JP2005503942A5 - - Google Patents
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- Publication number
- JP2005503942A5 JP2005503942A5 JP2003531777A JP2003531777A JP2005503942A5 JP 2005503942 A5 JP2005503942 A5 JP 2005503942A5 JP 2003531777 A JP2003531777 A JP 2003531777A JP 2003531777 A JP2003531777 A JP 2003531777A JP 2005503942 A5 JP2005503942 A5 JP 2005503942A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- channel
- polymer
- conductive
- traces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/941,058 US6591496B2 (en) | 2001-08-28 | 2001-08-28 | Method for making embedded electrical traces |
| PCT/US2002/020480 WO2003028417A1 (en) | 2001-08-28 | 2002-06-27 | Embedded electrical traces and method for making |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005503942A JP2005503942A (ja) | 2005-02-10 |
| JP2005503942A5 true JP2005503942A5 (enExample) | 2006-01-05 |
| JP4243541B2 JP4243541B2 (ja) | 2009-03-25 |
Family
ID=25475859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003531777A Expired - Fee Related JP4243541B2 (ja) | 2001-08-28 | 2002-06-27 | 埋め込み電気トレースおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6591496B2 (enExample) |
| EP (1) | EP1421835B1 (enExample) |
| JP (1) | JP4243541B2 (enExample) |
| AT (1) | ATE306804T1 (enExample) |
| DE (1) | DE60206641T2 (enExample) |
| WO (1) | WO2003028417A1 (enExample) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7102522B2 (en) * | 2002-12-24 | 2006-09-05 | 3M Innovative Properties Company | Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same |
| US6816125B2 (en) * | 2003-03-01 | 2004-11-09 | 3M Innovative Properties Company | Forming electromagnetic communication circuit components using densified metal powder |
| US7371452B2 (en) * | 2003-04-28 | 2008-05-13 | Eastman Kodak Company | Conductive patterned sheet utilizing multi-layered conductive conduit channels |
| US7138170B2 (en) * | 2003-04-28 | 2006-11-21 | Eastman Kodak Company | Terminated conductive patterned sheet utilizing conductive conduits |
| US7001658B2 (en) * | 2003-04-28 | 2006-02-21 | Eastman Kodak Company | Heat selective electrically conductive polymer sheet |
| US20060110580A1 (en) * | 2003-04-28 | 2006-05-25 | Aylward Peter T | Article comprising conductive conduit channels |
| US8062734B2 (en) * | 2003-04-28 | 2011-11-22 | Eastman Kodak Company | Article comprising conductive conduit channels |
| TWI220523B (en) * | 2003-05-26 | 2004-08-21 | Ritek Corp | Write once recording medium |
| DE10331714B4 (de) * | 2003-07-11 | 2006-05-24 | Micronas Gmbh | Verfahren zur Strukturierung der Oberfläche eines Substrats |
| DE20310834U1 (de) * | 2003-07-14 | 2003-12-24 | Klopp, Hans | Transparentes Gehäuse mit Versorgungsleitungen für einen elektrischen Verbraucher |
| US7160583B2 (en) * | 2004-12-03 | 2007-01-09 | 3M Innovative Properties Company | Microfabrication using patterned topography and self-assembled monolayers |
| JP2006261322A (ja) * | 2005-03-16 | 2006-09-28 | Jsr Corp | 電磁波シールドフィルムおよびその製造方法 |
| JP2006278617A (ja) * | 2005-03-29 | 2006-10-12 | Jsr Corp | 電磁波シールドフィルム |
| KR100608533B1 (ko) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| KR20080023303A (ko) * | 2005-05-18 | 2008-03-13 | 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 | 마이크로유체 그물구조 내 전도성 경로, 마이크로회로 및마이크로구조물의 제작 |
| US20070218258A1 (en) * | 2006-03-20 | 2007-09-20 | 3M Innovative Properties Company | Articles and methods including patterned substrates formed from densified, adhered metal powders |
