JP2005508763A - 任意の応力から保護されるコンポーネントの気密カプセル封じのための装置 - Google Patents
任意の応力から保護されるコンポーネントの気密カプセル封じのための装置 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
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- G02B6/24—Coupling light guides
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- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
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- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Abstract
【解決手段】コンポーネント(5)は基板(15)に固定され、該基板は、もう1つの面で接着ボンディング(16)によって固定される温度調整素子(17)を支える。このアセンブリは、接着ボンディング(13)によって結合された2つの部分(11,12)を有するパッケージ内に配置され、該パッケージは、光リンク(6)及び電気的接続体(18,142)用の通路を有する。それは、パッケージの1つの部分(11)の突起(19)によって支持される。もう1つの部分(12)には、温度調整電子機器を形成する3次元相互接続ブロック(14)がボンドされる。ブロック,パッケージ(11,12)並びにリンク及び接続体の最小の長さ(L)は、鉱物保護層(4’)内にカプセル封じされる。
本発明は、光電子コンポーネント及びMEMSコンポーネントに特に適する。
Description
パッケージの2つの部分が、接着ボンディングによって又は前記コンポーネントを支持する基板を介して結合され、パッケージ全体が鉱物保護層によって保護され、該鉱物保護層が、パッケージから出る接続体及び/又はリンクに沿って所定の最小の長さに広がることを特徴とする。
2,15 基板
3,3’,11,12,11’,21,22 パッケージ
4,4’ 保護層
30,31,70,71,80 接着剤
6 ファイバ
7 フェルール
8 V型ガラスブロック
50 受入面
51 放出面
13,16,141 接着ボンディング
14 3次元相互接続ブロック
17,17’ 温度調整素子
18,142 電気的接続体
19 突起
144,145 接続ピン
24 熱接続層
170 給電ワイヤ
Claims (14)
- 任意の応力から保護されるコンポーネントの気密カプセル封じのための装置であって、コンポーネントが乾燥雰囲気内に配置される、少なくとも2つの部分から形成され内部容積を定めるパッケージを有する装置において、
該パッケージの2つの部分(3,3’;11,12;11’,14;21,14;22,14)が、接着ボンディングによって又は前記コンポーネントを支持する基板を介して結合され、パッケージ全体が鉱物保護層によって保護され、該鉱物保護層は、前記パッケージから出る接続体及び/又はリンクに沿って所定の最小の長さに広がることを特徴とする装置。 - 前記所定の最小の長さ(L)は、およそ数ミリメートルであることを特徴とする請求項1に記載の装置。
- 前記保護層(4;4’)は、SiOxの層であって、xが実質的に1.4から2の間であることを特徴とする請求項1又は2に記載の装置。
- 前記パッケージに関して、前記xの値は、最適な接着を保証するために決定された2以下である第1の値から、最大限の気密性を保証するために最大2の値まで変化することを特徴とする請求項3に記載の装置。
- 前記保護層の厚さは、実質的に0.1から5ミクロンの間であることを特徴とする請求項3又は4に記載の装置。
- 前記厚さは、およそ0.5ミクロンであることを特徴とする請求項5に記載の装置。
- 前記コンポーネントは、接続導体(20)を有する基板(2)に取り付けられたMEMS(1)であり、前記パッケージは、前記基板の両側に互いに向き合って配置され且つそれに接着ボンドされた(31)2つの部分(3,3’)から形成され、前記保護層(4)は、前記2つの部分に広がり、且つ、前記最小の長さにわたって前記接続導体(20)と前記基板とに沿って広がることを特徴とする請求項1から6のいずれか1項に記載の装置。
- 前記コンポーネントは、平面基板(15)の第1の面に固定された光学又は電気光学コンポーネントであり、前記コンポーネントに面する基板のもう一方の面には、電子温度調整回路(14)によって給電される温度調整素子(17)が位置し、前記パッケージの第1部分(11)は、前記基板(15)を支持する少なくとも1つの内部突起(19)を含むことを特徴とする請求項1から6のいずれか1項に記載の装置。
- 前記温度調整回路は、前記パッケージのもう1つの部分(12)に固定された3次元相互接続ブロック(14)で構成され、前記保護層(4’)は、前記パッケージ及び前記ブロックと、前記最小の長さ(L)にわたって、光学接続体(6)並びに前記温度調整素子用の電気的接続体(18)及び前記電子温度調整回路用の電気的接続体(142)とをカプセル封じすることを特徴とする請求項8に記載の装置。
- 前記基板(15)への前記コンポーネント(5)の固定と、前記突起(19)への該基板の固定と、前記パッケージの第2部分(12)への前記ブロック(14)の固定とが、接着ボンディング(16,141)によってもたらされることを特徴とする請求項9に記載の装置。
- 前記温度調整回路は、3次元相互接続ブロック(14)で構成され、該ブロック(14)は前記パッケージの第2部分を構成し、且つ、前記コンポーネントを含む前記内部容積を定めるために前記パッケージの前記第1部分(11)に接着ボンディング(13)によって固定され、前記保護層(4’)は、前記第1部分(11)と、前記ブロック(14)と、前記最小の長さ(L)にわたって光学接続体(6)並びに前記温度調整素子用の電気的接続体(18)及び前記電子温度調整回路用の電気的接続体(142)とをカプセル封じすることを特徴とする請求項8に記載の装置。
- 前記コンポーネントは、平面基板(15)の第1の面に固定された光学又は光電子コンポーネント(5)であり、前記コンポーネントに面する前記基板のもう一方の面は、電子温度調整回路(14)によって給電される電子調整素子(17,17’)を支え、前記温度調整回路は、3次元相互ブロック(14)で構成され、該ブロック(14)は、前記パッケージの第2部分を構成し、且つ、前記コンポーネントを含む前記内部容積を定めるために前記パッケージの前記第1部分(21,22)に接着ボンディング(13)によって固定され、前記保護層(4’)は、前記第1部分(21,22)と、前記ブロック(14)と、前記最小の長さにわたって前記光学接続体(6)及び前記電子調整回路のための電気的接続体(142)とをカプセル封じし、前記基板及びコンポーネントに固定され且つ前記温度調整素子(17,17’)を前記電子温度調整回路に接続するために、前記ブロック(14)は、パッケージの内部に向かって、前記ブロックの内部面(143)にほぼ垂直な接続ピン(144,145)を含むことを特徴とする請求項1から6のいずれか1項に記載の装置。
