CN1643045A - 制备纳米多孔薄膜的方法 - Google Patents

制备纳米多孔薄膜的方法 Download PDF

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Publication number
CN1643045A
CN1643045A CNA038060094A CN03806009A CN1643045A CN 1643045 A CN1643045 A CN 1643045A CN A038060094 A CNA038060094 A CN A038060094A CN 03806009 A CN03806009 A CN 03806009A CN 1643045 A CN1643045 A CN 1643045A
Authority
CN
China
Prior art keywords
nanoparticles
monomers
particles
matrix material
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038060094A
Other languages
English (en)
Chinese (zh)
Inventor
苏应雄
Q·S·J·牛
P·H·汤森三世
S·J·马丁
T·H·卡兰塔尔
J·P·戈德沙克斯
K·J·布鲁扎
K·J·鲍克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Publication of CN1643045A publication Critical patent/CN1643045A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Polyethers (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Formation Of Insulating Films (AREA)
CNA038060094A 2002-02-15 2003-02-07 制备纳米多孔薄膜的方法 Pending CN1643045A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10,077,646 2002-02-15
US10/077,646 US20030165625A1 (en) 2002-02-15 2002-02-15 Method of making a nanoporous film

Publications (1)

Publication Number Publication Date
CN1643045A true CN1643045A (zh) 2005-07-20

Family

ID=27752702

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038060094A Pending CN1643045A (zh) 2002-02-15 2003-02-07 制备纳米多孔薄膜的方法

Country Status (8)

Country Link
US (1) US20030165625A1 (enExample)
EP (1) EP1476500A4 (enExample)
JP (1) JP2005517785A (enExample)
KR (1) KR20040091047A (enExample)
CN (1) CN1643045A (enExample)
AU (1) AU2003216205A1 (enExample)
TW (1) TW200303878A (enExample)
WO (1) WO2003070813A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105384915A (zh) * 2014-08-29 2016-03-09 罗门哈斯电子材料有限责任公司 聚亚芳基材料

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060252906A1 (en) * 2003-02-20 2006-11-09 Godschalx James P Method of synthesis of polyarylenes and the polyarylenes made by such method
JP4637830B2 (ja) * 2003-04-02 2011-02-23 ダウ グローバル テクノロジーズ インコーポレイティド 多官能性の、置換モノマー類、および、そのポリアリーレン組成物
WO2005030830A1 (en) * 2003-09-19 2005-04-07 Dow Global Technologies Inc. Multifunctional monomers containing bound poragens and polyarylene compositions therefrom
US20070037894A1 (en) * 2003-09-19 2007-02-15 Hahnfeld Jerry L Multifunctional menomers and polyarylene compsotions therefrom
WO2005037761A2 (en) 2003-10-21 2005-04-28 Dow Global Technologies Inc. Multifunctional ethynyl substituted monomers and polyarylene compositions therefrom
US7585928B2 (en) * 2003-10-21 2009-09-08 Dow Global Technologies Multifunctional monomers containing bound mesogenic poragen forming moieties and polyarylene compositions therefrom
JP4506953B2 (ja) * 2004-05-28 2010-07-21 日本電気株式会社 共重合高分子膜およびその作製方法
WO2006001790A1 (en) * 2004-06-10 2006-01-05 Dow Global Technologies Inc. Method of forming a nanoporous dielectric film
US8535702B2 (en) 2005-02-01 2013-09-17 Boston Scientific Scimed, Inc. Medical devices having porous polymeric regions for controlled drug delivery and regulated biocompatibility
US7960442B2 (en) 2005-04-20 2011-06-14 International Business Machines Corporation Nanoporous media templated from unsymmetrical amphiphilic porogens
US7482389B2 (en) 2005-04-20 2009-01-27 International Business Machines Corporation Nanoporous media with lamellar structures
US7723438B2 (en) 2005-04-28 2010-05-25 International Business Machines Corporation Surface-decorated polymeric amphiphile porogens for the templation of nanoporous materials
JP4788415B2 (ja) * 2006-03-15 2011-10-05 ソニー株式会社 半導体装置の製造方法
US7842938B2 (en) * 2008-11-12 2010-11-30 Seagate Technology Llc Programmable metallization cells and methods of forming the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700844A (en) * 1996-04-09 1997-12-23 International Business Machines Corporation Process for making a foamed polymer
EP1141128B1 (en) * 1998-11-24 2006-04-12 Dow Global Technologies Inc. A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom
US6172128B1 (en) * 1999-04-09 2001-01-09 Honeywell International Inc. Nanoporous polymers crosslinked via cyclic structures
US6359091B1 (en) * 1999-11-22 2002-03-19 The Dow Chemical Company Polyarylene compositions with enhanced modulus profiles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105384915A (zh) * 2014-08-29 2016-03-09 罗门哈斯电子材料有限责任公司 聚亚芳基材料

Also Published As

Publication number Publication date
WO2003070813A1 (en) 2003-08-28
EP1476500A4 (en) 2006-09-20
KR20040091047A (ko) 2004-10-27
US20030165625A1 (en) 2003-09-04
TW200303878A (en) 2003-09-16
JP2005517785A (ja) 2005-06-16
EP1476500A1 (en) 2004-11-17
AU2003216205A1 (en) 2003-09-09

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