| US8354160B2 (en) | 2006-06-23 | 2013-01-15 | 3M Innovative Properties Company | Articles having durable hydrophobic surfaces |
| KR20080004021A (ko) * | 2006-07-04 | 2008-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법 |
| KR101269741B1 (ko) * | 2006-07-04 | 2013-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 탄성 및 접착성을 갖는 전자기파 차단용 가스켓 |
| US7412765B2 (en) * | 2006-07-14 | 2008-08-19 | Auden Techno Corp. | Method of manufacturing a sticker type antenna |
| US8017308B2 (en) * | 2006-08-11 | 2011-09-13 | Battelle Memorial Institute | Patterning non-planar surfaces |
| US20080143519A1 (en) * | 2006-12-19 | 2008-06-19 | 3M Innovative Properties Company | Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag |
| DE102007020656B4 (de) | 2007-04-30 | 2009-05-07 | Infineon Technologies Ag | Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips |
| KR20090054198A (ko) * | 2007-11-26 | 2009-05-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
| JP5739083B2 (ja) * | 2008-05-08 | 2015-06-24 | 帝人株式会社 | 樹脂成形体及びその成形方法 |
| KR20100090493A (ko) * | 2009-02-06 | 2010-08-16 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 그 제조 방법 |
| GB0914961D0 (en) | 2009-08-27 | 2009-09-30 | Appleton Steve | Electrically heated window |
| US8813324B2 (en) | 2010-03-24 | 2014-08-26 | Western Digital (Fremont), Llc | Method for providing a piezoelectric multilayer |
| EP2563865B1 (en) | 2010-04-28 | 2016-06-01 | 3M Innovative Properties Company | Articles including nanosilica-based primers for polymer coatings and methods |
| KR20130073898A (ko) | 2010-04-28 | 2013-07-03 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 실리콘-기반 물질 |
| EP2625314A1 (en) | 2010-10-06 | 2013-08-14 | 3M Innovative Properties Company | Anti-reflective articles with nanosilica-based coatings and barrier layer |
| US20120086649A1 (en) * | 2010-10-12 | 2012-04-12 | Innovation & Infinity Global Corp. | Conductive circuits for a touch panel and the manufacturing method thereof |
| EP2445321A1 (en) * | 2010-10-13 | 2012-04-25 | Innovation & Infinity Global Corp. | Conductive circuits for a touch panel and the manufacturing method thereof |
| GB2520817B (en) * | 2013-11-06 | 2017-10-04 | Hamilton Sundstrand Corp | High-temperature environment electronic chassis |
| US9386712B2 (en) | 2013-11-06 | 2016-07-05 | Hamilton Sundstrand Corporation | High-temperature environment electronic chassis |
| DE102014107480B4 (de) * | 2014-05-27 | 2016-02-04 | Webasto SE | Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben |
| EP2955789A1 (en) * | 2014-06-12 | 2015-12-16 | BAE Systems PLC | Electro-optic windows |
| US10570659B2 (en) | 2014-06-12 | 2020-02-25 | Bae Systems Plc | Method of making electro-optic window by sputtering material to fill channels of a grid |
| KR102302150B1 (ko) * | 2015-02-16 | 2021-09-16 | 한국전자통신연구원 | 자기장 차폐 시트 및 그 제조 방법 |
| US10563292B2 (en) * | 2015-04-09 | 2020-02-18 | Electronics And Telecommunications Research Institute | Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
| EP3379897B1 (en) | 2015-11-17 | 2021-11-03 | Dai Nippon Printing Co., Ltd. | Heating electrode device, electrical heating glass, heat-generating plate, vehicle, window for building, sheet with conductor, conductive pattern sheet, conductive heat-generating body, laminated glass, and manufacturing method for conductive heat-generating body |
| FR3048659B1 (fr) * | 2016-03-10 | 2018-04-13 | Valeo Systemes D'essuyage | Systeme de detection optique pour vehicule automobile |
| GB201613051D0 (en) * | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
