JP2005347287A - 多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法 - Google Patents

多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法 Download PDF

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Publication number
JP2005347287A
JP2005347287A JP2002156262A JP2002156262A JP2005347287A JP 2005347287 A JP2005347287 A JP 2005347287A JP 2002156262 A JP2002156262 A JP 2002156262A JP 2002156262 A JP2002156262 A JP 2002156262A JP 2005347287 A JP2005347287 A JP 2005347287A
Authority
JP
Japan
Prior art keywords
multilayer substrate
coil
conductor
shield wire
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002156262A
Other languages
English (en)
Japanese (ja)
Inventor
Koichiro Sagawa
幸一郎 佐川
Masahiko Oshimura
雅彦 押村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2002156262A priority Critical patent/JP2005347287A/ja
Priority to PCT/JP2003/006647 priority patent/WO2003100852A1/fr
Priority to TW092114409A priority patent/TW200401603A/zh
Priority to AU2003241819A priority patent/AU2003241819A1/en
Publication of JP2005347287A publication Critical patent/JP2005347287A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2002156262A 2002-05-29 2002-05-29 多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法 Pending JP2005347287A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002156262A JP2005347287A (ja) 2002-05-29 2002-05-29 多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法
PCT/JP2003/006647 WO2003100852A1 (fr) 2002-05-29 2003-05-28 Fil metallique de blindage dans une carte multicouches, puce a semi-conducteurs, element de circuit electronique et procede de production de ce fil
TW092114409A TW200401603A (en) 2002-05-29 2003-05-28 Inter shielding wire of multi-layered substrate, semiconductor chip, electronic circuit device and manufacturing method of the same
AU2003241819A AU2003241819A1 (en) 2002-05-29 2003-05-28 Shielding wire in multilayer board, semiconductor chip, electronic circuit element, and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002156262A JP2005347287A (ja) 2002-05-29 2002-05-29 多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法

Publications (1)

Publication Number Publication Date
JP2005347287A true JP2005347287A (ja) 2005-12-15

Family

ID=29561466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002156262A Pending JP2005347287A (ja) 2002-05-29 2002-05-29 多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法

Country Status (4)

Country Link
JP (1) JP2005347287A (fr)
AU (1) AU2003241819A1 (fr)
TW (1) TW200401603A (fr)
WO (1) WO2003100852A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188343A (ja) * 2008-02-08 2009-08-20 Nec Corp インダクタ用シールドおよびシールド付きインダクタ
JP2011049378A (ja) * 2009-08-27 2011-03-10 Kyocera Corp 多層基板および電子機器
WO2020176467A1 (fr) * 2019-02-26 2020-09-03 Texas Instruments Incorporated Transformateur isolé à topologie de blindage intégrée permettant une emi réduite
JP2020202255A (ja) * 2019-06-07 2020-12-17 株式会社デンソー 電子装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04237106A (ja) * 1991-01-21 1992-08-25 Nippon Telegr & Teleph Corp <Ntt> 集積化インダクタンス素子及び集積化トランス
JPH0555043A (ja) * 1991-08-22 1993-03-05 Fujitsu Ltd 小型コイルとその製造方法，磁気ヘツドの製造方法及び磁気記憶装置
DE69321432T2 (de) * 1992-09-10 1999-05-27 Nat Semiconductor Corp Integrierte magnetische Speicherelementschaltung und ihr Herstellungsverfahren
JPH06112655A (ja) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd コイル内蔵多層印刷配線板およびその製造方法
JPH10154795A (ja) * 1996-11-19 1998-06-09 Advanced Materials Eng Res Inc 半導体チップにおけるインダクター及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188343A (ja) * 2008-02-08 2009-08-20 Nec Corp インダクタ用シールドおよびシールド付きインダクタ
JP2011049378A (ja) * 2009-08-27 2011-03-10 Kyocera Corp 多層基板および電子機器
WO2020176467A1 (fr) * 2019-02-26 2020-09-03 Texas Instruments Incorporated Transformateur isolé à topologie de blindage intégrée permettant une emi réduite
US11538766B2 (en) 2019-02-26 2022-12-27 Texas Instruments Incorporated Isolated transformer with integrated shield topology for reduced EMI
US11967566B2 (en) 2019-02-26 2024-04-23 Texas Instruments Incorporated Isolated transformer with integrated shield topology for reduced EMI
JP2020202255A (ja) * 2019-06-07 2020-12-17 株式会社デンソー 電子装置

Also Published As

Publication number Publication date
TW200401603A (en) 2004-01-16
AU2003241819A1 (en) 2003-12-12
WO2003100852A1 (fr) 2003-12-04

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