JP2005516344A5 - - Google Patents
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- Publication number
- JP2005516344A5 JP2005516344A5 JP2003562968A JP2003562968A JP2005516344A5 JP 2005516344 A5 JP2005516344 A5 JP 2005516344A5 JP 2003562968 A JP2003562968 A JP 2003562968A JP 2003562968 A JP2003562968 A JP 2003562968A JP 2005516344 A5 JP2005516344 A5 JP 2005516344A5
- Authority
- JP
- Japan
- Prior art keywords
- contact
- coil
- wire
- contacts
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 description 15
- 239000000523 sample Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000000806 elastomer Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34985002P | 2002-01-17 | 2002-01-17 | |
| US34985202P | 2002-01-17 | 2002-01-17 | |
| PCT/US2003/001035 WO2003063201A2 (en) | 2002-01-17 | 2003-01-14 | Compliant electrical contact |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009101625A Division JP4886001B2 (ja) | 2002-01-17 | 2009-04-20 | 柔軟電気接点 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005516344A JP2005516344A (ja) | 2005-06-02 |
| JP2005516344A5 true JP2005516344A5 (https=) | 2005-12-22 |
Family
ID=27616754
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003562968A Pending JP2005516344A (ja) | 2002-01-17 | 2003-01-14 | 柔軟電気接点 |
| JP2009101625A Expired - Lifetime JP4886001B2 (ja) | 2002-01-17 | 2009-04-20 | 柔軟電気接点 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009101625A Expired - Lifetime JP4886001B2 (ja) | 2002-01-17 | 2009-04-20 | 柔軟電気接点 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6787709B2 (https=) |
| EP (1) | EP1474822B1 (https=) |
| JP (2) | JP2005516344A (https=) |
| KR (1) | KR100874541B1 (https=) |
| CN (1) | CN1315135C (https=) |
| CA (1) | CA2473726A1 (https=) |
| IL (1) | IL163071A (https=) |
| WO (1) | WO2003063201A2 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6909056B2 (en) * | 2002-01-17 | 2005-06-21 | Ardent Concepts, Inc. | Compliant electrical contact assembly |
| US7446545B2 (en) * | 2003-05-08 | 2008-11-04 | Unitechno Inc. | Anisotropically conductive sheet |
| US20040224148A1 (en) * | 2003-05-08 | 2004-11-11 | Hitoshi Matsunaga | Anisotropically conductive sheet |
| US6981879B2 (en) * | 2004-03-18 | 2006-01-03 | International Business Machines Corporation | Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture |
| US7402051B1 (en) * | 2005-11-10 | 2008-07-22 | Antares Advanced Test Technologies, Inc. | Interconnect assembly for testing integrated circuit packages |
| JP2008027759A (ja) * | 2006-07-21 | 2008-02-07 | Fujikura Ltd | Ｉｃソケット及びｉｃパッケージ実装装置 |
| JP2009002845A (ja) * | 2007-06-22 | 2009-01-08 | Micronics Japan Co Ltd | 接触子及び接続装置 |
| WO2009058858A1 (en) * | 2007-10-29 | 2009-05-07 | Ardent Concepts, Inc. | Compliant electrical contact and assembly |
| USRE46958E1 (en) | 2011-10-24 | 2018-07-17 | Ardent Concepts, Inc. | Controlled-impedance cable termination using compliant interconnect elements |
| USRE47459E1 (en) | 2011-10-24 | 2019-06-25 | Ardent Concepts, Inc. | Controlled-impedance cable termination using compliant interconnect elements |
| GB2498536B (en) * | 2012-01-17 | 2016-03-09 | Control Tech Ltd | Electrical assembly |
| JP6071633B2 (ja) * | 2013-02-25 | 2017-02-01 | 秀雄 西川 | 接触子、検査治具、及び接触子の製造方法 |
| JP2014178175A (ja) * | 2013-03-14 | 2014-09-25 | Micronics Japan Co Ltd | 相互接続装置及び相互接続装置の組立方法 |
| DE102016006774A1 (de) * | 2016-06-02 | 2017-12-07 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Kontaktierungsanordnung |
| US10790432B2 (en) | 2018-07-27 | 2020-09-29 | International Business Machines Corporation | Cryogenic device with multiple transmission lines and microwave attenuators |
| US10931040B1 (en) * | 2018-08-02 | 2021-02-23 | Ardent Concepts, Inc. | Controlled-impedance circuit board connector assembly |