| DE102017208075A1 (de) * | 2017-05-12 | 2018-11-15 | Magna Powertrain Bad Homburg GmbH | Bauteil mit EMV Schutz für elektronische Platine |
| CN109085710A (zh) * | 2018-10-17 | 2018-12-25 | 吴江友鑫新材料科技有限公司 | 一种具有电磁屏蔽效果的调色玻璃及其制备方法 |
| DE102019201348A1 (de) | 2019-02-01 | 2020-08-06 | Lpkf Laser & Electronics Ag | Metallisierte Mikrostrukturen in Glasträgern |
| KR102786212B1 (ko) | 2019-05-06 | 2025-03-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 전도성 요소를 포함하는 패턴화된 물품 |
| CN114442395B (zh) * | 2022-01-26 | 2023-05-16 | 福耀玻璃工业集团股份有限公司 | 电致变色器件及其电极结构和制备方法、玻璃总成和车辆 |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2961746A (en) * | 1956-06-18 | 1960-11-29 | Aladdin Ind Inc | Printed circuits |
| US2963748A (en) | 1957-05-27 | 1960-12-13 | Young Lawrence John | Printed circuits |
| US3075280A (en) | 1959-10-19 | 1963-01-29 | Bell Telephone Labor Inc | Method of making printed wiring assemblies |
| GB993984A (en) | 1962-08-24 | 1965-06-02 | Standard Telephones Cables Ltd | Improvements in or relating to electrical circuits |
| US3247579A (en) | 1964-05-18 | 1966-04-26 | Microwave Electronics Corp | Circuit fabrication method |
| US3434939A (en) * | 1965-10-07 | 1969-03-25 | Fabri Tek Inc | Process for making printed circuits |
| US3851382A (en) * | 1968-12-02 | 1974-12-03 | Telefunken Patent | Method of producing a semiconductor or thick film device |
| US3800020A (en) | 1972-03-23 | 1974-03-26 | Cramer P Co | Method of making a circuit board |
| CH591570A5 (enExample) | 1972-11-28 | 1977-09-30 | Buser Ag Maschf Fritz | |
| US3932927A (en) | 1973-03-05 | 1976-01-20 | Motorola, Inc. | Scannable light emitting diode array and method |
| US3952152A (en) | 1974-10-29 | 1976-04-20 | Teletype Corporation | CRT shield |
| CH585611A5 (en) | 1975-04-09 | 1977-03-15 | Boccadoro Ferdinando | Diamond grain surface grinding wheel mfr. - with thread cut in wheel and part filled with grain before rolling flat |
| US4179797A (en) | 1978-03-23 | 1979-12-25 | Xerox Corporation | Method of making a resistor array |
| FR2430847A1 (fr) | 1978-07-13 | 1980-02-08 | Saint Gobain | Vitrage chauffant et/ou d'alarme |
| GB2033667A (en) | 1978-11-06 | 1980-05-21 | Powers C D | Improvements in circuit boards |
| US4381421A (en) | 1980-07-01 | 1983-04-26 | Tektronix, Inc. | Electromagnetic shield for electronic equipment |
| NL8100601A (nl) | 1981-02-09 | 1982-09-01 | Philips Nv | Ruit voorzien van elektrische draad en draad. |
| US4412255A (en) | 1981-02-23 | 1983-10-25 | Optical Coating Laboratory, Inc. | Transparent electromagnetic shield and method of manufacturing |
| US4510347A (en) | 1982-12-06 | 1985-04-09 | Fine Particles Technology Corporation | Formation of narrow conductive paths on a substrate |
| WO1984003586A1 (en) | 1983-03-02 | 1984-09-13 | Dennis R Mitchell | Method for bonding electrical conductors to an insulating substrate |
| US4604678A (en) * | 1983-07-18 | 1986-08-05 | Frederick Parker | Circuit board with high density electrical tracers |
| US5061438A (en) | 1983-09-21 | 1991-10-29 | Allied-Signal Inc. | Method of making a printed circuit board |
| US5094811A (en) | 1983-09-21 | 1992-03-10 | Allied-Signal | Method of making a printed circuit board |
| KR850700097A (ko) * | 1983-09-21 | 1985-10-21 | 로이 에이취, 맷신길 | 인쇄회로판 제조방법 |
| AU570309B2 (en) | 1984-03-26 | 1988-03-10 | Unisearch Limited | Buried contact solar cell |
| US4693783A (en) | 1984-12-31 | 1987-09-15 | Gte Laboratories Incorporated | Method of producing interconnections in a semiconductor integrated circuit structure |