- 前記温度調整素子は、ペルチェ効果冷却素子(17’)であり、前記パッケージの前記第1部分(22)は優れた熱導体である材料で形成され、前気冷却素子のウォーム面と前記パッケージの前記第1部分の内部面との間に、熱接続層(24)が熱を放散するために挿入されることを特徴とする請求項12に記載の装置。
- 前記パッケージから出る接続体及び/又はリンクは、前記パッケージの差し込み口において所定の長さ分むかれ、前記鉱物保護層は、前記所定の最小の長さを減らすために、前記接続体及び/又はリンクのむかれた部分にまでしか広がらないことを特徴とする請求項1から6及び8から13のいずれか1項に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0114543A FR2832136B1 (fr) | 2001-11-09 | 2001-11-09 | Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte |
PCT/FR2002/003524 WO2003041163A1 (fr) | 2001-11-09 | 2002-10-15 | Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte |
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JP2005508763A true JP2005508763A (ja) | 2005-04-07 |
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JP2003543098A Pending JP2005508763A (ja) | 2001-11-09 | 2002-10-15 | 任意の応力から保護されるコンポーネントの気密カプセル封じのための装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050012188A1 (ja) |
EP (1) | EP1442480B1 (ja) |
JP (1) | JP2005508763A (ja) |
FR (1) | FR2832136B1 (ja) |
WO (1) | WO2003041163A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US7642628B2 (en) * | 2005-01-11 | 2010-01-05 | Rosemount Inc. | MEMS packaging with improved reaction to temperature changes |
FR2884049B1 (fr) * | 2005-04-01 | 2007-06-22 | 3D Plus Sa Sa | Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion |
FR2894070B1 (fr) * | 2005-11-30 | 2008-04-11 | 3D Plus Sa Sa | Module electronique 3d |
FR2895568B1 (fr) * | 2005-12-23 | 2008-02-08 | 3D Plus Sa Sa | Procede de fabrication collective de modules electroniques 3d |
US7667333B2 (en) * | 2006-01-27 | 2010-02-23 | Infineon Technologies Ag | Stack of semiconductor chips |
FR2905198B1 (fr) * | 2006-08-22 | 2008-10-17 | 3D Plus Sa Sa | Procede de fabrication collective de modules electroniques 3d |
FR2911995B1 (fr) * | 2007-01-30 | 2009-03-06 | 3D Plus Sa Sa | Procede d'interconnexion de tranches electroniques |
US7847387B2 (en) * | 2007-11-16 | 2010-12-07 | Infineon Technologies Ag | Electrical device and method |
FR2940521B1 (fr) | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
FR2961305B1 (fr) | 2010-06-14 | 2012-06-22 | Eurocopter France | Dispositif de mesure inertielle ameliore et aeronef comportant un tel dispositif |
US10431509B2 (en) | 2014-10-31 | 2019-10-01 | General Electric Company | Non-magnetic package and method of manufacture |
TWI646641B (zh) * | 2016-08-24 | 2019-01-01 | 同欣電子工業股份有限公司 | Waterproof package module and waterproof packaging process |
FR3061404B1 (fr) | 2016-12-27 | 2022-09-23 | Packaging Sip | Procede de fabrication collective de modules electroniques hermetiques |
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Also Published As
Publication number | Publication date |
---|---|
WO2003041163A1 (fr) | 2003-05-15 |
US20050012188A1 (en) | 2005-01-20 |
EP1442480A1 (fr) | 2004-08-04 |
FR2832136B1 (fr) | 2005-02-18 |
FR2832136A1 (fr) | 2003-05-16 |
EP1442480B1 (fr) | 2019-03-06 |
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