JP2005517785A - ナノ多孔質フィルムの製造方法 - Google Patents

ナノ多孔質フィルムの製造方法 Download PDF

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Publication number
JP2005517785A
JP2005517785A JP2003569717A JP2003569717A JP2005517785A JP 2005517785 A JP2005517785 A JP 2005517785A JP 2003569717 A JP2003569717 A JP 2003569717A JP 2003569717 A JP2003569717 A JP 2003569717A JP 2005517785 A JP2005517785 A JP 2005517785A
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JP
Japan
Prior art keywords
nanoparticles
monomer
particles
matrix material
mixture
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Pending
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JP2003569717A
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English (en)
Japanese (ja)
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JP2005517785A5 (enExample
Inventor
フン ソ，イン
シャン ジェイ． ニウ，キン
エイチ．ザ サード タウンゼンド，ポール
ジェイ． マーティン，スティーブン
エイチ． カランタール，トーマス
ピー． ゴッドシャルクス，ジェイムズ
ジェイ． ブルーザ，ケネス
ジェイ． ボーク，ケビン
Original Assignee
ダウ グローバル テクノロジーズ インコーポレイティド
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Publication of JP2005517785A publication Critical patent/JP2005517785A/ja
Publication of JP2005517785A5 publication Critical patent/JP2005517785A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Polyethers (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Formation Of Insulating Films (AREA)
JP2003569717A 2002-02-15 2003-02-07 ナノ多孔質フィルムの製造方法 Pending JP2005517785A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/077,646 US20030165625A1 (en) 2002-02-15 2002-02-15 Method of making a nanoporous film
PCT/US2003/003826 WO2003070813A1 (en) 2002-02-15 2003-02-07 Method of making a nanoporous film

Publications (2)

Publication Number Publication Date
JP2005517785A true JP2005517785A (ja) 2005-06-16
JP2005517785A5 JP2005517785A5 (enExample) 2005-12-22

Family

ID=27752702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003569717A Pending JP2005517785A (ja) 2002-02-15 2003-02-07 ナノ多孔質フィルムの製造方法

Country Status (8)

Country Link
US (1) US20030165625A1 (enExample)
EP (1) EP1476500A4 (enExample)
JP (1) JP2005517785A (enExample)
KR (1) KR20040091047A (enExample)
CN (1) CN1643045A (enExample)
AU (1) AU2003216205A1 (enExample)
TW (1) TW200303878A (enExample)
WO (1) WO2003070813A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007509225A (ja) * 2003-10-21 2007-04-12 ダウ グローバル テクノロジーズ インコーポレイティド 結合メソゲン性ポラゲン形成性部分を含有する多官能性モノマー及びそれからのポリアリーレン組成物
JP2007515501A (ja) * 2003-09-19 2007-06-14 ダウ グローバル テクノロジーズ インコーポレイティド 多官能性モノマー及びそれからのポリアリーレン組成物

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060252906A1 (en) * 2003-02-20 2006-11-09 Godschalx James P Method of synthesis of polyarylenes and the polyarylenes made by such method
WO2004090018A1 (en) * 2003-04-02 2004-10-21 Dow Global Technologies Inc. Multifunctional substituted monomers and polyarylene compositions therefrom
US20080227882A1 (en) * 2003-09-19 2008-09-18 Hahnfeld Jerry L Multifunctional Monomers Containing Bound Poragens and Polyarylene Compositions Therefrom
US7626059B2 (en) 2003-10-21 2009-12-01 Dow Global Technologies Inc. Multifunctional ethynyl substituted monomers and polyarylene compositions therefrom
JP4506953B2 (ja) * 2004-05-28 2010-07-21 日本電気株式会社 共重合高分子膜およびその作製方法
KR101123436B1 (ko) * 2004-06-10 2012-03-28 다우 글로벌 테크놀로지스 엘엘씨 나노다공질 유전체 필름의 형성 방법
US8535702B2 (en) 2005-02-01 2013-09-17 Boston Scientific Scimed, Inc. Medical devices having porous polymeric regions for controlled drug delivery and regulated biocompatibility
US7482389B2 (en) * 2005-04-20 2009-01-27 International Business Machines Corporation Nanoporous media with lamellar structures
US7960442B2 (en) * 2005-04-20 2011-06-14 International Business Machines Corporation Nanoporous media templated from unsymmetrical amphiphilic porogens
US7723438B2 (en) 2005-04-28 2010-05-25 International Business Machines Corporation Surface-decorated polymeric amphiphile porogens for the templation of nanoporous materials
JP4788415B2 (ja) * 2006-03-15 2011-10-05 ソニー株式会社 半導体装置の製造方法
US7842938B2 (en) 2008-11-12 2010-11-30 Seagate Technology Llc Programmable metallization cells and methods of forming the same
US9868820B2 (en) 2014-08-29 2018-01-16 Rohm And Haas Electronic Materials Llc Polyarylene materials

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700844A (en) * 1996-04-09 1997-12-23 International Business Machines Corporation Process for making a foamed polymer
JP2002530505A (ja) * 1998-11-24 2002-09-17 ザ ダウ ケミカル カンパニー 架橋性マトリックス前駆体および気孔発生体を含有する組成物、並びにそれから製造された多孔質マトリックス
US6172128B1 (en) * 1999-04-09 2001-01-09 Honeywell International Inc. Nanoporous polymers crosslinked via cyclic structures
US6359091B1 (en) * 1999-11-22 2002-03-19 The Dow Chemical Company Polyarylene compositions with enhanced modulus profiles

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007515501A (ja) * 2003-09-19 2007-06-14 ダウ グローバル テクノロジーズ インコーポレイティド 多官能性モノマー及びそれからのポリアリーレン組成物
JP2007509225A (ja) * 2003-10-21 2007-04-12 ダウ グローバル テクノロジーズ インコーポレイティド 結合メソゲン性ポラゲン形成性部分を含有する多官能性モノマー及びそれからのポリアリーレン組成物
JP4885724B2 (ja) * 2003-10-21 2012-02-29 ダウ グローバル テクノロジーズ エルエルシー 結合メソゲン性ポラゲン形成性部分を含有する多官能性モノマー及びそれからのポリアリーレン組成物

Also Published As

Publication number Publication date
AU2003216205A1 (en) 2003-09-09
KR20040091047A (ko) 2004-10-27
EP1476500A1 (en) 2004-11-17
CN1643045A (zh) 2005-07-20
EP1476500A4 (en) 2006-09-20
TW200303878A (en) 2003-09-16
WO2003070813A1 (en) 2003-08-28
US20030165625A1 (en) 2003-09-04

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