| US10784553B2 (en) | 2018-09-07 | 2020-09-22 | International Business Machines Corporation | Well thermalized stripline formation for high-density connections in quantum applications |
| US10891251B2 (en) | 2018-11-09 | 2021-01-12 | International Business Machines Corporation | Signal connector for microwave circuits |
| US11551125B2 (en) | 2019-02-21 | 2023-01-10 | International Business Machines Corporation | High density microwave hermetic interconnects for quantum applications |
| KR102582793B1 (ko) * | 2021-08-02 | 2023-09-26 | 주식회사 아이에스시 | 검사용 소켓 및 그 제조방법 |
| US12603448B2 (en) | 2022-12-06 | 2026-04-14 | Amphenol Corporation | Card connector |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR959460A (https=) * | 1950-03-30 | |||
| US4029375A (en) * | 1976-06-14 | 1977-06-14 | Electronic Engineering Company Of California | Miniature electrical connector |
| EP0385142B1 (en) * | 1989-02-28 | 1995-09-27 | Fujitsu Limited | Electrical connecting apparatus |
| US4998886A (en) * | 1989-07-07 | 1991-03-12 | Teledyne Kinetics | High density stacking connector |
| EP0462706A1 (en) * | 1990-06-11 | 1991-12-27 | ITT INDUSTRIES, INC. (a Delaware corporation) | Contact assembly |
| CA2095119C (en) * | 1990-10-29 | 2002-06-04 | Welles K. Reymond | Electrical connectors having tapered spring contact element |
| US5101553A (en) * | 1991-04-29 | 1992-04-07 | Microelectronics And Computer Technology Corporation | Method of making a metal-on-elastomer pressure contact connector |
| US5167512A (en) * | 1991-07-05 | 1992-12-01 | Walkup William B | Multi-chip module connector element and system |
| US5230632A (en) * | 1991-12-19 | 1993-07-27 | International Business Machines Corporation | Dual element electrical contact and connector assembly utilizing same |
| GB2273830B (en) * | 1992-12-24 | 1997-04-16 | Whitaker Corp | Electrical contact elements for interposer structures |
| EP0616394A1 (en) * | 1993-03-16 | 1994-09-21 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
| US5427535A (en) * | 1993-09-24 | 1995-06-27 | Aries Electronics, Inc. | Resilient electrically conductive terminal assemblies |
| US5495667A (en) * | 1994-11-07 | 1996-03-05 | Micron Technology, Inc. | Method for forming contact pins for semiconductor dice and interconnects |
| US5667410A (en) * | 1995-11-21 | 1997-09-16 | Everett Charles Technologies, Inc. | One-piece compliant probe |
| JP3653131B2 (ja) * | 1995-12-28 | 2005-05-25 | 日本発条株式会社 | 導電性接触子 |
| US6150616A (en) * | 1996-04-12 | 2000-11-21 | Nhk Spring Co., Ltd. | Electroconductive contact unit system |
| JPH10189087A (ja) * | 1996-12-25 | 1998-07-21 | Nec Yamagata Ltd | ポゴピン |
| JP4060919B2 (ja) * | 1997-11-28 | 2008-03-12 | 富士通株式会社 | 電気的接続装置、接触子製造方法、及び半導体試験方法 |
| US6114240A (en) * | 1997-12-18 | 2000-09-05 | Micron Technology, Inc. | Method for fabricating semiconductor components using focused laser beam |
| JP2001230035A (ja) * | 2000-02-17 | 2001-08-24 | Kasasaku Electronics:Kk | Ｉｃソケット |
-
2003
- 2003-01-14 CA CA002473726A patent/CA2473726A1/en not_active Abandoned
- 2003-01-14 KR KR1020047011112A patent/KR100874541B1/ko not_active Expired - Lifetime
- 2003-01-14 EP EP03731913.4A patent/EP1474822B1/en not_active Expired - Lifetime
- 2003-01-14 US US10/341,723 patent/US6787709B2/en not_active Expired - Lifetime
- 2003-01-14 CN CNB038023563A patent/CN1315135C/zh not_active Expired - Lifetime
- 2003-01-14 WO PCT/US2003/001035 patent/WO2003063201A2/en not_active Ceased
- 2003-01-14 JP JP2003562968A patent/JP2005516344A/ja active Pending
-
2004
- 2004-07-15 IL IL163071A patent/IL163071A/en not_active IP Right Cessation
-
2009
- 2009-04-20 JP JP2009101625A patent/JP4886001B2/ja not_active Expired - Lifetime
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