| US4614837A (en) | 1985-04-03 | 1986-09-30 | Allied Corporation | Method for placing electrically conductive paths on a substrate |
| US4759965A (en) * | 1985-08-06 | 1988-07-26 | Canon Kabushiki Kaisha | Ceramic, preparation thereof and electronic circuit substrate by use thereof |
| US4755415A (en) | 1985-10-03 | 1988-07-05 | Fuji Photo Film Co., Ltd. | Optical shutter array and method for making |
| US4997674A (en) | 1987-06-30 | 1991-03-05 | Akzo America Inc. | Conductive metallization of substrates via developing agents |
| US5059485A (en) | 1988-06-08 | 1991-10-22 | Akzo America Inc. | Conductive metallization of substances without developing agents |
| US5055637A (en) | 1989-05-02 | 1991-10-08 | Hagner George R | Circuit boards with recessed traces |
| US4985601A (en) | 1989-05-02 | 1991-01-15 | Hagner George R | Circuit boards with recessed traces |
| JPH033292A (ja) | 1989-05-30 | 1991-01-09 | Matsushita Electric Ind Co Ltd | 回路基板及びそれを用いたイメージセンサ |
| US5169488A (en) | 1990-10-25 | 1992-12-08 | International Business Machines Corporation | Method of forming planarized, reusable calibration grids |
| JP3361556B2 (ja) | 1992-09-25 | 2003-01-07 | 日本メクトロン株式会社 | 回路配線パタ−ンの形成法 |
| US5462624A (en) | 1992-12-22 | 1995-10-31 | Vlsi Technology, Inc. | Embedded inter-connect frame |
| FR2708170B1 (fr) | 1993-07-19 | 1995-09-08 | Innovation Dev Cie Gle | Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant. |
| US5481400A (en) | 1993-11-09 | 1996-01-02 | Hughes Aircraft Company | Survivable window grids |
| US5595943A (en) | 1994-06-30 | 1997-01-21 | Hitachi, Ltd. | Method for formation of conductor using electroless plating |
| WO1996039252A1 (en) | 1995-06-06 | 1996-12-12 | David Sarnoff Research Center, Inc. | Electrokinetic pumping |
| US5928767A (en) * | 1995-06-07 | 1999-07-27 | Dexter Corporation | Conductive film composite |
| US5731086A (en) * | 1995-06-07 | 1998-03-24 | Gebhardt; William F. | Debossable films |
| US5761801A (en) * | 1995-06-07 | 1998-06-09 | The Dexter Corporation | Method for making a conductive film composite |
| US5745989A (en) | 1995-08-04 | 1998-05-05 | Exotic Materials, Inc. | Method of preparation of an optically transparent article with an embedded mesh |
| JPH09115334A (ja) | 1995-10-23 | 1997-05-02 | Mitsubishi Materiais Corp | 透明導電膜および膜形成用組成物 |
| JP3585244B2 (ja) | 1997-02-20 | 2004-11-04 | パレレック,インコーポレイテッド | 導電体製造のための低温方法および組成物 |
| US6103640A (en) | 1997-09-12 | 2000-08-15 | Bridgestone Corporation | Electromagnetic-wave shielding and light transmitting plate |
| US6103033A (en) | 1998-03-04 | 2000-08-15 | Therasense, Inc. | Process for producing an electrochemical biosensor |
| US6117781A (en) * | 1999-04-22 | 2000-09-12 | Advanced Micro Devices, Inc. | Optimized trench/via profile for damascene processing |
| US6663786B2 (en) * | 2001-06-14 | 2003-12-16 | International Business Machines Corporation | Structure having embedded flush circuitry features and method of fabricating |
-
2001
- 2001-08-28 US US09/941,058 patent/US6591496B2/en not_active Expired - Lifetime
-
2002
- 2002-06-27 JP JP2003531777A patent/JP4243541B2/ja not_active Expired - Fee Related
- 2002-06-27 WO PCT/US2002/020480 patent/WO2003028417A1/en not_active Ceased
- 2002-06-27 EP EP02746740A patent/EP1421835B1/en not_active Expired - Lifetime
- 2002-06-27 DE DE60206641T patent/DE60206641T2/de not_active Expired - Lifetime
- 2002-06-27 AT AT02746740T patent/ATE306804T1/de not_active IP Right Cessation
-
2003
- 2003-05-21 US US10/442,396 patent/US6929849B2/en not_active Expired - Fee Related
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