CN1315135C - 顺应性电接触件 - Google Patents

顺应性电接触件 Download PDF

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Publication number
CN1315135C
CN1315135C CNB038023563A CN03802356A CN1315135C CN 1315135 C CN1315135 C CN 1315135C CN B038023563 A CNB038023563 A CN B038023563A CN 03802356 A CN03802356 A CN 03802356A CN 1315135 C CN1315135 C CN 1315135C
Authority
CN
China
Prior art keywords
electric wire
electrical contact
contact
coil
compliant electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB038023563A
Other languages
English (en)
Chinese (zh)
Other versions
CN1618107A (zh
Inventor
G·A·文色尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ardent Concepts Inc
Original Assignee
Ardent Concepts Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ardent Concepts Inc filed Critical Ardent Concepts Inc
Publication of CN1618107A publication Critical patent/CN1618107A/zh
Application granted granted Critical
Publication of CN1315135C publication Critical patent/CN1315135C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CNB038023563A 2002-01-17 2003-01-14 顺应性电接触件 Expired - Lifetime CN1315135C (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34985002P 2002-01-17 2002-01-17
US34985202P 2002-01-17 2002-01-17
US60/349,850 2002-01-17
US60/349,852 2002-01-17
PCT/US2003/001035 WO2003063201A2 (en) 2002-01-17 2003-01-14 Compliant electrical contact

Publications (2)

Publication Number Publication Date
CN1618107A CN1618107A (zh) 2005-05-18
CN1315135C true CN1315135C (zh) 2007-05-09

Family

ID=27616754

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038023563A Expired - Lifetime CN1315135C (zh) 2002-01-17 2003-01-14 顺应性电接触件

Country Status (8)

Country Link
US (1) US6787709B2 (https=)
EP (1) EP1474822B1 (https=)
JP (2) JP2005516344A (https=)
KR (1) KR100874541B1 (https=)
CN (1) CN1315135C (https=)
CA (1) CA2473726A1 (https=)
IL (1) IL163071A (https=)
WO (1) WO2003063201A2 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6909056B2 (en) * 2002-01-17 2005-06-21 Ardent Concepts, Inc. Compliant electrical contact assembly
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
US20040224148A1 (en) * 2003-05-08 2004-11-11 Hitoshi Matsunaga Anisotropically conductive sheet
US6981879B2 (en) * 2004-03-18 2006-01-03 International Business Machines Corporation Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture
US7402051B1 (en) * 2005-11-10 2008-07-22 Antares Advanced Test Technologies, Inc. Interconnect assembly for testing integrated circuit packages
JP2008027759A (ja) * 2006-07-21 2008-02-07 Fujikura Ltd Ｉｃソケット及びｉｃパッケージ実装装置
JP2009002845A (ja) * 2007-06-22 2009-01-08 Micronics Japan Co Ltd 接触子及び接続装置
WO2009058858A1 (en) * 2007-10-29 2009-05-07 Ardent Concepts, Inc. Compliant electrical contact and assembly
USRE46958E1 (en) 2011-10-24 2018-07-17 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
USRE47459E1 (en) 2011-10-24 2019-06-25 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
GB2498536B (en) * 2012-01-17 2016-03-09 Control Tech Ltd Electrical assembly
JP6071633B2 (ja) * 2013-02-25 2017-02-01 秀雄 西川 接触子、検査治具、及び接触子の製造方法
JP2014178175A (ja) * 2013-03-14 2014-09-25 Micronics Japan Co Ltd 相互接続装置及び相互接続装置の組立方法
DE102016006774A1 (de) * 2016-06-02 2017-12-07 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktierungsanordnung
US10790432B2 (en) 2018-07-27 2020-09-29 International Business Machines Corporation Cryogenic device with multiple transmission lines and microwave attenuators
US10931040B1 (en) * 2018-08-02 2021-02-23 Ardent Concepts, Inc. Controlled-impedance circuit board connector assembly
US10784553B2 (en) 2018-09-07 2020-09-22 International Business Machines Corporation Well thermalized stripline formation for high-density connections in quantum applications
US10891251B2 (en) 2018-11-09 2021-01-12 International Business Machines Corporation Signal connector for microwave circuits
US11551125B2 (en) 2019-02-21 2023-01-10 International Business Machines Corporation High density microwave hermetic interconnects for quantum applications
KR102582793B1 (ko) * 2021-08-02 2023-09-26 주식회사 아이에스시 검사용 소켓 및 그 제조방법
US12603448B2 (en) 2022-12-06 2026-04-14 Amphenol Corporation Card connector

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167512A (en) * 1991-07-05 1992-12-01 Walkup William B Multi-chip module connector element and system

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR959460A (https=) * 1950-03-30
US4029375A (en) * 1976-06-14 1977-06-14 Electronic Engineering Company Of California Miniature electrical connector
EP0385142B1 (en) * 1989-02-28 1995-09-27 Fujitsu Limited Electrical connecting apparatus
US4998886A (en) * 1989-07-07 1991-03-12 Teledyne Kinetics High density stacking connector
EP0462706A1 (en) * 1990-06-11 1991-12-27 ITT INDUSTRIES, INC. (a Delaware corporation) Contact assembly
CA2095119C (en) * 1990-10-29 2002-06-04 Welles K. Reymond Electrical connectors having tapered spring contact element
US5101553A (en) * 1991-04-29 1992-04-07 Microelectronics And Computer Technology Corporation Method of making a metal-on-elastomer pressure contact connector
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
GB2273830B (en) * 1992-12-24 1997-04-16 Whitaker Corp Electrical contact elements for interposer structures
EP0616394A1 (en) * 1993-03-16 1994-09-21 Hewlett-Packard Company Method and system for producing electrically interconnected circuits
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
US5667410A (en) * 1995-11-21 1997-09-16 Everett Charles Technologies, Inc. One-piece compliant probe
JP3653131B2 (ja) * 1995-12-28 2005-05-25 日本発条株式会社 導電性接触子
US6150616A (en) * 1996-04-12 2000-11-21 Nhk Spring Co., Ltd. Electroconductive contact unit system
JPH10189087A (ja) * 1996-12-25 1998-07-21 Nec Yamagata Ltd ポゴピン
JP4060919B2 (ja) * 1997-11-28 2008-03-12 富士通株式会社 電気的接続装置、接触子製造方法、及び半導体試験方法
US6114240A (en) * 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
JP2001230035A (ja) * 2000-02-17 2001-08-24 Kasasaku Electronics:Kk Ｉｃソケット

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167512A (en) * 1991-07-05 1992-12-01 Walkup William B Multi-chip module connector element and system

Also Published As

Publication number Publication date
EP1474822A4 (en) 2007-03-14
US6787709B2 (en) 2004-09-07
JP2005516344A (ja) 2005-06-02
CN1618107A (zh) 2005-05-18
JP4886001B2 (ja) 2012-02-29
WO2003063201A2 (en) 2003-07-31
WO2003063201A3 (en) 2003-10-16
KR20040103916A (ko) 2004-12-09
EP1474822B1 (en) 2016-12-07
EP1474822A2 (en) 2004-11-10
KR100874541B1 (ko) 2008-12-16
US20030132020A1 (en) 2003-07-17
CA2473726A1 (en) 2003-07-31
JP2009164135A (ja) 2009-07-23
IL163071A (en) 2009-11-18

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20070509

CX01 Expiry of patent term