en) 2004-06-11

Similar Documents

Publication Publication Date Title
JP2005520321A (ja) ツールのフロントエンド加工物処理のための統合システム
KR100616125B1 (ko) 수직 인터페이스에 적합한 개방 시스템
US6135698A (en) Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
US6082949A (en) Load port opener
CN1996552B (zh) 晶片机
CN1329948C (zh) 晶片机
JP4309263B2 (ja) 半導体ツールインターフェースのフレーム
JP4309264B2 (ja) 半導体材料取扱い装置
US7976263B2 (en) Integrated wafer transfer mechanism
KR100663322B1 (ko) 소규모 환경 내에서의 카세트 버퍼링
US6520727B1 (en) Modular sorter
US20130028691A1 (en) Transfer mechanism with multiple wafer handling capability
JP4542893B2 (ja) バッファを備えた基板ローディング及びアンローディングステーション
WO1999060625A1 (en) Method and apparatus for wafer transportation, exposure system, micro device, and reticle library
WO2025204240A1 (ja) 基板搬送システム

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050627

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050627

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080317

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080617

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080916

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20081125